TWI252543B - Structure and method of pretreated substrate before processing - Google Patents

Abstract

This invention provides a structure and a method of pretreated substrate before processing. There are a face with high adhesion and a face with low adhesion. The two faces exhibit adhesion of great difference on the two sides of the double-sided adhesion body. The face with high adhesion of the double-sided adhesion body is adhered closely to a heat-resistant plate of large size, and the face with low adhesion is adhered closely to a circuit board of large size. There are a plurality of semiconductor substrates on the circuit board of large size to be cut into independent substrates. When the semiconductor substrates are retrieved from the heat-resistant plate of large size, there is no residual adhesive left on the semiconductor substrates previously adhered tightly onto the face with low adhesion.

Description

1252543 IX. Description of the invention: [Technical field to which the invention pertains] The present invention relates to a structure and method for pre-sequence pre-sales, such as a double-weekly eight-piece and a large heat-resistant plate and a large circuit board. Processing the carrier structure and method. Knive [Prior Art] In the case of cost or other factors, when mass-produced electronic components or carrier boards containing lines, it is generally first to deal with the large number of conductors. A plurality of semiconductor carrier plates on the board are cut into separate carrier plates, and then, the steps of blowing, dusting, washing, ultrasonic, and baking are completed, and finally, the new job and the product package are performed. 'Tooth' In the method of cutting a semiconductor carrier board from a large-sized circuit board, it is most common in the Republic of China Patent No. 3, No. 6 publication No. "Semiconductor component circuit board and its manufacturing method". The method of the rib % patent is mainly to form a ν-shaped groove on the single-sided light surface of the Μ circuit (4) along the boundary of the half (10) and the boundary after the completion of the conductor and before the electro-test. So that along the semiconductor enemy's borders, the shape will be shaped like a letter. (After the completion of the electrical test and other steps, the skilled worker can use the hand along the pre-formed grain-like lines, The semiconductor carrier board _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ Cause 5

Claims (1)

1252543 X. Patent Application Range: 1 · A pre-processed carrier structure before the program, the carrier structure comprises: a large circuit board having a plurality of semiconductor carriers, and along the semiconductor carriers The boundary between the two has been cut into separate carrier plates; a large and inch heat plate having an area substantially equivalent to the large circuit board B; and a double-sided adhesive body having the double-sided adhesive body The viscous material having a large difference in dryness on both sides respectively has a higher degree of dryness of the double-sided drilled body and is closely adhered to the large heat-resistant plate, and the lower viscosity thereof is closely adhered to the large-sized circuit board. 2. The carrier structure of claim 1, wherein the structure of the semiconductor carrier further comprises: a substrate comprising at least an occupant capable of adhering Ic; and The heat dissipating metal plate is bonded to the bottom surface of the veneer by an adhesive. 3. The carrier structure of claim 2, wherein the heat dissipating metal plate is a copper alloy. The carrier structure of claim 2, wherein a surface of the heat dissipating metal plate that is not drilled with the substrate has a recording layer. The invention relates to the carrier structure described in the second item, wherein the large piece of heat resistant material may be an aluminum plate or other heat resistant material plate. The double-sided adhesive 6_• is a carrier structure as described in the scope of the patent application, wherein the body may be a face rubber ♦ or a controllable viscous material. Pre-process pre-loading method, the method comprising: providing a plurality of semiconductor carriers - a large circuit board; providing a large heat-resistant plate having an area substantially equal to the large circuit board; Forming a high degree of ablation between the large heat-resistant plates and forming a low-bonding of the large-sized adhesive body with the large-sized circuit board, so that the large-sized circuit board and the heat-resistant plate are tightly coupled to each other, and the large-sized circuit will be The two thousand conductor carriers on the board are cut along the boundaries of each other into respective independent π 戟 , , and each of the semiconductor carriers that are independent of each other is still being smashed by the double sided drill The double-sided adhesive body can be fixed to the large heat-resistant plate. The method described in claim 7 is a double-sided tape or a controllable adhesive. The method of claim 8, wherein the double-sided adhesive body is the double-sided adhesive tape, the method further comprising: closely bonding the high-viscosity surface of the double-sided adhesive tape to the large heat-resistant plate And a low-viscosity surface of the double-sided tape and the large-sized circuit board are tightly sealed 3 such that the large-sized circuit board and the large heat-resistant board are tightly coupled to each other. 10. The method of claim 8, wherein when the double-sided adhesive is the controllable adhesive, the method further comprises: coating the large amount of the control with the controllable adhesive The hot plate is to be highly bonded to the large heat-resistant plate; the controllable adhesive coated on the large heat-resistant plate is heated; and the large piece having the heat-controllable adhesive is heat-resistant The board is ablated by the large circuit board so that it can form a low degree of ablation with the large circuit board due to solvent evaporation or/and cross-linking reaction. The semiconductor carrier board, the structure of the method of claim 7, further comprising: a substrate comprising at least a cavity to which Ic can be attached; and