JP4445648B2 - Silver electrolytic stripping solution and silver electrolytic stripping method using the same - Google Patents

Silver electrolytic stripping solution and silver electrolytic stripping method using the same Download PDF

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JP4445648B2
JP4445648B2 JP2000207798A JP2000207798A JP4445648B2 JP 4445648 B2 JP4445648 B2 JP 4445648B2 JP 2000207798 A JP2000207798 A JP 2000207798A JP 2000207798 A JP2000207798 A JP 2000207798A JP 4445648 B2 JP4445648 B2 JP 4445648B2
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silver
plating film
stripping solution
electrolytic
acid
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JP2002030500A (en
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保夫 加藤
邦明 石渡
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NE Chemcat Corp
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NE Chemcat Corp
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Description

【0001】
【発明の属する技術分野】
本発明は、銀の電解剥離液及びそれを用いた銀の電解剥離方法に関する。
【0002】
【従来の技術】
ICリードフレーム等の電子部品に部分銀めっきを施す場合、めっきを施さないめっき不要部分をラバーマスク等でマスキングし、必要な部分のみにめっきすることが行われる。この場合に、マスキングした部分にめっき液が入り込んでしまい、めっき不要部分までめっきされることが多い。このような場合、めっきした後に、この不要なめっき皮膜を剥離除去する必要がある。剥離する方法として、被処理物を剥離液に浸漬し、この被処理物を陽極として電気分解し、不要なめっき皮膜を除去することにより行われる。
【0003】
剥離液としては、従来より、シアン化ナトリウムやシアン化カリウム等のシアン化物を剥離液中に数十g/L含有するシアン系剥離液が知られている。シアン系剥離液は、毒性が強いため作業が危険であり、廃水処理が煩雑であるという問題があった。さらに、銀めっきが施される素地が銅又は銅系合金の場合、シアン系剥離液はシアン化物が素地を変色させるため銅又は銅系合金素地に使用できないという問題があった。
【0004】
そこで、シアンを含有しない電解剥離液が提案された。このような電解剥離液としては、−NH−を含有する5員環及び6員環化合物を主成分とするもの(特開平2−175825号公報)、2−ピロリドン−5−カルボン酸からなるもの(特開平6−41800号公報)、ヒダントイン化合物からなるもの(特開平7−243100号公報)、アラントインからなるもの(特開平8−337900号公報)がある。
【0005】
しかし、これらの電解剥離液は、実用的な剥離速度を得るためには、強アルカリ性成分を用いて主成分を溶解して用いる。このため、不要な部分の銀めっき皮膜を除去できても、剥離の対象としていない必要部分のめっき皮膜にまで腐蝕溶解が進み、必要部分のめっき皮膜の光沢度が変化したり、めっき皮膜が部分的に腐蝕されてムラが生ずるという欠点がある。
【0006】
また、これらの電解剥離液は、剥離液を強く攪拌しないと必要部分のめっき皮膜に変色やムラが生ずるため、弱い攪拌状態下で電解剥離処理する短冊型の被処理物には使用することができず、強い攪拌状態下で電解剥離処理するリールツーリール方式の被処理物にしか使用できないという制限がある。
【0007】
さらに、これらの電解剥離液は、必要部分のめっき皮膜にムラが生ずるのを防ぐために、剥離液中の主成分を80〜100g/Lという高い濃度にする必要がある。このため、剥離液のコストが高くなるという欠点がある。
【0008】
シアンを含有しない別の電解剥離液としては、ピペラジンやピペリジン等からなるもの(特開平8−325799号公報)、脂肪族アミノカルボン酸からなるもの(特開平10−88398号公報)、ピリジン誘導体からなるもの(特開平11−106999号公報)がある。
【0009】
これらの電解剥離液は、剥離速度が低く、30秒程度の通常の剥離時間では処理できず、生産効率が低いという問題があった。そこで、陽極電流密度を高くして剥離速度を増大させると、不要部分のめっき皮膜と必要部分のめっき皮膜との境界部が腐蝕され、黒く変色するという問題が生じた。
【0010】
さらに、シアンを含有しない電解剥離液として、コハク酸イミド及び/又はフタル酸イミドとアルカリ金属水酸化物とを主成分としてなる電解剥離液が開示された(特開平2−104699号公報)。この電解剥離液は、陽極電流密度を高くしても不要部分のめっき皮膜と必要部分のめっき皮膜との境界部が腐蝕されにくく、黒く変色するという問題がないため、10〜15秒程度の短時間で剥離除去が可能である。さらに、剥離液中の主成分を20〜50g/Lという低い濃度にしても必要部分のめっき皮膜にムラが発生しないという利点がある。
【0011】
しかし、この電解剥離液は、アルカリ金属水酸化物を含有するアルカリ性の液であるため、主成分のコハク酸イミドやフタル酸イミドが加水分解し易く、3日以上経過すると剥離機能が失われる。また、剥離処理中、コハク酸イミドやフタル酸イミドの分解物が必要部分のめっき皮膜に付着し、黄色い変色やムラが発生する。そのため、度々、新しい剥離液に交換しなければならず、作業効率の観点から実用上の大きな問題点となっている。
【0012】
【発明が解決しようとする課題】
本発明は、上記従来技術の問題点を解決するためになされたものであり、その目的は、必要部分のめっき皮膜に変色や光沢ムラが発生せず、必要部分のめっき皮膜と不要部分のめっき皮膜との境界部に変色が発生せず、10〜15秒程度の短時間で剥離することができ、剥離液中の主成分の濃度が50g/L以下であっても使用することができ、2週間以上の連続作業が可能であり、短冊型の被処理物にも使用することができる銀電解剥離液及び該銀電解剥離液を用いた銀電解剥離方法を提供することにある。
【0013】
【課題を解決するための手段】
上記目的を達成するために、本発明は、
〔1〕 (a)コハク酸イミド、(b)脂肪族アミノカルボン酸、脂肪族アミノカルボン酸の塩、脂肪族ヒドロキシカルボン酸及び脂肪族ヒドロキシカルボン酸の塩からなる群から選ばれる少なくとも一種、並びに(c)含窒素複素環状化合物を含有する銀電解剥離液を提案するもので、
〔2〕 pHが3〜10であることを含む。
【0014】
また、本発明は、
〔3〕 〔1〕又は〔2〕に記載の銀電解剥離液に被処理物を浸漬し、該被処理物を陽極として、該被処理物の所定箇所の銀めっき皮膜を除去する銀電解剥離方法を提案するものである。
【0015】
ここで、所定箇所とは、めっきを施す対象にしていない部分であって、被処理物にマスキングしてめっきを施さないようにしたにも拘らず、めっきされたため、電解剥離の対象となった部分(めっき不要部分)を指す。
【0016】
以下、本発明を詳細に説明する。
【0017】
【発明の実施の形態】
本発明の銀電解剥離液は、主成分にコハク酸イミドを用いる。コハク酸イミドは、剥離した金属銀を錯化して可溶性化合物とする錯化剤であり、不要部分の銀めっき皮膜を溶解するとともに、必要部分の銀めっき皮膜に変色の原因となる酸化物等が付着するのを防止する。銀電解剥離液中のコハク酸イミドの含有量は、好ましくは5〜100g/L、更に好ましくは20〜70g/L、特に好ましくは30〜55g/Lである。
【0018】
コハク酸イミドの含有量が5g/Lより少ないと、剥離した金属銀が可溶性化合物になりにくいため剥離作用が低下し、10〜15秒程度での剥離が困難となる。また、必要部分の銀めっき皮膜が変色し易くなる。
【0019】
コハク酸イミドの含有量が100g/Lより多いと、高い陽極電流密度での作業が可能であるが、剥離液中のコハク酸イミドの含有量が多いので、剥離後、被処理物に付着した剥離液に伴って剥離液槽外に持ち出されるコハク酸イミドの量が多くなり、不経済である。
【0020】
脂肪族アミノカルボン酸、脂肪族アミノカルボン酸の塩、脂肪族ヒドロキシカルボン酸及び脂肪族ヒドロキシカルボン酸の塩からなる群から選ばれる少なくとも一種は、コハク酸イミドの錯化性能を低下させることなく剥離液の電気伝導性を高く維持し、剥離液中の可溶性銀化合物を安定的に溶解させることにより、銀化合物やコハク酸イミドの分解物が必要部分の銀めっき皮膜に付着するのを防止する作用を有する。
【0021】
本発明の銀電解剥離液に用いられる脂肪族アミノカルボン酸としては、例えばグリシン、グリシルグリシン、アスパラギン酸、アラニン、グリシルアラニン、バリン、ロイシン、イソロイシン、グルタミン酸、リジン、システイン、シスチン、メチオニン等が挙げられる。また、脂肪族アミノカルボン酸の塩としては、上記した脂肪族アミノカルボン酸のナトリウム塩、カリウム塩が挙げられ、例えばグルタミン酸ソーダ、アスパラギン酸カリウム等が挙げられる。
【0022】
本発明の銀電解剥離液に用いられる脂肪族ヒドロキシカルボン酸としては、例えばクエン酸、酒石酸、リンゴ酸、グルコン酸等が挙げられる。また、脂肪族ヒドロキシカルボン酸の塩としては、上記した脂肪族ヒドロキシカルボン酸のナトリウム塩、カリウム塩が挙げられ、例えばクエン酸ナトリウム、酒石酸カリウム等が挙げられる。
【0023】
これらの脂肪族アミノカルボン酸又はその塩及び脂肪族ヒドロキシカルボン酸又はその塩は一種単独で用いてもよいし、二種以上混合して用いてもよい。
【0024】
銀電解剥離液中の脂肪族アミノカルボン酸、脂肪族アミノカルボン酸の塩、脂肪族ヒドロキシカルボン酸及び脂肪族ヒドロキシカルボン酸の塩からなる群から選ばれる少なくとも一種の含有量は、好ましくは1〜60g/L、更に好ましくは5〜40g/L、特に好ましくは10〜30g/Lである。
【0025】
脂肪族アミノカルボン酸、脂肪族アミノカルボン酸の塩、脂肪族ヒドロキシカルボン酸及び脂肪族ヒドロキシカルボン酸の塩からなる群から選ばれる少なくとも一種の含有量が1g/Lより少ないと、銀電解剥離液の電気伝導性が低下し易くなり、高い陽極電流密度での剥離作業が困難となる。また、めっき素地が銅又は銅合金の場合にはめっき素地が酸化変色し易い。
【0026】
脂肪族アミノカルボン酸、脂肪族アミノカルボン酸の塩、脂肪族ヒドロキシカルボン酸及び脂肪族ヒドロキシカルボン酸の塩からなる群から選ばれる少なくとも一種の含有量が60g/Lより多いと、剥離液中これらの化合物の含有量が多いので、剥離後、被処理物に付着した剥離液に伴って剥離液槽外に持ち出されるこれらの化合物の量が多くなり、不経済である。
【0027】
含窒素複素環状化合物は、必要部分の銀めっき皮膜に吸着し皮膜表面を覆うため、剥離液に溶解している銀化合物が必要部分の銀めっき皮膜に付着するのを防止するとともに、必要部分の銀めっき皮膜がコハク酸イミドによって腐蝕されるのを抑制する。さらに、コハク酸イミドの分解物が必要部分の銀めっき皮膜に付着するのを防止するため、変色やムラの発生を防止する。
【0028】
本発明の銀電解剥離液に用いられる含窒素複素環状化合物としては、例えば2−エチルピリジン、ピリジン、ニコチン、4−ピコリルアミン、3−ピコリルアミン、2−アミノピリジン、2−アミノ−3−ヒドロキシピリジン、3−クロロピリジン、3−シアノピリジン、2,4−ジアミノピリジン、2−ヒドロキシピリジン、2,6−ルチジン、2−メトキシピリジン、ニコチン酸、ニコチンアルデヒド、4−ピコリン、α−ピコリン酸、2,3−ピコリンジオール、キノリン酸、ピリジン−3−スルホン酸、インドール、イサチン、レピジン、2−メチル−8−ヒドロキシキノリン、キノリン、イソキノリン、8−キノール、ピラゾール、アラントイン、2−エチルイミダゾール、イミダゾール、ヒスチジン、2−アミノ−4−ヒドロキシ−6−メチルピリミジン、2−アミノピリミジン、4−アミノウラシル、4,6−ジメチール−2−メルカプトピリミジン、ピリミジン、2−チオウラシル、ウラシル、ベンズイミダゾール、アミノイミダゾール、3−アミノ−1,2,4−トリアゾール、1,2,3−ベンゾトリアゾール、シアヌル酸、2−ビニール−4,6−ジアミノ−s−トリアジン、アデニン、グアニン、2−メルカプトチアゾリン、ロダニン、チアゾール、2−アミノ−6−エトキシベンゾチアゾール、ベンゾチアゾール等が挙げられる。
【0029】
これらの含窒素複素環状化合物は、一種単独で用いてもよいし、二種以上混合して用いてもよい。
【0030】
銀電解剥離液中の含窒素複素環状化合物の含有量は、好ましくは0.1〜25g/L、更に好ましくは0.5〜10g/L、特に好ましくは1〜5g/Lである。
【0031】
含窒素複素環状化合物の含有量が0.1g/Lより少ないと、必要部分の銀めっき皮膜表面を十分に覆うことができないため、剥離液に溶解している銀化合物が必要部分の銀めっき皮膜に付着し易くなる。また、必要部分の銀めっき皮膜がコハク酸イミドによって腐蝕され易くなったり、コハク酸イミドの分解物が必要部分の銀めっき皮膜に付着し易いため、変色やムラが発生し易い。
【0032】
含窒素複素環状化合物の含有量が25g/Lより多いと、含窒素複素環状化合物自体が剥離液に溶解し難くなる。さらに、剥離後、被処理物に付着した剥離液に伴って剥離液槽外に持ち出される含窒素複素環状化合物の量が多くなり、不経済である。
【0033】
本発明の銀電解剥離液においては、電気伝導性を良好に維持するためとコハク酸イミドの溶解を安定にするためにpHを3〜10にすることが好ましい。
【0034】
pHが3より低いと、コハク酸イミドの溶解が不安定となり沈殿し易くなり、銀の電解剥離作用が低下する。pHが10より高いと、コハク酸イミドが加水分解し易くなる。このため、剥離液中におけるコハク酸イミドの濃度を一定に維持することが困難となり、剥離液の寿命が短くなる。
【0035】
本発明の銀電解剥離液は、水酸化カリウム、水酸化ナトリウム若しくはアンモニア水等のアルカリ又は硫酸、塩酸、硝酸若しくは酢酸等の酸を用いてpHを調整することができる。
【0036】
また、本発明の銀電解剥離液には、pHを安定にするためにpH緩衝剤を添加してもよい。pH緩衝剤としては、例えば硼酸、硼酸カリウム、硼酸ナトリウム、燐酸カリウム等が挙げられ、これらの一種以上を添加することができる。
【0037】
さらに、本発明の銀電解剥離液には、必要部分の銀めっき皮膜の外観ムラを防止するために、剥離液の表面張力を低下させる界面活性剤を添加することができる。界面活性剤としては、例えばノニオン界面活性剤、アニオン界面活性剤、カチオン界面活性剤、両性界面活性剤、高分子界面活性剤等が挙げられ、これらの一種以上を添加することができる。
【0038】
本発明の銀電解剥離液は、短冊型及びリールツーリール方式のいずれの剥離装置にも適用することができる。
【0039】
本発明の銀電解剥離液を用いて電解剥離を行う際の液温は、良好な剥離温度を得るために、10〜50℃が好ましく、20〜35℃が更に好ましい。
【0040】
液温が10℃より低いと、剥離液の電気伝導性が低下するため剥離時間が長くなる。液温が50℃より高いと、コハク酸イミドの分解が早く進み、剥離液の寿命が短くなる。
【0041】
陽極電流密度は、剥離液の攪拌状態にもよるが、0.1〜30A/dm2が好ましく、1〜10A/dm2が更に好ましい。ここで、陽極電流密度とは、必要部分の銀めっき皮膜を対象にした電流密度である。
【0042】
陽極電流密度が0.1A/dm2より低いと、剥離時間が長くなり、30A/dm2より高いと、必要部分のめっき部に過剰な電流が流れるため、剥離後の必要部分の銀めっき皮膜の光沢が変色したりムラが発生し易い。
【0043】
陰極には通常、不溶性材料を用いる。これら不溶性材料の中では、白金やロジウム又は白金やロジウムで被覆されたチタン若しくはタンタル、あるいはステンレス鋼が好ましく用いられる。
【0044】
【実施例】
次に実施例を挙げて本発明を具体的に説明するが、本発明はこれら実施例に限定されるものではない。
【0045】
銅合金(オーリン194)製QFP(Quad Flat Packageの略称)144ピンリードフレームのパッド部及びインナーリード部を含む10×10mmの領域をめっき必要部分とし、これ以外の領域をラバーマスクした。このリードフレームに、銀めっき液(エヌ・イー ケムキャット製S−930)を用いて、平均めっき厚さが5μmとなるように半光沢の銀めっきを施して剥離試料とした。この試料のラバーマスクした部分にめっき液が入り込んでめっきされた不要部分のめっき厚さは0.2〜0.5μmであった。
【0046】
この試料を、下記の電解剥離液及び剥離条件で15秒間電解剥離を行い、素地、必要部分銀めっき皮膜及び必要部分銀めっき皮膜と不要部分銀めっき皮膜との境界部について、それぞれの色調を倍率30倍の実体顕微鏡で観察した。結果を表1に示す。
【0047】
なお、各実施例及び比較例での電解剥離後、全ての例について不要部分銀めっき皮膜は剥離除去されていた。
【0048】
また、各実施例及び比較例の電解剥離液をプラスチック製容器に入れて密閉し、これを50℃の恒温槽に浸漬し、2週間保持した後取り出し、各実施例及び比較例に記した剥離条件で15秒間電解剥離を行い、素地、必要部分銀めっき皮膜及び必要部分銀めっき皮膜と不要部分銀めっき皮膜との境界部について、それぞれの色調を倍率30倍の実体顕微鏡で観察した。結果を表1に示す。
【0049】
実施例1
コハク酸イミド 50g/L
グリシン 6g/L
クエン酸 45g/L
α−ピコリン酸 5g/L
pH 5.5
液温 25℃
陽極電流密度 4A/dm2
実施例2
コハク酸イミド 20g/L
グルタミン酸ナトリウム 15g/L
ニコチン酸 1g/L
pH 8.5
液温 35℃
陽極電流密度 2A/dm2
実施例3
コハク酸イミド 85g/L
アスパラギン酸 35g/L
2−アミノピリジン 8g/L
pH 7.6
液温 20℃
陽極電流密度 15A/dm2
実施例4
コハク酸イミド 45g/L
イソロイシン 38g/L
キノリン酸 18g/L
pH 9.5
液温 15℃
陽極電流密度 4.5A/dm2
実施例5
コハク酸イミド 45g/L
グルコン酸 15g/L
α−ピコリン酸 5g/L
pH 6.0
液温 25℃
陽極電流密度 3A/dm2
実施例6
コハク酸イミド 10g/L
酒石酸ナトリウム 50g/L
イミダゾール 20g/L
pH 8.5
液温 20℃
陽極電流密度 1A/dm2
実施例7
コハク酸イミド 65g/L
アスパラギン酸カリウム 20g/L
グルコン酸カリウム 10g/L
α−ピコリン酸 10g/L
pH 4.5
液温 25℃
陽極電流密度 7A/dm2
実施例8
コハク酸イミド 55g/L
システイン 5g/L
酒石酸 15g/L
ニコチン酸 10g/L
pH 5.0
液温 25℃
陽極電流密度 4A/dm2
実施例9
コハク酸イミド 25g/L
アラニン 12g/L
クエン酸カリウム 25g/L
α−ピコリン酸 5g/L
pH 9.0
液温 35℃
陽極電流密度 6A/dm2
比較例1
コハク酸イミド 45g/L
水酸化カリウム 7g/L
pH 9.3
液温 35℃
陽極電流密度 2A/dm2
比較例2
5,5−ジメチルヒダントイン 75g/L
水酸化ナトリウム 30g/L
pH 10.0
液温 40℃
陽極電流密度 5A/dm2
比較例3
グリシン 50g/L
水酸化ナトリウム 10g/L
pH 13.0
液温 40℃
陽極電流密度 2A/dm2
【0050】
【表1】

Figure 0004445648
【0051】
表1より、本発明の実施例1〜9及び比較例1の建浴後の電解剥離液を用いて電解剥離した試料は、素地、必要部分銀めっき皮膜及び必要部分銀めっき皮膜と不要部分銀めっき皮膜との境界部において剥離前と比較して変化がなかった。
一方、比較例2及び3の試料にはそれぞれ、素地が褐色に変色し、必要部分銀めっき皮膜に光沢ムラが生じた。さらに、比較例3の試料では、必要部分銀めっき皮膜と不要部分銀めっき皮膜との境界部が黒灰色に変色した。
【0052】
また、50℃の恒温槽で2週間保持後の電解剥離液を用いて電解剥離した試験において、本発明の実施例1〜9の電解剥離液を用いて電解剥離した試料は、全ての評価項目で剥離前と比較して変化がなかった。建浴後の電解剥離液を用いた場合に全ての評価項目で剥離前と比較して変化がなかった比較例1の電解剥離液は、50℃の恒温槽で2週間保持後に用いると必要部分銀めっき皮膜に黄色ムラが生じた。50℃の恒温槽で2週間保持後に用いた比較例2及び3の電解剥離液では、建浴後の電解剥離液を用いた場合と同様の色調変化が発生した。
【0053】
以上の試験結果から、本発明の銀電解剥離液は、50℃の恒温槽で2週間保持した後であっても、被処理物の色調を変化させることなく良好な電解剥離を行うことができることが示された。
【0054】
【発明の効果】
本発明の銀電解剥離液を用いれば、素地、必要部分の銀めっき皮膜及び必要部分の銀めっき皮膜と不要部分の銀めっき皮膜との境界部に変色や光沢ムラが生ずることなく10〜15秒程度の短時間で剥離することができる。また、剥離液中の主成分の濃度が50g/L以下であっても剥離することができるため剥離液が安価である。さらに、2週間以上の連続剥離作業が可能であり、剥離液の寿命が長いという利点を有する。さらに、本発明の銀電解剥離液は、弱い攪拌状態下で使用しても必要部分の銀めっき皮膜に変色やムラが生じないため短冊型の被処理物にも使用することができる。[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a silver electrolytic stripping solution and a silver electrolytic stripping method using the same.
[0002]
[Prior art]
When partial silver plating is applied to an electronic component such as an IC lead frame, a portion that does not require plating is masked with a rubber mask or the like, and only a necessary portion is plated. In this case, the plating solution enters the masked portion, and plating is often performed up to a portion that does not require plating. In such a case, it is necessary to peel off the unnecessary plating film after plating. As a method for peeling, the object to be treated is immersed in a stripping solution, electrolyzed using the object to be treated as an anode, and unnecessary plating film is removed.
[0003]
As a stripping solution, conventionally, a cyan stripping solution containing several tens of g / L of cyanide such as sodium cyanide and potassium cyanide is known. Since the cyan stripping solution is highly toxic, the work is dangerous and the wastewater treatment is complicated. Furthermore, when the substrate on which silver plating is applied is copper or a copper-based alloy, there is a problem that the cyan stripping solution cannot be used for the copper or copper-based alloy substrate because cyanide discolors the substrate.
[0004]
Therefore, an electrolytic stripping solution not containing cyan has been proposed. Examples of such an electrolytic stripper include those containing a 5-membered ring and 6-membered ring compound containing -NH- as the main component (Japanese Patent Laid-Open No. 2-175825), and those comprising 2-pyrrolidone-5-carboxylic acid. (Japanese Patent Laid-Open No. 6-41800), those composed of hydantoin compounds (Japanese Patent Laid-Open No. 7-243100), and those composed of allantoin (Japanese Patent Laid-Open No. 8-337900).
[0005]
However, these electrolytic stripping solutions are used by dissolving the main component using a strong alkaline component in order to obtain a practical stripping rate. For this reason, even if the unnecessary part of the silver plating film can be removed, the corrosion dissolution proceeds to the necessary part of the plating film that is not subject to peeling, and the gloss of the required part of the plating film changes or the plating film is partially There is a drawback in that unevenness occurs due to corrosion.
[0006]
In addition, these electrolytic stripping solutions may be used for strip-type workpieces that are subjected to electrolytic stripping treatment under weak stirring conditions because the plating film in the necessary portions will be discolored and uneven if the stripping solution is not stirred vigorously. However, there is a limitation that it can only be used for a reel-to-reel type workpiece to be electrolytically stripped under strong stirring conditions.
[0007]
Furthermore, these electrolytic stripping solutions need to have a high concentration of 80 to 100 g / L of the main component in the stripping solution in order to prevent unevenness in the plating film in the necessary portions. For this reason, there exists a fault that the cost of stripping solution becomes high.
[0008]
Other electrolytic stripping solutions not containing cyan include those composed of piperazine, piperidine, etc. (JP-A-8-325799), those composed of aliphatic aminocarboxylic acids (JP-A-10-88398), and pyridine derivatives. (Japanese Patent Laid-Open No. 11-106999).
[0009]
These electrolytic stripping solutions have a problem that the stripping rate is low, they cannot be processed in a normal stripping time of about 30 seconds, and the production efficiency is low. Therefore, when the anode current density is increased to increase the peeling rate, the problem arises that the boundary portion between the unnecessary portion plating film and the necessary portion plating film is corroded and turns black.
[0010]
Furthermore, an electrolytic stripping solution containing succinimide and / or phthalic imide and an alkali metal hydroxide as main components has been disclosed as an electrolytic stripping solution not containing cyan (Japanese Patent Laid-Open No. 2-104699). This electrolytic stripping solution has a short time of about 10 to 15 seconds because there is no problem that the boundary between the plating film of the unnecessary part and the plating film of the necessary part is hardly corroded even when the anode current density is increased, and there is no problem of discoloration to black. It can be peeled and removed in time. Furthermore, even if the main component in the stripping solution is as low as 20 to 50 g / L, there is an advantage that unevenness does not occur in the plating film of the necessary part.
[0011]
However, since this electrolytic stripping solution is an alkaline solution containing an alkali metal hydroxide, the main components succinimide and phthalimide are easily hydrolyzed and the stripping function is lost after 3 days or more. Further, during the peeling treatment, a decomposition product of succinimide or phthalic imide adheres to a plating film in a necessary portion, and yellow discoloration or unevenness occurs. Therefore, it must be replaced with a new stripping solution frequently, which is a big practical problem from the viewpoint of work efficiency.
[0012]
[Problems to be solved by the invention]
The present invention has been made to solve the above-described problems of the prior art, and its purpose is to prevent discoloration and gloss unevenness in the plating film of the necessary part, and to plating the necessary part of the plating film and the unnecessary part. Discoloration does not occur at the boundary with the film, it can be peeled off in a short time of about 10 to 15 seconds, and it can be used even if the concentration of the main component in the peeling liquid is 50 g / L or less, An object of the present invention is to provide a silver electrolytic stripping solution that can be continuously used for 2 weeks or more and can be used for a strip-shaped workpiece, and a silver electrolytic stripping method using the silver electrolytic stripper.
[0013]
[Means for Solving the Problems]
In order to achieve the above object, the present invention provides:
[1] (a) succinimide, (b) at least one selected from the group consisting of aliphatic aminocarboxylic acids, salts of aliphatic aminocarboxylic acids, aliphatic hydroxycarboxylic acids and salts of aliphatic hydroxycarboxylic acids, and (C) A silver electrolytic stripping solution containing a nitrogen-containing heterocyclic compound is proposed,
[2] The pH is 3 to 10.
[0014]
The present invention also provides:
[3] Silver electrolytic stripping in which a workpiece is immersed in the silver electrolytic stripping solution according to [1] or [2], and using the workpiece to be an anode, a silver plating film at a predetermined portion of the workpiece is removed. A method is proposed.
[0015]
Here, the predetermined portion is a portion that is not a target to be plated, and was plated because it was not plated by masking the workpiece. This refers to the part (part that does not require plating)
[0016]
Hereinafter, the present invention will be described in detail.
[0017]
DETAILED DESCRIPTION OF THE INVENTION
The silver electrolytic stripper of the present invention uses succinimide as the main component. Succinimide is a complexing agent that forms a soluble compound by complexing exfoliated metallic silver, and dissolves unnecessary parts of the silver plating film and also causes oxides that cause discoloration in the necessary part of the silver plating film. Prevent sticking. The content of succinimide in the silver electrolytic stripper is preferably 5 to 100 g / L, more preferably 20 to 70 g / L, and particularly preferably 30 to 55 g / L.
[0018]
If the succinimide content is less than 5 g / L, the peeled metal silver is unlikely to become a soluble compound, so that the peeling action is lowered and peeling in about 10 to 15 seconds becomes difficult. Moreover, the silver plating film of a required part becomes easy to discolor.
[0019]
When the content of succinimide is more than 100 g / L, it is possible to work with a high anode current density, but since the content of succinimide in the stripping solution is large, it adheres to the object to be treated after peeling. The amount of succinimide taken out of the stripper tank with the stripper increases, which is uneconomical.
[0020]
At least one selected from the group consisting of aliphatic aminocarboxylic acid, aliphatic aminocarboxylic acid salt, aliphatic hydroxycarboxylic acid and aliphatic hydroxycarboxylic acid salt is peeled off without reducing the complexing performance of succinimide Maintains high electrical conductivity of the solution and stably dissolves soluble silver compounds in the stripping solution to prevent the decomposition of silver compounds and succinimide from adhering to the necessary silver plating film Have
[0021]
Examples of the aliphatic aminocarboxylic acid used in the silver electrolytic stripper of the present invention include glycine, glycylglycine, aspartic acid, alanine, glycylalanine, valine, leucine, isoleucine, glutamic acid, lysine, cysteine, cystine, methionine and the like. Is mentioned. Examples of the salt of the aliphatic aminocarboxylic acid include the sodium salt and potassium salt of the aliphatic aminocarboxylic acid described above, and examples thereof include sodium glutamate and potassium aspartate.
[0022]
Examples of the aliphatic hydroxycarboxylic acid used in the silver electrolytic stripper of the present invention include citric acid, tartaric acid, malic acid, and gluconic acid. Examples of the salt of the aliphatic hydroxycarboxylic acid include the sodium salt and potassium salt of the above-mentioned aliphatic hydroxycarboxylic acid, such as sodium citrate and potassium tartrate.
[0023]
These aliphatic aminocarboxylic acids or salts thereof and aliphatic hydroxycarboxylic acids or salts thereof may be used alone or in combination of two or more.
[0024]
The content of at least one selected from the group consisting of aliphatic aminocarboxylic acids, salts of aliphatic aminocarboxylic acids, aliphatic hydroxycarboxylic acids and salts of aliphatic hydroxycarboxylic acids in the silver electrolytic stripper is preferably 1 to 60 g / L, more preferably 5 to 40 g / L, particularly preferably 10 to 30 g / L.
[0025]
If the content of at least one selected from the group consisting of aliphatic aminocarboxylic acid, aliphatic aminocarboxylic acid salt, aliphatic hydroxycarboxylic acid and aliphatic hydroxycarboxylic acid salt is less than 1 g / L, a silver electrolytic stripping solution The electrical conductivity of the film tends to decrease, and the peeling operation at a high anode current density becomes difficult. Further, when the plating base is copper or a copper alloy, the plating base is easily oxidized and discolored.
[0026]
When the content of at least one selected from the group consisting of aliphatic aminocarboxylic acid, aliphatic aminocarboxylic acid salt, aliphatic hydroxycarboxylic acid and aliphatic hydroxycarboxylic acid salt is more than 60 g / L, Since the content of the compound is large, the amount of these compounds taken out of the stripper tank with the stripper adhering to the object to be treated after stripping increases, which is uneconomical.
[0027]
Since the nitrogen-containing heterocyclic compound is adsorbed to the necessary part of the silver plating film and covers the surface of the film, the silver compound dissolved in the stripping solution is prevented from adhering to the necessary part of the silver plating film, and Suppresses corrosion of silver plating film by succinimide. Furthermore, in order to prevent the decomposition product of succinimide from adhering to the necessary silver plating film, discoloration and unevenness are prevented.
[0028]
Examples of the nitrogen-containing heterocyclic compound used in the silver electrolytic stripper of the present invention include 2-ethylpyridine, pyridine, nicotine, 4-picolylamine, 3-picolylamine, 2-aminopyridine, 2-amino-3-hydroxy. Pyridine, 3-chloropyridine, 3-cyanopyridine, 2,4-diaminopyridine, 2-hydroxypyridine, 2,6-lutidine, 2-methoxypyridine, nicotinic acid, nicotinaldehyde, 4-picoline, α-picolinic acid, 2,3-picolinediol, quinolinic acid, pyridine-3-sulfonic acid, indole, isatin, lepidin, 2-methyl-8-hydroxyquinoline, quinoline, isoquinoline, 8-quinol, pyrazole, allantoin, 2-ethylimidazole, imidazole Histidine, 2-amino-4-hydroxy -6-methylpyrimidine, 2-aminopyrimidine, 4-aminouracil, 4,6-dimethyl-2-mercaptopyrimidine, pyrimidine, 2-thiouracil, uracil, benzimidazole, aminoimidazole, 3-amino-1,2,4 -Triazole, 1,2,3-benzotriazole, cyanuric acid, 2-vinyl-4,6-diamino-s-triazine, adenine, guanine, 2-mercaptothiazoline, rhodanine, thiazole, 2-amino-6-ethoxybenzo Examples include thiazole and benzothiazole.
[0029]
These nitrogen-containing heterocyclic compounds may be used alone or in combination of two or more.
[0030]
The content of the nitrogen-containing heterocyclic compound in the silver electrolytic stripper is preferably 0.1 to 25 g / L, more preferably 0.5 to 10 g / L, and particularly preferably 1 to 5 g / L.
[0031]
If the content of the nitrogen-containing heterocyclic compound is less than 0.1 g / L, the necessary part of the silver plating film surface cannot be sufficiently covered. It becomes easy to adhere to. In addition, the necessary portion of the silver plating film is easily corroded by the succinimide, and the decomposition product of the succinimide is likely to adhere to the necessary portion of the silver plating film, so that discoloration and unevenness are likely to occur.
[0032]
When the content of the nitrogen-containing heterocyclic compound is more than 25 g / L, the nitrogen-containing heterocyclic compound itself is difficult to dissolve in the stripping solution. Furthermore, the amount of the nitrogen-containing heterocyclic compound taken out of the stripping solution tank with the stripping solution adhering to the object to be processed after stripping increases, which is uneconomical.
[0033]
In the silver electrolytic stripper of the present invention, it is preferable to adjust the pH to 3 to 10 in order to maintain good electrical conductivity and to stabilize the dissolution of succinimide.
[0034]
When pH is lower than 3, dissolution of succinimide becomes unstable and precipitation is likely, and the electrolytic peeling action of silver is lowered. When the pH is higher than 10, the succinimide is easily hydrolyzed. For this reason, it becomes difficult to keep the concentration of succinimide in the stripping solution constant, and the life of the stripping solution is shortened.
[0035]
The silver electrolytic stripper of the present invention can be adjusted in pH using an alkali such as potassium hydroxide, sodium hydroxide or aqueous ammonia, or an acid such as sulfuric acid, hydrochloric acid, nitric acid or acetic acid.
[0036]
Further, a pH buffering agent may be added to the silver electrolytic stripper of the present invention in order to stabilize the pH. Examples of the pH buffering agent include boric acid, potassium borate, sodium borate, potassium phosphate and the like, and one or more of these can be added.
[0037]
Furthermore, a surfactant that lowers the surface tension of the stripping solution can be added to the silver electrolytic stripping solution of the present invention in order to prevent uneven appearance of the silver plating film at a necessary portion. Examples of the surfactant include nonionic surfactants, anionic surfactants, cationic surfactants, amphoteric surfactants, and polymer surfactants, and one or more of these can be added.
[0038]
The silver electrolytic stripper of the present invention can be applied to both strip-type and reel-to-reel strippers.
[0039]
The liquid temperature when performing electrolytic stripping using the silver electrolytic stripper of the present invention is preferably 10 to 50 ° C, and more preferably 20 to 35 ° C, in order to obtain a good stripping temperature.
[0040]
When the liquid temperature is lower than 10 ° C., the electrical conductivity of the stripping solution is lowered, so that the stripping time becomes long. When the liquid temperature is higher than 50 ° C., the decomposition of succinimide proceeds rapidly, and the life of the stripping solution is shortened.
[0041]
The anode current density depends on the stirring conditions of the stripping solution is preferably 0.1~30A / dm 2, more preferably 1 to 10 A / dm 2. Here, the anode current density is a current density for a silver plating film of a necessary part.
[0042]
When the anode current density is lower than 0.1 A / dm 2 , the peeling time becomes longer. When the anode current density is higher than 30 A / dm 2 , excessive current flows through the plated portion of the necessary portion. The gloss of the glass is discolored or uneven.
[0043]
An insoluble material is usually used for the cathode. Among these insoluble materials, platinum, rhodium, titanium or tantalum coated with platinum or rhodium, or stainless steel is preferably used.
[0044]
【Example】
EXAMPLES Next, although an Example is given and this invention is demonstrated concretely, this invention is not limited to these Examples.
[0045]
A copper alloy (Olin 194) QFP (abbreviation for Quad Flat Package) 144-pin lead frame including a pad portion and an inner lead portion of a 10 × 10 mm region was required for plating, and the other regions were rubber masked. This lead frame was subjected to semi-glossy silver plating using a silver plating solution (S-930, manufactured by N.E. Chemcat) so as to have an average plating thickness of 5 μm to obtain a peeled sample. The plating thickness of the unnecessary portion plated with the plating solution entering the rubber masked portion of this sample was 0.2 to 0.5 μm.
[0046]
This sample was subjected to electrolytic stripping for 15 seconds under the following electrolytic stripping solution and stripping conditions, and each color tone was multiplied for the substrate, the necessary part silver plating film, and the boundary part between the necessary part silver plating film and the unnecessary part silver plating film. Observation was performed with a 30-fold stereomicroscope. The results are shown in Table 1.
[0047]
In addition, after the electrolysis peeling in each Example and a comparative example, the unnecessary partial silver plating film was peeled and removed about all the examples.
[0048]
Moreover, the electrolytic stripping solution of each Example and Comparative Example was put in a plastic container and sealed, and this was immersed in a thermostatic bath at 50 ° C., held for 2 weeks, taken out, and stripped as described in each Example and Comparative Example Electrolytic peeling was performed for 15 seconds under the conditions, and the color tone of the substrate, the necessary partial silver plating film, and the boundary between the necessary partial silver plating film and the unnecessary partial silver plating film was observed with a stereoscopic microscope at a magnification of 30 times. The results are shown in Table 1.
[0049]
Example 1
Succinimide 50g / L
Glycine 6g / L
Citric acid 45g / L
α-picolinic acid 5g / L
pH 5.5
Liquid temperature 25 ℃
Anode current density 4A / dm 2
Example 2
Succinimide 20g / L
Sodium glutamate 15g / L
Nicotinic acid 1g / L
pH 8.5
Liquid temperature 35 ℃
Anode current density 2A / dm 2
Example 3
Succinimide 85g / L
Aspartic acid 35g / L
2-aminopyridine 8g / L
pH 7.6
Liquid temperature 20 ℃
Anode current density 15A / dm 2
Example 4
Succinimide 45g / L
Isoleucine 38g / L
Quinolic acid 18g / L
pH 9.5
Liquid temperature 15 ℃
Anode current density 4.5 A / dm 2
Example 5
Succinimide 45g / L
Gluconic acid 15g / L
α-picolinic acid 5g / L
pH 6.0
Liquid temperature 25 ℃
Anode current density 3A / dm 2
Example 6
Succinimide 10g / L
Sodium tartrate 50g / L
Imidazole 20g / L
pH 8.5
Liquid temperature 20 ℃
Anode current density 1A / dm 2
Example 7
Succinimide 65g / L
Potassium aspartate 20g / L
Potassium gluconate 10g / L
α-picolinic acid 10g / L
pH 4.5
Liquid temperature 25 ℃
Anode current density 7A / dm 2
Example 8
Succinimide 55g / L
Cysteine 5g / L
Tartaric acid 15g / L
Nicotinic acid 10g / L
pH 5.0
Liquid temperature 25 ℃
Anode current density 4A / dm 2
Example 9
Succinimide 25g / L
Alanine 12g / L
Potassium citrate 25g / L
α-picolinic acid 5g / L
pH 9.0
Liquid temperature 35 ℃
Anode current density 6A / dm 2
Comparative Example 1
Succinimide 45g / L
Potassium hydroxide 7g / L
pH 9.3
Liquid temperature 35 ℃
Anode current density 2A / dm 2
Comparative Example 2
5,5-dimethylhydantoin 75g / L
Sodium hydroxide 30g / L
pH 10.0
Liquid temperature 40 ℃
Anode current density 5A / dm 2
Comparative Example 3
Glycine 50g / L
Sodium hydroxide 10g / L
pH 13.0
Liquid temperature 40 ℃
Anode current density 2A / dm 2
[0050]
[Table 1]
Figure 0004445648
[0051]
From Table 1, the samples that were electrolytically stripped using the electrolytic stripping solution after building baths of Examples 1 to 9 and Comparative Example 1 of the present invention were the base, the necessary partial silver plating film, the necessary partial silver plating film, and the unnecessary partial silver plating. There was no change at the boundary with the film compared to before peeling.
On the other hand, in the samples of Comparative Examples 2 and 3, the base material turned brown, and uneven gloss occurred in the necessary partial silver plating film. Furthermore, in the sample of Comparative Example 3, the boundary between the necessary partial silver plating film and the unnecessary partial silver plating film was changed to black gray.
[0052]
Moreover, in the test which carried out the electrolytic stripping using the electrolytic stripping solution after hold | maintaining for 2 weeks in a 50 degreeC thermostat, the sample electrolytically stripped using the electrolytic stripping solution of Examples 1-9 of this invention is all evaluation items. There was no change compared with before peeling. When using the electrolytic stripper after the bathing bath, the electrolytic stripper of Comparative Example 1, which did not change compared to before the stripping in all the evaluation items, was necessary when used for 2 weeks in a constant temperature bath at 50 ° C. Yellow unevenness occurred in the plating film. In the electrolytic stripping solutions of Comparative Examples 2 and 3 used after being held in a thermostatic bath at 50 ° C. for 2 weeks, the same color change occurred when the electrolytic stripping solution after the building bath was used.
[0053]
From the above test results, the silver electrolytic stripper of the present invention can perform good electrolytic stripping without changing the color tone of the object to be processed even after being kept in a thermostat at 50 ° C. for 2 weeks. It has been shown.
[0054]
【The invention's effect】
If the silver electrolytic stripper of the present invention is used, the substrate, the necessary part of the silver plating film, and the boundary part between the necessary part of the silver plating film and the unnecessary part of the silver plating film do not cause discoloration or gloss unevenness for 10 to 15 seconds. It can be peeled off in a short time. Moreover, since it can peel even if the density | concentration of the main component in stripping solution is 50 g / L or less, stripping solution is cheap. Furthermore, continuous stripping work for two weeks or more is possible, and there is an advantage that the life of the stripping solution is long. Furthermore, since the silver electrolysis stripping solution of the present invention does not cause discoloration or unevenness in the silver plating film at the required portion even when used under weak stirring conditions, it can also be used for strip-shaped workpieces.

Claims (3)

(a)コハク酸イミド、(b)脂肪族アミノカルボン酸、脂肪族アミノカルボン酸の塩、脂肪族ヒドロキシカルボン酸及び脂肪族ヒドロキシカルボン酸の塩からなる群から選ばれる少なくとも一種、並びに(c)含窒素複素環状化合物を含有する銀電解剥離液。(A) succinimide, (b) at least one selected from the group consisting of aliphatic aminocarboxylic acids, salts of aliphatic aminocarboxylic acids, aliphatic hydroxycarboxylic acids and salts of aliphatic hydroxycarboxylic acids, and (c) A silver electrolytic stripper containing a nitrogen-containing heterocyclic compound. pHが3〜10である請求項1に記載の銀電解剥離液。The silver electrolysis stripping solution according to claim 1 whose pH is 3-10. 請求項1又は2に記載の銀電解剥離液に被処理物を浸漬し、該被処理物を陽極として、該被処理物の所定箇所の銀めっき皮膜を除去する銀電解剥離方法。A silver electrolytic stripping method of immersing a workpiece in the silver electrolytic stripping solution according to claim 1 or 2 and removing a silver plating film at a predetermined location of the workpiece using the workpiece as an anode.
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