1327458 九、發明說明： 【發明所屬之技術領域】 ^發明涉及-種散熱裝置之製造方法’尤係指一種用 於電子7L件上之散熱裝置之製造方法。 【先前技術】 隨著電子產業之飛速發展，電腦中央處理器 度越來越快，其產生之熱量也隨之劇增，而“u = 丨無法及時排出，將嚴重影響中央處理器運行時之二=右 為此，業界通常在中央處理器頂面裝設一散熱ς疋 風扇與散熱器之組合來協助排出熱量，以確^央声理二 在適當温度下正常工作。 、处理益 習知散熱裝置往往包括一貼附於中央處理 以及焊接在基座上之散熱韓片，並於基座上設 孔以結合螺絲將散熱農置固定於中央處理器上、 I座與散熱㈣之焊接過㈣，該貫穿孔 堵住，影響散㈣置之安Ρ 锡丹與松香 π，ί Γ t述不足’業界在烊接前使用螺絲螺鎖進該螺 ，土座/、散熱鰭片烊接完畢以後再 ’、 土煜桩渦招忐邱山 1夂订π崎、、、示取出’從而防 貧與松香落人堵住貫穿孔H 仔較淺’貫穿孔仍然會被堵塞；若螺絲鎖得較深，會穿 效^座表面將散熱鰭片頂起，影響基座與散熱鰭片之熱傳 【發明内容] 料ίΓ:在提供一種操作簡便、易於實施且用於避免 散,，，、裝置之貝穿孔堵塞之製造方法。 一種散熱裝置之製造方法，包括如下步驟： 基座複數散熱鰭片、複數薄片及焊接劑，其 令該基座具有焊接面’焊接面上同時設有複數上下貫穿之 孔，該散熱鰭片具有焊接部； 將上述;㈣地#附在基座之焊接面上以覆蓋該貫 穿孔； 塗附該焊接劑於基座之焊接面與散熱籍片之焊接部之 間’並組裝整個散熱裝置； 加熱該放熱裝置，使焊接劑熔融塗布於基座之焊接面 及散熱鰭片之焊接部； 冷卻該散熱裝置，通過焊接劑冷卻凝固使基座、散熱 鰭片緊密烊接在一起。 … 與習知技術相比，本發明散熱裝置之製造方法通過在 基座之貝牙孔上貼附耐高溫薄片，以避免錫膏進入貫穿孔 發生堵塞操作簡便易於實施。 【實施方式】 清參閱圖1至圖3,本發明提供一種散熱裝置之製造方 法’主要步驟包括： (一）備置該散熱裝置之基座1〇、二熱管2〇、複數散熱 鰭片30、複數薄片4〇以及焊接劑（圖未示），其中該焊接劑 具有助焊劑（如松香）用以輔助焊接； 1327458 該基座1〇呈-板狀體，其底面為光滑平面，盘 =圖未示)表面接觸。該基座10上表面為谭接面、15，1 二容置熱管20之凹槽12，該二凹槽。縱向延伸: 構月平行且鄰接，末端分叉，共同形成-“γ”狀結 基板1G上設有貫料接面15與下表面之帶有内螺紋 之四貝穿孔14’以供螺絲(圖未示)將其螺鎖固定於電子元 熱管20之橫截面大致呈橢圓形，其形狀與凹槽u對 應呈n 包括靠近之吸熱段21及連接吸敎段 ::開之放熱段22。熱管20置於凹槽12内後，其上表面 /、基座ίο上表面平齊。其中熱管2〇之吸熱段21置於貫穿 孔14之中間以接近電子元件，放熱段22離電子元件較遠。 薄片40由耐高溫材料組成，以克服焊接過程中高溫之 影響。薄片40形狀不限，在本實施例中大致呈正方^二薄 片40 —表面帶有粘性，以牢固粘附在基座⑺之貫穿孔I# 之上，防止焊接過程中焊接劑流入貫穿孔14内引起堵塞。 每一散熱鰭片30為一片狀金屬體，各散熱鰭片3〇相 互平行並垂直於基座1〇上表面，並於其底部彎折形成複數 平行基座10之折緣，以形成散熱鰭片3〇之谭接部％。該 散熱鰭片30橫向垂直熱管20放置。 (一）將薄片40牢固地粘附在基座谭接面上，並 使薄片40覆蓋於貫穿孔14上； (三）組裝該散熱裝置，在基座10之焊接面15及基座 1327458 10之凹槽12表面塗抹糊狀之焊接劑，然後將熱管20對應 放置於凹槽12内，並在熱管20上表面也塗抹焊接劑後將 散熱鰭片30放置於基座1〇及熱管2〇上； (四） 對該組裝後之散熱裝置進行加熱，使焊接劑熔融塗 布於基座10、熱管20、散熱鰭片3〇之間； (五） 冷卻該散熱裝置，焊接劑冷卻凝固即可將熱管20 焊接至凹槽12内、將散熱鰭片3〇緊密焊接於基座1〇及熱 官20表面。 至此，本發明散熱裝置之製造過程完畢，最後基座上 形成了 /米度與基座相專之孔，孔之開口朝下，便於螺絲從 下方旋入。 與習知技術相比，該散熱裝置之製造方法使用薄片4〇 粘附於貫穿孔14上有效避免了在焊接過程中焊接劑流入貫 穿孔14中，由此在焊接之前不需在貫穿孔14内預先安裝 螺絲，從㈣免了在焊接前安裝螺絲以及焊接後拆卸螺絲 之繁靖過程，操作簡便易於實施，並保證了散_片如與 基座10之平穩焊接，使整個散熱裝置焊接後牢固緊靠。 綜上所述，本發明符合發明專利要件， 利申請。#’以上所述者僅為本發明之較佳實施例，舉凡 熟悉本案技藝之人士，在爰依本發明精神所作之等效修飾 或變化，皆應涵蓋於以下之申請專利範圍内。 少 【圖式簡單說明】 圖1係本發明散熱裝置之立體分解圖。 1327458 圖2係圖1散熱裝置之局部組合圖。 圖3係圖1散熱裝置之組合圖。 【主要元件符號說明】 基座 10 凹槽 12 貫穿孔 14 焊接面 15 埶管 20 吸熱段 21 放熱段 22 散熱鰭片 30 焊接部 33 薄片 401327458 IX. Description of the Invention: [Technical Field of the Invention] The invention relates to a method of manufacturing a heat dissipating device, particularly to a method of manufacturing a heat dissipating device for an electronic 7L member. [Prior Art] With the rapid development of the electronics industry, the computer central processing system is getting faster and faster, and the heat generated by it is also increasing rapidly. "U = 丨 can not be discharged in time, which will seriously affect the operation of the central processing unit. Second = right For this reason, the industry usually installs a combination of a heat sink fan and a heat sink on the top surface of the central processor to assist in the discharge of heat, so as to ensure that the sound is working properly at an appropriate temperature. The heat sink often includes a heat-dissipating Korean film attached to the central processing and soldered on the base, and a hole is arranged in the base to fix the heat-dissipating farm to the central processor, and the soldering of the I-seat and the heat-dissipating (four) (4) The through hole is blocked, affecting the dispersion of the four (4). The tin and the rosin π, ί Γ t is insufficient. The industry uses the screw to lock the screw before the splicing, the earth seat / the heat sink fins are connected. In the future, the soil raft vortex 忐 忐 Qiushan 1 夂 π 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 Deeper, will wear the surface of the seat will be the heat sink fin The top of the sheet affects the heat transfer of the pedestal and the heat sink fins. [Invention] The present invention provides a manufacturing method that is easy to operate, easy to implement, and used to avoid clogging of the bumps of the device. The manufacturing method includes the following steps: a plurality of radiant fins, a plurality of lamellas, and a soldering agent, wherein the pedestal has a soldering surface, and the soldering surface is provided with a plurality of upper and lower through holes, the heat dissipating fins having a soldering portion; Attaching the above (4) ground # to the soldering surface of the pedestal to cover the through hole; coating the solder between the soldering surface of the pedestal and the soldering portion of the heat sinking piece' and assembling the entire heat dissipating device; heating the heat radiating The device melts and applies the solder to the soldering surface of the pedestal and the soldering portion of the heat dissipating fin; and cools the heat dissipating device to cool and solidify by the soldering agent, so that the pedestal and the heat dissipating fin are closely spliced together. The method for manufacturing the heat dissipating device of the present invention is simple and easy to implement by attaching a high temperature resistant sheet to the bead opening of the pedestal to prevent the solder paste from entering the through hole. Referring to FIG. 1 to FIG. 3, the present invention provides a method for manufacturing a heat dissipating device. The main steps include: (1) preparing a base 1 〇, 2 heat pipes 2 〇, a plurality of heat radiating fins 30, and a plurality of thin plates of the heat dissipating device; 4〇 and a soldering agent (not shown), wherein the solder has a flux (such as rosin) to assist the welding; 1327458 The base 1 is a plate-shaped body, the bottom surface of which is a smooth plane, the disk = the figure is not shown The surface of the base 10 is a tanned surface, 15 and 1 a recess 12 for accommodating the heat pipe 20. The two grooves are longitudinally extended: the structural moon is parallel and adjacent, and the ends are bifurcated to form a joint - " The γ" junction substrate 1G is provided with a four-hole perforation 14' with an internal thread 15 and a lower surface for a screw (not shown) to be screwed to the cross section of the electron heat pipe 20. It has an elliptical shape, and its shape corresponds to the groove u. The n includes an endothermic section 21 and a connecting suction section: an open heat release section 22. After the heat pipe 20 is placed in the recess 12, the upper surface / the base ίο upper surface is flush. The heat absorbing section 21 of the heat pipe 2 is placed in the middle of the through hole 14 to approach the electronic component, and the heat releasing section 22 is far from the electronic component. Sheet 40 is comprised of a high temperature resistant material to overcome the effects of high temperatures during the soldering process. The shape of the sheet 40 is not limited. In the present embodiment, the sheet 40 is substantially square and has a surface which is adhesively adhered to the through hole I# of the base (7) to prevent the solder from flowing into the through hole 14 during the soldering process. Causing a blockage inside. Each of the heat dissipation fins 30 is a piece of metal body, and the heat dissipation fins 3 are parallel to each other and perpendicular to the upper surface of the base 1 and are bent at the bottom thereof to form a folded edge of the plurality of parallel bases 10 to form heat dissipation. % of the fins of the fins. The heat sink fins 30 are placed transversely to the heat pipe 20. (1) firmly attaching the sheet 40 to the base of the base and covering the through hole 14; (3) assembling the heat sink, the welding surface 15 of the base 10 and the base 1327458 10 The surface of the groove 12 is coated with a paste-like solder, and then the heat pipe 20 is correspondingly placed in the groove 12, and the heat-dissipating fins 30 are placed on the base 1 and the heat pipe 2 after the upper surface of the heat pipe 20 is also coated with a soldering agent. (4) heating the assembled heat dissipating device to melt the coating agent between the susceptor 10, the heat pipe 20, and the heat dissipating fins 3; (5) cooling the heat dissipating device, and the soldering agent can be cooled and solidified. The heat pipe 20 is welded into the groove 12, and the heat radiating fins 3 are tightly welded to the surface of the base 1 and the heat 20 . At this point, the manufacturing process of the heat dissipating device of the present invention is completed, and finally, the hole of the /meter degree and the base is formed on the base, and the opening of the hole faces downward, so that the screw is screwed from below. Compared with the prior art, the manufacturing method of the heat dissipating device uses the sheet 4〇 to adhere to the through hole 14 to effectively prevent the solder from flowing into the through hole 14 during the soldering process, thereby eliminating the need for the through hole 14 before soldering. Pre-installed screws, from (4) to avoid the installation of screws before welding and the process of disassembling the screws after welding, the operation is simple and easy to implement, and the smooth welding of the scattered sheet and the base 10 is ensured, so that the entire heat sink is welded. Firmly close. In summary, the present invention meets the requirements of the invention patent, and the application is made. The above is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art will be included in the following claims. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is an exploded perspective view of a heat sink of the present invention. 1327458 Figure 2 is a partial combination diagram of the heat sink of Figure 1. Figure 3 is a combination diagram of the heat sink of Figure 1. [Main component symbol description] Base 10 Groove 12 Through hole 14 Welding surface 15 Tube 20 Heat absorption section 21 Heat release section 22 Heat sink fin 30 Welded part 33 Sheet 40