TWI264887B - Small-form-factor wireless communication module and manufacturing method thereof - Google Patents

Small-form-factor wireless communication module and manufacturing method thereof Download PDF

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Publication number
TWI264887B
TWI264887B TW094114516A TW94114516A TWI264887B TW I264887 B TWI264887 B TW I264887B TW 094114516 A TW094114516 A TW 094114516A TW 94114516 A TW94114516 A TW 94114516A TW I264887 B TWI264887 B TW I264887B
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substrate
wireless communication
module
pads
carrier substrate
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TW094114516A
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TW200640163A (en
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Kuo-Hsien Liao
Chia-Yang Chen
Chuei-Tang Wang
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Universal Scient Ind Co Ltd
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Priority to TW094114516A priority Critical patent/TWI264887B/zh
Priority to US11/206,843 priority patent/US7312518B2/en
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    • H—ELECTRICITY
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    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5385—Assembly of a plurality of insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L25/0657—Stacked arrangements of devices
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/0652—Bump or bump-like direct electrical connections from substrate to substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06572—Auxiliary carrier between devices, the carrier having an electrical connection structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49822—Multilayer substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49838—Geometry or layout
    • H—ELECTRICITY
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/145—Arrangements wherein electric components are disposed between and simultaneously connected to two planar printed circuit boards, e.g. Cordwood modules
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2018—Presence of a frame in a printed circuit or printed circuit assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers

Description

1264887 “日片21於5亥頂面221上的該第一焊墊⑶，然後 …、使忒曰曰片21藉由錫貧固定於該模組基板η的頂 面 221 。 ' (C)將該模組基板22翻面使該底面222朝上，並印錫膏 在垓底面222上的該等第一焊墊223。 ⑻設置該等晶片21於該底面222上的該第—痒塾功， 然後加熱使該晶片21藉由錫膏固定於該模組基板22 的底面222。 (E )植入纟亥寺錫球2 3到續莖楚—卜 無線通訊模組20。寺弟―㈣224,就可以完成該 )此¥可先將，亥主機板10上的該等焊墊η印上錫膏 ，再將該等錫球23對準於魅機板ig上的該等焊= 1卜加熱使該無線通訊模組20與主機板1〇相連，就 可以安裝完成該無線通訊模組2〇。 所以由上述的製造步驟可以發現，直到步驟⑻ 该無線通訊额2〇,都只需要使用_片基板就可以完成凡 看之下所需使用的成本❹，然而實際製造時，由Μ 無線通訊模組2。是採用球腳格狀陣列的封裝型態，因此在:： 造、設計方面仍然有以下的缺點產生，諸如： 衣 1.:合圖2所示，如果設在該模組基板22底面222的 晶片21其高度為〇.4_ !則該等錫球23直徑就必 須要大於0.4酿，而實務上一般會採用〇·5軸以上 的錫球直徑，此外，在該等錫球23之間也㈣Μ 有至少〇.4mm的間隙（gap)，才能避免相鄰兩錫球 1264887 2+3有接觸短路的情形發生，在如此條件下，如果該 杈、且基板22的大小是1〇><1〇mm，再考慮該底面222 的四隅不放置该錫球23，則該底面如的單側邊只 月匕谷、.内到9個锡球23，而環繞一圈總共可以容納％ 個，這也就是說，該晶片21的引腳數目不能大於 们如果未來垓晶片21的複雜度更高，以致於 引腳數目大於36個時就無法使用，或者必須要加大 。亥換組基板22的尺寸，如此，對於模組小型化的設 鲁 計方面會造成阻礙。 2·另外在加熱時，該等錫球23會受熱塌陷，尤其是在 4步驟（F )中有重量下壓時更迅速，所以在製造過 轾中，不容易控制與該主機板1〇及相關後續安裝的 - 整體高度，而且還有該等錫球23短路的風險。 雖然/、而要用一片基板就可以完成，但是該植球機 等相關設備的價袼相當昂貴，一般製造工廠並無植 球设備與技術，如果一般製造工廠經過檢測後，需 籲 要拆卸該無線通訊模組2Q，則被拆下的該無線通訊 柄組20需要送回封裝廠再重新作植球，如此才能再 次被使用，於是會相當耗時費工。 【發明内容】 因此’本發明之目的，即在提供一種體積小、能適用 方、、更夕弓I腳數目的晶片、容易製造與裝卸的小型化無線通 訊模組及其製造方法。 表疋’本發明小型化無線通訊模組是用於設置在一具有 1264887 無線通訊功能的裝置中，該裝置包含—具有多數焊墊的主機 板’該小型化無線通訊模組包含二晶片、—模組基板，及一 承載基板。 該等晶片的其中-者是用於通訊電路的晶片。 遠模組基板包括一頂面念 貝由 底面、多數設置於該頂面與 底面的第一焊墊，及多赵訊 夕數5又置於该底面的第二焊墊，該等晶 片是分別設置在該頂、底面處的該等第一焊墊。 该承載基板是設置於該握έ4 、杈組基板的底面，該承載基板包 括一面對該模組基板底面 ·"败低由的承載面、-相反於該承載面並面
? δ亥主機板的焊接面、一速技私兮I 逑接於该承載面與焊接面周緣的圍 =、-形成於該圍繞面旁側的容室空間，及多數設置μ 承ί面與焊接㈣第三焊墊；其中，該承《板的高度是大 於荨於该模組基板底面處的兮 _ ^ 处亥日日片，邊容室空間是對應容納 二基板底面處的該晶片’該等第三谭墊的佈局是分別配 5該等第二焊墊與該主機板處的焊墊。 本發明小型化無線通訊模組的製造方法，是使用上述該 小型化無線通訊模組的所有構件，該方法包含以下步驟： (Α)製備該#晶片、該模组基板，及該承載基板。 ⑻將料3分職置於關組基㈣頂面與底面。 (C)將該承載基板的頂面結合於該模組基板的底面，並使 該承載基板的旁側預留一容室空間，該容室空間是對 應容納該模組基板底面處的該晶片，該承載基板的底 面疋用於結合在該具有無線通訊功能的裝置。 精此在製造時’由於該等第二、三焊墊的寬度是不受限 1264887 CB) 2㈣膏在該頂面51上的㈣―焊墊53，再設置該 曰曰片40於該頂面51上的該第一焊墊兄，然後加熱使 邊晶片40藉由錫膏固定於該模組基板5〇的頂面51。 c)將該模組基板5Q翻面，使該底面52朝上，並印錫膏 在該底面52上的該等第一焊墊53與第二焊墊54。 D)利用表面黏著技術設置該等晶片4〇於該底面52上的 該第一焊墊53，以及設置該承載基板60的承載面61 連接於該底面52,該承載基板6〇是環形，其中間處 是對應容納該等晶片40的容室空間64,該承載基板 60的第三焊墊65是對應該等第二焊墊54。
E 加熱使該等晶片40與承载基板6〇藉由錫膏固定於該 模組基板5〇底面52 ’完成本發明小型化無線通訊模 組400的第一較佳實施例。
F 此時，可先將該主機板等焊墊31印上錫膏 ，再將該焊接面62上的該等第三焊墊65對準該主機 板3〇上的該等焊堅3卜加熱使該無線通訊模組20盘 主機板30相連，絲絲完成料型化錢通訊模組 4〇〇 〇 而在圖4的例子中可以發現，如 5亥柄組基板5 0的大小 與名知相同一樣為！0xl0mm的尺寸’ 一 寺弗二、二焊墊54 、65的寬度也與習知錫球的直徑相 」為〇.4mm，則兩相鄰焊 墊的間隙（gap )就能縮小為〇·2 入 绝疋由於不需考慮錫球 羽陷後會向兩側延伸而能將間隙縮 罢、卜曰勒 j 问樣考慮四隅處不配 十’於疋單側邊能容納到1 5個焊轨 Λ干垫，而環繞一圈總共可 1264887 將该小型化無線通訊模組·安裝職主機板3Q就可以完成 安裝工作。 所以在該第二較佳實施例中，可以發現本發明不只能用 於引腳數目更高的晶片，在控制整體高度與元件的佈局方面 ，本發明逛能具有更彈性的設計空間，於是更能因應不同的 各戶而求，革握住更精準迅速的開發成果。 細納上述，因此由上述該第一、二較佳實施例中不難 ^現，本發明的組成結構雖然較習知還多出了該承載基板 6〇，但在設計方面，本發明能達到小型化、容易控制高度 叹汁更有彈性的成果，而在運用的設備方面，能使用一 般工廠常用的設備完成，所以相較於習知的方式與結構， 本^月對電路的開發佈局上，以及後續製造上都能提供更 長遂的進步，成本也能夠降低很多，確實能達到本發明的 使用目的及要求。 准X上所述者，僅為本發明之較佳實施例而已，當不 能以此限定本發明實施之範圍，即大凡依本發日⑼請專利 範圍及發明說明内容所作之簡單的等效變化與修飾，皆仍 屬本發明專利涵蓋之範圍内。 【圖式簡單說明】 .圖1是一示意圖，說明習知無線通訊模組的製程步驟 圖2是一立體圖，說明上述該無線通訊模組的結構； ^圖3是一示意圖，說明本發明小型化無線通訊模組的 第一較佳實施例； 13 1264887 圖4是一立體圖，說明本發明上述該第一較佳實施例 的結構； 圖5是一立體分解圖，說明本發明小型化無線通訊模 組的第二較佳實施例結構；及 圖6是一立體組合圖，說明上述該第二較佳實施例中 的組合結構。
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Claims (1)

  1. Ϊ264887 十、申請專利範圍： l 一種小型化無線通訊模組，是用於設置在一具有無線通 訊功能的裝置中，該裝置包含一具有多數焊墊的主機板 ’ s亥小型化無線通訊模組包含·· 二晶片’該等晶片的其中一者是用於通訊電路的晶 片； 一模組基板，包括一頂面、一底面、多數設置於該 頂面與底面的第一焊墊，及多數設置於該底面的第二焊 墊’該等晶片是分別設置在該頂、底面處的該等第一焊 墊；及 一承載基板，是設置於該模組基板的底面，該承載 基板包括一面對該模組基板底面的承載面、一相反於該 承載面並面對該主機板的焊接面、一連接於該承載面與 焊接面周緣的圍繞面、一形成於該圍繞面旁側的容室空 間，及多數設置於該承載面與烊接面的第三焊墊，·其中
    ，該承載基板的高度是大&等於該模組基板底面處的該 晶片’該容室空間是對應容納該模組基板底面處的該晶 片，該等帛三焊墊㈣^分別配合料帛二焊塾與該 主機板處的焊墊。 〃 / 依據申請專利範圍第丨項所述之小型化無、線通訊模植， 其中，該承載基板是環形，該容室空間是位於該承載基 板的中間。 土 ΓΓ請專利範圍第1項所述之小型化無線通訊模缸， 中，該模組基板與承載基板上的第二、- 二烊墊是採用 16 1264887 9·依據申請專利範圍第6項所诚$ f荆外么μ 所述之小型化無線通訊模組的 衣ie方法，其中，該承载其 θ 戰基板疋％形，，亥容室空間是藉 由挖空方式形成於該承載基板的中間。 1 =據申料㈣圍第6項所叙小型化無線通訊模組的 衣迈方法，其中，該承載基板之頂面亦一 ° 复一曰曰片 ， 而該模組基板則對應該晶片設有一鏤空部。
    18
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