WO2006052310A3 - Nickel electroplating bath designed to replace monovalent copper strike solutions - Google Patents

Nickel electroplating bath designed to replace monovalent copper strike solutions Download PDF

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Publication number
WO2006052310A3
WO2006052310A3 PCT/US2005/028628 US2005028628W WO2006052310A3 WO 2006052310 A3 WO2006052310 A3 WO 2006052310A3 US 2005028628 W US2005028628 W US 2005028628W WO 2006052310 A3 WO2006052310 A3 WO 2006052310A3
Authority
WO
WIPO (PCT)
Prior art keywords
nickel electroplating
acid
nickel
electroplating bath
monovalent copper
Prior art date
Application number
PCT/US2005/028628
Other languages
French (fr)
Other versions
WO2006052310A2 (en
Inventor
Siona Bunce
Anthony Rowan
Ernest Long
Original Assignee
Macdermid Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Macdermid Inc filed Critical Macdermid Inc
Publication of WO2006052310A2 publication Critical patent/WO2006052310A2/en
Publication of WO2006052310A3 publication Critical patent/WO2006052310A3/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)

Abstract

A nickel electroplating bath is disclosed which is suitable for plating, a base layer of nickel over zinc or zinc alloy parts. Subsequent plating onto this base layer can be achieved with copper, chromium or bright nickel with good adhesion and appearance. The nickel electroplating solution proposed comprises an additive package comprising (i) sulphonic acid or sulphonic acid salts, (ii) sulfonated alkoxylate and (iii) organic acid selected from the group consisting of tolylacetic acid, salicylic acid, hydroxy-benzoic acid, benzyloxyacetone and mixtures of the foregoing.
PCT/US2005/028628 2004-11-10 2005-08-10 Nickel electroplating bath designed to replace monovalent copper strike solutions WO2006052310A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/985,134 2004-11-10
US10/985,134 US20060096868A1 (en) 2004-11-10 2004-11-10 Nickel electroplating bath designed to replace monovalent copper strike solutions

Publications (2)

Publication Number Publication Date
WO2006052310A2 WO2006052310A2 (en) 2006-05-18
WO2006052310A3 true WO2006052310A3 (en) 2006-12-21

Family

ID=36315195

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2005/028628 WO2006052310A2 (en) 2004-11-10 2005-08-10 Nickel electroplating bath designed to replace monovalent copper strike solutions

Country Status (2)

Country Link
US (1) US20060096868A1 (en)
WO (1) WO2006052310A2 (en)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ES2615337T3 (en) * 2008-07-08 2017-06-06 Enthone, Inc. Electrolyte and method to deposit a matt metallic layer
US20100084278A1 (en) * 2008-10-02 2010-04-08 Rowan Anthony J Novel Cyanide-Free Electroplating Process for Zinc and Zinc Alloy Die-Cast Components
KR101058635B1 (en) * 2008-12-23 2011-08-22 와이엠티 주식회사 Electroless Nickel Plating Solution Composition, Flexible Printed Circuit Board and Manufacturing Method Thereof
US20110155582A1 (en) 2009-11-18 2011-06-30 Tremmel Robert A Semi-Bright Nickel Plating Bath and Method of Using Same
DE102012216011A1 (en) * 2012-09-10 2014-03-13 Dr. Hesse GmbH & Cie. KG Boric acid-free zinc-nickel electrolyte
CN102965697B (en) * 2012-12-18 2015-06-24 南通广联实业有限公司 Electroplating process for flexible nickel
JP6024714B2 (en) * 2013-10-03 2016-11-16 トヨタ自動車株式会社 Nickel solution for film formation and film forming method using the same
DE102013113129A1 (en) * 2013-11-27 2015-05-28 RIAG Oberflächentechnik AG Process for the galvanic deposition of nickel and corresponding electrolyte
DE102014118614A1 (en) * 2014-12-15 2016-06-16 Harting Kgaa Boric acid-free nickel bath
JP2020524746A (en) * 2017-06-23 2020-08-20 アトテック ドイチェランド ゲーエムベーハー Nickel electroplating bath for depositing a decorative nickel coating on a substrate
TWI658174B (en) * 2017-09-22 2019-05-01 明志科技大學 Electroplating equipment
KR102589924B1 (en) * 2018-08-16 2023-10-17 현대자동차주식회사 Method of manufacturing electrocatalyst through one step electrodeposition and manufactured electrocatalyst therefrom
CN112522685A (en) * 2020-12-03 2021-03-19 江苏思瑞奕精密科技有限公司 Zinc alloy surface treatment method
CN113073364A (en) * 2021-03-26 2021-07-06 深圳市崇辉表面技术开发有限公司 Electroplating solution for LED bracket and preparation method thereof

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3753872A (en) * 1971-01-11 1973-08-21 Langbein Pfanhauser Werke Ag Method of and bath for producing microcrack chromium coatings
WO2003100137A2 (en) * 2002-05-23 2003-12-04 Atotech Deutschland Gmbh Acid plating bath and method for the electolytic deposition of satin nickel deposits

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU561654B2 (en) * 1981-08-21 1987-05-14 Rosemount Analytical Inc Solid electrolyte gas sensor
US4469569A (en) * 1983-01-03 1984-09-04 Omi International Corporation Cyanide-free copper plating process
US4521282A (en) * 1984-07-11 1985-06-04 Omi International Corporation Cyanide-free copper electrolyte and process
US4904354A (en) * 1987-04-08 1990-02-27 Learonal Inc. Akaline cyanide-free Cu-Zu strike baths and electrodepositing processes for the use thereof
US5006262A (en) * 1989-11-21 1991-04-09 Met. Rev. Inc. Process for recovering copper from copper ion containing aqueous solutions
US5266212A (en) * 1992-10-13 1993-11-30 Enthone-Omi, Inc. Purification of cyanide-free copper plating baths
US6054037A (en) * 1998-11-11 2000-04-25 Enthone-Omi, Inc. Halogen additives for alkaline copper use for plating zinc die castings

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3753872A (en) * 1971-01-11 1973-08-21 Langbein Pfanhauser Werke Ag Method of and bath for producing microcrack chromium coatings
WO2003100137A2 (en) * 2002-05-23 2003-12-04 Atotech Deutschland Gmbh Acid plating bath and method for the electolytic deposition of satin nickel deposits

Also Published As

Publication number Publication date
WO2006052310A2 (en) 2006-05-18
US20060096868A1 (en) 2006-05-11

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