TWI263703B - Method enabling effective storage of metal ion supply source in plating equipment - Google Patents

Method enabling effective storage of metal ion supply source in plating equipment

Info

Publication number
TWI263703B
TWI263703B TW092103019A TW92103019A TWI263703B TW I263703 B TWI263703 B TW I263703B TW 092103019 A TW092103019 A TW 092103019A TW 92103019 A TW92103019 A TW 92103019A TW I263703 B TWI263703 B TW I263703B
Authority
TW
Taiwan
Prior art keywords
metal ion
supply source
plating
ion supply
solution
Prior art date
Application number
TW092103019A
Other languages
Chinese (zh)
Other versions
TW200303937A (en
Inventor
Yoshihisa Muranushi
Tadashi Saitoh
Original Assignee
Atotech Deutschland Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech Deutschland Gmbh filed Critical Atotech Deutschland Gmbh
Publication of TW200303937A publication Critical patent/TW200303937A/en
Application granted granted Critical
Publication of TWI263703B publication Critical patent/TWI263703B/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C25D21/14—Controlled addition of electrolyte components
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating

Abstract

To avoid a change in plating performance, even where operation of the plating equipment is interrupted, the properties of the plating solution need to be preserved. For plating equipment having an insoluble anode, add a reservoir (7) for storing a replacement solution to the tank (4) having a metal ion supply source (copper ball (5)) and, upon termination of the plating operation, the entire plating solution is discharged from the tank (4) containing the metal ion supply source, while the solution for replacement is transferred from the reservoir (7) to the empty tank having a metal ion supply source, and immediately prior to the resumption of the plating operation transfer the solution for replacement back to the reservoir (7) and return the plating solution to the tank (4) containing the metal ion supply source.
TW092103019A 2002-02-21 2003-02-13 Method enabling effective storage of metal ion supply source in plating equipment TWI263703B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002044679A JP3725083B2 (en) 2002-02-21 2002-02-21 Method for enabling effective preservation of metal ion source in plating equipment

Publications (2)

Publication Number Publication Date
TW200303937A TW200303937A (en) 2003-09-16
TWI263703B true TWI263703B (en) 2006-10-11

Family

ID=27750561

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092103019A TWI263703B (en) 2002-02-21 2003-02-13 Method enabling effective storage of metal ion supply source in plating equipment

Country Status (11)

Country Link
US (1) US20050139477A1 (en)
EP (1) EP1476590B1 (en)
JP (1) JP3725083B2 (en)
KR (1) KR100858503B1 (en)
CN (1) CN1636086B (en)
AT (1) ATE369446T1 (en)
CA (1) CA2473054A1 (en)
DE (1) DE60315422T2 (en)
MY (1) MY132672A (en)
TW (1) TWI263703B (en)
WO (1) WO2003071010A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11352710B2 (en) * 2019-09-30 2022-06-07 Abdurrahman Ildeniz Leak free brush electroplating system

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4469546A (en) * 1981-12-16 1984-09-04 Cooper Tire & Rubber Company Transfer ring for a tire building machine
US4469564A (en) * 1982-08-11 1984-09-04 At&T Bell Laboratories Copper electroplating process
JPH0559598A (en) * 1991-08-30 1993-03-09 Kawasaki Steel Corp Method and device for supplying metal ion of zn-ni electroplating
DE4344387C2 (en) * 1993-12-24 1996-09-05 Atotech Deutschland Gmbh Process for the electrolytic deposition of copper and arrangement for carrying out the process
DE69929967T2 (en) * 1998-04-21 2007-05-24 Applied Materials, Inc., Santa Clara ELECTROPLATING SYSTEM AND METHOD FOR ELECTROPLATING ON SUBSTRATES
CN1170965C (en) * 1998-05-16 2004-10-13 布拉斯伯格表面技术股份有限公司 Method for electro copperplating substrates
US6200436B1 (en) * 1999-04-27 2001-03-13 Advanced Micro Devices, Inc. Recycling consistent plating system for electroplating
JP3523555B2 (en) * 2000-02-28 2004-04-26 古河電気工業株式会社 Plating equipment
TW501277B (en) * 2000-03-29 2002-09-01 Sanyo Electric Co Plating device
US6575111B2 (en) * 2001-05-01 2003-06-10 Drillmar, Inc. Method for tendering

Also Published As

Publication number Publication date
EP1476590A1 (en) 2004-11-17
KR20040083096A (en) 2004-09-30
TW200303937A (en) 2003-09-16
EP1476590B1 (en) 2007-08-08
JP2003253497A (en) 2003-09-10
MY132672A (en) 2007-10-31
WO2003071010A1 (en) 2003-08-28
DE60315422D1 (en) 2007-09-20
KR100858503B1 (en) 2008-09-12
DE60315422T2 (en) 2008-04-30
ATE369446T1 (en) 2007-08-15
CN1636086B (en) 2010-04-28
CN1636086A (en) 2005-07-06
CA2473054A1 (en) 2003-08-28
JP3725083B2 (en) 2005-12-07
US20050139477A1 (en) 2005-06-30

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees