TWI263703B - Method enabling effective storage of metal ion supply source in plating equipment - Google Patents
Method enabling effective storage of metal ion supply source in plating equipmentInfo
- Publication number
- TWI263703B TWI263703B TW092103019A TW92103019A TWI263703B TW I263703 B TWI263703 B TW I263703B TW 092103019 A TW092103019 A TW 092103019A TW 92103019 A TW92103019 A TW 92103019A TW I263703 B TWI263703 B TW I263703B
- Authority
- TW
- Taiwan
- Prior art keywords
- metal ion
- supply source
- plating
- ion supply
- solution
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
- C25D21/14—Controlled addition of electrolyte components
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Automation & Control Theory (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
- Chemically Coating (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002044679A JP3725083B2 (ja) | 2002-02-21 | 2002-02-21 | メッキ設備における金属イオン供給源の有効保存を可能とする方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200303937A TW200303937A (en) | 2003-09-16 |
TWI263703B true TWI263703B (en) | 2006-10-11 |
Family
ID=27750561
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW092103019A TWI263703B (en) | 2002-02-21 | 2003-02-13 | Method enabling effective storage of metal ion supply source in plating equipment |
Country Status (11)
Country | Link |
---|---|
US (1) | US20050139477A1 (ja) |
EP (1) | EP1476590B1 (ja) |
JP (1) | JP3725083B2 (ja) |
KR (1) | KR100858503B1 (ja) |
CN (1) | CN1636086B (ja) |
AT (1) | ATE369446T1 (ja) |
CA (1) | CA2473054A1 (ja) |
DE (1) | DE60315422T2 (ja) |
MY (1) | MY132672A (ja) |
TW (1) | TWI263703B (ja) |
WO (1) | WO2003071010A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11352710B2 (en) * | 2019-09-30 | 2022-06-07 | Abdurrahman Ildeniz | Leak free brush electroplating system |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4469546A (en) * | 1981-12-16 | 1984-09-04 | Cooper Tire & Rubber Company | Transfer ring for a tire building machine |
US4469564A (en) * | 1982-08-11 | 1984-09-04 | At&T Bell Laboratories | Copper electroplating process |
JPH0559598A (ja) * | 1991-08-30 | 1993-03-09 | Kawasaki Steel Corp | Zn−Ni電気めつきにおける金属イオンの供給方法及び装置 |
DE4344387C2 (de) * | 1993-12-24 | 1996-09-05 | Atotech Deutschland Gmbh | Verfahren zur elektrolytischen Abscheidung von Kupfer und Anordnung zur Durchführung des Verfahrens |
WO1999054527A2 (en) * | 1998-04-21 | 1999-10-28 | Applied Materials, Inc. | Electro-chemical deposition system and method of electroplating on substrates |
CA2331750A1 (en) * | 1998-05-16 | 1999-11-25 | Blasberg Oberflachentechnik Gmbh | Method for electro copperplating substrates |
US6200436B1 (en) * | 1999-04-27 | 2001-03-13 | Advanced Micro Devices, Inc. | Recycling consistent plating system for electroplating |
JP3523555B2 (ja) * | 2000-02-28 | 2004-04-26 | 古河電気工業株式会社 | メッキ装置 |
TW501277B (en) * | 2000-03-29 | 2002-09-01 | Sanyo Electric Co | Plating device |
US6575111B2 (en) * | 2001-05-01 | 2003-06-10 | Drillmar, Inc. | Method for tendering |
-
2002
- 2002-02-21 JP JP2002044679A patent/JP3725083B2/ja not_active Expired - Fee Related
-
2003
- 2003-02-13 TW TW092103019A patent/TWI263703B/zh not_active IP Right Cessation
- 2003-02-17 DE DE60315422T patent/DE60315422T2/de not_active Expired - Lifetime
- 2003-02-17 AT AT03717186T patent/ATE369446T1/de active
- 2003-02-17 CN CN038042835A patent/CN1636086B/zh not_active Expired - Fee Related
- 2003-02-17 EP EP03717186A patent/EP1476590B1/en not_active Expired - Lifetime
- 2003-02-17 WO PCT/EP2003/001588 patent/WO2003071010A1/en active IP Right Grant
- 2003-02-17 CA CA002473054A patent/CA2473054A1/en not_active Abandoned
- 2003-02-17 KR KR1020047011656A patent/KR100858503B1/ko not_active IP Right Cessation
- 2003-02-17 US US10/502,557 patent/US20050139477A1/en not_active Abandoned
- 2003-02-19 MY MYPI20030580A patent/MY132672A/en unknown
Also Published As
Publication number | Publication date |
---|---|
JP3725083B2 (ja) | 2005-12-07 |
TW200303937A (en) | 2003-09-16 |
KR20040083096A (ko) | 2004-09-30 |
EP1476590A1 (en) | 2004-11-17 |
EP1476590B1 (en) | 2007-08-08 |
MY132672A (en) | 2007-10-31 |
CN1636086B (zh) | 2010-04-28 |
CA2473054A1 (en) | 2003-08-28 |
DE60315422T2 (de) | 2008-04-30 |
US20050139477A1 (en) | 2005-06-30 |
ATE369446T1 (de) | 2007-08-15 |
WO2003071010A1 (en) | 2003-08-28 |
KR100858503B1 (ko) | 2008-09-12 |
DE60315422D1 (de) | 2007-09-20 |
CN1636086A (zh) | 2005-07-06 |
JP2003253497A (ja) | 2003-09-10 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |