TWI266771B - Polymer compound, positive resist composition and process for forming resist pattern - Google Patents

Polymer compound, positive resist composition and process for forming resist pattern

Info

Publication number
TWI266771B
TWI266771B TW094134016A TW94134016A TWI266771B TW I266771 B TWI266771 B TW I266771B TW 094134016 A TW094134016 A TW 094134016A TW 94134016 A TW94134016 A TW 94134016A TW I266771 B TWI266771 B TW I266771B
Authority
TW
Taiwan
Prior art keywords
polymer compound
resist pattern
forming
resist composition
positive resist
Prior art date
Application number
TW094134016A
Other languages
English (en)
Other versions
TW200624446A (en
Inventor
Toshiyuki Ogata
Syogo Matsumaru
Hideo Hada
Original Assignee
Tokyo Ohka Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Ohka Kogyo Co Ltd filed Critical Tokyo Ohka Kogyo Co Ltd
Publication of TW200624446A publication Critical patent/TW200624446A/zh
Application granted granted Critical
Publication of TWI266771B publication Critical patent/TWI266771B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
    • G03F7/0397—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having an alicyclic moiety in a side chain
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/26—Esters containing oxygen in addition to the carboxy oxygen
    • C08F220/28—Esters containing oxygen in addition to the carboxy oxygen containing no aromatic rings in the alcohol moiety
    • C08F220/283—Esters containing oxygen in addition to the carboxy oxygen containing no aromatic rings in the alcohol moiety and containing one or more carboxylic moiety in the chain, e.g. acetoacetoxyethyl(meth)acrylate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055—Radiation sensitive composition or product or process of making
    • Y10S430/106—Binder containing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055—Radiation sensitive composition or product or process of making
    • Y10S430/114—Initiator containing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/146—Laser beam

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Materials For Photolithography (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
TW094134016A 2004-10-04 2005-09-29 Polymer compound, positive resist composition and process for forming resist pattern TWI266771B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004291486A JP4841823B2 (ja) 2004-10-04 2004-10-04 高分子化合物、ポジ型レジスト組成物およびレジストパターン形成方法

Publications (2)

Publication Number Publication Date
TW200624446A TW200624446A (en) 2006-07-16
TWI266771B true TWI266771B (en) 2006-11-21

Family

ID=36142555

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094134016A TWI266771B (en) 2004-10-04 2005-09-29 Polymer compound, positive resist composition and process for forming resist pattern

Country Status (4)

Country Link
US (1) US7851127B2 (zh)
JP (1) JP4841823B2 (zh)
TW (1) TWI266771B (zh)
WO (1) WO2006038477A1 (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5434709B2 (ja) * 2010-03-15 2014-03-05 Ｊｓｒ株式会社 感放射線性樹脂組成物及び重合体
JP5608009B2 (ja) * 2010-08-12 2014-10-15 大阪有機化学工業株式会社 ホモアダマンタン誘導体、その製造方法及びフォトレジスト組成物
JP5861336B2 (ja) * 2010-09-14 2016-02-16 セントラル硝子株式会社 重合体、およびそれを含むレジスト材料、ならびにそれを用いるパターン形成方法
JP2012252077A (ja) 2011-06-01 2012-12-20 Tokyo Ohka Kogyo Co Ltd レジスト組成物及びレジストパターン形成方法、並びに、高分子化合物及びその製造方法
JP5618924B2 (ja) * 2011-06-30 2014-11-05 富士フイルム株式会社 感活性光線性又は感放射線性樹脂組成物、該組成物を用いたレジスト膜及びパターン形成方法、並びに電子デバイスの製造方法及び電子デバイス
JP6706925B2 (ja) * 2015-02-12 2020-06-10 住友化学株式会社 レジスト組成物及びレジストパターンの製造方法

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3865474B2 (ja) * 1996-08-20 2007-01-10 東京応化工業株式会社 ポジ型レジスト組成物
US5929271A (en) 1996-08-20 1999-07-27 Tokyo Ohka Kogyo Co., Ltd. Compounds for use in a positive-working resist composition
FR2758138B1 (fr) * 1997-01-06 1999-01-29 Rhodia Chimie Sa Procede de reduction d'un compose carbonyle
JP3840052B2 (ja) * 1998-08-10 2006-11-01 株式会社東芝 レジスト用樹脂
TWI227377B (en) * 1999-10-06 2005-02-01 Fuji Photo Film Co Ltd Positive-type resist composition
KR100788806B1 (ko) * 1999-10-29 2007-12-27 후지필름 가부시키가이샤 포지티브 포토레지스트 조성물
JP2001318465A (ja) * 2000-05-11 2001-11-16 Fuji Photo Film Co Ltd ポジ型フォトレジスト組成物
JP2002251012A (ja) * 2001-02-23 2002-09-06 Fuji Photo Film Co Ltd ポジ型感光性組成物
US6927009B2 (en) * 2001-05-22 2005-08-09 Fuji Photo Film Co., Ltd. Positive photosensitive composition
KR20020090489A (ko) * 2001-05-28 2002-12-05 금호석유화학 주식회사 화학증폭형 레지스트용 중합체 및 이를 함유한 화학증폭형레지스트 조성물
JP3803286B2 (ja) 2001-12-03 2006-08-02 東京応化工業株式会社 ポジ型レジスト組成物及びレジストパターンの形成方法
JP2003207896A (ja) * 2002-01-16 2003-07-25 Fuji Photo Film Co Ltd ポジ型レジスト組成物
US7510822B2 (en) * 2002-04-10 2009-03-31 Fujifilm Corporation Stimulation sensitive composition and compound
US7122589B2 (en) 2002-09-30 2006-10-17 Fuji Photo Film Co., Ltd Positive resist composition and pattern formation method using the same
JP4328588B2 (ja) * 2002-09-30 2009-09-09 富士フイルム株式会社 ポジ型レジスト組成物及びそれを用いたパターン形成方法
US6860889B2 (en) * 2002-10-07 2005-03-01 Alfred O. Bonati Clamping screw extractor
JP4115309B2 (ja) * 2003-03-24 2008-07-09 富士フイルム株式会社 ポジ型レジスト組成物
JP4439270B2 (ja) * 2003-06-18 2010-03-24 富士フイルム株式会社 ポジ型レジスト組成物及びそれを用いたパターン形成方法
US6982354B2 (en) * 2004-02-02 2006-01-03 General Electric Company Preparation of ketone containing cyclic compounds

Also Published As

Publication number Publication date
US20090162784A1 (en) 2009-06-25
JP4841823B2 (ja) 2011-12-21
JP2006104289A (ja) 2006-04-20
WO2006038477A1 (ja) 2006-04-13
US7851127B2 (en) 2010-12-14
TW200624446A (en) 2006-07-16

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