CN105369304A - A tin-copper-nickel alloy electroplating solution and an electroplating method thereof - Google Patents
A tin-copper-nickel alloy electroplating solution and an electroplating method thereof Download PDFInfo
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- CN105369304A CN105369304A CN201410395964.0A CN201410395964A CN105369304A CN 105369304 A CN105369304 A CN 105369304A CN 201410395964 A CN201410395964 A CN 201410395964A CN 105369304 A CN105369304 A CN 105369304A
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Abstract
A tin-copper-nickel alloy electroplating solution and an electroplating method thereof are disclosed. The electroplating solution comprises 80-150 g/L of stannous sulfate, 60-100 g/L of organic copper sulfonate, 40-80 g/L of nickel sulfate, 10-20 g/L of hydroxy carboxylic acid, 0.5-15 g/L of an antioxidant, 20-35 g/L of a complexing agent, 1-5 g/L of a stabilizing agent and 1-5 g/L of a brightener, with the balance being deionized water. The electroplating solution is simple in composition, low in cost, high in stability, low in toxicity, safe and environmental friendly. A plating layer prepared by electroplating is free of crystal whisker, good in thermal stability, good in malleability, high in processability and not liable to crack.
Description
Technical field
The present invention relates to electroplate liquid technical field, particularly relate to a kind of tin-copper-nickel alloy electroplate liquid and electro-plating method thereof.
Background technology
Along with the development of science and technology, more and more stricter to the requirement of product, the coating of single-element is difficult to the demand meeting plated item, and researcher turns one's attention to alloy plating gradually.
Because tin and tinsel coating have good corrosion stability and solderability performance, be applied to the solderable coating of electronic unit widely, but, pure tin coating easily produces the whisker causing short circuit, plumbous for human body and bad environmental, and be strictly controlled, have now been developed the unleaded weldability alloy layers such as Xi-Yin, Sn-Bi, but the bath stability of tin-silver alloy layers is poor, cost is higher, whisker easily occurs in tin alloy; Though tin-bismuth alloy electroplating coating is not easy to produce whisker, poor processability, easily to crack.And known PH buffer reagent boric acid is to human body and bad environmental.
Summary of the invention
In view of this, one aspect of the present invention provides a kind of tin-copper-nickel alloy electroplate liquid, and tin of the present invention-copper-nickel alloy electroplate liquid composition is simple, cost is low, stability is strong, toxicity is little, safety and environmental protection.
This electroplate liquid comprises stannous sulfate 80 ~ 150g/L, organic sulfonic acid copper 60 ~ 100g/L, single nickel salt 40 ~ 80g/L, hydroxycarboxylic acid 10 ~ 20g/L, antioxidant 0.5 ~ 15g/L complexing agent 20 ~ 35g/L, stablizer 1 ~ 5g/L, brightening agent 1 ~ 5g/L, surplus are deionized water.
Preferably, this electroplate liquid comprises stannous sulfate 100g/L, organic sulfonic acid copper 80g/L, single nickel salt 50g/L, hydroxycarboxylic acid 12g/L, antioxidant 5g/L, complexing agent 25g/L, stablizer 3g/L, brightening agent 2g/L, surplus be deionized water.
Preferably, sulfonic acid copper is a kind of in copper methanesulfonate, trifluoromethayl sulfonic acid copper, thionamic acid copper, fourth sulfonic acid copper or at least 2 kinds mixtures, and hydroxycarboxylic acid is a kind of in oxyacetic acid, lactic acid, citric acid, oxysuccinic acid or at least 2 kinds mixtures.
Preferably, complexing agent is a kind of in Trisodium Citrate, Sunmorl N 60S or both mixtures.
Preferably, stablizer is a kind of in phytic acid, xitix or both mixtures.
Preferably, elementary brightening agent is benzene sulfinic acid sodium salt, and brightening agent is a kind of in asccharin, formaldehyde, dimethylated hexynol or at least 2 kinds mixtures.
The present invention provides on the other hand a kind of and uses above-mentioned tin-copper-nickel alloy electroplate liquid electric plating method, and the method plating obtains that coating is good without whisker, Heat stability is good, ductility, processing characteristics cracks by force, not easily.
A kind of use above-mentioned tin-copper-nickel alloy electroplate liquid electric plating method, comprises the following steps:
(1) tin-copper-nickel alloy electroplate liquid is prepared: complexing agent 20 ~ 35g, stablizer 1 ~ 5g and antioxidant 0.5 ~ 15g are dissolved in wiring solution-forming in deionized water, hydroxycarboxylic acid 10 ~ 20g, stannous sulfate 80 ~ 150g, organic sulfonic acid copper 60 ~ 100g, single nickel salt 40g ~ 80g stirring and dissolving makes mixed solution is added in this solution, in this mixed solution, add brightening agent 1 ~ 5g dissolve, the deionized water adding surplus is again 1L to cumulative volume, obtains tin-copper-nickel alloy electroplate liquid;
(2) do anode with carbon dioxide process carbon electrode, workpiece does negative pole, electroplates, and obtains the tin-copper-nickel alloy coating of light.
Preferably, the tin obtained in step (1)-copper-nickel alloy electroplate liquid ammoniacal liquor regulates PH to 4 ~ 8.
Preferably, in step (2), electroplating process is temperature 40 ~ 80 DEG C, and current density is 50 ~ 150mA/cm
2under carry out.
Preferably, in step (2), the area ratio of negative electrode and positive electrode is (1/2 ~ 2): 1.
Tin of the present invention-copper-nickel alloy electroplate liquid comprises stannous sulfate 80 ~ 150g/L, organic sulfonic acid copper 60 ~ 100g/L, single nickel salt 40 ~ 80g/L, hydroxycarboxylic acid 10 ~ 20g/L, antioxidant 0.5 ~ 15g/L complexing agent 20 ~ 35g/L, stablizer 1 ~ 5g/L, brightening agent 1 ~ 5g/L, surplus are deionized water.This tin-copper-nickel alloy electroplate liquid composition is simple, cost is low, stability is strong, toxicity is little, safety and environmental protection, electroplates that the coating that obtains is good without whisker, Heat stability is good, ductility, processing characteristics cracks by force, not easily.
Embodiment
Further illustrate technical scheme of the present invention respectively below in conjunction with the embodiments.
Raw material involved in following examples is commercially available.
Embodiment 1: the tin-copper-nickel alloy electroplate liquid of the present embodiment comprises following component:
Use this tin-copper-nickel alloy electroplate liquid electro-plating method as follows:
Prepare tin-copper-nickel alloy electroplate liquid: complexing agent 25g, stablizer 3g and antioxidant 5g are dissolved in wiring solution-forming in deionized water, hydroxycarboxylic acid 12g, stannous sulfate 80g, organic sulfonic acid copper 60g, single nickel salt 40g stirring and dissolving makes mixed solution is added in this solution, in this mixed solution, add brightening agent 2g dissolve, the deionized water adding surplus is again 1L to cumulative volume, obtains tin-copper-nickel alloy electroplate liquid.
Regulate this electroplate liquid PH to 4 ~ 8 with ammoniacal liquor, do anode with carbon dioxide process carbon electrode, workpiece does negative pole, temperature of electroplating solution be 60 DEG C, current density is 80mA/cm
2, negative electrode and positive electrode area ratio be under 1:1 condition, electroplate, obtain light tin-copper-nickel alloy coating.
Embodiment 2: the tin-copper-nickel alloy electroplate liquid of the present embodiment comprises following component:
Use this tin-copper-nickel alloy electroplate liquid electro-plating method as follows:
Prepare tin-copper-nickel alloy electroplate liquid: complexing agent 25g, stablizer 3g and antioxidant 5g are dissolved in wiring solution-forming in deionized water, hydroxycarboxylic acid 12g, stannous sulfate 100g, organic sulfonic acid copper 80g, single nickel salt 50g stirring and dissolving makes mixed solution is added in this solution, in this mixed solution, add brightening agent 2g dissolve, the deionized water adding surplus is again 1L to cumulative volume, obtains tin-copper-nickel alloy electroplate liquid.
Regulate this electroplate liquid PH to 4 ~ 8 with ammoniacal liquor, do anode with carbon dioxide process carbon electrode, workpiece does negative pole, temperature of electroplating solution be 60 DEG C, current density is 80mA/cm
2, negative electrode and positive electrode area ratio be under 1:1 condition, electroplate, obtain light tin-copper-nickel alloy coating.
Embodiment 3: the tin-copper-nickel alloy electroplate liquid of the present embodiment comprises following component:
Use this tin-copper-nickel alloy electroplate liquid electro-plating method as follows:
Prepare tin-copper-nickel alloy electroplate liquid: complexing agent 25g, stablizer 3g and antioxidant 5g are dissolved in wiring solution-forming in deionized water, hydroxycarboxylic acid 12g, stannous sulfate 150g, organic sulfonic acid copper 100g, single nickel salt 80g stirring and dissolving makes mixed solution is added in this solution, in this mixed solution, add brightening agent 2g dissolve, the deionized water adding surplus is again 1L to cumulative volume, obtains tin-copper-nickel alloy electroplate liquid.
Regulate this electroplate liquid PH to 4 ~ 8 with ammoniacal liquor, do anode with carbon dioxide process carbon electrode, workpiece does negative pole, temperature of electroplating solution be 60 DEG C, current density is 80mA/cm
2, negative electrode and positive electrode area ratio be under 1:1 condition, electroplate, obtain light tin-copper-nickel alloy coating.
Tin of the present invention-copper-nickel alloy electroplate liquid composition is simple, cost is low, stability is strong, toxicity is little, safety and environmental protection, electroplates that the coating that obtains is good without whisker, Heat stability is good, ductility, processing characteristics cracks by force, not easily.
It should be noted that and understand, when not departing from the spirit and scope of accompanying claim the present invention for required protection, various amendment and improvement can be made to the present invention of foregoing detailed description.Therefore, the scope of claimed technical scheme is not by the restriction of given any specific exemplary teachings.
Applicant states, the present invention illustrates detailed process equipment and process flow process of the present invention by above-described embodiment, but the present invention is not limited to above-mentioned detailed process equipment and process flow process, namely do not mean that the present invention must rely on above-mentioned detailed process equipment and process flow process and could implement.Person of ordinary skill in the field should understand, any improvement in the present invention, to equivalence replacement and the interpolation of ancillary component, the concrete way choice etc. of each raw material of product of the present invention, all drops within protection scope of the present invention and open scope.
Claims (9)
1. tin-copper-nickel alloy electroplate liquid, it is characterized in that, comprise stannous sulfate 80 ~ 150g/L, organic sulfonic acid copper 60 ~ 100g/L, single nickel salt 40 ~ 80g/L, hydroxycarboxylic acid 10 ~ 20g/L, antioxidant 0.5 ~ 15g/L complexing agent 20 ~ 35g/L, stablizer 1 ~ 5g/L, brightening agent 1 ~ 5g/L, surplus be deionized water.
2. tin according to claim 1-copper-nickel alloy electroplate liquid, it is characterized in that, comprise stannous sulfate 100g/L, organic sulfonic acid copper 80g/L, single nickel salt 50g/L, hydroxycarboxylic acid 12g/L, antioxidant 5g/L, complexing agent 25g/L, stablizer 3g/L, brightening agent 2g/L, surplus be deionized water.
3. tin according to claim 1-copper-nickel alloy electroplate liquid, it is characterized in that, described sulfonic acid copper is a kind of in copper methanesulfonate, trifluoromethayl sulfonic acid copper, thionamic acid copper, fourth sulfonic acid copper or at least 2 kinds mixtures, and described hydroxycarboxylic acid is a kind of in oxyacetic acid, lactic acid, citric acid, oxysuccinic acid or at least 2 kinds mixtures.
4. tin according to claim 1-copper-nickel alloy electroplate liquid, is characterized in that, described complexing agent is a kind of in Trisodium Citrate, Sunmorl N 60S or both mixtures, and described stablizer is a kind of in phytic acid, xitix or both mixtures.
5. tin according to claim 1-copper-nickel alloy electroplate liquid, is characterized in that, described brightening agent is a kind of in asccharin, formaldehyde, dimethylated hexynol or at least 2 kinds mixtures.
6. use the electroplate liquid electric plating method described in claim 1, it is characterized in that, comprise the following steps:
(1) tin-copper-nickel alloy electroplate liquid is prepared: complexing agent 20 ~ 35g, stablizer 1 ~ 5g and antioxidant 0.5 ~ 15g are dissolved in wiring solution-forming in deionized water, hydroxycarboxylic acid 10 ~ 20g, stannous sulfate 80 ~ 150g, organic sulfonic acid copper 60 ~ 100g, single nickel salt 40 ~ 80g stirring and dissolving makes mixed solution is added in this solution, in this mixed solution, add brightening agent 1 ~ 5g dissolve, the deionized water adding surplus is again 1L to cumulative volume, obtains tin-copper-nickel alloy electroplate liquid;
(2) do anode with carbon dioxide process carbon electrode, workpiece does negative pole, electroplates, and obtains the tin-copper-nickel alloy coating of light.
7. electro-plating method according to claim 6, is characterized in that, obtains tin-copper-nickel alloy electroplate liquid ammoniacal liquor and regulate PH to 4 ~ 8 in step (1).
8. electro-plating method according to claim 6, is characterized in that, in step (2), electroplating process is temperature 40 ~ 80 DEG C, and current density is 50 ~ 150mA/cm
2under carry out.
9. electro-plating method according to claim 6, is characterized in that, in step (2), the area ratio of negative electrode and positive electrode is (1/2 ~ 2): 1.
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| CN201410395964.0A CN105369304A (en) | 2014-08-12 | 2014-08-12 | A tin-copper-nickel alloy electroplating solution and an electroplating method thereof |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105755512A (en) * | 2016-03-04 | 2016-07-13 | 昆山艾森半导体材料有限公司 | Antioxidant for tin methane-sulfonate, preparation method and use method thereof |
| CN107687011A (en) * | 2017-07-14 | 2018-02-13 | 成都联利达五金制品有限公司 | A kind of sulphite electroplate liquid |
| CN112626575A (en) * | 2020-11-30 | 2021-04-09 | 杭州科技职业技术学院 | Surface electroplating liquid for alloy and electroplating process |
| CN114075680A (en) * | 2020-08-21 | 2022-02-22 | 江苏澳光电子有限公司 | Corrosion-resistant water-seal electroplating solution |
-
2014
- 2014-08-12 CN CN201410395964.0A patent/CN105369304A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105755512A (en) * | 2016-03-04 | 2016-07-13 | 昆山艾森半导体材料有限公司 | Antioxidant for tin methane-sulfonate, preparation method and use method thereof |
| CN105755512B (en) * | 2016-03-04 | 2018-01-05 | 昆山艾森半导体材料有限公司 | A kind of tin methane sulfonate antioxidant and preparation method thereof and application method |
| CN107687011A (en) * | 2017-07-14 | 2018-02-13 | 成都联利达五金制品有限公司 | A kind of sulphite electroplate liquid |
| CN114075680A (en) * | 2020-08-21 | 2022-02-22 | 江苏澳光电子有限公司 | Corrosion-resistant water-seal electroplating solution |
| CN112626575A (en) * | 2020-11-30 | 2021-04-09 | 杭州科技职业技术学院 | Surface electroplating liquid for alloy and electroplating process |
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