JP4012760B2 - Aqueous electrolytic stripping solution for tin-silver alloy and electrolytic stripping method - Google Patents
Aqueous electrolytic stripping solution for tin-silver alloy and electrolytic stripping method Download PDFInfo
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Description
【０００１】
【発明の属する技術分野】
本発明は、導電性基体に施された錫−銀合金皮膜を電解により、導電性基体から剥離するために使用する錫−銀合金用水性電解剥離液、及びこの水性電解剥離液を用いた錫−銀合金用皮膜の剥離方法に関するものである。
【従来の技術】
集積回路の製造工程において、リ−ドフレ−ムに規格外のめっきを施した場合、基材のリ−ドフレ−ムを腐食することなしにめっき層だけを剥離して、再めっきする必要がある。また、リ−ドフレ−ムを短冊にしてステンレス等の治具に引掛けてめっきした後、治具だけを剥離する場合もある。
【０００２】
このような剥離に関する従来の技術として、特開昭６２−２５７０００号公報及び特開平４−５００２４２号公報には、メタンスルホン酸、エタンスルホン酸、プロパンスルホン酸、ブタンスルホン酸などのアルカンスルホン酸の水溶液に浸漬し、錫又は錫合金皮膜等が付着した鉄及び鉄合金製品、同及び同合金、亜鉛及び亜鉛合金を陽極にして定電圧で電解することにより剥離する方法が開示されている。また、特開平６−２７２０９８号公報には、アルカンスルホン酸、アルカノールスルホン酸又はアリールスルホン酸の水溶液に、クエン酸等の錯化剤を併用し、電解により錫又は錫合金のめっき皮膜を除去する方法が開示されている。さらに、特開平１１−１８００号公報には、スルホカルボン酸及び/又は素の塩を含有する水溶液に、錫又は錫合金皮膜を有する導電性基体を浸漬し、電解することにより剥離する方法が開示されている。
【０００３】
近年、環境問題の立場から錫合金皮膜に関しても鉛を使用しない方向に進んでおり、錫鉛合金皮膜の代替として錫−銀合金皮膜が新しく開発され、上市されるようになってきた。しかし、錫−銀合金皮膜は、従来の錫又は錫鉛合金皮膜等と異なり、銀を含有するため上述の従来の電解剥離方法を使用しても、銀がスマットとして残り充分に除去できないという問題があった。
【発明が解決しようとする課題】
本発明は、導電性基体に施された錫−銀合金皮膜を電解により、導電性基体から迅速に、かつ効率的に剥離させることができる錫−銀合金皮膜用水性電解剥離液を提供することを目的とする。また、本発明は、上記水性電解剥離液を用いた、錫−銀合金皮膜の電解剥離方法を提供することを目的とする。
【０００４】
【課題を解決するための手段】
本発明は、従来使用されていた電解剥離液と比較して、高い濃度でアルカンスルホン酸を含有する水溶液を電解剥離液として用いることで、上記課題を解決できるとの知見に基づいてなされたのである。
即ち、本発明はアルカンスルホン酸及び／又はその塩を５００〜８００ｇ／Ｌ以上含有することを特徴とする錫−銀合金用水性電解剥離液を提供する。また、本発明は、上記水性電解剥離液中で錫−銀合金皮膜を有する導電性基体を陽極として電解することを特徴とする錫−銀合金皮膜の電解剥離方法を提供する。
【０００５】
【発明の実施の形態】
本発明で用いるアルカンスルホン酸及びその塩は、水溶性であれば任意の化合物であってもよい。炭素数１〜４のアルカンスルホン酸及びその塩が好ましい。さらに好ましいものとして、メタンスルホン酸、エタンスルホン酸、プロパンスルホン酸、ブタンスルホン酸、及びこれらの塩が挙げられる。ここで、塩としては、ナトリウム塩やカリウム塩等のアルカリ金属塩、アンモニウム塩やアルカノールアミン塩等の有機アミン塩が挙げられる。本発明で用いる水性電解剥離液は、上記アルカンスルホン酸及び／又はその塩を水に溶解してなる水溶液である。この水溶液におけるスルホカルボン酸及び／又はその塩の濃度は、５００ｇ／Ｌ以上であり、好ましくは５００〜８００ｇ／Ｌである。この範囲のスルホカルボン酸濃度であれば、迅速、かつ効率的な剥離が可能であり、高電流部部分で陽極酸化を生じ黒色表面となることもない。より好ましくは６００〜７５０ｇ／Ｌである。本発明で用いる水性電解剥離液のｐＨは２以下であるのが好ましい。
【０００６】
本発明で用いる水性電解剥離液には、さらにチオアミド化合物、チオール化合物、芳香族チオール化合物及び芳香族スルフィド化合物からなる群から選ばれる一種以上の化合物を含有させるのが好ましい。チオアミド化合物としては、チオ尿素、ジメチルチオ尿素、ジエチルチオ尿素、アリルチオ尿素、エチレンチオ尿素、テトラメチルチオ尿素が挙げられるが、これらに限定されない。チオール化合物としては、メルカプトコハク酸、メルカプト乳酸が挙げられるが、これらに限定されない。芳香族チオール化合物としては、チオフェノール、メルカプトフェノール、チオクレゾール、ニトロチオフェノール、チオサルチル酸アミノチオフェノール、ベンゼンチオフェノール、メルカプトピリジンが挙げられるが、これらに限定されない。芳香族スルフィド化合物としては、４，４−チオジフェノール、４，４−アミノジフェニルスルフィド、チオビスチオフェノール、２，２−ジアミノジフェニルジスルフィド、２，２−ジチオジ安息香酸、ジトリルジスルフィド、２，２−ジピリジルジスルフィドが挙げられるが、これらに限定されない。上記化合物は単独で、又は２種以上組み合わせて用いてもよい。上記化合物は、水性電解剥離液に０．１〜５０ｇ／Ｌの量で含有させるのが好ましい。より好ましくは１〜２０ｇ／Ｌである。
【０００７】
また、本発明で用いる水性電解剥離得液には、上記化合物に代えて、又は上記化合物に加えて、ジメチルアミン、エチレンジアミン、ジエチレントリアミン、トリエチレンテトラミン等の炭素数２〜８の脂肪族アミン、ピリジンやイミダゾ−ル等の炭素数７〜１２の含チッ素複素環式化合物とエピクロルヒドリン等のエピハロヒドリンを重合反応させて得られる水溶性高分子化合物を含有させてもよい。本発明で用いるアルカンスルホン酸及びその塩は、電解により錫の酸化物の沈殿はほとんど生じないが、上記高分子化合物を含有させることによって、錫の酸化物を均一に溶解させ、スラッジが生成するのをより効率的に防止することができる。また、上記高分子化合物はインヒビタ−としての働きもあるため、錫−銀合金剥離後の鉄系基材等を傷めることもないといった利点もある。上記高分子化合物は、特公昭５３−３２３４４号公報に記載の光沢剤としての反応物等である。上記高分子化合物は単独で、又は２種以上組み合わせて用いてもよい。上記高分子化合物は、水性電解剥離液に１〜２０ｇ／Ｌの量で含有させるのが好ましい。より好ましくは５〜２０ｇ／Ｌである。
【０００８】
本発明では、上記水性電解剥離液中で、錫―銀合金皮膜を有する導電性基体を陽極として電解することにより錫―銀合金皮膜を導電性基体から効率的に剥離することができる。ここで、錫―銀合金皮膜を有する導電性基体としては、任意の厚みの錫―銀合金皮膜を有する任意の導電性基体が挙げられる。一般的には、導電性基体として、鉄、鉄系金属、銅、銅系金属等が挙げられる。また、皮膜の好適な厚みとしては、０．１〜５０μｍが挙げられるが、本発明はこれらに限定されるものではない。
陰極で使用する鉄系基材、治具としては、鉄、ステンレス、４２アロイ等が使用でき、一般的にステンレスを使用する。極比（陰極面積／陽極面積）は５／１以上が好ましい。陽極電流密度は５〜２００Ａ／ｄｍ2とするのが好ましく、より好ましくは１０〜５０Ａ／ｄｍ2である。この範囲で電解を行うと非常に早い剥離速度が得られ、また導電性基体への影響も少ないといった利点が得られる。また、一般的にステンレス等の鉄系治具の溶解がほとんどなく、錫−銀合金皮膜の剥離が充分に行えるような電流密度を与える電圧値に設定し、定電圧で行うことが好ましい。電解温度は２０℃〜６０℃であるのが好ましく、より好ましくは４０℃〜５０℃である。処理時間は処理条件（特に電流密度）や付着した錫−銀合金の量によって異なるのが、例えば０．５分〜１０分が例示される。しかしながら、電解時間は、剥離速度が陽極電流密度に比例して大きくなる等電解条件や付着した錫−銀合金の量によって異なるので、適宜に設定するのが好ましい。
【０００９】
【発明の効果】
本発明の剥離液を用いれば、陽極電解により短時間でステンレス等の鉄系及び銅系基材や治具から、錫−銀合金皮膜を均一な表面に剥離できる。
次に、実施例及び比較例を示して本発明を説明する。
【００１０】
【実施例】
参考例１
実施例で用いるイミダゾールとエピクロヒドリンとの反応物を、特公昭５３−３２３４４号公報第３欄１）の方法で製造した。すなわち、温度計、コンデンサーと分液ロートを付けた３００ｃｃの三角フラスコにイミダゾール３０ｇを入れ、水１４０ｇを注加して撹拌溶解させた。次いで液温を５０℃に上昇させ分液ロートからエピクロヒドリン６０ｇを液温が５０〜８０℃の間になるように保持して約３０分間で滴下し反応させた。滴下終了後さらに８０〜８５℃に保持して２時間撹拌し反応を完結させた。
【００１１】
実施例１
片面を被覆したＳＵＳ３０４平板（５０×１０×０．３ｍｍ）に厚さ１０μｍの錫−銀合金めっき（Ｓｎ／Ａｇ＝９６．５／３．５）を施したものを試験片とし、これをメタンスルホン酸５００ｇ／Ｌの剥離液に浸漬し、試験片を陽極とし、ＳＵＳ３０４平板（１００×１００×０．３ｍｍ）を陰極として、２．０Ｖ定電圧（電解開始時の陽極電流密度は３０Ａ／ｄｍ2）で５０℃、６０秒定電圧電解処理を行った。錫−銀合金めっきは除去され、処理後の基材表面は均一で損傷はなかった。
【００１２】
実施例２
片面を被覆した４２アロイ平板（５０×１０×０．３ｍｍ）に厚さ１０μｍの錫−銀合金めっき（Ｓｎ／Ａｇ＝９６．５／３．５）を施したものを試験片とし、これをメタンスルホン酸７５０ｇ／Ｌの剥離液に浸漬し、試験片を陽極とし、ＳＵＳ３０４平板（１００×１００×０．３ｍｍ）を陰極として、電解開始時の陽極電流密度が３０Ａ／ｄｍ2になるように電圧を選んで５０℃、６０秒定電圧電解処理を行った。錫−銀合金めっきは除去され、処理後の基材表面は均一で損傷はなかった。
【００１３】
実施例３
片面を被覆したＳＵＳ３０４平板（５０×１０×０．３ｍｍ）に厚さ１０μｍの錫−銀合金めっき（Ｓｎ／Ａｇ＝９６．５／３．５）を施したものを試験片とし、これをメタンスルホン酸７００ｇ／Ｌとチオ尿素１０ｇ／Ｌの剥離液に浸漬し、試験片を陽極とし、ＳＵＳ３０４平板（１００×１００×０．３ｍｍ）を陰極として、２．０Ｖ定電圧（電解開始時の陽極電流密度は３０Ａ／ｄｍ2）で５０℃、６０秒定電圧電解処理を行った。錫−銀合金めっきは完全に除去され、処理後の基材表面は均一で損傷はなかった。
【００１４】
実施例４
片面を被覆したＳＵＳ３０４平板（５０×１０×０．３ｍｍ）に厚さ１０μｍの錫−銀合金めっき（Ｓｎ／Ａｇ＝９６．５／３．５）を施したものを試験片とし、これをメタンスルホン酸７００ｇ／Ｌとアミノチオフェノール５ｇ／Ｌの剥離液に浸漬し、試験片を陽極とし、ＳＵＳ３０４平板（１００×１００×０．３ｍｍ）を陰極として、２．０Ｖ定電圧（電解開始時の陽極電流密度は３０Ａ／ｄｍ2）で５０℃、６０秒定電圧電解処理を行った。錫−銀合金めっきは完全に除去され、処理後の基材表面は均一で損傷はなかった。
【００１５】
実施例５
片面を被覆したＳＵＳ３０４平板（５０×１０×０．３ｍｍ）に厚さ１０μｍの錫−銀合金めっき（Ｓｎ／Ａｇ＝９６．５／３．５）を施したものを試験片とし、これをメタンスルホン酸６００ｇ／Ｌとイミダゾ−ルとエピクロヒドリンの反応物１０ｇ／Ｌの剥離液に浸漬し、試験片を陽極とし、ＳＵＳ３０４平板（１００×１００×０．３ｍｍ）を陰極として、２．０Ｖ定電圧（電解開始時の陽極電流密度は３０Ａ／ｄｍ2）で５０℃、６０秒定電圧電解処理を行った。錫−銀合金めっきは除去され、処理後の基材表面は均一で損傷はなかった。
【００１６】
比較例１
片面を被覆したＳＵＳ３０４平板（５０×１０×０．３ｍｍ）に厚さ１０μｍの錫−銀合金めっき（Ｓｎ／Ａｇ＝９６．５／３．５）を施したものを試験片とし、これをメタンスルホン酸３００ｇ／Ｌの剥離液に浸漬し、試験片を陽極とし、ＳＵＳ３０４平板（１００×１００×０．３ｍｍ）を陰極として、２．０Ｖ定電圧（電解開始時の陽極電流密度は３０Ａ／ｄｍ2）で５０℃、６０秒定電圧電解処理を行った。錫−銀合金めっきは完全に除去されなく、黒色のスマットが多量に残存した。[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an aqueous electrolytic stripping solution for a tin-silver alloy used for stripping a tin-silver alloy coating applied to a conductive substrate from the conductive substrate by electrolysis, and tin using the aqueous electrolytic stripping solution. -It is related with the peeling method of the film | membrane for silver alloys.
[Prior art]
In the integrated circuit manufacturing process, when the lead frame is subjected to non-standard plating, it is necessary to peel and replate only the plating layer without corroding the lead frame of the substrate. . In some cases, after the lead frame is made into a strip and hooked on a jig such as stainless steel for plating, only the jig is peeled off.
[0002]
As conventional techniques related to such peeling, Japanese Patent Application Laid-Open No. 62-257000 and Japanese Patent Application Laid-Open No. 4-500242 disclose alkanesulfonic acids such as methanesulfonic acid, ethanesulfonic acid, propanesulfonic acid, and butanesulfonic acid. An iron and iron alloy product immersed in an aqueous solution and having tin or a tin alloy film or the like attached thereto, and a method of peeling by electrolysis at a constant voltage using the same or the same alloy, zinc or zinc alloy as an anode are disclosed. JP-A-6-272098 also discloses that a plating film of tin or tin alloy is removed by electrolysis using a complexing agent such as citric acid in an aqueous solution of alkanesulfonic acid, alkanolsulfonic acid or arylsulfonic acid. A method is disclosed. Furthermore, Japanese Patent Application Laid-Open No. 11-1800 discloses a method in which a conductive substrate having a tin or tin alloy film is immersed in an aqueous solution containing a sulfocarboxylic acid and / or a salt of an element, and then peeled off by electrolysis. Has been.
[0003]
In recent years, in view of environmental problems, tin alloy coatings are also being used in the direction of not using lead, and tin-silver alloy coatings have been newly developed and put on the market as an alternative to tin-lead alloy coatings. However, unlike the conventional tin or tin lead alloy film, the tin-silver alloy film contains silver, so even if the above conventional electrolytic stripping method is used, the silver remains as a smut and cannot be sufficiently removed. was there.
[Problems to be solved by the invention]
The present invention provides an aqueous electrolytic stripping solution for a tin-silver alloy film capable of rapidly and efficiently stripping a tin-silver alloy film applied to a conductive substrate from the conductive substrate by electrolysis. With the goal. It is another object of the present invention to provide a method for electrolytic stripping of a tin-silver alloy film using the aqueous electrolytic stripping solution.
[0004]
[Means for Solving the Problems]
Since the present invention was made based on the knowledge that the above problem can be solved by using an aqueous solution containing alkanesulfonic acid at a high concentration as the electrolytic stripping solution as compared with the electrolytic stripping solution used conventionally. is there.
That is, the present invention provides an aqueous electrolytic stripping solution for a tin-silver alloy containing 500 to 800 g / L or more of alkanesulfonic acid and / or a salt thereof. The present invention also provides a method for electrolytic stripping of a tin-silver alloy film, characterized in that electrolysis is performed using the conductive substrate having a tin-silver alloy film in the aqueous electrolytic stripper as an anode.
[0005]
DETAILED DESCRIPTION OF THE INVENTION
The alkanesulfonic acid and its salt used in the present invention may be any compound as long as it is water-soluble. C1-C4 alkanesulfonic acid and its salt are preferable. Further preferred are methanesulfonic acid, ethanesulfonic acid, propanesulfonic acid, butanesulfonic acid, and salts thereof. Here, examples of the salt include alkali metal salts such as sodium salt and potassium salt, and organic amine salts such as ammonium salt and alkanolamine salt. The aqueous electrolytic stripping solution used in the present invention is an aqueous solution obtained by dissolving the above alkanesulfonic acid and / or a salt thereof in water. The concentration of the sulfocarboxylic acid and / or salt thereof in this aqueous solution is 500 g / L or more, preferably 500 to 800 g / L. If the concentration of the sulfocarboxylic acid is within this range, rapid and efficient peeling is possible, and no anodization occurs at the high current portion, resulting in a black surface. More preferably, it is 600-750 g / L. The aqueous electrolytic stripper used in the present invention preferably has a pH of 2 or less.
[0006]
The aqueous electrolytic stripping solution used in the present invention preferably further contains one or more compounds selected from the group consisting of thioamide compounds, thiol compounds, aromatic thiol compounds and aromatic sulfide compounds. Examples of thioamide compounds include, but are not limited to, thiourea, dimethylthiourea, diethylthiourea, allylthiourea, ethylenethiourea, and tetramethylthiourea. Examples of the thiol compound include, but are not limited to, mercaptosuccinic acid and mercaptolactic acid. Aromatic thiol compounds include, but are not limited to, thiophenol, mercaptophenol, thiocresol, nitrothiophenol, aminothiophenol thiosalicylate, benzenethiophenol, and mercaptopyridine. Aromatic sulfide compounds include 4,4-thiodiphenol, 4,4-aminodiphenyl sulfide, thiobisthiophenol, 2,2-diaminodiphenyl disulfide, 2,2-dithiodibenzoic acid, ditolyl disulfide, 2, Although 2-dipyridyl disulfide is mentioned, it is not limited to these. You may use the said compound individually or in combination of 2 or more types. The above compound is preferably contained in the aqueous electrolytic stripper in an amount of 0.1 to 50 g / L. More preferably, it is 1-20 g / L.
[0007]
In addition, the aqueous electrolytic stripping solution used in the present invention may be an aliphatic amine having 2 to 8 carbon atoms such as dimethylamine, ethylenediamine, diethylenetriamine, triethylenetetramine, or pyridine instead of or in addition to the above compound. A water-soluble polymer compound obtained by polymerizing a nitrogen-containing heterocyclic compound having 7 to 12 carbon atoms such as imidazole and epihalohydrin such as epichlorohydrin may be contained. Alkanesulfonic acid and its salt used in the present invention hardly cause precipitation of tin oxide by electrolysis, but by containing the above polymer compound, tin oxide is uniformly dissolved and sludge is generated. Can be prevented more efficiently. Further, since the polymer compound also functions as an inhibitor, there is also an advantage that the iron-based substrate after the tin-silver alloy is peeled is not damaged. The polymer compound is a reaction product as a brightener described in JP-B-53-32344. The above polymer compounds may be used alone or in combination of two or more. The polymer compound is preferably contained in the aqueous electrolytic stripper in an amount of 1 to 20 g / L. More preferably, it is 5-20 g / L.
[0008]
In the present invention, the tin-silver alloy film can be efficiently peeled from the conductive substrate by electrolysis using the conductive substrate having the tin-silver alloy film as an anode in the aqueous electrolytic stripping solution. Here, examples of the conductive substrate having a tin-silver alloy film include any conductive substrate having a tin-silver alloy film having an arbitrary thickness. Generally, examples of the conductive substrate include iron, iron-based metal, copper, and copper-based metal. Moreover, 0.1-50 micrometers is mentioned as suitable thickness of a film | membrane, However, This invention is not limited to these.
As the iron-based substrate and jig used for the cathode, iron, stainless steel, 42 alloy or the like can be used, and stainless steel is generally used. The pole ratio (cathode area / anode area) is preferably 5/1 or more. Anode current densities is preferably a 5~200A / dm 2, more preferably from 10 to 50 A / dm 2. When electrolysis is carried out in this range, it is possible to obtain an advantage that a very high peeling rate is obtained and the influence on the conductive substrate is small. Moreover, it is preferable to set it to a voltage value that gives a current density such that generally an iron-based jig such as stainless steel is hardly dissolved and the tin-silver alloy film can be sufficiently peeled, and it is preferably performed at a constant voltage. The electrolysis temperature is preferably 20 ° C to 60 ° C, more preferably 40 ° C to 50 ° C. The treatment time varies depending on the treatment conditions (particularly current density) and the amount of adhering tin-silver alloy, and for example, 0.5 minutes to 10 minutes is exemplified. However, the electrolysis time is preferably set appropriately because it varies depending on the electrolysis conditions in which the peeling rate increases in proportion to the anode current density and the amount of the attached tin-silver alloy.
[0009]
【The invention's effect】
If the stripping solution of the present invention is used, a tin-silver alloy film can be stripped on a uniform surface from an iron-based and copper-based substrate such as stainless steel and a jig in a short time by anodic electrolysis.
Next, an Example and a comparative example are shown and this invention is demonstrated.
[0010]
【Example】
Reference example 1
A reaction product of imidazole and epichlorohydrin used in the examples was produced by the method of JP-B No. 53-32344, column 3, 1). That is, 30 g of imidazole was put into a 300 cc Erlenmeyer flask equipped with a thermometer, a condenser and a separatory funnel, and 140 g of water was poured into the flask and dissolved. Next, the liquid temperature was raised to 50 ° C., and 60 g of epichlorohydrin was kept from the separating funnel so that the liquid temperature was between 50 ° C. and 80 ° C., and the reaction was carried out dropwise over about 30 minutes. After completion of the dropwise addition, the reaction was completed by further stirring for 2 hours while maintaining the temperature at 80 to 85 ° C.
[0011]
Example 1
A SUS304 flat plate (50 × 10 × 0.3 mm) coated on one side and tin-silver alloy plating (Sn / Ag = 96.5 / 3.5) with a thickness of 10 μm was used as a test piece. It is immersed in a stripping solution of sulfonic acid 500 g / L, a test piece is used as an anode, a SUS304 flat plate (100 × 100 × 0.3 mm) is used as a cathode, and a constant voltage of 2.0 V (an anode current density at the start of electrolysis is 30 A / dm). 2 ), a constant voltage electrolysis treatment was performed at 50 ° C. for 60 seconds. The tin-silver alloy plating was removed, and the treated substrate surface was uniform and not damaged.
[0012]
Example 2
A 42-aluminum flat plate (50 × 10 × 0.3 mm) coated on one side and tin-silver alloy plating (Sn / Ag = 96.5 / 3.5) with a thickness of 10 μm was used as a test piece. Soaking in a stripping solution of 750 g / L of methanesulfonic acid, using the test piece as an anode, and using a SUS304 flat plate (100 × 100 × 0.3 mm) as a cathode, the anode current density at the start of electrolysis is 30 A / dm 2. A voltage was selected and a constant voltage electrolysis treatment was performed at 50 ° C. for 60 seconds. The tin-silver alloy plating was removed, and the treated substrate surface was uniform and not damaged.
[0013]
Example 3
A SUS304 flat plate (50 × 10 × 0.3 mm) coated on one side and tin-silver alloy plating (Sn / Ag = 96.5 / 3.5) with a thickness of 10 μm was used as a test piece. Immerse in a stripping solution of 700 g / L of sulfonic acid and 10 g / L of thiourea, and use a test piece as an anode, a SUS304 flat plate (100 × 100 × 0.3 mm) as a cathode, and a constant voltage of 2.0 V (anode at the start of electrolysis) The current density was 30 A / dm 2 ), and a constant voltage electrolysis treatment was performed at 50 ° C. for 60 seconds. The tin-silver alloy plating was completely removed, and the substrate surface after the treatment was uniform and not damaged.
[0014]
Example 4
A SUS304 flat plate (50 × 10 × 0.3 mm) coated on one side and tin-silver alloy plating (Sn / Ag = 96.5 / 3.5) with a thickness of 10 μm was used as a test piece. It is immersed in a stripping solution of sulfonic acid 700 g / L and aminothiophenol 5 g / L, the test piece is used as an anode, and a SUS304 flat plate (100 × 100 × 0.3 mm) is used as a cathode. The anode current density was 30 A / dm 2 ), and a constant voltage electrolysis treatment was performed at 50 ° C. for 60 seconds. The tin-silver alloy plating was completely removed, and the substrate surface after the treatment was uniform and not damaged.
[0015]
Example 5
A SUS304 flat plate (50 × 10 × 0.3 mm) coated on one side and tin-silver alloy plating (Sn / Ag = 96.5 / 3.5) with a thickness of 10 μm was used as a test piece. Soaked in a stripping solution of 600 g / L of sulfonic acid, imidazole, and epichlorohydrin, 10 g / L, a test piece as an anode, a SUS304 flat plate (100 × 100 × 0.3 mm) as a cathode, and a constant voltage of 2.0 V (The anode current density at the start of electrolysis was 30 A / dm 2 ), and a constant voltage electrolysis treatment was performed at 50 ° C. for 60 seconds. The tin-silver alloy plating was removed, and the treated substrate surface was uniform and not damaged.
[0016]
Comparative Example 1
A SUS304 flat plate (50 × 10 × 0.3 mm) coated on one side and tin-silver alloy plating (Sn / Ag = 96.5 / 3.5) with a thickness of 10 μm was used as a test piece. It is immersed in a stripping solution of sulfonic acid 300 g / L, a test piece is used as an anode, a SUS304 flat plate (100 × 100 × 0.3 mm) is used as a cathode, and a constant voltage of 2.0 V (an anode current density at the start of electrolysis is 30 A / dm). 2 ), a constant voltage electrolysis treatment was performed at 50 ° C. for 60 seconds. The tin-silver alloy plating was not completely removed, and a large amount of black smut remained.
Claims (4)
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