MY114710A - Electrolytic desilvering agents and electrolytic desilvering method - Google Patents

Electrolytic desilvering agents and electrolytic desilvering method

Info

Publication number
MY114710A
MY114710A MYPI96002021A MYPI19962021A MY114710A MY 114710 A MY114710 A MY 114710A MY PI96002021 A MYPI96002021 A MY PI96002021A MY PI19962021 A MYPI19962021 A MY PI19962021A MY 114710 A MY114710 A MY 114710A
Authority
MY
Malaysia
Prior art keywords
electrolytic
desilvering
agent
copper
bath
Prior art date
Application number
MYPI96002021A
Inventor
Hisano Satomi
Aiba Akihiro
Original Assignee
Nippon Mining Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mining Co filed Critical Nippon Mining Co
Publication of MY114710A publication Critical patent/MY114710A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F5/00—Electrolytic stripping of metallic layers or coatings
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/20—Separation of the formed objects from the electrodes with no destruction of said electrodes
    • C25D1/22—Separating compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Preventing Corrosion Or Incrustation Of Metals (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)

Abstract

AN ELECTROLYTIC DESILVERING AGENT COMPRISING: (A) AT ONE DESILVERING CONSTITUENT SELECTED FROM THE GROUP CONSISTING OF HYDANTOIN, 5,5-DIMETHYLHYDANTOIN, CYANURIC ACID, 6-METHYL-3-PYRIDAZONE, 3-METHYL-5-PYRAZOLONE, AND ALLANTOIN, AS A PRINCIPAL CONSTITUENT; AND (B)A BORIC ACID COMPOUND AS AN ACCESSORY CONSTITUENT. DESIRABLY, THE AGENT FURTHER COMPRISES (C) A SURFACTANT AND (D) ONE OR MORE SELECTED FROM THE GROUP CONSISTING OF BENZOTRIAZOLE, BENZIMIDAZOLE, THIOURACIL, AND THE LIKE, AS A COPPER OR INHIBITORS. A WORKPIECE OF COPPER OR A.COPPER ALLOY SILVER PLATED ON THE SURFACE IS IMMERSED INTO A BATH OF THE ELECTROLYTIC DESIIVERING AGENT AND ELECTROLYSIS IS CARRIED OUT USING THE WORKPIECE AS AN ANODE, WITH STIRRING UNDER THE CONDITIONS OF PH: 7 TO 14; BATH CURRENT DENSITY: 0.1 TO 50 A/D M2; AND BATH TEMPERATURE: 10 TO 60?C.
MYPI96002021A 1995-05-31 1996-05-28 Electrolytic desilvering agents and electrolytic desilvering method MY114710A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP15546295 1995-05-31
JP15546195 1995-05-31
JP8142304A JP2939181B2 (en) 1995-05-31 1996-05-14 Silver electrolytic peeling agent and electrolytic peeling method

Publications (1)

Publication Number Publication Date
MY114710A true MY114710A (en) 2002-12-31

Family

ID=27318421

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI96002021A MY114710A (en) 1995-05-31 1996-05-28 Electrolytic desilvering agents and electrolytic desilvering method

Country Status (6)

Country Link
JP (1) JP2939181B2 (en)
KR (1) KR100251832B1 (en)
GB (1) GB2301599B (en)
HK (1) HK1008687A1 (en)
MY (1) MY114710A (en)
SG (1) SG74111A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100322499B1 (en) * 1999-06-29 2002-02-07 김 무 Method for Stripping an unnecessary Silver Plating In Manufacturing a Lead-Frame
KR100429389B1 (en) * 2001-07-23 2004-04-29 유니온스페셜티 (주) Electrolytic Removing Agent for Silver and Process for Electrolytic Removing of Silver
CN109880161A (en) * 2019-02-26 2019-06-14 张坤 A kind of Compositional type copper resistant agent and its preparation and verification method

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1162504A (en) * 1980-11-25 1984-02-21 Mobuyuki Oda Treating tin plated steel sheet with composition containing titanium or zirconium compounds
JPH05311485A (en) * 1991-12-25 1993-11-22 Nikko Kinzoku Kk Hole sealing treatment of noble metal plate material
JP2603800B2 (en) * 1994-03-08 1997-04-23 日本エレクトロプレイテイング・エンジニヤース株式会社 Silver electrolytic stripping solution and electrolytic stripping method using the same

Also Published As

Publication number Publication date
GB2301599A (en) 1996-12-11
GB2301599B (en) 1999-11-10
HK1008687A1 (en) 1999-05-14
JPH0949100A (en) 1997-02-18
KR100251832B1 (en) 2000-04-15
SG74111A1 (en) 2000-07-18
GB9611400D0 (en) 1996-08-07
KR960041426A (en) 1996-12-19
JP2939181B2 (en) 1999-08-25

Similar Documents

Publication Publication Date Title
MY132467A (en) Tin electroplating process
GB1327376A (en) Electrodeposition of copper
GB0027930D0 (en) Intermetallic compounds
HK1000650A1 (en) Process for plating a face of an aluminium or aluminium alloy workpiece
MY122680A (en) Electrodeposited copper foil with carrier, method for producing the electrodeposited copper foil, and copper-clad laminate formed by use of the electrodeposited copper foil
ATE262055T1 (en) ELECTROLYTIC SOLUTION FOR THE ELECTROCHEMICAL DEPOSITION OF PALLADIUM OR ITS ALLOYS
MY114710A (en) Electrolytic desilvering agents and electrolytic desilvering method
PL319470A1 (en) Method of treating outer surfaces of continuous casting mould components made of copper or its alloys, including nickel plating stage and stage of removing the nickel coating from that surface
US5376189A (en) Composition and process for treatment of metallic surfaces
ATE142285T1 (en) METHOD FOR CONTINUOUSLY PRODUCING AN ELECTRICAL CONDUCTOR FROM COPPER-PLATED AND TIN-PLATED ALUMINUM AND CONDUCTOR PRODUCED IN THIS WAY
GB2253634A (en) Pretreating solution for silver plating to prevent silver displacement
PL344187A1 (en) Method and apparatus for the treatment of a melt
MY130855A (en) Tin electroplating process
US4299670A (en) Palladium plating procedure and bath
JPS57140891A (en) Pretreating solution for silver plating
JPS57145969A (en) Chemical plating method
JP2997186B2 (en) Silver electrolytic stripping agent and electrolytic stripping method
JP2603800B2 (en) Silver electrolytic stripping solution and electrolytic stripping method using the same
JP2000345400A (en) Electrolytic peeling agent for silver and electrolytic peeling method therefor
ATE286547T1 (en) METHOD FOR THE GALVANIC DEPOSITATION OF ZINC DEPOSITS AND/OR ZINC ALLOY DEPOSITS
JP4445648B2 (en) Silver electrolytic stripping solution and silver electrolytic stripping method using the same
JPH07173676A (en) Surface treatment of tin or tin-lead alloy plated material
TW338072B (en) Lectrolytic desilvering agents and electrolytic desilvering method
KR100429389B1 (en) Electrolytic Removing Agent for Silver and Process for Electrolytic Removing of Silver
JPH08337900A (en) Electrolytically stripping agent for silver