TWI240349B - Cluster type asher equipment used for manufacture of semiconductor device - Google Patents

Cluster type asher equipment used for manufacture of semiconductor device Download PDF

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Publication number
TWI240349B
TWI240349B TW92103457A TW92103457A TWI240349B TW I240349 B TWI240349 B TW I240349B TW 92103457 A TW92103457 A TW 92103457A TW 92103457 A TW92103457 A TW 92103457A TW I240349 B TWI240349 B TW I240349B
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Taiwan
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transfer
wafer
wafers
alignment
substrate
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TW92103457A
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Chinese (zh)
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TW200410354A (en
Inventor
Kyoung-Soo Park
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Psk Inc
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67167—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers surrounding a central transfer chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67294—Apparatus for monitoring, sorting or marking using identification means, e.g. labels on substrates or labels on containers

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Plasma & Fusion (AREA)
  • Drying Of Semiconductors (AREA)

Abstract

Disclosed is asher equipment used for manufacture of a semiconductor device, including a transfer module which is provided with a substrate transfer robot capable of simultaneously transferring at least two substrates and being defined with process chambers. A buffer stage is arranged in a manner such that, before introduction of the wafers into the respective process chambers, alignment and OCR processes can be implemented in a standby state of the wafers which is to be transferred to be introduced into the respective process chambers by the substrate transfer robot.

Description

0349 玖、發明說明 %方式及圖式簡單說明） 1 發明說明應敘明：發明所屬之技術領域、先前技術、内容、實 【發明所屬之·技術領域 發明領域 本發明有關於用於製造半導體裝置之叢集式灰化設備 更特定言之，本發明有關於其中將—用於進行對準及 OCR(光學字元辨識）功能之單元配置於—緩衝站中之用於 製造半導體裝置之叢集式灰化設備’藉以可在一晶圓位於 緩衝站中的同時進行對準及〇CR程序。0349 (Instructions of the invention,% mode and diagrams) (1) The description of the invention should state: the technical field, the prior art, the content, and the practice of the invention More specifically, the present invention relates to a cluster type ashing device for manufacturing semiconductor devices in which a unit for performing alignment and OCR (optical character recognition) functions is disposed in a buffer station. This allows the alignment and OCR processes to be performed while a wafer is in a buffer station.

並且，本發明有關於其中設有複數個轉移模組之用於 製造半導體裝置之叢集式灰化設備，各轉移模組用於將一 晶圓轉移至一處理室中，所以可以從一待命狀態同時將複 數個晶圓導入處理室中的方式來實行一半導體製造程序， 且其中將一用力進行對準及〇CR功能之單元配置於一緩衝 15站中，故可在一晶圓位於緩衝站中的同時進行對準及QCR 程序。 並且，本發明有關於其中設有複數個轉移模組之用於 製造半導體裝置之叢集式灰化設備，各轉移模組用於將一 晶圓轉移至一處理室中，所以可以從一待命狀態同時將複 20數個晶圓導入處理室中的方式來實行一半導體製造程序。 L先前技術3 發明背景 一般而言，用於製造半導體裝置之叢集式設備係作為 多反應器式複合半導體製造設備，此製造設備係包括單一 5 1240349 玖、發明說明 共同轉移模組，其具有一基材轉移機械臂；一叢集平台， 其由複數個分離閥及伴隨的真空化元件所構成；複數個處 理模組，其位於叢集平台的各側；及附接模組，諸如卡匣 模組等。 5 第1圖示意顯示用於製造半導體裝置之習知叢集式設 備100的一構造，參照第1圖，以一種使一能夠自動轉移一 基材140的基材轉移模組132定位在多角形轉移模組13〇的 一中心部份上之狀態來使用一多角形轉移模組13〇作為基 本平台。處理室ll〇a、11 Ob及ll〇c以及第一及第二承載器 10 室（loa(n〇ck chamber)120a及120b係分別界定於多角形轉移 模組130的各別側上，基材分別裝上及卸下第一及第二承 載器室120a及120b。 下文描述具有上述構造之習知叢集式設備1〇()的操作 〇 15 首先，將一可供插入一基材之卡匣（未圖示）安裝在第 一承載器室120a中，隨後利用一真空泵使第一承載器室 120a中的壓力降低至一預定值，若第一承載器室12〇a中的 壓力降低至預定值，則基材轉移機械臂132將基材取出卡 匣外且將基材放在一用於對準基材的一平坦區之對準器 20 I22上。依此方式對準的基材係由轉移模組130的基材轉移 機械臂132導入第一處理室丨丨⑹中，以經歷一指定程序。 在加熱基材而貫行指定程序之情形中，指定程序完成之後 ，藉由基材轉移機械臂132將基材取出第一處理室11(^外 然後放在一冷卻板124上，此冷卻板】24係為用於將基材冷 1240349 玖、發明說明 I至環境溫度之所謂InC。。丨er。對於各基材執行下列所有 將基材取出安裝在承載器室中之切外、將基材導 入處理室中、眚；— 序以及將已經歷指㉔序的基材 在冷卻板上加以冷卻。 5 然而，習知叢集式設備的缺點在於，因為一用於進行 對準及〇CR功能之單元係位於卡匡或基材轉移機械臂的一 側’叢集式設備的尺寸不得不增大。並且，因為對準及 OCR程序係在基材前分開實 a i J 1 ηΎ 日日圓導入處理室 10 ’故需要加長的時間長度來完成整體程序而使生產力變 差0 並且，習知的叢集式設備中，當對於採用承載器室的 晶圓實行半導體製造程序時，由於晶圓逐一轉移及導入處 理室中，處於真空狀態的轉移時間將變得比待命狀態更長 ’因而使生產力變差。 15 並且，在習知的叢集式設備中，因為晶圓經由作為真 空化轉移室的承載器室逐-轉移至各處理室中，所以需要 ^別^承載器室及製備真空操作式機械臂，因此製造此 设備所需要的成本不得不增高。因此，當在一灰化器或一 姓刻器的-Llte Eteh系統中實行程序時並不適宜使用昂貴 的習知叢集式設備，其並不需要真空化轉移室，諸如用於 提升-緩衝站的產出之雙手式轉移機械f，此緩衝㈣包 括一在晶圓導人-處理室之前不需保持真空化狀態而 能夠管理個別晶圓之OCR元件、以及一能夠改善程序的精 岔度之對準元件。 20 1240349 玖、發明說明 I[考务明内】 發明概要 5 10 依此，本發明已致力克服相關技術的障礙，本發明之 -目的係提供其中將—用於進行對準及〇cr功能的單元配 置於一緩衝站中之用於製造半導《置的叢集式灰化設備 ，稭以可在-晶圓位於緩衝站中的同時實行一 〇cr程序， 戶:以不用批次方式而是以個體方式來管理譬如则公厘的 昂貴晶圓以提高良率，並得以實行額外對準程序來確保晶 圓的對準並改善一製程的精密度。 本毛月之另目的係提供其中提供複數個轉移模組之 用於製造半導體裝置之叢集式灰化設備，各轉移模組係用 方、將b日圓轉移至-處理室中，故可同時將多個晶圓導入 處理室中以增進設備的產出。 為了達成上述目的，根據本發明之一型態，提供用於 15 ^造半導體裝置之灰化設備，此灰化設備係包括—轉移模 、、且，其设有一能夠同時轉移至少兩個基材且界定有處理室 之基材轉移機械臂，其中將一緩衝站配置為在晶圓導入各 另丨J處王甲含由4 y~ _ 月1J ’可以晶圓被基材轉移機械臂轉移導入各 2別處理室中的一待命狀態來實行對準及OCR程序。 W 根據本發明的另一型態，灰化設備進-步包含附接至 基材轉移機械臂之複數個轉移模組，這些複數個轉移模組 係用於將已在緩衝站中經歷對準及OCR程序之多個晶圓導 入各別處理室中。 根據本發明的另一型態，緩衝站係包括-對準器；且 1240349 玖、發明說明 δ 一晶圓放在對進哭、 〇 、轉 〇〇上犄，對準器藉由真空吸住晶圓 動晶圓及感應此s 曰曰Η的一凹口部份以將晶圓對準。 圖式簡單說明 ϋ ^、囷式由下文咩細描述更清楚地得知本發明之上 34目的、其他特性及優點，其中： —第1圖為用於製造半導體裝置之一習知叢集式設備的 第2圖為根據本發明的一較佳實施例用於製造半導體 裝置之一叢集式灰化設備的構造圖； 第3圖為詳細顯示第2圖戶斤示的灰化設備中所採用之一 緩衝站之立體圖’此緩衝站係包括_對準模組及—〇cR程 序模組； 第4圖顯示根據本發明的一實施例之一轉移模組的立 體圖；及 15 第5圖顯示根據本發明的一實施例之一種藉由轉移模 組將晶圓導入一處理室中之狀態的立體圖。 C實施方式3 較佳實施例之詳細說明 現在詳細參照本發明的一較佳實施例，其一範例顯示 20於附圖中，各圖及文中盡可能以相同編號來代表相同或相 似的元件。 如苐2及3圖所示’在根據本發明的一實施例之叢集式 灰化设備2 0 0中，一能夠貫行一對準程序之對準器2 I §係定 位於一冷卻站2 1 6下方的一緩衝站2]0中。並且，一 OCR模 1240349 玖、發明說明 組220係在對準器21 8的一上端的一側及冷卻站216的一下 端的一側定位於緩衝站21〇中。 此時，當實行一指定的半導體製造程序時，將各別晶 圓放在緩衝站210中的轉移模組212上由一基材轉移機械臂 5 214逐一轉移及導入一處理室222中。位於緩衝站21〇中的 對準器218及〇CR模組22〇係對於在緩衝站2丨〇中保持一待 命狀悲的晶圓實行其各別的對準及〇CR程序。 並且，當一晶圓放在位於緩衝站21〇内的對準器218上 時，對準器218藉由真空吸住晶圓、轉動晶圓及感應此晶 10圓的一凹口部份以將晶圓對準。 本發明中，將兩個轉移模組212a及212b形成為附接至 基材轉移模組214而可在同一時間轉移兩個晶圓。因此， 已在緩衝站210中經歷對準及〇CR程序同時保持待命狀態 之兩個晶圓係由基材轉移機械臂214導入處理室2 2 2中以經 15歷下一項半導體製造程序。 產業適用柹 m佩+努、明用於製造半導 20 式灰化設備提供的優點在於··因為將一用於進行對準： ⑽功能之單元配置於一緩衝站中而得以在一晶圓位於緩 J站中的同蚪來貫行對準及〇CR程序，故不再需以分開的 訏間長度只仃對準及〇CR程序，可藉此改善生產力。 ^ 、 本么明中，因為提供複數個轉移模組且各轉移 曰。用方、#曰曰圓轉移至-處理室中，所以可在將複數個 圓同4導入處理室中的情形下實行一半導體製造程序， 10 1240349 玖、發明說明 故可增進設備的產出並可改善生產力。 並且，本發明中，可以提升緩衝站的產出，此緩衝站 係包括在晶圓導入一處理室中之前不需一定保持一真空化 狀態而能夠管理個別晶圓之一〇CR元件、以及能夠改善一 5 程序的精密度之一對準元件。 圖式及說明書中，已揭露本發明之典型較佳實施例， 雖然採用特定用語但其係為普通及說明性質而非限制性質 ，本發明的範圍由申請專利範圍所界定。 【圖式簡單^說^明】 10 可參知、圖式由下文詳細描述更清楚地得知本發明之上 述目的、其他特性及優點，其中： 第1圖為用於製造半導體裝置之一習知叢集式設備的 示意圖； 第2圖為根據本發明的一較佳實施例用於製造半導體 15裝置之一叢集式灰化設備的構造圖； 第3圖為詳細顯示第2圖所示的灰化設備中所採用之一 緩衝站之立體圖，此緩衝站係包括一對準模組及一〇cr程 序模組； 第4圖顯示根據本發明的一實施例之一轉移模組的立 20體圖；及 第5圖顯示根據本發明的一實施例之一種藉由轉移模 組將晶圓導入一處理室中之狀態的立體圖。 1240349 玖、發明說明 【圖式之^主要兀件彳戈表符號表】 100…習知叢集式設備 132…基材轉移模組 110a·.·第一處理室 140…基材 110b、110c、222處理室 200…叢集式灰化設備 120a…第一承載器室 210···緩衝站 120b…第二承載器室 212、212a、212b···轉移模組 122、218…對準器 214…基材轉移機械臂 124…冷卻板 216…冷卻站 130…多角形轉移模組 220·.· OCR模組 12In addition, the present invention relates to a cluster ashing device for manufacturing semiconductor devices provided with a plurality of transfer modules therein, and each transfer module is used to transfer a wafer to a processing chamber, so it can be switched from a standby state At the same time, a semiconductor manufacturing process is performed by introducing a plurality of wafers into a processing chamber, and a unit for performing alignment and 〇CR function is arranged in a buffer station 15, so a wafer can be located in the buffer station. Alignment and QCR procedures are performed simultaneously. In addition, the present invention relates to a cluster ashing device for manufacturing semiconductor devices provided with a plurality of transfer modules therein, and each transfer module is used to transfer a wafer to a processing chamber, so it can be switched from a standby state At the same time, a semiconductor manufacturing process is performed by introducing a plurality of wafers into a processing chamber. L Prior Art 3 BACKGROUND OF THE INVENTION Generally speaking, a cluster device for manufacturing a semiconductor device is a multi-reactor type compound semiconductor manufacturing device. This manufacturing device includes a single 5 1240349, a common transfer module for invention description, which has a Substrate transfer robotic arm; a cluster platform composed of a plurality of separation valves and accompanying vacuum elements; a plurality of processing modules located on each side of the cluster platform; and attachment modules such as a cassette module Wait. 5 FIG. 1 schematically shows a structure of a conventional cluster device 100 for manufacturing a semiconductor device. Referring to FIG. 1, a substrate transfer module 132 capable of automatically transferring a substrate 140 is positioned in a polygonal shape. The state of a central portion of the transfer module 13o uses a polygonal transfer module 13o as a basic platform. The processing chambers 110a, 11 Ob and 110c, and the first and second carrier 10 chambers (loa (nock chambers) 120a and 120b are respectively defined on respective sides of the polygon transfer module 130. The first and second carrier chambers 120a and 120b are loaded and unloaded respectively. The operation of the conventional cluster device 10 () having the above structure is described below. 15 First, a card that can be inserted into a substrate is inserted. A cassette (not shown) is installed in the first carrier chamber 120a, and then a vacuum pump is used to reduce the pressure in the first carrier chamber 120a to a predetermined value. If the pressure in the first carrier chamber 120a is reduced to A predetermined value, the substrate transfer robot arm 132 takes the substrate out of the cassette and places the substrate on an aligner 20 I22 for aligning a flat area of the substrate. The substrate aligned in this manner The substrate transfer robot arm 132 of the transfer module 130 is introduced into the first processing chamber to undergo a specified procedure. In the case where the specified procedure is performed by heating the substrate, after the specified procedure is completed, the Material transfer robot arm 132 takes the substrate out of the first processing chamber 11 and then places it on a cooling plate 124 Above, this cooling plate] 24 is a so-called InC for cooling the substrate 1240349 玖, invention description I to ambient temperature. 丨 er. For each substrate, perform all of the following to remove the substrate and install it in the carrier chamber. Cutting, introducing the substrate into the processing chamber, cooling the substrate and cooling the substrate on the cooling plate. 5 However, the disadvantage of the conventional cluster device is that one The quasi and 0CR function unit is located on the side of the Kuang or substrate transfer robot arm. The size of the cluster device has to be increased. And because the alignment and OCR procedures are separated in front of the substrate, ai J 1 ηΎ The Japanese yen is introduced into the processing chamber 10 ', so it takes a longer time to complete the overall process and the productivity is reduced. Also, in the conventional cluster equipment, when a semiconductor manufacturing process is performed on a wafer using a carrier chamber, The circle is transferred and introduced into the processing chamber one by one, and the transfer time in the vacuum state will become longer than the standby state, thereby reducing productivity. 15 And, in the conventional cluster equipment, because the wafer The carrier chamber, which is a vacuum transfer chamber, is transferred to each processing chamber one by one, so the carrier chamber and the preparation of a vacuum-operated robot arm are needed, so the cost of manufacturing this equipment has to be increased. Therefore, It is not appropriate to use expensive conventional cluster equipment when performing procedures in a asher or a -Llte Eteh system, which does not require vacuum transfer chambers, such as those used in lift-buffer stations. Out of the two-handed transfer mechanism f, this buffer unit includes an OCR device that can manage individual wafers without maintaining a vacuum state before the wafer is introduced into the processing chamber, and a pair of countermeasures that can improve the precision of the process. 20 1240349 玖 、 Explanation of the invention I [Kao Mingming] Summary of the invention 5 10 Accordingly, the present invention has been devoted to overcoming the obstacles of the related technology, and the purpose of the present invention is to provide which will be used for alignment and 〇 The cr function unit is arranged in a buffer station and is used to manufacture semi-conducting cluster ashing equipment. The wafer can be implemented in the buffer station while the 10 cr process is implemented. Way In such the way to manage the individual mm wafer expensive to increase yield, and to provide for additional procedures to ensure alignment of the alignment of the crystal and to improve the precision of a circle manufacturing process. Another purpose of this month is to provide cluster ashing equipment for manufacturing semiconductor devices, in which a plurality of transfer modules are provided. Each transfer module is intended to transfer b yen to a processing chamber, so it can be simultaneously transferred. Multiple wafers are introduced into the processing chamber to increase the throughput of the equipment. In order to achieve the above object, according to one aspect of the present invention, an ashing device for a semiconductor device is provided. The ashing device includes a transfer mold, and is provided with a substrate capable of transferring at least two substrates at the same time. And a substrate transfer robot arm with a processing chamber is defined, in which a buffer station is configured to be introduced at each of the other wafers. J Jia Wang contains 4 y ~ _ month 1J 'The wafer can be transferred and imported by the substrate transfer robot arm. Alignment and OCR procedures are performed in a standby state in each of the two processing chambers. W According to another aspect of the present invention, the ashing device further includes a plurality of transfer modules attached to the substrate transfer robotic arm, the plurality of transfer modules being used to align the materials that have undergone alignment in the buffer station. And the OCR process of multiple wafers are introduced into the respective processing chambers. According to another aspect of the present invention, the buffer station system includes an aligner; and 1240349 玖, description of the invention δ-a wafer is placed on the wafer, 〇, turn 〇〇 犄, the aligner is held by vacuum The wafer moves the wafer and senses a notch portion of the wafer to align the wafer. The drawings are briefly explained. ^ And 囷 are more clearly understood from the following detailed description of the 34 objects, other characteristics and advantages of the present invention. Among them:-Figure 1 is a conventional cluster device for manufacturing semiconductor devices. FIG. 2 is a structural diagram of a cluster ashing apparatus for manufacturing a semiconductor device according to a preferred embodiment of the present invention; FIG. 3 is a detailed view of the ashing apparatus used in FIG. 2 A perspective view of a buffer station 'This buffer station includes an _alignment module and a -0cR program module; Figure 4 shows a perspective view of a transfer module according to an embodiment of the present invention; and Figure 5 shows a A perspective view of a state in which a wafer is introduced into a processing chamber by a transfer module according to an embodiment of the present invention. C. Embodiment 3 Detailed Description of the Preferred Embodiment Now referring to a preferred embodiment of the present invention in detail, an example is shown in the drawings. Each figure and the text represent the same or similar elements with the same number as much as possible. As shown in Figures 2 and 3, 'In the cluster ashing apparatus 2000 according to an embodiment of the present invention, an aligner 2 I capable of performing an alignment procedure is positioned at a cooling station A buffer station 2] 0 under 2 1 6 is in. In addition, an OCR die 1240349, the invention description group 220 is positioned in the buffer station 21o on the upper end side of the aligner 21 8 and the lower end side of the cooling station 216. At this time, when a designated semiconductor manufacturing process is performed, individual wafers are placed on the transfer module 212 in the buffer station 210 and transferred by a substrate transfer robot 5 214 one by one into a processing chamber 222. The aligner 218 and the 〇CR module 22 located in the buffer station 21o perform the respective alignment and ○ CR procedures for the wafer that has maintained a standby state in the buffer station 2o. In addition, when a wafer is placed on the aligner 218 located in the buffer station 21, the aligner 218 sucks the wafer by vacuum, rotates the wafer, and senses a 10-circle notch portion of the wafer to Align the wafer. In the present invention, the two transfer modules 212a and 212b are formed to be attached to the substrate transfer module 214 so that two wafers can be transferred at the same time. Therefore, the two wafers that have undergone the alignment and OCR procedures in the buffer station 210 while remaining on standby are introduced into the processing chamber 2 2 2 by the substrate transfer robot 214 to go through the next semiconductor manufacturing procedure. Industrial Applicability 柹 m Pe + Nu, Ming is used to manufacture semiconducting 20-type ashing equipment. The advantages are: Because one unit is used for alignment: ⑽ The functional unit is arranged in a buffer station and one wafer is available. The alignment and 〇CR procedures are carried out by the peers located in the station, so it is no longer necessary to only use the alignment and 〇CR procedures with separate interval lengths, which can improve productivity. ^ In Benming, because a plurality of transfer modules are provided and each transfer is called. Yong Fang and # 曰 said the circle was transferred to the-processing chamber, so a semiconductor manufacturing process can be performed in the case where a plurality of circles are introduced into the processing chamber. 10 1240349 发明, invention description can improve the output of the equipment and Improve productivity. In addition, in the present invention, the output of the buffer station can be improved. The buffer station includes a CR device that can manage one of the individual wafers without having to maintain a vacuum state before the wafer is introduced into a processing chamber, and can Improve the precision of a 5 procedure by aligning the components. In the drawings and the description, typical preferred embodiments of the present invention have been disclosed. Although specific terms are used, they are general and illustrative rather than restrictive. The scope of the present invention is defined by the scope of patent application. [Simplified diagrams ^ explain ^ clear] 10 can be known, the detailed description of the above-mentioned objects, other characteristics and advantages of the present invention are more clearly understood from the following detailed description, in which: Figure 1 is a practice for manufacturing semiconductor devices A schematic diagram of a cluster type device is shown in FIG. 2. FIG. 2 is a structural diagram of a cluster ashing device for manufacturing a semiconductor 15 device according to a preferred embodiment of the present invention. A perspective view of a buffer station used in a chemical equipment, the buffer station includes an alignment module and a 0cr program module; FIG. 4 shows a stand 20 body of a transfer module according to an embodiment of the present invention And FIG. 5 is a perspective view showing a state where a wafer is introduced into a processing chamber by a transfer module according to an embodiment of the present invention. 1240349 发明 Description of the invention [Schematic diagram of the main elements of the diagram] 100 ... Conventional cluster equipment 132 ... Substrate transfer module 110a ... First processing chamber 140 ... Substrates 110b, 110c, 222 Processing chamber 200 ... cluster ashing equipment 120a ... first carrier chamber 210 ... buffer station 120b ... second carrier chamber 212, 212a, 212b ... transfer module 122, 218 ... aligner 214 ... base Material transfer manipulator 124 ... cooling plate 216 ... cooling station 130 ... polygonal transfer module 220 .... OCR module 12

Claims (1)

124()34¾ 92103457號專利申請案申請專利範圍修正本94年3月29曰 拾、申請專利範圍 1· 一種用於製造半導體裝置之灰化設備，該灰化設備係 包含一轉移模組及處理室，該轉移模組設有一能夠同 犄轉移至少兩個基材之基材轉移機械臂，其中在該等 晶圓導入該等各別處理室之前，將一緩衝站配置為可 5 於該等晶圓的待命狀態下來實行對準及OCR程序，該 等晶圓係藉由該基材轉移機械臂轉移而導入該等各別 處理室。 2. 如申請專利範圍第！項之灰化設備，進一步包含附接至 4基材轉移機械臂之複數個該等轉移模組，複數個該 1〇 等轉移模組係用於將已在該緩衝站中經歷該對準及該 OCR程序之多個晶圓導人該等各別處理室中。 3. ^申請專利範圍p項之灰化設備，其中該緩衝站包括 子準，且田日日圓放在該對準器上時，該對準器 糟由真空吸住該晶圓、轉動該晶圓、及感應該晶圓的 15 一凹口部份以將該晶圓對準。 13Patent application No. 124 () 34¾ 92103457 for revision of patent application scope March 29, 1994, patent application scope 1. An ashing equipment for manufacturing semiconductor devices, the ashing equipment includes a transfer module and processing Room, the transfer module is provided with a substrate transfer robot arm capable of simultaneously transferring at least two substrates, wherein a buffer station is configured so that Alignment and OCR procedures are performed in the standby state of the wafers, and the wafers are transferred to the respective processing chambers by the substrate transfer robot arm transfer. 2. If the scope of patent application is the first! The ashing equipment of item further includes a plurality of such transfer modules attached to a 4-substrate transfer robotic arm, and the plurality of 10 transfer modules are used to pass the alignment and The wafers of the OCR process are directed into the respective processing chambers. 3. ^ The ashing equipment in the scope of application for item p, wherein the buffer station includes the sub-standard, and when Tian Yen is placed on the aligner, the aligner sucks the wafer by vacuum and rotates the crystal. Round and indent a 15-notch portion of the wafer to align the wafer. 13
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