TWI257126B - Slurry and polishing method - Google Patents

Slurry and polishing method

Info

Publication number
TWI257126B
TWI257126B TW92120053A TW92120053A TWI257126B TW I257126 B TWI257126 B TW I257126B TW 92120053 A TW92120053 A TW 92120053A TW 92120053 A TW92120053 A TW 92120053A TW I257126 B TWI257126 B TW I257126B
Authority
TW
Taiwan
Prior art keywords
slurry
organic compound
cyclic organic
polishing method
oxidizer
Prior art date
Application number
TW92120053A
Other languages
English (en)
Chinese (zh)
Other versions
TW200405453A (en
Inventor
Masato Fukasawa
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of TW200405453A publication Critical patent/TW200405453A/zh
Application granted granted Critical
Publication of TWI257126B publication Critical patent/TWI257126B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/04—Aqueous dispersions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
    • H01L21/321—After treatment
    • H01L21/32115—Planarisation
    • H01L21/3212—Planarisation by chemical mechanical polishing [CMP]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Weting (AREA)
TW92120053A 2002-07-25 2003-07-23 Slurry and polishing method TWI257126B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002216423 2002-07-25
JP2002216428 2002-07-25

Publications (2)

Publication Number Publication Date
TW200405453A TW200405453A (en) 2004-04-01
TWI257126B true TWI257126B (en) 2006-06-21

Family

ID=31190292

Family Applications (1)

Application Number Title Priority Date Filing Date
TW92120053A TWI257126B (en) 2002-07-25 2003-07-23 Slurry and polishing method

Country Status (4)

Country Link
JP (1) JPWO2004012248A1 (ja)
AU (1) AU2003248101A1 (ja)
TW (1) TWI257126B (ja)
WO (1) WO2004012248A1 (ja)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004010379A1 (de) * 2004-03-03 2005-09-22 Schott Ag Verfahren zur Herstellung von Wafern mit defektarmen Oberflächen, die Verwendung solcher Wafer und damit erhaltene elektronische Bauteile
JP4316406B2 (ja) * 2004-03-22 2009-08-19 株式会社フジミインコーポレーテッド 研磨用組成物
JP4644434B2 (ja) * 2004-03-24 2011-03-02 株式会社フジミインコーポレーテッド 研磨用組成物
JP5648567B2 (ja) * 2010-05-07 2015-01-07 日立化成株式会社 Ｃｍｐ用研磨液及びこれを用いた研磨方法
JP5953766B2 (ja) * 2012-01-24 2016-07-20 日立化成株式会社 研磨液及び基体の研磨方法
JP6589361B2 (ja) * 2015-05-01 2019-10-16 日立化成株式会社 研磨剤、研磨剤セット及び基体の研磨方法
CN113874377A (zh) * 2019-05-13 2021-12-31 埃科莱布美国股份有限公司 作为铜腐蚀抑制剂的1,2,4-三唑并[1,5-a]嘧啶衍生物

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6217416B1 (en) * 1998-06-26 2001-04-17 Cabot Microelectronics Corporation Chemical mechanical polishing slurry useful for copper/tantalum substrates
JP2000252243A (ja) * 1998-12-28 2000-09-14 Hitachi Chem Co Ltd 金属用研磨液及びそれを用いた研磨方法
JP4538109B2 (ja) * 1999-02-18 2010-09-08 株式会社トッパンＴｄｋレーベル 化学機械研磨組成物
JP3902897B2 (ja) * 1999-11-15 2007-04-11 日立化成工業株式会社 金属用研磨液を用いた基板の研磨方法
JP2001185514A (ja) * 1999-12-27 2001-07-06 Hitachi Chem Co Ltd Ｃｍｐ研磨剤及び基板の研磨方法
JP3841995B2 (ja) * 1999-12-28 2006-11-08 Ｎｅｃエレクトロニクス株式会社 化学的機械的研磨用スラリー
JP4001219B2 (ja) * 2000-10-12 2007-10-31 Ｊｓｒ株式会社 化学機械研磨用水系分散体及び化学機械研磨方法
WO2001071789A1 (fr) * 2000-03-21 2001-09-27 Wako Pure Chemical Industries, Ltd. Agent de nettoyage de tranche de semi-conducteur et procede de nettoyage
JP3768401B2 (ja) * 2000-11-24 2006-04-19 Ｎｅｃエレクトロニクス株式会社 化学的機械的研磨用スラリー
JP3768402B2 (ja) * 2000-11-24 2006-04-19 Ｎｅｃエレクトロニクス株式会社 化学的機械的研磨用スラリー
JP2003188120A (ja) * 2001-12-17 2003-07-04 Hitachi Chem Co Ltd 金属用研磨液及び研磨方法
CN101037585B (zh) * 2002-04-30 2010-05-26 日立化成工业株式会社 研磨液及研磨方法
JP2004031442A (ja) * 2002-06-21 2004-01-29 Hitachi Chem Co Ltd 研磨液及び研磨方法
JP2004031446A (ja) * 2002-06-21 2004-01-29 Hitachi Chem Co Ltd 研磨液及び研磨方法

Also Published As

Publication number Publication date
WO2004012248A1 (ja) 2004-02-05
TW200405453A (en) 2004-04-01
JPWO2004012248A1 (ja) 2005-11-24
AU2003248101A1 (en) 2004-02-16

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees