TWI264224B - Imaging apparatus - Google Patents

Imaging apparatus

Info

Publication number
TWI264224B
TWI264224B TW093122542A TW93122542A TWI264224B TW I264224 B TWI264224 B TW I264224B TW 093122542 A TW093122542 A TW 093122542A TW 93122542 A TW93122542 A TW 93122542A TW I264224 B TWI264224 B TW I264224B
Authority
TW
Taiwan
Prior art keywords
flexible board
housing
connection terminal
external connection
bent
Prior art date
Application number
TW093122542A
Other languages
English (en)
Inventor
Koji Sawahata
Susumu Moriya
Hiroshi Aoki
Izumi Kobayashi
Toshiyuki Honda
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Application granted granted Critical
Publication of TWI264224B publication Critical patent/TWI264224B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14618—Containers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Signal Processing (AREA)
  • Multimedia (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Studio Devices (AREA)
  • Camera Bodies And Camera Details Or Accessories (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Lens Barrels (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
TW093122542A 2004-07-28 2004-07-28 Imaging apparatus TWI264224B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2004/010695 WO2006011200A1 (ja) 2004-07-28 2004-07-28 撮像装置

Publications (1)

Publication Number Publication Date
TWI264224B true TWI264224B (en) 2006-10-11

Family

ID=35785959

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093122542A TWI264224B (en) 2004-07-28 2004-07-28 Imaging apparatus

Country Status (5)

Country Link
US (1) US7564111B2 (zh)
JP (1) JP4276678B2 (zh)
CN (1) CN100512379C (zh)
TW (1) TWI264224B (zh)
WO (1) WO2006011200A1 (zh)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI437301B (zh) * 2006-02-03 2014-05-11 Hitachi Maxell Camera module
JP2007227672A (ja) * 2006-02-23 2007-09-06 Olympus Imaging Corp 撮像装置
US7750279B2 (en) 2006-02-23 2010-07-06 Olympus Imaging Corp. Image pickup apparatus and image pickup unit
JP2008148222A (ja) * 2006-12-13 2008-06-26 Matsushita Electric Ind Co Ltd 固体撮像装置とその製造方法
US8605208B2 (en) 2007-04-24 2013-12-10 Digitaloptics Corporation Small form factor modules using wafer level optics with bottom cavity and flip-chip assembly
JP4992687B2 (ja) * 2007-12-03 2012-08-08 ソニー株式会社 カメラモジュールおよび撮像装置
US8270103B2 (en) * 2008-04-16 2012-09-18 Komatsulite Mfg. Co., Ltd. Imaging lens unit
JP5047902B2 (ja) * 2008-08-08 2012-10-10 シャープ株式会社 固体撮像装置およびそれを備えた電子機器
JP4991658B2 (ja) * 2008-08-08 2012-08-01 シャープ株式会社 配線基板、固体撮像装置、および電子機器
JP5042940B2 (ja) * 2008-08-08 2012-10-03 シャープ株式会社 固体撮像装置およびそれを備えた電子機器
CN101771057A (zh) * 2008-12-26 2010-07-07 佛山普立华科技有限公司 相机模组
JP2011027853A (ja) * 2009-07-22 2011-02-10 Toshiba Corp カメラモジュールの製造方法
US8248523B2 (en) * 2009-11-05 2012-08-21 Flextronics Ap, Llc Camera module with fold over flexible circuit and cavity substrate
JP5491628B2 (ja) * 2010-06-28 2014-05-14 京セラ株式会社 配線基板および撮像装置ならびに撮像装置モジュール
JP5386567B2 (ja) * 2011-11-15 2014-01-15 株式会社フジクラ 撮像素子チップの実装方法、内視鏡の組立方法、撮像モジュール及び内視鏡
CN103325797B (zh) * 2012-03-19 2015-10-14 海华科技股份有限公司 降低整体厚度的影像感测模块
JP6005984B2 (ja) * 2012-05-07 2016-10-12 オリンパス株式会社 撮像装置
CN104755978B (zh) * 2012-08-10 2018-01-12 南昌欧菲光电技术有限公司 具有柔性印刷电路延伸的自动聚焦相机模组
US9007520B2 (en) 2012-08-10 2015-04-14 Nanchang O-Film Optoelectronics Technology Ltd Camera module with EMI shield
US9001268B2 (en) 2012-08-10 2015-04-07 Nan Chang O-Film Optoelectronics Technology Ltd Auto-focus camera module with flexible printed circuit extension
TWI681696B (zh) 2013-03-07 2020-01-01 日商半導體能源研究所股份有限公司 顯示裝置
JP6719941B2 (ja) * 2016-03-27 2020-07-08 日本電産コパル株式会社 電子部品搭載部材、及び撮像装置
US10958815B1 (en) * 2017-09-06 2021-03-23 Apple Inc. Folded flex circuit board for camera ESD protection
TWI657305B (zh) * 2018-05-04 2019-04-21 致伸科技股份有限公司 攝像模組之組裝方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57162398A (en) 1981-03-31 1982-10-06 Tokyo Shibaura Electric Co Printed circuit board electronic device
JP2001358997A (ja) * 2000-06-12 2001-12-26 Mitsubishi Electric Corp 半導体装置
US6798031B2 (en) * 2001-02-28 2004-09-28 Fujitsu Limited Semiconductor device and method for making the same
TW548843B (en) * 2001-02-28 2003-08-21 Fujitsu Ltd Semiconductor device and method for making the same
JP2004153503A (ja) 2002-10-30 2004-05-27 Ngk Insulators Ltd カメラモジュールおよび角速度センサ部品の筐体への実装構造
JP2004193082A (ja) * 2002-12-13 2004-07-08 Nec Saitama Ltd 電子機器の接地構造、該接地構造を備えた電子機器、及び該電子機器の機能ユニット
JP2005210409A (ja) 2004-01-22 2005-08-04 Hitachi Maxell Ltd カメラモジュール

Also Published As

Publication number Publication date
JPWO2006011200A1 (ja) 2008-05-01
WO2006011200A1 (ja) 2006-02-02
CN1993979A (zh) 2007-07-04
US20070120050A1 (en) 2007-05-31
US7564111B2 (en) 2009-07-21
CN100512379C (zh) 2009-07-08
JP4276678B2 (ja) 2009-06-10

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees