PL428192A1 - Method of joining titanium and titanium alloys with copper and copper alloys by soft soldering - Google Patents
Method of joining titanium and titanium alloys with copper and copper alloys by soft solderingInfo
- Publication number
- PL428192A1 PL428192A1 PL428192A PL42819218A PL428192A1 PL 428192 A1 PL428192 A1 PL 428192A1 PL 428192 A PL428192 A PL 428192A PL 42819218 A PL42819218 A PL 42819218A PL 428192 A1 PL428192 A1 PL 428192A1
- Authority
- PL
- Poland
- Prior art keywords
- copper
- titanium
- alloys
- joining
- soft soldering
- Prior art date
Links
Abstract
Przedmiotem zgłoszenia jest sposób łączenia tytanu i stopów tytanu z miedzią i stopami miedzi metodą lutowania miękkiego. Połączenia tego typu stosowane są w aplikacjach, w których wymagane jest połączenie właściwości dobrze przewodzącej ciepło i prąd miedzi z bardzo wytrzymałym tytanem i mogą być stosowane w wielu dziedzinach przemysłu m.in. w astronautyce, budowie statków. Oprócz dobrej przewodności cieplnej i elektrycznej połączenia tych metali charakteryzują się dużą odpornością na zużycie i odpornością na korozję. Sposób łączenia tytanu lub stopów tytanu z miedzią lub stopami miedzi przy użyciu spoiwa w postaci lutu, w procesie lutowania miękkiego w temperaturze w zakresie 190 ÷ 250°C charakteryzuje się tym, że przed wytworzeniem trwałego połączenia lutowanego miękkiego materiałów (1, 2) na uprzednio odtłuszczoną oraz oczyszczoną z tlenków, powierzchnię jednego z materiałów (1) nanosi się metodą natryskiwania cieplnego warstwę metaliczną z proszku metalu, która po procesie natryskiwania tworzy, naniesioną na tym metalu (1), warstwę metaliczną (3), przy czym przed wytworzeniem trwałego połączenia lutowanego warstwę metaliczną (3) oraz powierzchnię materiału (2) pokrywa się topnikiem (4).The subject of the application is a method of joining titanium and titanium alloys with copper and copper alloys by soft soldering. Connections of this type are used in applications where it is required to combine the properties of good heat and current conductivity of copper with very durable titanium and can be used in many industries, including in astronautics, shipbuilding. In addition to good thermal and electrical conductivity, the combinations of these metals are characterized by high wear resistance and corrosion resistance. The method of joining titanium or titanium alloys with copper or copper alloys using a binder in the form of solder, in the soft soldering process at a temperature in the range of 190 ÷ 250 ° C, is characterized by the fact that before creating a permanent soft soldered connection of materials (1, 2) on previously the surface of one of the materials (1) degreased and cleaned of oxides is applied by thermal spraying to a metal layer made of metal powder, which after the spraying process forms a metal layer (3) applied to the metal (1), but before creating a permanent bond the metal layer (3) and the surface of the material (2) are covered with flux (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PL428192A PL428192A1 (en) | 2018-12-17 | 2018-12-17 | Method of joining titanium and titanium alloys with copper and copper alloys by soft soldering |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PL428192A PL428192A1 (en) | 2018-12-17 | 2018-12-17 | Method of joining titanium and titanium alloys with copper and copper alloys by soft soldering |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| PL428192A1 true PL428192A1 (en) | 2020-06-29 |
Family
ID=71124785
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PL428192A PL428192A1 (en) | 2018-12-17 | 2018-12-17 | Method of joining titanium and titanium alloys with copper and copper alloys by soft soldering |
Country Status (1)
| Country | Link |
|---|---|
| PL (1) | PL428192A1 (en) |
-
2018
- 2018-12-17 PL PL428192A patent/PL428192A1/en unknown
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