TWI755229B - Silver-plated layer electrolytically-stripping agent without cyanide, and method for electrolytically stripping silver-plated layer - Google Patents

Silver-plated layer electrolytically-stripping agent without cyanide, and method for electrolytically stripping silver-plated layer Download PDF

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TWI755229B
TWI755229B TW109146964A TW109146964A TWI755229B TW I755229 B TWI755229 B TW I755229B TW 109146964 A TW109146964 A TW 109146964A TW 109146964 A TW109146964 A TW 109146964A TW I755229 B TWI755229 B TW I755229B
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silver
stripping
electrolytic
electrolytic silver
plated layer
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TW202225499A (en
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許振明
陳振航
王家瑩
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力橋國際有限公司
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Abstract

The invention provides an environmentally friendly type, silver-plated layer electrolytically-stripping agent without cyanide that is suitable for electronic parts such as lead frames and connectors. The silver-plated layer electrolytically-stripping agent comprises a hydantoin compound as a complexing agent and alkanolamide capable of enhancing the ability of stripping an extra part of silver-plated layer on the side of the lead frame that is not required and not causing damage to the substrate, and a gloss rise of the surface of a required part of silver-plated layer can be inhibited after stripping a silver-plated layer that is not required. The invention also provides a method for electrolytically stripping a silver-plated layer.

Description

無氰之電解剝銀劑及電解剝銀方法Cyanide-free electrolytic silver stripping agent and electrolytic silver stripping method

本發明關於一種電解剝銀劑,尤其是有關一種不含氰化物的電解剝銀劑。The present invention relates to an electrolytic silver stripping agent, in particular to a cyanide-free electrolytic silver stripping agent.

電子產業中的多種元件,如中央處理器、電路板、記憶體、覆晶晶片,乃至於手機外殼中的隱藏式天線,都具有鍍覆金屬的部分,這些部分負擔關鍵性的功能。然而,地球上的礦產資源並非取之不竭,用之不盡。因此,在永續發展的考慮下,如何從廢棄物上回收其金屬成分,逐漸成為產業中重視的工作環節之一。Various components in the electronics industry, such as central processing units, circuit boards, memory, flip chips, and even hidden antennas in mobile phone casings, have metal-plated parts that perform critical functions. However, the earth's mineral resources are not inexhaustible and inexhaustible. Therefore, under the consideration of sustainable development, how to recover its metal components from waste has gradually become one of the important work links in the industry.

例如,發光二極體(LED)導線架及積體電路(IC)導線架上某些區域會鍍銀,以產生特定之功效。發光二極體係藉由具備使用銅帶而形成的導線架、以及搭載於導線架上的LED晶片等發光元件而構成。在這樣的銅帶上形成有例如作為基底電鍍層的銅(Cu)電鍍層或鎳(Ni)電鍍層中的至少任一個,以及使來自發光元件的光反射的銀(Ag)電鍍層作為表面電鍍層。另外,IC導線架是提供積體電路晶片安放導線的基座,並將IC晶片與印刷電路板連接起來。已知的IC導線架為了讓連接IC晶片的金導線(gold wire)與導腳(lead)間有較佳的電接合性,會在焊接區(bonding area)電鍍一層銀。在處理不合格品以回收和再利用下面的銅材料的過程中,需要從銅層或其他金屬層上剝除銀。另外,在銀價節節升高的趨勢下,銀具有回收價值。For example, light emitting diode (LED) leadframes and integrated circuit (IC) leadframes are silver-plated in certain areas for specific effects. The light-emitting diode system includes a lead frame formed using a copper tape, and light-emitting elements such as an LED chip mounted on the lead frame. Such a copper tape is formed with, for example, at least one of a copper (Cu) plating layer or a nickel (Ni) plating layer as a base plating layer, and a silver (Ag) plating layer for reflecting light from the light-emitting element as a surface Plating. In addition, the IC lead frame is a base that provides the integrated circuit chip to place the wires and connects the IC chip to the printed circuit board. In the known IC lead frame, a layer of silver is plated on the bonding area in order to provide better electrical bonding between the gold wire connecting the IC chip and the lead. In the process of disposing of non-conforming product to recover and reuse the underlying copper material, it is necessary to strip silver from copper or other metal layers. In addition, under the trend of rising silver prices, silver has recycling value.

在此揭露的習知電解剝除鍍銀層之方法,包括如下幾種。 (1)MIL-STD-871C(Jun. 2015),揭露底材為銅合金,氰化物系電解剝銀液:氰化鈉82~98 g/l,氫氧化鈉8~22 g/l,操作溫度範圍係20至71℃,工件為陽極,電解處理最大電壓為2 V,然而此方法所用之氰化物屬毒性化學物質,有害人體及污染環境。 (2)日本公開特許公報,特開平2-104699(1990),上村工業株式會社專利揭露之鍍銀電解剝銀劑:丁二醯亞胺(succinimide)10~100 g/l,鹼金屬導電鹽如NaOH、KOH及LiOH 3~12 g/l,作為防止底材受侵蝕及招致底層金屬亮度變異,pH 6~9.5,其他添加劑如緩衝劑,包括硼酸、硼酸鉀及硼酸鈉≦50 g/l,鍍銀層之底材如銅、銅合金、鋼鐵、不鏽鋼、鎳鐵合金等,不鏽鋼陰極,操作溫度範圍為20~50℃,電壓3~15 V,電流密度為0.1~5 A/dm 2,暴露之預鍍銀層完全去除,光澤銀層維持原有亮度並無變色,暴露之銅層維持亮度並未受侵蝕。 (3)日本公開特許公報,特開2002-30500(平成14年)N.E. Chemcat株式會社提出:丁二醯亞胺之操作pH 7.5~9,pH>10,由於丁二醯亞胺加水易分解,導致濃度難維持、壽限短。另外,日本公開特許公報,特開平7-243100,Japan Electroplating Eng.株式會社提出丁二醯亞胺剝銀18 g/l以上,結果銀表面不均、帶黃味,2小時之剝除得調整濃度及pH。 The conventional electrolytic stripping method of the silver plating layer disclosed herein includes the following methods. (1) MIL-STD-871C (Jun. 2015), revealing that the substrate is copper alloy, cyanide-based electrolytic silver stripping solution: sodium cyanide 82~98 g/l, sodium hydroxide 8~22 g/l, operation The temperature range is 20 to 71 °C, the workpiece is the anode, and the maximum voltage for electrolysis is 2 V. However, the cyanide used in this method is a toxic chemical substance, which is harmful to the human body and pollutes the environment. (2) Japanese Patent Laid-Open Gazette, No. 2-104699 (1990), the patent of Uemura Industry Co., Ltd. discloses a silver-plating electrolytic silver stripper: succinimide (succinimide) 10~100 g/l, alkali metal conductive salt Such as NaOH, KOH and LiOH 3~12 g/l, to prevent the substrate from being corroded and causing the brightness variation of the underlying metal, pH 6~9.5, other additives such as buffers, including boric acid, potassium borate and sodium borate ≤ 50 g/l , The substrate of silver-plated layer such as copper, copper alloy, steel, stainless steel, nickel-iron alloy, etc., stainless steel cathode, the operating temperature range is 20~50℃, the voltage is 3~15 V, and the current density is 0.1~5 A/dm 2 , The exposed pre-silver layer is completely removed, the glossy silver layer maintains the original brightness without discoloration, and the exposed copper layer maintains the brightness and is not corroded. (3) Japanese Open Patent Gazette, Unexamined 2002-30500 (Heisei 14) NE Chemcat Co., Ltd. proposed: the operation pH of succinimide is 7.5~9, pH>10, because succinimide is easily decomposed by adding water, As a result, the concentration is difficult to maintain and the life limit is short. In addition, Japanese Patent Laid-Open No. 7-243100, Japan Electroplating Eng. Co., Ltd. proposed that succinimide stripped silver more than 18 g/l, the result was uneven silver surface, with yellow smell, the stripping for 2 hours can be adjusted concentration and pH.

為了改善上述丁二醯亞胺之缺點,海因化合物被提出。日本公開特許公報,特開平7-243100(1995),Japan Electroplating Eng.株式會社提出電解剝銀劑:海因(hydantoin)化合物作為錯合劑、pH調整劑及導電鹽,如KOH、NaOH、氯化鉀、磷酸鉀等,pH 7~12,操作溫度範圍20~60℃,電流密度0.5~10 A/dm 2,不鏽鋼陰極,預鍍銀完全剝銀,銀層未變色,銅基板及銅露出之表面未見腐蝕、變色。日本特許公報,特開平11-50298(1999),Japan Electroplating Eng.株式會社專利提出電解剝銀劑:海因化合物作為錯合劑,醛基及/或磺酸基化合物作為光澤調整劑、pH調整劑及導電鹽,如KOH、NaOH、氯化鉀、磷酸鉀等,pH 7~12,操作溫度範圍20~60℃,電流密度0.5~10 A/dm 2,預鍍銀完全剝銀,試片殘留銀之光澤度0.5~0.7(剝離處理前為0.5~0.7)並未改變,鍍銀層表面光澤、無不規則狀。日本特許公報,特許第4312201(2009)日鑛材料股份有限公司提出電解剝銀劑:海因化合物作為錯合劑,並加入氨基羧酸,pH 9~12,不鏽鋼陰極,操作溫度範圍10~60℃,電流密度0.1~50 A/dm 2。剝除不須要的銀層,底材面外觀及側面剝除能力良好,銀面光澤度0.41(剝離前之銀面光澤度0.40,數字愈大光澤愈高),然並未能降低殘留銀之光澤度。實務上,殘留銀之光澤度過高時,會造成引線結合時之影像識別不良影響。日本公開特許公報,特開平10-298800(1998),Japan Electroplating Eng.株式會社提出電解剝銀劑:海因化合物作為錯合劑,並加入高分子氮化合物(分子量100~70000)作為光澤調整劑,以及pH調整劑及導電鹽,如KOH、NaOH、氯化鉀、磷酸鉀等,pH 7~12,操作溫度範圍20~60℃,電流密度0.5~10 A/dm 2,預鍍銀完全剝除,並降低了殘留銀之光澤度。 In order to improve the above-mentioned disadvantages of succinimide, hydantoin compounds have been proposed. Japanese Open Patent Gazette, JP 7-243100 (1995), Japan Electroplating Eng. Co., Ltd. proposed electrolytic silver stripping agent: hydantoin compound as complexing agent, pH adjusting agent and conductive salt, such as KOH, NaOH, chlorinated Potassium, potassium phosphate, etc., pH 7~12, operating temperature range 20~60°C, current density 0.5~10 A/dm 2 , stainless steel cathode, pre-silvered and completely stripped, silver layer is not discolored, copper substrate and copper exposed There is no corrosion or discoloration on the surface. Japanese Patent Publication, JP 11-50298 (1999), Japan Electroplating Eng. Co., Ltd. patent proposes electrolytic silver stripper: hydantoin compound as complexing agent, aldehyde group and/or sulfonic acid group compound as gloss adjuster, pH adjuster and conductive salts, such as KOH, NaOH, potassium chloride, potassium phosphate, etc., pH 7~12, operating temperature range 20~60℃, current density 0.5~10 A/dm 2 , pre-silvering is completely stripped, and the test piece remains The gloss of silver is 0.5~0.7 (0.5~0.7 before peeling treatment) has not changed, and the surface of silver-plated layer is glossy and has no irregularity. Japanese Patent Gazette, Patent No. 4312201 (2009) Nippon Mining Materials Co., Ltd. proposed electrolytic silver stripping agent: hydantoin compound as complexing agent, and adding aminocarboxylic acid, pH 9~12, stainless steel cathode, operating temperature range 10~60℃ , the current density is 0.1~50 A/dm 2 . Stripping off the unnecessary silver layer, the substrate surface has good appearance and side stripping ability, the silver surface gloss is 0.41 (the silver surface gloss before stripping is 0.40, the larger the number, the higher the gloss), but it does not reduce the residual silver. Gloss. In practice, if the gloss of the residual silver is too high, it will cause adverse effects on image recognition during wire bonding. Japanese Patent Publication No. 10-298800 (1998), Japan Electroplating Eng. Co., Ltd. proposed electrolytic silver stripping agent: hydantoin compound as complexing agent, and adding high molecular nitrogen compound (molecular weight 100~70000) as gloss modifier, As well as pH adjusters and conductive salts, such as KOH, NaOH, potassium chloride, potassium phosphate, etc., pH 7~12, operating temperature range 20~60°C, current density 0.5~10 A/dm 2 , pre-silver completely stripped , and reduces the gloss of residual silver.

上述習知技術所使用之氰化物屬毒性化學物質,對人體及水質環境皆為有害。The cyanide used in the above-mentioned conventional technology is a toxic chemical substance, which is harmful to the human body and the water environment.

上述習知技術所使用含有丁二醯亞胺之剝銀劑,由於當處理液pH>10時,加水易分解,導致濃度難維持、壽限短,又當處理液溫度>50℃,丁二醯亞胺分解早、壽限亦短,已被海因化合物所取代。The silver stripping agent containing succinimide used in the above-mentioned conventional technology is easily decomposed by adding water when the pH of the treatment solution is greater than 10, resulting in difficulty in maintaining the concentration and short lifespan. Imide decomposes early and has a short life span, so it has been replaced by hydantoin compounds.

上述習知技術所使用含有海因化合物之電解剝銀劑,剝除連接器及導線架,去除不須要之鍍銀層,並未能降低殘留銀之光澤度,雖有高分子氮化合物作為光澤調整劑可降低必要部分之銀面光澤度,然高分子氮化合物分子量之多寡亦影響其光澤度。The electrolytic silver stripper containing a hydantoin compound used in the above-mentioned conventional technology is used to strip off the connector and lead frame, and remove the unnecessary silver plated layer, which cannot reduce the gloss of the residual silver. The adjusting agent can reduce the gloss of the necessary part of the silver surface, but the molecular weight of the high molecular nitrogen compound also affects the gloss.

本發明之一目的,在於提供一種電解剝銀劑,其不含氰化物及高分子氮化合物,可迅速剝除連接器及導線架等電子零件上不須要之鍍銀層,並能降低殘留銀之光澤度。One object of the present invention is to provide an electrolytic silver stripping agent, which does not contain cyanide and polymer nitrogen compounds, can quickly strip off unnecessary silver plating layers on electronic parts such as connectors and lead frames, and can reduce residual silver of gloss.

為了達成上述之目的,本發明有關一種電解剝銀劑,包括海因化合物1~300 g/l;pH調整劑及導電鹽10~150 g/l;及烷醇醯胺(alkanolamide)0.05~10 g/l。In order to achieve the above purpose, the present invention relates to an electrolytic silver stripper, comprising 1-300 g/l of hydantoin compound; 10-150 g/l of pH adjuster and conductive salt; and 0.05-10 g/l of alkanolamide g/l.

於一態樣中,該海因化合物係1-甲基海因(1-methylhydantoin)、1,3-二甲基海因(1,3-dimethylhydantoin)或5,5-二甲基海因(5,5-dimethylhydantoin)。In one aspect, the hydantoin compound is 1-methylhydantoin, 1,3-dimethylhydantoin, or 5,5-dimethylhydantoin ( 5,5-dimethylhydantoin).

於一態樣中,該pH調整劑及導電鹽係選自由氫氧化鉀、氫氧化鈉、磷酸鉀、磷酸鈉、磷酸銨、磷酸氫二鉀、磷酸氫二鈉及磷酸氫二銨所組成的任一族群之一材料。In one aspect, the pH adjuster and conductive salt are selected from the group consisting of potassium hydroxide, sodium hydroxide, potassium phosphate, sodium phosphate, ammonium phosphate, dipotassium hydrogen phosphate, disodium hydrogen phosphate, and diammonium hydrogen phosphate. material from any of the ethnic groups.

於一態樣中,該烷醇醯胺係選自由油酸二乙醇醯胺、亞油酸二乙醇醯胺、N,N-二乙醇十二醯胺及椰子油酸二乙醇醯胺所組成的任一族群之一材料。In one aspect, the alkanolamide is selected from the group consisting of diethanolamide oleate, diethanolamide linoleate, N,N-diethanoldodecanolamide, and diethanolamide cocoate. material from any of the ethnic groups.

本發明之電解剝銀劑,不使用屬於毒性化學物質之氰化物,可迅速剝除連接器及導線架上不須要之鍍銀層,且無損底材。The electrolytic silver stripping agent of the present invention does not use cyanide, which is a toxic chemical substance, and can quickly strip off unnecessary silver plating layers on connectors and lead frames without damaging the substrate.

本發明提供一種電解剝銀方法,包括:提供一電解槽,該電解槽內包括一陰極、一陽極及一電解剝銀劑;將一含銀的底材放置於該電解槽中,並與該陽極連接;施加一定電壓以進行電解剝銀。The invention provides an electrolytic silver stripping method, comprising: providing an electrolytic cell, which includes a cathode, an anode and an electrolytic silver stripping agent; placing a silver-containing substrate in the electrolytic cell, and combining with the electrolytic cell Anode connection; voltage applied for electrolytic silver stripping.

於一態樣中,上述之電解剝銀劑,包括海因化合物1~300 g/l;pH調整劑及導電鹽10~150 g/l;及烷醇醯胺(alkanolamide)0.05~10 g/l。In one aspect, the above-mentioned electrolytic silver stripper includes 1-300 g/l of hydantoin compound; 10-150 g/l of pH adjuster and conductive salt; and 0.05-10 g/l of alkanolamide. l.

本發明所述電解剝銀方法乃是一種電化學過程,經由外界提供電能,將陽極上含有不須要之金屬層進行解離並溶入電解液內,達到不須要之鍍銀層被剝除且不侵蝕底材之方式。The electrolytic silver-stripping method of the present invention is an electrochemical process. Electric energy is provided from the outside to dissociate the unnecessary metal layer on the anode and dissolve it into the electrolyte, so that the unnecessary silver-plated layer is stripped off without any damage. The way in which the substrate is eroded.

本發明之一具體例係有關電解剝銀劑,包括海因化合物1~300 g/l;pH調整劑及導電鹽10~150 g/l;及烷醇醯胺(alkanolamide)0.05~10 g/l。A specific example of the present invention relates to an electrolytic silver stripper, including 1-300 g/l of hydantoin compound; 10-150 g/l of pH adjuster and conductive salt; and 0.05-10 g/l of alkanolamide l.

於一具體例中,本發明電解剝銀劑所含海因化合物之濃度為1~300 g/l,較宜50~150 g/l,適合的海因化合物包括1-甲基海因(1-methylhydantoin)、1,3-二甲基海因(1,3-dimethylhydantoin)及5,5-二甲基海因(5,5-dimethylhydantoin)等,最宜為5,5-二甲基海因,作為銀之錯合劑,當濃度低時,剝銀效率低且溶入之銀含量少,5,5-二甲基海因75 g/l,最佳狀態能剝除銀30 g/l;濃度高時,增加配液成本,且未能增加效率。In a specific example, the concentration of the hydantoin compound contained in the electrolytic silver stripping agent of the present invention is 1-300 g/l, preferably 50-150 g/l, and suitable hydantoin compounds include 1-methyl hydantoin (1-methyl hydantoin). -methylhydantoin), 1,3-dimethylhydantoin (1,3-dimethylhydantoin) and 5,5-dimethylhydantoin (5,5-dimethylhydantoin), etc., 5,5-dimethylhydantoin is the most suitable Because, as a silver complex agent, when the concentration is low, the silver stripping efficiency is low and the dissolved silver content is small, 5,5-dimethyl hydantoin is 75 g/l, and the best state can strip silver 30 g/l ; When the concentration is high, the cost of dosing is increased, and the efficiency cannot be increased.

於一具體例中,本發明電解剝銀劑所含pH調整劑及導電鹽係選自由氫氧化鉀、氫氧化鈉、磷酸鉀、磷酸鈉、磷酸銨、磷酸氫二鉀、磷酸氫二鈉及磷酸氫二銨所組成的任一族群之一材料,該pH調整劑及導電鹽之濃度為10~150 g/l,較宜20~80 g/l,處理液最宜pH>10,當濃度低時,處理液導電性低,剝銀效率低;當濃度高時,增加配液成本,且未能增加效率。In a specific example, the pH adjuster and conductive salt contained in the electrolytic silver stripping agent of the present invention are selected from potassium hydroxide, sodium hydroxide, potassium phosphate, sodium phosphate, ammonium phosphate, dipotassium hydrogen phosphate, disodium hydrogen phosphate and One of the materials of any group composed of diammonium hydrogen phosphate, the concentration of the pH adjuster and the conductive salt is 10~150 g/l, preferably 20~80 g/l, and the optimum pH of the treatment solution is greater than 10, when the concentration When the concentration is low, the conductivity of the treatment solution is low, and the silver stripping efficiency is low; when the concentration is high, the cost of dosing is increased, and the efficiency cannot be increased.

於一具體例中,本發明電解剝銀劑所含烷醇醯胺係選自由油酸二乙醇醯胺、亞油酸二乙醇醯胺、N,N-二乙醇十二醯胺及椰子油酸二乙醇醯胺所組成的任一族群之一材料,烷醇醯胺之濃度為0.05~10 g/l,較宜0.1~5 g/l,烷醇醯胺係作為光澤調整劑,當濃度低時,鍍層光澤改善未顯著;當濃度高時,增加配液成本,且未能增加效率。In a specific example, the alkanolamide contained in the electrolytic silver stripper of the present invention is selected from the group consisting of diethanolamide oleate, diethanolamide linoleate, N,N-diethanoldodecamide and coconut oleic acid. One of the materials of any group composed of diethanolamide, the concentration of alkanolamide is 0.05~10 g/l, preferably 0.1~5 g/l, alkanolamide is used as gloss adjuster, when the concentration is low When the concentration is high, the coating gloss is not improved significantly; when the concentration is high, the cost of dosing is increased, and the efficiency cannot be increased.

本發明之電解剝銀劑,不使用屬於毒性化學物質之氰化物,可迅速剝除連接器及導線架上不須要之鍍銀層,且無損底材。The electrolytic silver stripping agent of the present invention does not use cyanide, which is a toxic chemical substance, and can quickly strip off unnecessary silver plating layers on connectors and lead frames without damaging the substrate.

另外,本發明提供一種電解剝銀方法,包括:提供一電解槽,該電解槽內包括一陰極、一陽極及一電解剝銀劑;將一含銀的底材放置於該電解槽中,並與該陽極連接;施加一定電壓以進行電解剝銀,其中該電解剝銀劑係包括海因化合物1~300 g/l;pH調整劑及導電鹽10~150 g/l;及烷醇醯胺(alkanolamide)0.05~10 g/l。In addition, the present invention provides an electrolytic silver stripping method, comprising: providing an electrolytic cell, the electrolytic cell includes a cathode, an anode and an electrolytic silver stripping agent; placing a silver-containing substrate in the electrolytic cell, and Connect with the anode; apply a certain voltage for electrolytic silver stripping, wherein the electrolytic silver stripping agent includes 1~300 g/l of hydantoin compound; 10~150 g/l of pH adjusting agent and conductive salt; and alkanolamide (alkanolamide) 0.05~10 g/l.

上述海因化合物之濃度為1~300 g/l,較宜50~150 g/l,適合的海因化合物包括1-甲基海因(1-methylhydantoin)、1,3-二甲基海因(1,3-dimethylhydantoin)及5,5-二甲基海因(5,5-dimethylhydantoin)等。The concentration of the above hydantoin compounds is 1~300 g/l, preferably 50~150 g/l. Suitable hydantoin compounds include 1-methylhydantoin, 1,3-dimethylhydantoin (1,3-dimethylhydantoin) and 5,5-dimethylhydantoin (5,5-dimethylhydantoin).

上述pH調整劑及導電鹽之濃度為10~150 g/l,較宜20~80 g/l,適宜之pH調整劑及導電鹽包括氫氧化鉀、氫氧化鈉、磷酸鉀、磷酸鈉、磷酸銨、磷酸氫二鉀、磷酸氫二鈉及磷酸氫二銨等或其混合物。The concentration of the above pH adjusting agent and conductive salt is 10~150 g/l, preferably 20~80 g/l. Suitable pH adjusting agent and conductive salt include potassium hydroxide, sodium hydroxide, potassium phosphate, sodium phosphate, phosphoric acid Ammonium, dipotassium hydrogen phosphate, disodium hydrogen phosphate and diammonium hydrogen phosphate, etc. or mixtures thereof.

上述烷醇醯胺之濃度為0.05~10 g/l,較宜0.1~5 g/l,適宜之烷醇醯胺包括油酸二乙醇醯胺、亞油酸二乙醇醯胺、N,N-二乙醇十二醯胺及椰子油酸二乙醇醯胺等或其混合物。The concentration of the above-mentioned alkanolamide is 0.05~10 g/l, preferably 0.1~5 g/l, and suitable alkanolamides include oleic acid diethanolamide, linoleic acid diethanolamide, N,N- Diethanol laurylamide and cocoate diethanolamide, etc. or mixtures thereof.

於一具體例中,本發明電解剝銀方法的陰極,可採用石墨、白金鈦網、白金鈮網、AISI 316不鏽鋼等不溶性材料。本發明電解剝銀方法的陽極,可採用AISI 316不鏽鋼材料。In a specific example, insoluble materials such as graphite, platinum titanium mesh, platinum niobium mesh, and AISI 316 stainless steel can be used for the cathode of the electrolytic silver stripping method of the present invention. The anode of the electrolytic silver stripping method of the present invention can be made of AISI 316 stainless steel.

於一具體例中,本發明電解剝銀方法之操作溫度範圍為20~60℃,較宜45~50℃,當溫度低時,處理液導電差、剝除效率低;當溫度高時,耗費能源,處理液揮發快、配液之組成變異較大。In a specific example, the operating temperature range of the electrolytic silver stripping method of the present invention is 20 to 60° C., preferably 45 to 50° C. When the temperature is low, the conductivity of the treatment solution is poor and the stripping efficiency is low; when the temperature is high, the cost is low. Energy, fast volatilization of the treatment solution, and large variation in the composition of the solution.

於一具體例中,本發明電解剝銀方法之操作pH 7~14,較宜pH 10~11。In a specific example, the operating pH of the electrolytic silver stripping method of the present invention is 7-14, preferably pH 10-11.

於一具體例中,本發明電解剝銀方法之操作電流密度0.5~10 A/dm 2,電壓為2~4 V,較宜2.5~3.5 V;電壓低於2 V時,剝銀效率低;電壓高於4 V時,剝銀效率快,但剝除不均。 In a specific example, the operating current density of the electrolytic silver stripping method of the present invention is 0.5~10 A/dm 2 , and the voltage is 2~4 V, preferably 2.5~3.5 V; when the voltage is lower than 2 V, the silver stripping efficiency is low; When the voltage is higher than 4 V, the silver stripping efficiency is fast, but the stripping is uneven.

本發明所述電解剝銀方法乃是一種電化學過程,經由外界提供電能,將陽極上含有不須要之金屬層進行解離並溶入電解液內,達到不須要之鍍銀層被剝除且不侵蝕底材之方式。The electrolytic silver-stripping method of the present invention is an electrochemical process. Electric energy is provided from the outside to dissociate the unnecessary metal layer on the anode and dissolve it into the electrolyte, so that the unnecessary silver-plated layer is stripped off without any damage. The way in which the substrate is eroded.

以下說明本發明之電解剝銀方法的實施例之操作參數及測試結果。光澤度測試:記錄測試三點之平均值;測試儀:NDK VSR 400光澤鍍機計;Fischerscope X-ray XDLM X光螢光測厚儀。The operation parameters and test results of the embodiments of the electrolytic silver stripping method of the present invention are described below. Gloss test: record the average of three test points; tester: NDK VSR 400 gloss coater; Fischerscope X-ray XDLM X-ray fluorescence thickness gauge.

實施例1:使用銅材導線架上具有氰化浴鍍銅/鍍銀3~4 µ″的底材為待處理物,電解剝銀之表面積為0.4 dm 2。本實施例所使用的電解剝銀劑包括5,5-二甲基海因(5,5-dimethylhydantoin)100 g/l、KOH 40 g/l,及椰子油酸二乙醇醯胺0.01 g/l,進行電解剝銀時的操作pH 10.88,操作溫度為45~50℃,陽極採用不鏽鋼,電壓3.74 V,電流0.8 A,電解時間4秒,剝離前之平均光澤度0.646,剝離後試件殘留之平均光澤度0.67。 Example 1: Using a copper lead frame The substrate with cyanide bath copper/silver plating of 3~4 μ″ is the object to be treated, and the surface area of the electrolytically stripped silver is 0.4 dm 2 . The electrolytic stripper used in this example Silver agents include 5,5-dimethylhydantoin (5,5-dimethylhydantoin) 100 g/l, KOH 40 g/l, and diethanolamide cocoate 0.01 g/l, for electrolytic silver stripping pH 10.88, operating temperature 45~50℃, stainless steel anode, voltage 3.74 V, current 0.8 A, electrolysis time 4 seconds, the average gloss before peeling is 0.646, and the average gloss remaining after peeling is 0.67.

實施例2:使用銅材導線架上具有氰化浴鍍銅/鍍銀3~4 µ″的底材為待處理物,電解剝銀之表面積為0.4 dm 2。本實施例所使用的電解剝銀劑包括5,5-二甲基海因100 g/l、KOH 40 g/l,及椰子油酸二乙醇醯胺0.05 g/l,與實施例1之差異係改變椰子油酸二乙醇醯胺的濃度。進行電解剝銀時的操作pH 10.69,操作溫度45~50℃,陽極採用不鏽鋼,電壓3.48 V,電流0.8 A,電解時間4秒,剝離前之平均光澤度0.646,剝離後試件殘留之平均光澤度0.5875。 Example 2: Using a copper lead frame The substrate with cyanide bath copper/silver plating of 3~4 µ″ is the object to be treated, and the surface area of the electrolytically stripped silver is 0.4 dm 2 . The electrolytic stripper used in this example The silver agent includes 5,5-dimethyl hydantoin 100 g/l, KOH 40 g/l, and diethanolamide cocoate 0.05 g/l. The difference from Example 1 is to change diethanolamide cocoate. The concentration of amine. The operating pH during electrolytic silver stripping is 10.69, the operating temperature is 45~50 °C, the anode is stainless steel, the voltage is 3.48 V, the current is 0.8 A, the electrolysis time is 4 seconds, the average gloss before stripping is 0.646, and the test piece after stripping The residual average gloss was 0.5875.

實施例3:使用銅材導線架上具有氰化浴鍍銅/鍍銀3~4 µ″的底材為待處理物,電解剝銀之表面積為0.4 dm 2。本實施例所使用的電解剝銀劑包括5,5-二甲基海因100 g/l、KOH 40 g/l,及椰子油酸二乙醇醯胺0.2 g/l,與實施例1之差異係改變椰子油酸二乙醇醯胺的濃度。進行電解剝銀時的操作pH 10.64,操作溫度45~50℃,陽極採用不鏽鋼,電壓3.38 V,電流0.8 A,電解時間4秒,剝離前之平均光澤度0.646,剝離後試件殘留之平均光澤度0.575。 Example 3: Using a copper lead frame The substrate with cyanide bath copper/silver plating of 3~4 μ″ is the object to be treated, and the surface area of the electrolytically stripped silver is 0.4 dm 2 . The electrolytic stripper used in this example The silver agent includes 100 g/l of 5,5-dimethyl hydantoin, 40 g/l of KOH, and 0.2 g/l of diethanolamide cocoate. The difference from Example 1 is to change diethanolamide cocoate. The concentration of amine. The operating pH during electrolytic silver stripping is 10.64, the operating temperature is 45~50 °C, the anode is stainless steel, the voltage is 3.38 V, the current is 0.8 A, the electrolysis time is 4 seconds, the average gloss before stripping is 0.646, and the test piece after stripping The residual average gloss is 0.575.

實施例4:使用銅材導線架上具有氰化浴鍍銅/鍍銀3~4 µ″的底材為待處理物,電解剝銀之表面積為0.4 dm 2。本實施例所使用的電解剝銀劑包括5,5-二甲基海因100 g/l、KOH 60 g/l,及椰子油酸二乙醇醯胺1 g/l,與實施例1之差異係改變KOH及椰子油酸二乙醇醯胺的濃度。進行電解剝銀時的操作pH 10.64,操作溫度45~50℃,陽極採用不鏽鋼,電壓3.24 V,電流0.8 A,電解時間4秒,剝離前之平均光澤度0.646,剝離後試件殘留之平均光澤度0.5125。 Example 4: Using a copper lead frame The substrate with cyanide bath copper/silver plating of 3~4 μ″ is the object to be treated, and the surface area of the electrolytically stripped silver is 0.4 dm 2 . The electrolytic stripper used in this example The silver agent includes 5,5-dimethyl hydantoin 100 g/l, KOH 60 g/l, and diethanolamide cocoate 1 g/l. The difference from Example 1 is to change KOH and cocoic acid diethanolamine. The concentration of ethanolamide. The operating pH during electrolytic silver stripping is 10.64, the operating temperature is 45~50 °C, the anode is stainless steel, the voltage is 3.24 V, the current is 0.8 A, the electrolysis time is 4 seconds, the average gloss before stripping is 0.646, and after stripping The average gloss remaining on the test piece is 0.5125.

比較例1:使用銅材導線架上具有氰化浴鍍銅/鍍銀3~4 µ″的底材為待處理物,電解剝銀之表面積為0.4 dm 2。本比較例所使用的電解剝銀劑係參考前案特開平10-298800的內容,包括5,5-二甲基海因(5,5-dimethylhydantoin)100 g/l、KOH 40 g/l,及聚乙烯亞胺(polyethyleneimine)2 g/l(原液溶於水配成40 g/l,加入量50 ml/l),進行電解剝銀時的操作pH 10.88,操作溫度為45~50℃,陽極採用不鏽鋼,電壓3.76 V,電流0.8 A,電解時間4秒,預鍍銀全部剝除,功能區銀層無雙色,剝離前之平均光澤度0.548,剝離後試件殘留之平均光澤度0.418 Comparative Example 1: Using a copper lead frame with a cyanide bath copper/silver plating of 3~4 μ″ on the substrate as the object to be treated, the surface area of the electrolytically stripped silver is 0.4 dm 2 . The electrolytic stripper used in this comparative example The silver agent refers to the content of Japanese Patent Laid-Open No. 10-298800, including 5,5-dimethylhydantoin (5,5-dimethylhydantoin) 100 g/l, KOH 40 g/l, and polyethyleneimine (polyethyleneimine) 2 g/l (the stock solution is dissolved in water to make 40 g/l, the addition amount is 50 ml/l), the operating pH of the electrolytic silver stripping is 10.88, the operating temperature is 45~50 °C, the anode is made of stainless steel, the voltage is 3.76 V, The current is 0.8 A, the electrolysis time is 4 seconds, the pre-silver is completely stripped, the silver layer in the functional area has no double color, the average gloss before stripping is 0.548, and the average gloss remaining after stripping is 0.418 .

比較例2:使用銅材導線架上具有氰化浴鍍銅/鍍銀3~4 µ″的底材為待處理物,電解剝銀之表面積為0.4 dm 2。本比較例所使用的電解剝銀劑包括5,5-二甲基海因100 g/l、KOH 40 g/l、聚乙烯亞胺2 g/l(原液溶於水配成40 g/l,加入量50 ml/l),及四級月桂基三聚氧乙烯氫氧化銨(quaternary lauryl tripolyoxyethylene ammonium hydroxide)(其係一種陽離子界面活性劑)0.01 g/l,進行電解剝銀時的操作pH 10.82,操作溫度為45~50℃,陽極採用不鏽鋼,電壓2.76 V、電流0.8 A、電解時間4秒,預鍍銀全部剝除,剝離前之平均光澤度0.584,剝離後試件殘留之平均光澤度0.584,加入陽離子界面活性劑,以降低操作電壓。 Comparative Example 2: Using a copper lead frame with a cyanide bath copper/silver plating of 3~4 μ″ on the substrate as the object to be treated, the surface area of the electrolytically stripped silver is 0.4 dm 2 . The electrolytic stripper used in this comparative example The silver agent includes 5,5-dimethylhydantoin 100 g/l, KOH 40 g/l, polyethyleneimine 2 g/l (the stock solution is dissolved in water to make 40 g/l, the addition amount is 50 ml/l) , and quaternary lauryl tripolyoxyethylene ammonium hydroxide (which is a cationic surfactant) 0.01 g/l, the operating pH for electrolytic silver stripping is 10.82, and the operating temperature is 45~50 ℃, the anode is made of stainless steel, the voltage is 2.76 V, the current is 0.8 A, the electrolysis time is 4 seconds, the pre-silvering is completely stripped, the average gloss before stripping is 0.584, and the average gloss remaining after stripping is 0.584, and cationic surfactant is added. , to reduce the operating voltage.

比較例3:使用銅材導線架上具有氰化浴鍍銅/鍍銀3~4 µ″的底材為待處理物,電解剝銀之表面積為0.4 dm 2。本比較例所使用的電解剝銀劑包括5,5-二甲基海因100 g/l、KOH 40 g/l、聚乙烯亞胺2 g/l(原液溶於水配成40 g/l,加入量50 ml/l),及PE6400(聚氧乙烯、聚氧丙烯嵌段聚合物,一種非離子界面活性劑)0.01 g/l,進行電解剝銀時的操作pH 10.88、操作溫度為45~50℃,陽極採用不鏽鋼,電壓2.76 V,電流0.8 A,電解時間4秒,預鍍銀全部剝除,剝離前之平均光澤度0.78,剝離後試件殘留之平均光澤度0.881。 Comparative Example 3: Using a copper lead frame with a cyanide bath copper/silver plating of 3~4 μ″ on the substrate as the object to be treated, the surface area of the electrolytically stripped silver is 0.4 dm 2 . The electrolytic stripper used in this comparative example The silver agent includes 5,5-dimethylhydantoin 100 g/l, KOH 40 g/l, polyethyleneimine 2 g/l (the stock solution is dissolved in water to make 40 g/l, the addition amount is 50 ml/l) , and PE6400 (polyoxyethylene, polyoxypropylene block polymer, a non-ionic surfactant) 0.01 g/l, the operating pH during electrolytic silver stripping is 10.88, the operating temperature is 45~50 ℃, the anode is made of stainless steel, The voltage was 2.76 V, the current was 0.8 A, the electrolysis time was 4 seconds, the pre-silver was completely stripped, the average gloss before stripping was 0.78, and the average gloss remaining after stripping was 0.881.

本發明之電解剝銀劑可運用在LED及IC導線架等生產線上,其可迅速剝除導線架上不須要之鍍銀層,且無損底材。The electrolytic silver stripping agent of the present invention can be used in production lines such as LED and IC lead frames, and can quickly strip off unnecessary silver plating layers on the lead frames without damaging the substrate.

前述實施例及具體例的描述應視為例示性,而非限制如申請專利範圍界定的本發明。將輕易理解大量以上記載的特徵之變化及組合可被利用而不背離如記載在申請專利範圍的本發明。如此的變化意圖包括在以下申請專利範圍之範圍內。The foregoing descriptions of the embodiments and specific examples should be considered as illustrative, rather than limiting, of the invention as defined by the scope of the claims. It will be readily appreciated that numerous variations and combinations of the above-recited features may be utilized without departing from the invention as described in the claims. Such variations are intended to be included within the scope of the following claims.

Claims (10)

一種電解剝銀劑,包括海因化合物1~300 g/l;pH調整劑及導電鹽10~150 g/l;及烷醇醯胺0.05~10 g/l。An electrolytic silver stripping agent comprises 1-300 g/l of hydantoin compound; 10-150 g/l of pH adjusting agent and conductive salt; and 0.05-10 g/l of alkanolamide. 如請求項1的電解剝銀劑,其中該海因化合物係1-甲基海因、1,3-二甲基海因及5,5-二甲基海因其中之一。The electrolytic silver stripper according to claim 1, wherein the hydantoin compound is one of 1-methyl hydantoin, 1,3-dimethyl hydantoin and 5,5-dimethyl hydantoin. 如請求項1的電解剝銀劑,其中該pH調整劑及導電鹽係選自由氫氧化鉀、氫氧化鈉、磷酸鉀、磷酸鈉、磷酸銨、磷酸氫二鉀、磷酸氫二鈉及磷酸氫二銨所組成的任一族群之一材料。The electrolytic silver stripper of claim 1, wherein the pH adjuster and the conductive salt are selected from potassium hydroxide, sodium hydroxide, potassium phosphate, sodium phosphate, ammonium phosphate, dipotassium hydrogen phosphate, disodium hydrogen phosphate and hydrogen phosphate One of the materials of any group composed of diammonium. 如請求項3的電解剝銀劑,其中該烷醇醯胺係選自由油酸二乙醇醯胺、亞油酸二乙醇醯胺、N,N-二乙醇十二醯胺及椰子油酸二乙醇醯胺所組成的任一族群之一材料。The electrolytic silver stripper according to claim 3, wherein the alkanolamide is selected from the group consisting of oleic acid diethanolamide, linoleic acid diethanolamide, N,N-diethanol lauramide and cocoic acid diethanol One of the materials of any group consisting of amides. 一種電解剝銀方法,包括:提供一電解槽,該電解槽內包括一陰極、一陽極及一電解剝銀劑;將一含銀的底材放置於該電解槽中,並與該陽極連接;施加一定電壓以進行電解剝銀,其中該電解剝銀劑係包括海因化合物1~300 g/l;pH調整劑及導電鹽10~150 g/l;及烷醇醯胺0.05~10 g/l。An electrolytic silver stripping method, comprising: providing an electrolytic cell, which comprises a cathode, an anode and an electrolytic silver stripping agent; placing a silver-containing substrate in the electrolytic cell and connecting with the anode; Apply a certain voltage to carry out electrolytic silver stripping, wherein the electrolytic silver stripping agent includes 1~300 g/l of hydantoin compound; 10~150 g/l of pH adjusting agent and conductive salt; and 0.05~10 g/l of alkanolamide l. 如請求項5的電解剝銀方法,其中該陰極係石墨、白金鈦網、白金鈮網或AISI 316不鏽鋼。The electrolytic silver stripping method of claim 5, wherein the cathode is graphite, platinum titanium mesh, platinum niobium mesh or AISI 316 stainless steel. 如請求項5的電解剝銀方法,其中施加電壓為2~4 V。The electrolytic silver stripping method of claim 5, wherein the applied voltage is 2-4 V. 如請求項5的電解剝銀方法,其中操作電流密度為0.5~10 A/dm 2The electrolytic silver stripping method of claim 5, wherein the operating current density is 0.5-10 A/dm 2 . 如請求項5的電解剝銀方法,其中操作溫度範圍為20~60℃。The electrolytic silver stripping method of claim 5, wherein the operating temperature range is 20°C to 60°C. 如請求項5的電解剝銀方法,其中操作pH為7~14。The electrolytic silver stripping method of claim 5, wherein the operating pH is 7-14.
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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2333780A (en) * 1995-05-31 1999-08-04 Japan Energy Corp Electrolytic desilvering agent
WO2000075404A1 (en) * 1999-06-03 2000-12-14 Japan Energy Corporation Electrolytic removing agent for silver and method for electrolytic removing
TW200304507A (en) * 2002-03-25 2003-10-01 Macdermid Inc Method of stripping silver from a printed circuit board
TW200424367A (en) * 2003-03-25 2004-11-16 Nikko Materials Co Ltd Electrolytic stripping agent for silver

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2333780A (en) * 1995-05-31 1999-08-04 Japan Energy Corp Electrolytic desilvering agent
WO2000075404A1 (en) * 1999-06-03 2000-12-14 Japan Energy Corporation Electrolytic removing agent for silver and method for electrolytic removing
TW200304507A (en) * 2002-03-25 2003-10-01 Macdermid Inc Method of stripping silver from a printed circuit board
TW200424367A (en) * 2003-03-25 2004-11-16 Nikko Materials Co Ltd Electrolytic stripping agent for silver

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