WO2008137459A3 - Agitation of electrolytic solution in electrodeposition - Google Patents

Agitation of electrolytic solution in electrodeposition Download PDF

Info

Publication number
WO2008137459A3
WO2008137459A3 PCT/US2008/062027 US2008062027W WO2008137459A3 WO 2008137459 A3 WO2008137459 A3 WO 2008137459A3 US 2008062027 W US2008062027 W US 2008062027W WO 2008137459 A3 WO2008137459 A3 WO 2008137459A3
Authority
WO
WIPO (PCT)
Prior art keywords
electrolytic solution
agitation
electrodeposition
substrate
ultrasound
Prior art date
Application number
PCT/US2008/062027
Other languages
French (fr)
Other versions
WO2008137459A2 (en
Inventor
Sergey Savastiouk
Valentin Kosenko
Alexander J Berger
Original Assignee
Tru Si Technologies Inc
Sergey Savastiouk
Valentin Kosenko
Alexander J Berger
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tru Si Technologies Inc, Sergey Savastiouk, Valentin Kosenko, Alexander J Berger filed Critical Tru Si Technologies Inc
Publication of WO2008137459A2 publication Critical patent/WO2008137459A2/en
Publication of WO2008137459A3 publication Critical patent/WO2008137459A3/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/10—Agitating of electrolytes; Moving of racks
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18—Electroplating using modulated, pulsed or reversing current
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/20—Electroplating using ultrasonics, vibrations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
    • H01L21/2885—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition using an external electrical current, i.e. electro-deposition
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76898—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics formed through a semiconductor substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76877—Filling of holes, grooves or trenches, e.g. vias, with conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09563—Metal filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0285—Using ultrasound, e.g. for cleaning, soldering or wet treatment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0292—Using vibration, e.g. during soldering or screen printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1492—Periodical treatments, e.g. pulse plating of through-holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/421—Blind plated via connections

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Electrochemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

In a reverse pulse plating of a substrate (110), the electrolytic solution is agitated with a greater power on forward pulses (210) than on reverse pulses (220). An ultrasound agitation source (170) can be positioned at the bottom of the substrate (110) if the anode (134) is at the top. The ultrasound source may contact the substrate's bottom. Other features are also provided.
PCT/US2008/062027 2007-05-03 2008-04-30 Agitation of electrolytic solution in electrodeposition WO2008137459A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/744,046 US20080271995A1 (en) 2007-05-03 2007-05-03 Agitation of electrolytic solution in electrodeposition
US11/744,046 2007-05-03

Publications (2)

Publication Number Publication Date
WO2008137459A2 WO2008137459A2 (en) 2008-11-13
WO2008137459A3 true WO2008137459A3 (en) 2009-04-16

Family

ID=39864962

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2008/062027 WO2008137459A2 (en) 2007-05-03 2008-04-30 Agitation of electrolytic solution in electrodeposition

Country Status (2)

Country Link
US (1) US20080271995A1 (en)
WO (1) WO2008137459A2 (en)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2381015B1 (en) 2005-08-12 2019-01-16 Modumetal, Inc. Compositionally modulated composite materials
EA201792049A1 (en) 2009-06-08 2018-05-31 Модьюметал, Инк. ELECTRICALLY DESIGNED NANOLAMINATE COATINGS AND SHELLS FOR PROTECTION AGAINST CORROSION
JP6113154B2 (en) 2011-06-24 2017-04-12 エーシーエム リサーチ （シャンハイ） インコーポレーテッド Method and apparatus for forming a uniform metal film on a substrate
CN103000567B (en) * 2011-09-13 2015-07-22 中芯国际集成电路制造(北京)有限公司 Manufacturing method of semiconductor device
CA2905513C (en) 2013-03-15 2022-05-03 Modumetal, Inc. Nickel chromium nanolaminate coating having high hardness
EP2971266A4 (en) 2013-03-15 2017-03-01 Modumetal, Inc. A method and apparatus for continuously applying nanolaminate metal coatings
EP2971264A4 (en) 2013-03-15 2017-05-31 Modumetal, Inc. Nanolaminate coatings
CA2905536C (en) 2013-03-15 2023-03-07 Modumetal, Inc. Electrodeposited compositions and nanolaminated alloys for articles prepared by additive manufacturing processes
US10472727B2 (en) 2013-03-15 2019-11-12 Modumetal, Inc. Method and apparatus for continuously applying nanolaminate metal coatings
JP6116450B2 (en) * 2013-09-05 2017-04-19 住友精密工業株式会社 Metal filling apparatus and metal filling method
CA2961507C (en) 2014-09-18 2024-04-09 Modumetal, Inc. Methods of preparing articles by electrodeposition and additive manufacturing processes
EP3194642A4 (en) 2014-09-18 2018-07-04 Modumetal, Inc. A method and apparatus for continuously applying nanolaminate metal coatings
CN109952391B (en) 2016-09-08 2022-11-01 莫杜美拓有限公司 Method of providing a laminate coating on a workpiece, and articles made therefrom
CN110637107B (en) 2017-03-24 2022-08-19 莫杜美拓有限公司 Lift plunger with electroplated layer and system and method for producing the same
EP3612669A1 (en) 2017-04-21 2020-02-26 Modumetal, Inc. Tubular articles with electrodeposited coatings, and systems and methods for producing the same
WO2019210264A1 (en) 2018-04-27 2019-10-31 Modumetal, Inc. Apparatuses, systems, and methods for producing a plurality of articles with nanolaminated coatings using rotation

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10204680A (en) * 1997-01-14 1998-08-04 Murata Mfg Co Ltd Plating method and plating apparatus
DE19925373A1 (en) * 1999-06-02 2000-12-07 Bosch Gmbh Robert Metal electroplating process, especially for producing metallic microstructures, uses a periodic succession of deposition pulses and pauses and electrolyte movement relative to the workpiece
US6368482B1 (en) * 2000-09-19 2002-04-09 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration, Washington, Dc (Us) Plating processes utilizing high intensity acoustic beams
WO2004112093A2 (en) * 2003-06-06 2004-12-23 P.C.T. Systems, Inc. Method and apparatus to process substrates with megasonic energy
US20060131175A1 (en) * 2002-12-18 2006-06-22 Reiner Anton Method for the deposition of an alloy on a substrate

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4686014A (en) * 1984-11-23 1987-08-11 Pellegrino Peter P Turbulent cell electroplating method and apparatus
DE19547948C1 (en) * 1995-12-21 1996-11-21 Atotech Deutschland Gmbh Mfg. unipolar or bipolar pulsed current for plating esp. of circuit boards at high current
US5662788A (en) * 1996-06-03 1997-09-02 Micron Technology, Inc. Method for forming a metallization layer
US6547936B1 (en) * 1996-11-22 2003-04-15 Chema Technology, Inc. Electroplating apparatus having a non-dissolvable anode
US7556722B2 (en) * 1996-11-22 2009-07-07 Metzger Hubert F Electroplating apparatus
US6929723B2 (en) * 1996-11-22 2005-08-16 Hubert F. Metzger Electroplating apparatus using a non-dissolvable anode and ultrasonic energy
WO1999061032A1 (en) * 1998-05-25 1999-12-02 Nippon Shinyaku Co., Ltd. Process for producing composite preparation containing nucleic acid
MY144574A (en) * 1998-09-14 2011-10-14 Ibiden Co Ltd Printed circuit board and method for its production
KR100390890B1 (en) * 1998-11-14 2003-10-08 주식회사 하이닉스반도체 A method for forming a conductive layer and an apparatus thereof
US6140241A (en) * 1999-03-18 2000-10-31 Taiwan Semiconductor Manufacturing Company Multi-step electrochemical copper deposition process with improved filling capability
DE60045566D1 (en) * 1999-08-06 2011-03-03 Ibiden Co Ltd Multi-layer printed circuit board
US6398937B1 (en) * 2000-09-01 2002-06-04 National Research Council Of Canada Ultrasonically assisted plating bath for vias metallization in printed circuit board manufacturing
US6610189B2 (en) * 2001-01-03 2003-08-26 Applied Materials, Inc. Method and associated apparatus to mechanically enhance the deposition of a metal film within a feature
US6746590B2 (en) * 2001-09-05 2004-06-08 3M Innovative Properties Company Ultrasonically-enhanced electroplating apparatus and methods
JP2003213489A (en) * 2002-01-15 2003-07-30 Learonal Japan Inc Method of via-filling
US20030196901A1 (en) * 2002-04-23 2003-10-23 Applied Materials, Inc. Method for plating metal onto wafers
DE10223957B4 (en) * 2002-05-31 2006-12-21 Advanced Micro Devices, Inc., Sunnyvale An improved method of electroplating copper on a patterned dielectric layer
US7022216B2 (en) * 2002-06-12 2006-04-04 Faraday Technology Marketing Group, Llc Electrolytic etching of metal layers
DE60336539D1 (en) * 2002-12-20 2011-05-12 Shipley Co Llc Method for electroplating with reversed pulse current

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10204680A (en) * 1997-01-14 1998-08-04 Murata Mfg Co Ltd Plating method and plating apparatus
DE19925373A1 (en) * 1999-06-02 2000-12-07 Bosch Gmbh Robert Metal electroplating process, especially for producing metallic microstructures, uses a periodic succession of deposition pulses and pauses and electrolyte movement relative to the workpiece
US6368482B1 (en) * 2000-09-19 2002-04-09 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration, Washington, Dc (Us) Plating processes utilizing high intensity acoustic beams
US20060131175A1 (en) * 2002-12-18 2006-06-22 Reiner Anton Method for the deposition of an alloy on a substrate
WO2004112093A2 (en) * 2003-06-06 2004-12-23 P.C.T. Systems, Inc. Method and apparatus to process substrates with megasonic energy

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
CHAN K C ET AL: "The effects of pulse plating parameters on copper plating distribution of microvia in pcb manufacture", IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, IEEE, PISCATAWAY, NY, US, vol. 26, no. 2, 1 April 2003 (2003-04-01), pages 106 - 109, XP011102081, ISSN: 1521-334X *

Also Published As

Publication number Publication date
US20080271995A1 (en) 2008-11-06
WO2008137459A2 (en) 2008-11-13

Similar Documents

Publication Publication Date Title
WO2008137459A3 (en) Agitation of electrolytic solution in electrodeposition
WO2004016829A3 (en) Electrolytic copper plating solutions
USD620748S1 (en) Cookware handle
USD558882S1 (en) Biomedical electrode for attachment to skin
EP1533041A4 (en) Electrolyzed water spraying device
EP2337072A3 (en) Light emitting device and light unit using the same
EP1892103A3 (en) Ink tank
AU2003302453A1 (en) Bipolar zero-gap electrolytic cell
WO2004083488A3 (en) Electrolytic cell for production of aluminum from alumina
TW200702498A (en) Method for electrodeposition of bronzes
WO2008108341A1 (en) Production method and device of surface roughened copper plate, and surface roughened copper plate
TW200626754A (en) Copper electrolytic solution containing compound having specified structrue and electrolytic copper foil produced with the same
WO2006052310A3 (en) Nickel electroplating bath designed to replace monovalent copper strike solutions
EP2166271A3 (en) Hydrogen supply equipment
AU2002322853A1 (en) Ultrasonically-enhanced electroplating apparatus and methods
AU2003212904A1 (en) Improved cathode for use in the production of aluminium in an electrolytic cell
WO2006055145A3 (en) Current collimation for thin seed and direct plating
EP3088570A3 (en) Acid copper electroplating bath and method for electroplating low internal stress and good ductility copper deposits
EP1493847A3 (en) Plating tool, plating method, electroplating apparatus, plated product, and method for producing plated product
EP1622212A3 (en) Nanostructured electrodes
CA114699S (en) Battery grid
WO2005064043A3 (en) Improved metal strip electroplating
WO2012021695A3 (en) Deplating contacts in an electrochemical plating apparatus
USD568802S1 (en) Boat hull
CN201785534U (en) Electroplating clamp with surface rubber coating

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08747196

Country of ref document: EP

Kind code of ref document: A2

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 08747196

Country of ref document: EP

Kind code of ref document: A2