WO2004074553A3 - Plating using an insoluble anode and seperately supplied plating material - Google Patents

Plating using an insoluble anode and seperately supplied plating material Download PDF

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Publication number
WO2004074553A3
WO2004074553A3 PCT/US2004/004241 US2004004241W WO2004074553A3 WO 2004074553 A3 WO2004074553 A3 WO 2004074553A3 US 2004004241 W US2004004241 W US 2004004241W WO 2004074553 A3 WO2004074553 A3 WO 2004074553A3
Authority
WO
WIPO (PCT)
Prior art keywords
plating
copper
supplied
reaction tank
plating material
Prior art date
Application number
PCT/US2004/004241
Other languages
French (fr)
Other versions
WO2004074553A2 (en
Inventor
Robert Barcell
Original Assignee
Optimum Water Technologies Llc
Robert Barcell
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Optimum Water Technologies Llc, Robert Barcell filed Critical Optimum Water Technologies Llc
Publication of WO2004074553A2 publication Critical patent/WO2004074553A2/en
Publication of WO2004074553A3 publication Critical patent/WO2004074553A3/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/16—Regeneration of process solutions
    • C25D21/18—Regeneration of process solutions of electrolytes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Chemically Coating (AREA)
  • Electroplating And Plating Baths Therefor (AREA)

Abstract

Plating an article in a plating system (20) having a solution at relatively low temperatures is provided. The plating system contains a cathode and an insoluble anode. The plating material can include copper dissolved from small size copper articles placed in a reaction tank (30). The copper particles are contacted by oxygen in the form of air bubbles. The flow of air to produce the air bubbles can be automatically or manually controlled. The copper particles can be immersed in solution in the reaction tank or, alternatively, desired solution can be controllably sprayed on the copper particles in conjunction with dissolving thereof. The plating material output from the reaction tank is supplied to the plating system through a filter (46) so that only desired plating material is supplied to the plating system. The cathode in the plating system can be a circuit board that is copper plated using the supplied copper plating material.
PCT/US2004/004241 2003-02-14 2004-02-13 Plating using an insoluble anode and seperately supplied plating material WO2004074553A2 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US44780403P 2003-02-14 2003-02-14
US60/447,804 2003-02-14
US10/394,397 2003-03-21
US10/394,397 US20040159551A1 (en) 2003-02-14 2003-03-21 Plating using an insoluble anode and separately supplied plating material

Publications (2)

Publication Number Publication Date
WO2004074553A2 WO2004074553A2 (en) 2004-09-02
WO2004074553A3 true WO2004074553A3 (en) 2008-01-10

Family

ID=32853134

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2004/004241 WO2004074553A2 (en) 2003-02-14 2004-02-13 Plating using an insoluble anode and seperately supplied plating material

Country Status (2)

Country Link
US (1) US20040159551A1 (en)
WO (1) WO2004074553A2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7528006B2 (en) * 2005-06-30 2009-05-05 Intel Corporation Integrated circuit die containing particle-filled through-silicon metal vias with reduced thermal expansion
WO2008016541A1 (en) * 2006-07-31 2008-02-07 Wayne Charles Walker Constituent maintenance of a copper sulfate bath through chemical dissolution of copper metal

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4324623A (en) * 1980-01-12 1982-04-13 Koito Seisakusho Co. Ltd. Method and apparatus for replenishing an electroplating bath with metal to be deposited
US4375400A (en) * 1980-12-08 1983-03-01 Olin Corporation Electrolyte circulation in an electrolytic cell
US5976341A (en) * 1993-12-24 1999-11-02 Schumacher; Rolf Process and apparatus for electrolytic deposition of metal layers

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6929723B2 (en) * 1996-11-22 2005-08-16 Hubert F. Metzger Electroplating apparatus using a non-dissolvable anode and ultrasonic energy
EP0940652B1 (en) * 1998-03-05 2004-12-22 Nippon Telegraph and Telephone Corporation Surface shape recognition sensor and method of fabricating the same
US6254760B1 (en) * 1999-03-05 2001-07-03 Applied Materials, Inc. Electro-chemical deposition system and method
US6200436B1 (en) * 1999-04-27 2001-03-13 Advanced Micro Devices, Inc. Recycling consistent plating system for electroplating
US6270635B1 (en) * 1999-04-27 2001-08-07 Advanced Micro Devices, Inc. Consistent plating system for electroplating

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4324623A (en) * 1980-01-12 1982-04-13 Koito Seisakusho Co. Ltd. Method and apparatus for replenishing an electroplating bath with metal to be deposited
US4375400A (en) * 1980-12-08 1983-03-01 Olin Corporation Electrolyte circulation in an electrolytic cell
US5976341A (en) * 1993-12-24 1999-11-02 Schumacher; Rolf Process and apparatus for electrolytic deposition of metal layers

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
LOWENHEIM F.A.: "Electroplating", 1987, MCGRAW-HILL BOOK COMPANY, NEW YORK, pages: 12 - 13 *

Also Published As

Publication number Publication date
WO2004074553A2 (en) 2004-09-02
US20040159551A1 (en) 2004-08-19

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