TWI268199B - Polishing system comprising a highly branched polymer - Google Patents

Polishing system comprising a highly branched polymer

Info

Publication number
TWI268199B
TWI268199B TW093141179A TW93141179A TWI268199B TW I268199 B TWI268199 B TW I268199B TW 093141179 A TW093141179 A TW 093141179A TW 93141179 A TW93141179 A TW 93141179A TW I268199 B TWI268199 B TW I268199B
Authority
TW
Taiwan
Prior art keywords
polishing system
branched polymer
highly branched
polishing
polymer
Prior art date
Application number
TW093141179A
Other languages
English (en)
Other versions
TW200531787A (en
Inventor
Kevin J Moeggenborg
Fred F Sun
Original Assignee
Cabot Microelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cabot Microelectronics Corp filed Critical Cabot Microelectronics Corp
Publication of TW200531787A publication Critical patent/TW200531787A/zh
Application granted granted Critical
Publication of TWI268199B publication Critical patent/TWI268199B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
TW093141179A 2004-01-09 2004-12-29 Polishing system comprising a highly branched polymer TWI268199B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/755,154 US7255810B2 (en) 2004-01-09 2004-01-09 Polishing system comprising a highly branched polymer

Publications (2)

Publication Number Publication Date
TW200531787A TW200531787A (en) 2005-10-01
TWI268199B true TWI268199B (en) 2006-12-11

Family

ID=34739520

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093141179A TWI268199B (en) 2004-01-09 2004-12-29 Polishing system comprising a highly branched polymer

Country Status (11)

Country Link
US (1) US7255810B2 (zh)
EP (1) EP1702015B1 (zh)
JP (1) JP5006048B2 (zh)
KR (1) KR101049981B1 (zh)
CN (1) CN1906260A (zh)
AT (1) ATE444342T1 (zh)
DE (1) DE602005016887D1 (zh)
IL (1) IL176312A (zh)
MY (1) MY142089A (zh)
TW (1) TWI268199B (zh)
WO (1) WO2005071031A1 (zh)

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US20070077865A1 (en) * 2005-10-04 2007-04-05 Cabot Microelectronics Corporation Method for controlling polysilicon removal
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JP6101421B2 (ja) * 2010-08-16 2017-03-22 インテグリス・インコーポレーテッド 銅または銅合金用エッチング液
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MY178806A (en) * 2013-05-15 2020-10-20 Basf Se Chemical-mechanical polishing compositions comprising polyethylene imine
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US20150104940A1 (en) 2013-10-11 2015-04-16 Air Products And Chemicals Inc. Barrier chemical mechanical planarization composition and method thereof
JP6435689B2 (ja) * 2014-07-25 2018-12-12 Ａｇｃ株式会社 研磨剤と研磨方法、および研磨用添加液
JP6947827B2 (ja) 2016-09-23 2021-10-13 サン−ゴバン セラミックス アンド プラスティクス，インコーポレイティドＳａｉｎｔ−Ｇｏｂａｉｎ Ｃｅｒａｍｉｃｓ Ａｎｄ Ｐｌａｓｔｉｃｓ， Ｉｎｃ． 化学的機械的平坦化スラリーおよびその形成方法
JP2018074048A (ja) * 2016-10-31 2018-05-10 花王株式会社 シリコンウェーハ用研磨液組成物
US20210260603A1 (en) 2018-07-04 2021-08-26 Basf Se Iron chelators as activators in alkaline flotation circuits
CN112714787B (zh) * 2019-03-22 2022-08-19 株式会社大赛璐 半导体布线研磨用组合物
KR20220130543A (ko) * 2021-03-18 2022-09-27 삼성에스디아이 주식회사 텅스텐 패턴 웨이퍼 연마용 cmp 슬러리 조성물 및 이를 이용한 텅스텐 패턴 웨이퍼의 연마 방법
KR20220130544A (ko) * 2021-03-18 2022-09-27 삼성에스디아이 주식회사 텅스텐 패턴 웨이퍼 연마용 cmp 슬러리 조성물 및 이를 이용한 텅스텐 패턴 웨이퍼의 연마 방법
KR20230028826A (ko) * 2021-08-23 2023-03-03 삼성에스디아이 주식회사 텅스텐 패턴 웨이퍼 연마용 ｃｍｐ 슬러리 조성물 및 이를 이용한 텅스텐 패턴 웨이퍼의 연마 방법

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Also Published As

Publication number Publication date
KR101049981B1 (ko) 2011-07-19
IL176312A (en) 2010-11-30
CN1906260A (zh) 2007-01-31
KR20060121292A (ko) 2006-11-28
JP5006048B2 (ja) 2012-08-22
IL176312A0 (en) 2006-10-05
EP1702015A1 (en) 2006-09-20
MY142089A (en) 2010-09-15
TW200531787A (en) 2005-10-01
US20050150598A1 (en) 2005-07-14
US7255810B2 (en) 2007-08-14
JP2007519783A (ja) 2007-07-19
ATE444342T1 (de) 2009-10-15
WO2005071031A1 (en) 2005-08-04
DE602005016887D1 (de) 2009-11-12
EP1702015B1 (en) 2009-09-30

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