TWI257153B - System and methods for hermetic sealing of post media-filled MEMS package - Google Patents

System and methods for hermetic sealing of post media-filled MEMS package

Info

Publication number
TWI257153B
TWI257153B TW093124658A TW93124658A TWI257153B TW I257153 B TWI257153 B TW I257153B TW 093124658 A TW093124658 A TW 093124658A TW 93124658 A TW93124658 A TW 93124658A TW I257153 B TWI257153 B TW I257153B
Authority
TW
Taiwan
Prior art keywords
mems package
methods
hermetic sealing
post media
filled
Prior art date
Application number
TW093124658A
Other languages
English (en)
Other versions
TW200529385A (en
Inventor
Chien-Hua Chen
Charles C Haluzak
Donald L Michael
Original Assignee
Hewlett Packard Development Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Development Co filed Critical Hewlett Packard Development Co
Publication of TW200529385A publication Critical patent/TW200529385A/zh
Application granted granted Critical
Publication of TWI257153B publication Critical patent/TWI257153B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B81C1/00277—Processes for packaging MEMS devices for maintaining a controlled atmosphere inside of the cavity containing the MEMS
    • B81C1/00293—Processes for packaging MEMS devices for maintaining a controlled atmosphere inside of the cavity containing the MEMS maintaining a controlled atmosphere with processes not provided for in B81C1/00285
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B81C1/00277—Processes for packaging MEMS devices for maintaining a controlled atmosphere inside of the cavity containing the MEMS
    • B81C1/00285—Processes for packaging MEMS devices for maintaining a controlled atmosphere inside of the cavity containing the MEMS using materials for controlling the level of pressure, contaminants or moisture inside of the package, e.g. getters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0145—Hermetically sealing an opening in the lid

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Micromachines (AREA)
  • Mechanical Light Control Or Optical Switches (AREA)
TW093124658A 2004-02-19 2004-08-17 System and methods for hermetic sealing of post media-filled MEMS package TWI257153B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/783,849 US6946728B2 (en) 2004-02-19 2004-02-19 System and methods for hermetic sealing of post media-filled MEMS package

Publications (2)

Publication Number Publication Date
TW200529385A TW200529385A (en) 2005-09-01
TWI257153B true TWI257153B (en) 2006-06-21

Family

ID=34861355

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093124658A TWI257153B (en) 2004-02-19 2004-08-17 System and methods for hermetic sealing of post media-filled MEMS package

Country Status (2)

Country Link
US (2) US6946728B2 (zh)
TW (1) TWI257153B (zh)

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DE102005060870A1 (de) * 2005-12-20 2007-06-21 Robert Bosch Gmbh Verfahren zum Verschließen einer Öffnung
DE102005062554A1 (de) * 2005-12-27 2007-07-05 Robert Bosch Gmbh Mikromechanisches Bauelement mit Kappe mit Verschluss
US20070178666A1 (en) * 2006-01-31 2007-08-02 Stats Chippac Ltd. Integrated circuit system with waferscale spacer system
US7414310B2 (en) * 2006-02-02 2008-08-19 Stats Chippac Ltd. Waferscale package system
US7932569B2 (en) * 2006-09-27 2011-04-26 Miradia, Inc. Micromechanical device with microfluidic lubricant channel
US7763489B2 (en) * 2006-09-27 2010-07-27 Miradia, Inc. Method of forming a micromechanical system containing a microfluidic lubricant channel
US20080248613A1 (en) * 2006-09-27 2008-10-09 Dongmin Chen Method of Forming a Micromechanical Device with Microfluidic Lubricant Channel
US7430359B2 (en) * 2006-10-02 2008-09-30 Miradia, Inc. Micromechanical system containing a microfluidic lubricant channel
US8096665B2 (en) * 2006-10-11 2012-01-17 Miradia, Inc. Spatially offset multi-imager-panel architecture for projecting an image
US7605466B2 (en) * 2007-10-15 2009-10-20 General Electric Company Sealed wafer packaging of microelectromechanical systems
US7915696B2 (en) * 2007-10-24 2011-03-29 General Electric Company Electrical connection through a substrate to a microelectromechanical device
EP2598934A4 (en) 2010-07-26 2018-01-17 Elenza, Inc. Hermetically sealed implantable ophthalmic devices and methods of making same
US8643140B2 (en) 2011-07-11 2014-02-04 United Microelectronics Corp. Suspended beam for use in MEMS device
WO2013052676A1 (en) 2011-10-07 2013-04-11 Analog Devices, Inc. Systems and methods for air release in cavity packages
FR2981059A1 (fr) * 2011-10-11 2013-04-12 Commissariat Energie Atomique Procede d'encapsulation de micro-dispositif par report de capot et depot de getter a travers le capot
US8525354B2 (en) 2011-10-13 2013-09-03 United Microelectronics Corporation Bond pad structure and fabricating method thereof
US8981501B2 (en) 2013-04-25 2015-03-17 United Microelectronics Corp. Semiconductor device and method of forming the same
US9728510B2 (en) 2015-04-10 2017-08-08 Analog Devices, Inc. Cavity package with composite substrate
US10407194B2 (en) * 2016-06-21 2019-09-10 United States Of America As Represented By The Secretary Of The Navy Low temperature self-sealing vacuum packaging
DE102017200162A1 (de) 2017-01-09 2018-07-12 Robert Bosch Gmbh Verfahren zum Herstellen eines mikroelektromechanischen Bauteils und Wafer-Anordnung
US11532532B2 (en) * 2019-05-08 2022-12-20 Nxp Usa, Inc. Composite media protection for pressure sensor
US11367664B2 (en) * 2019-12-19 2022-06-21 Amkor Technology Japan, Inc. Semiconductor devices and methods of manufacturing semiconductor devices
DE102020205490A1 (de) * 2020-04-30 2021-11-04 Robert Bosch Gesellschaft mit beschränkter Haftung Verfahren zum Herstellen einer Drucksensoreinrichtung und Drucksensoreinrichtung
CN115339045B (zh) * 2022-08-25 2023-10-13 合肥通富微电子有限公司 一种塑封方法

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US5596486A (en) 1993-11-10 1997-01-21 Kaman Aerospace Corporation Hermetically sealed memory or PC card unit having a frame, header and covers in bonded engagement
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ATE285756T1 (de) 2001-06-28 2005-01-15 Microchips Inc Verfahren zum hermetischen versiegeln von mikrochip-reservoir-vorrichtungen
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Also Published As

Publication number Publication date
TW200529385A (en) 2005-09-01
US7534662B2 (en) 2009-05-19
US6946728B2 (en) 2005-09-20
US20050202591A1 (en) 2005-09-15
US20050184382A1 (en) 2005-08-25

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MM4A Annulment or lapse of patent due to non-payment of fees