JP2003236657A - Chip for soldering iron - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a soldering chip which can demonstrate excellent service life even to a lead-free solder. <P>SOLUTION: Chips (10, 20, 30 and 40) comprise base chip materials (11, 21, 31 and 41) and soldering members (13, 22, 32 and 42) fixed to tip sides of the base chip materials. The base chip materials are formed of a material having high heat conductivity, the soldering members are formed of a material having heat resistance and tin erosion resistance, and soldering materials (15, 23, 33 and 43) are plated at least on a surface of a part to be soldered out of the soldering members. The soldering members are fixed to the base chip materials by using fitting, joining or thermal spraying. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a soldering iron chip, and more particularly to a chip capable of exhibiting an excellent life even with lead-free solder.

[0002]

2. Description of the Related Art For example, when assembling electronic equipment, various electronic components and wirings are often soldered to an electronic substrate using a soldering iron. In such a soldering iron, a method is widely adopted in which a tip side chip is heated by a heating heater or the like, the tip is brought into contact with a land or a work of an electronic substrate to melt the solder, and the chip is separated to solidify the solder.

A chip made of a copper-based material has been used in the soldering iron as described above in consideration of heat conduction efficiency. Plating a plating layer of a metal-based material, and further plating a solder material on the surface of the portion of the iron plating layer to be soldered,
Chips plated with chrome or hard chrome have been used for other parts.

Recently, environmental pollution caused by lead has become a serious problem, and tin-based solder, so-called lead-free solder, tends to be adopted in place of lead-tin-based eutectic solder.

[0005]

However, although a conventional soldering iron chip has a reasonable chip life for a lead-tin based eutectic solder, it does not operate at a high temperature for lead-free solder. Corrosion and wear of tin became remarkable, the life of the chip was very short, and when the number of times of soldering was large, it was necessary to replace the chip in about one day.

In this situation, it is an object of the present invention to provide a soldering iron chip which has an excellent life even with lead-free solder.

[0007]

Therefore, a chip for a soldering iron according to the present invention is a chip for a soldering iron in which a tip side chip is heated by a heat generating means and soldering is performed by the heat of the chip. It is composed of a chip base material and a soldering member fixed to the tip side of the chip base material, and a material with high thermal conductivity is used for the chip base material, while the soldering member has heat resistance and tin erosion resistance. And a solder material is plated on the surface of at least the portion to be soldered of the soldering member.

One of the features of the present invention is that a soldering member is fixed to a chip base material, a heat resistant and tin erosion resistant material is used for the soldering member, and the solder material is plated on the surface thereof. In point.

As a result, even when used in soldering using lead-free solder, the corrosion of tin on the chip at high temperatures is small and the heat resistance is excellent, so that the chip life can be greatly extended.

Further, since the soldering member is fixed to the tip side of the chip base material having thermal conductivity, heat smoothly flows from the chip base material to the soldering member, ensuring high thermal conductivity and smoothing. It can guarantee good soldering workability.

The chip base material and the soldering member may be fixed by fitting or joining. For example, the soldering member may be processed into the shape on the tip end side of the chip to form irregularities that can be engaged with the soldering member and the chip base material, and they may be fitted to each other. Further, the chip base material and the soldering member should be joined by brazing of silver, joining by amalgamation of gold or silver, or joining by heat welding, thermocompression bonding, ultrasonic joining, laser welding, arc welding, etc. You can also

Further, the soldering member can be fixed to the chip base material by utilizing thermal spraying. That is, the soldering member may be fixed to the chip base material by processing the heat resistant and tin erosion resistant material into a predetermined shape after being sprayed.

The material of the chip base material is not particularly limited as long as it is a material having high thermal conductivity, and the material of the soldering member is heat resistant and tin erosion resistant.
According to the trial production by the present inventors, the chip base material is a copper-based material,
Aluminum-based materials, molybdenum-based materials, iron-based materials and stainless-based materials for soldering members (for example, SUS3
04, 316, 430, 403, 413, 310S, etc.), titanium-based materials (titanium or titanium alloys), inconel, hastelloy, ceramic-based materials (alumina, other ceramics). Has been confirmed.

Further, as in the case of the conventional chip, the surface of the chip base material is plated with an iron-based material, and the part of the chip that is not involved in soldering is plated with chromium or hard chrome as required. Good.

In order to ensure high thermal conductivity, the surface of the portion of the chip base material that is fitted or joined to the soldering member is plated with nickel-based material, tin-based material or gold material. Good.

Further, in the case of joining by thermal spraying, the surface of the chip base material to be sprayed is subjected to surface roughening treatment, for example, shot blasting, and then a gold material is plated. be able to.

The chip of the present invention can be applied not only to general soldering but also to correction of soldering and soldering. In that sense, the term "soldering" in the claims should be construed to include correction of soldering and soldering.

[0018]

BEST MODE FOR CARRYING OUT THE INVENTION The present invention will be described in detail below with reference to specific examples shown in the drawings. FIG. 1 shows a preferred embodiment of a soldering chip according to the present invention. The chip 10 of this example is configured by fixing the chip base material 11 and the soldering member 13 by fitting.

The chip base material 11 is made of pure copper (other materials may be used) in a predetermined shape, and the soldering member 13 is made of SUS304 (or 316) stainless steel material in a predetermined shape. Has been done. Further, a recess 12 is formed on the tip side of the chip base material 11, and the soldering member 1
The protrusion 14 is formed on the rear end side of the chip 3, and the protrusion 14 of the soldering member 13 is fitted in the recess 12 of the chip base material 11.

Further, the solder material 15 is plated on the surface of the soldering portion of the soldering member 13 on the tip end side, and the surface of the portion of the chip base material 11 and the soldering member 13 not related to soldering is chromium. Or hard chrome is plated.

FIG. 2 shows a second embodiment. In the chip 20 of this example, after spraying SUS304 (or 316),
The soldering member 22 is manufactured by processing into a predetermined shape, and this is joined to the tip of the chip base material 21 made of pure copper by silver brazing (may be gold or silver amalgamation). If necessary, consolidation processing may be performed after thermal spraying, or iron plating may be performed.

The solder material 23 is plated on the surface of the soldering member 22 on the tip side thereof, and the surface of the chip base material 21 is plated with chrome or hard chrome.

FIG. 3 shows a third embodiment. In the chip 30 of this example, SUS30 is attached to the tip of the chip base material 31 made of pure copper.
After spraying 4 (or 316), the soldering member 32 is fixed to the chip base material 31 by processing into a predetermined shape. The surface of the chip base material 31 to be sprayed may be subjected to treatment such as shot blasting and then plated with gold.

A solder material 33 is plated on the surface of the soldering portion 32 on the tip side of the soldering member 32, and chromium or hard chromium is plated on the surface of the chip base material 21.

FIG. 4 shows a fourth embodiment. In the chip 40 of this example, the soldering member 42 is fixed to the chip base material 41 by spraying a ceramic material onto the tip of a pure copper chip base material 41 and then processing it into a predetermined shape.

The solder material 43 is plated on the surface of the soldering member 42 on the tip side thereof, and the surface of the chip base material 21 is plated with chrome or hard chrome.

[Brief description of drawings]

FIG. 1 is a perspective view showing a preferred embodiment of a soldering iron chip according to the present invention.

FIG. 2 is a perspective view showing a second embodiment.

FIG. 3 is a perspective view showing a third embodiment.

FIG. 4 is a perspective view showing a fourth embodiment.

[Explanation of symbols]

10, 20, 30, 40 chips 11, 21, 31, 41 Chip base material 13, 22, 32, 42 Soldering member 15, 23, 33, 43 Solder plating part

   ─────────────────────────────────────────────────── ─── Continued front page    (71) Applicant 502057946             Masahiko Ishikawa             220-3 Miyagami-cho, Himeji City, Hyogo Prefecture (72) Inventor Kensei Matsubara             Hyogo prefecture Himeji city new house 4-6 (72) Inventor Satoshi Kusuda             15-1 Yurinoki-dori, Okubo-cho, Akashi-shi, Hyogo             Number 1 East Square III 1106 (72) Inventor Kazuo Urata             665-187 Gose Town, Nishiwaki City, Hyogo Prefecture (72) Inventor Masahiko Ishikawa             220-3 Miyagami-cho, Himeji City, Hyogo Prefecture F-term (reference) 5E319 AA01 AC01 CC54 GG15

Claims (6)

[Claims] 1. A chip for a soldering iron, wherein a tip side chip is heated by a heat generating means and soldered by the heat of the chip, comprising: a chip base material; and a soldering member fixed to the tip side of the chip base material. While the chip base material is made of a material having high thermal conductivity, the soldering member is made of a heat resistant and tin erosion resistant material, and at least soldering of the soldering member is performed. A soldering iron chip characterized in that the surface of the portion to be soldered is plated with a solder material. 2. The chip for a soldering iron according to claim 1, wherein the soldering member is fixed to the chip base material by fitting or joining. 3. The chip for a soldering iron according to claim 1, wherein the soldering member is fixed to the chip base material by processing the heat resistant and tin erosion resistant material into a predetermined shape after thermal spraying. 4. The chip base material is made of a copper-based material, an aluminum-based material, or a molybdenum-based material, and the soldering member is an iron-based material, a stainless-based material, a titanium-based material, Inconel, Hastelloy, or a ceramic-based material. The soldering iron chip according to any one of claims 1 to 3, which is manufactured using a material. 5. The chip for a soldering iron according to claim 1, wherein an iron-based material is plated on the surface of the chip base material. 6. The nickel-based material, the tin-based material, or the gold material is plated on the surface of the portion of the chip base material that is fitted or joined to the soldering member. The described soldering chip.