TWI268517B - Thermistor with positive temperature coefficient and its manufacturing method having high-polymer base body with alkene series high-polymer compound that has a melting temperature 85 to 95 DEG C - Google Patents
Thermistor with positive temperature coefficient and its manufacturing method having high-polymer base body with alkene series high-polymer compound that has a melting temperature 85 to 95 DEG CInfo
- Publication number
- TWI268517B TWI268517B TW092102516A TW92102516A TWI268517B TW I268517 B TWI268517 B TW I268517B TW 092102516 A TW092102516 A TW 092102516A TW 92102516 A TW92102516 A TW 92102516A TW I268517 B TWI268517 B TW I268517B
- Authority
- TW
- Taiwan
- Prior art keywords
- polymer
- base body
- thermistor
- temperature coefficient
- polymer base
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
- H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
- H01C17/06506—Precursor compositions therefor, e.g. pastes, inks, glass frits
- H01C17/06573—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the permanent binder
- H01C17/06586—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the permanent binder composed of organic material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
- H01C7/027—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient consisting of conducting or semi-conducting material dispersed in a non-conductive organic material
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Electromagnetism (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Thermistors And Varistors (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002032906 | 2002-02-08 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200307956A TW200307956A (en) | 2003-12-16 |
TWI268517B true TWI268517B (en) | 2006-12-11 |
Family
ID=27677985
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW092102516A TWI268517B (en) | 2002-02-08 | 2003-02-07 | Thermistor with positive temperature coefficient and its manufacturing method having high-polymer base body with alkene series high-polymer compound that has a melting temperature 85 to 95 DEG C |
Country Status (6)
Country | Link |
---|---|
US (1) | US7368069B2 (zh) |
EP (1) | EP1484772B1 (zh) |
CN (1) | CN100433203C (zh) |
DE (1) | DE60325705D1 (zh) |
TW (1) | TWI268517B (zh) |
WO (1) | WO2003067613A1 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI384622B (zh) * | 2007-01-25 | 2013-02-01 | Alpha & Omega Semiconductor | 自我保護之功率元件結構及製造方法 |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6620343B1 (en) * | 2002-03-19 | 2003-09-16 | Therm-O-Disc Incorporated | PTC conductive composition containing a low molecular weight polyethylene processing aid |
CN102082016B (zh) * | 2009-11-26 | 2012-07-04 | 比亚迪股份有限公司 | 一种正温度系数热敏电阻及其制备方法 |
CN105981114B (zh) * | 2014-02-06 | 2018-05-04 | 国立研究开发法人科学技术振兴机构 | 温度传感器用树脂组合物、温度传感器用元件、温度传感器及温度传感器用元件的制造方法 |
TW201604901A (zh) * | 2014-07-30 | 2016-02-01 | 聚鼎科技股份有限公司 | 正溫度係數元件 |
CN111397752A (zh) * | 2020-04-16 | 2020-07-10 | 德州尧鼎光电科技有限公司 | 液体电导可调温度传感器 |
EP3913592B1 (en) * | 2020-05-22 | 2024-06-26 | Carrier Corporation | Heat detection device for a fire alarm |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4545926A (en) * | 1980-04-21 | 1985-10-08 | Raychem Corporation | Conductive polymer compositions and devices |
JPH0799721B2 (ja) * | 1986-09-13 | 1995-10-25 | 日本メクトロン株式会社 | Ptc組成物の製造法 |
JP2897344B2 (ja) | 1990-05-23 | 1999-05-31 | 住友化学工業株式会社 | 熱可塑性樹脂組成物 |
JP3219481B2 (ja) | 1992-09-07 | 2001-10-15 | ティーディーケイ株式会社 | 有機質正特性サーミスタ |
US5582770A (en) * | 1994-06-08 | 1996-12-10 | Raychem Corporation | Conductive polymer composition |
CA2215903A1 (en) * | 1995-03-22 | 1996-10-03 | Raychem Corporation | Conductive polymer composition and device |
JP2810351B2 (ja) | 1995-09-27 | 1998-10-15 | ティーディーケイ株式会社 | 有機質正特性サーミスタ |
JP3268249B2 (ja) | 1996-11-28 | 2002-03-25 | ティーディーケイ株式会社 | 有機質正特性サーミスタ |
JP3701113B2 (ja) * | 1997-12-04 | 2005-09-28 | Tdk株式会社 | 有機質正特性サーミスタ |
JP3506628B2 (ja) | 1998-06-24 | 2004-03-15 | Tdk株式会社 | 有機質正特性サーミスタの製造方法 |
JP2000124003A (ja) * | 1998-10-13 | 2000-04-28 | Matsushita Electric Ind Co Ltd | チップ形ptcサーミスタおよびその製造方法 |
US6299801B1 (en) * | 1998-11-02 | 2001-10-09 | Tdk Corporation | Organic positive temperature coefficient thermistor |
JP2001052901A (ja) | 1999-08-05 | 2001-02-23 | Tdk Corp | チップ型有機質正特性サーミスタとその製造方法 |
JP3896232B2 (ja) * | 1999-10-01 | 2007-03-22 | Tdk株式会社 | 有機質正特性サーミスタおよびその製造方法 |
JP2000133502A (ja) | 1999-11-08 | 2000-05-12 | Tdk Corp | 有機質正特性サ―ミスタ |
JP2000133503A (ja) | 1999-11-08 | 2000-05-12 | Tdk Corp | 有機質正特性サ―ミスタの製造方法 |
-
2003
- 2003-02-07 DE DE60325705T patent/DE60325705D1/de not_active Expired - Lifetime
- 2003-02-07 TW TW092102516A patent/TWI268517B/zh not_active IP Right Cessation
- 2003-02-07 EP EP03737503A patent/EP1484772B1/en not_active Expired - Fee Related
- 2003-02-07 US US10/503,618 patent/US7368069B2/en not_active Expired - Fee Related
- 2003-02-07 WO PCT/JP2003/001300 patent/WO2003067613A1/ja active Application Filing
- 2003-02-07 CN CNB03807740XA patent/CN100433203C/zh not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI384622B (zh) * | 2007-01-25 | 2013-02-01 | Alpha & Omega Semiconductor | 自我保護之功率元件結構及製造方法 |
Also Published As
Publication number | Publication date |
---|---|
US20050116808A1 (en) | 2005-06-02 |
EP1484772A4 (en) | 2006-02-08 |
EP1484772A1 (en) | 2004-12-08 |
CN1647217A (zh) | 2005-07-27 |
CN100433203C (zh) | 2008-11-12 |
EP1484772B1 (en) | 2009-01-07 |
WO2003067613A1 (fr) | 2003-08-14 |
TW200307956A (en) | 2003-12-16 |
US7368069B2 (en) | 2008-05-06 |
DE60325705D1 (en) | 2009-02-26 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |