TWI270196B - Integrated circuit - Google Patents
Integrated circuit Download PDFInfo
- Publication number
- TWI270196B TWI270196B TW091116270A TW91116270A TWI270196B TW I270196 B TWI270196 B TW I270196B TW 091116270 A TW091116270 A TW 091116270A TW 91116270 A TW91116270 A TW 91116270A TW I270196 B TWI270196 B TW I270196B
- Authority
- TW
- Taiwan
- Prior art keywords
- decoding
- circuit
- line
- semiconductor wafer
- address
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 claims abstract description 36
- 235000012431 wafers Nutrition 0.000 description 46
- 230000002079 cooperative effect Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 1
- 230000000875 corresponding effect Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/0203—Particular design considerations for integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/528—Geometry or layout of the interconnection structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Semiconductor Integrated Circuits (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001220875A JP2003037170A (ja) | 2001-07-23 | 2001-07-23 | 集積回路 |
Publications (1)
Publication Number | Publication Date |
---|---|
TWI270196B true TWI270196B (en) | 2007-01-01 |
Family
ID=19054632
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW091116270A TWI270196B (en) | 2001-07-23 | 2002-07-22 | Integrated circuit |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP2003037170A (ko) |
KR (1) | KR100849963B1 (ko) |
CN (1) | CN1298053C (ko) |
TW (1) | TWI270196B (ko) |
WO (1) | WO2003010818A1 (ko) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20100040580A (ko) | 2008-10-10 | 2010-04-20 | 성균관대학교산학협력단 | 적층 메모리 소자 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02207567A (ja) * | 1989-02-07 | 1990-08-17 | Hitachi Ltd | 半導体集積回路及びその製造方法 |
US5761694A (en) * | 1995-11-30 | 1998-06-02 | Cirrus Logic, Inc. | Multi-bank memory system and method having addresses switched between the row and column decoders in different banks |
US5941980A (en) * | 1996-08-05 | 1999-08-24 | Industrial Technology Research Institute | Apparatus and method for parallel decoding of variable-length instructions in a superscalar pipelined data processing system |
JP4601737B2 (ja) * | 1998-10-28 | 2010-12-22 | 株式会社東芝 | メモリ混載ロジックlsi |
JP2000251496A (ja) * | 1999-02-23 | 2000-09-14 | Hitachi Ltd | 半導体集積回路装置 |
JP2000347890A (ja) | 1999-06-02 | 2000-12-15 | Nec Corp | 半導体装置のテストパタン生成方法およびテストパタン生成装置 |
JP2001077311A (ja) * | 1999-09-06 | 2001-03-23 | Sharp Corp | 半導体装置 |
-
2001
- 2001-07-23 JP JP2001220875A patent/JP2003037170A/ja active Pending
-
2002
- 2002-07-10 CN CNB028024761A patent/CN1298053C/zh not_active Expired - Fee Related
- 2002-07-10 WO PCT/JP2002/006971 patent/WO2003010818A1/ja active Application Filing
- 2002-07-10 KR KR1020037003925A patent/KR100849963B1/ko not_active IP Right Cessation
- 2002-07-22 TW TW091116270A patent/TWI270196B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
CN1465102A (zh) | 2003-12-31 |
JP2003037170A (ja) | 2003-02-07 |
KR20040030412A (ko) | 2004-04-09 |
CN1298053C (zh) | 2007-01-31 |
KR100849963B1 (ko) | 2008-08-01 |
WO2003010818A1 (en) | 2003-02-06 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |