JP3454034B2 - Vacuum processing equipment - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a vacuum processing apparatus, and particularly to a sample which is a semiconductor element substrate such as Si,
A vacuum processing apparatus suitable for single-wafer processing such as etching, CVD (chemical vapor deposition), sputtering, milling, ashing, baking, rinser (water washing), and semiconductor manufacturing for manufacturing semiconductor devices using the vacuum processing apparatus. It's about the line.

[0002]

2. Description of the Related Art A vacuum processing apparatus for processing a sample is roughly divided into a cassette block and a vacuum processing block. The cassette block has a front extending in the longitudinal direction facing a bay passage of a semiconductor manufacturing line. There are a cassette for the sample, an alignment unit for adjusting the orientation of the sample, and an atmospheric robot. The vacuum processing block is provided with a load-side load lock chamber, an unload-side load lock chamber, a vacuum processing chamber, a post-processing chamber, a vacuum pump, a vacuum robot, and the like.

In these vacuum processing apparatuses, the sample taken out from the cassette of the cassette block is transferred to the load-side load lock chamber of the vacuum processing block by the atmospheric robot. The sample, which is transferred from the load-side load lock chamber to the processing chamber by the vacuum robot and set on the electrode structure, is subjected to plasma etching or the like. Then, if necessary, they are transferred to the post-processing chamber and processed. The processed sample is transferred to the cassette of the cassette block by the vacuum robot and the atmospheric robot.

An example of a vacuum processing apparatus for plasma etching a sample is, for example, Japanese Patent Publication No. 61-8153, Japanese Patent Publication No. 63-133532, and Japanese Patent Laid-Open No. 3-192.
No. 52, Japanese Patent Laid-Open No. 4-226048, Japanese Patent Publication No.
-30369, JP-A-6-314729,
There are those described in JP-A-6-314730 and US Pat. No. 5,314,509.

[0005]

In the vacuum processing apparatus of the prior art described above, the processing chamber and the load lock chamber are arranged concentrically or in a rectangular shape. For example, U.S. Pat.
The device described in the specification No. 509 has a vacuum robot in the vicinity of the center of the vacuum processing block and three processing chambers arranged concentrically around the vacuum robot. The load side load lock chamber is located between the vacuum robot and the cassette block. A load lock chamber is provided on the unload side. Also, in the devices described in JP-A-3-19252 and JP-A-4-226048, a vacuum robot is arranged near the center of a vacuum processing block, and a plurality of processing chambers and load lock chambers are concentrically arranged around the vacuum robot. Has been done.

In these devices, a plurality of processing chambers and load lock chambers are concentrically arranged and the rotation angle of the transfer arm of the robot is large, so that the external dimensions of the vacuum pumps and the like attached to each processing chamber are also included. Is large, and in particular, the horizontal length between the vacuum processing apparatuses is large, and there is a problem that the required floor area of the plurality of vacuum processing apparatuses is large.

On the other hand, with respect to the processing chamber in the vacuum processing block of the vacuum processing apparatus, the vacuum pump and other various piping equipment, it is necessary to perform maintenance such as inspection and repair regularly or irregularly. Therefore, in general, a door is provided around the vacuum processing block, and by opening this door, the load lock chamber, the unload lock chamber, the processing chamber, the vacuum robot, and various piping equipment can be inspected and repaired. It is like this.

In the conventional vacuum processing apparatus, the diameter d of the sample to be handled is 8 inches (about 200 mm) or less, but the outer dimension Cw of the cassette is also about 250 mm, and the size of the floor area is still a big problem. It was. Furthermore, considering that a large-diameter sample such as a diameter d of 12 inches (about 300 mm) is to be handled, the external dimension Cw of the cassette becomes as large as about 350 mm, and the width of the cassette block that stores a plurality of cassettes is also large. growing. If the width of the vacuum processing block is determined according to this width, the entire vacuum processing apparatus requires a large space. As an example, consider a cassette block containing four cassettes, and when the diameter d of the sample is changed from 8 inches to 12 inches, the width of the cassette block is at least about 40.
It has to be larger than cm.

On the other hand, in order to perform a large amount of processing while performing various kinds of processing on a sample, in a general semiconductor manufacturing line, a plurality of vacuum processing apparatuses that perform the same processing are collected in the same bay, and the transportation between the bays is automatically performed. Or do it manually. Since such a semiconductor manufacturing line requires high cleanliness, the entire semiconductor manufacturing line is installed in a large clean room. The increase in the size of the vacuum processing apparatus accompanying the increase in the diameter of the sample is accompanied by the increase in the area occupied by the clean room, which further increases the construction cost of the clean room, which originally has a high construction cost. If a vacuum processing apparatus having a large occupied area is installed in a clean room having the same area, the number of vacuum processing apparatuses as a whole must be reduced or the intervals between the vacuum processing apparatuses must be narrowed. A reduction in the number of vacuum processing apparatuses installed in a clean room of the same area inevitably leads to a decrease in the productivity of the semiconductor manufacturing line and an increase in the semiconductor manufacturing cost.
On the other hand, narrowing the intervals between the vacuum processing devices causes a shortage of maintenance space for inspection and repair, and significantly impairs maintainability of the vacuum processing devices.

On the other hand, with the increase in the diameter of the sample, it is a major issue to improve the throughput per unit floor space of the semiconductor manufacturing apparatus (the number of substrates processed per time).

A first object of the present invention is to provide a vacuum processing apparatus or a semiconductor manufacturing apparatus which suppresses an increase in an occupying area, that is, a lateral dimension in a plane arrangement, and which can easily add, change and expand a vacuum processing chamber in a small space. To do.

A second object of the present invention is to provide a vacuum processing apparatus or a semiconductor manufacturing apparatus in which the functions associated with the addition, modification and expansion of the vacuum processing chamber can be easily added and a control method therefor.

[0013]

To achieve the above first object, according to the Invention The present invention comprises a transport room for performing loading and unloading of the sample, and a processing chamber for vacuum processing the sample, the The processing chamber has a first processing chamber and a second processing chamber larger than the first processing chamber, and vacuum transfer for transferring the sample between the processing chamber and the loading / unloading chamber via a vacuum transfer chamber. In a vacuum processing apparatus comprising a processing chamber and the loading / unloading chamber arranged along the circumference of the vacuum transfer chamber, the first processing chamber is located closer to the loading / unloading chamber than the second processing chamber. The vacuum processing apparatus is characterized in that it is provided.

According to the present invention, the loading / unloading chamber (load lock)
Large second process chamber having an outer diameter from the chamber) to the far side (side by side two etching chamber), disposed substantially in vertical direction and the vacuum transfer chamber, on the side closer to the transport room (load lock chamber) is relatively Two first processing chambers (ashing chambers) having a small outer diameter can be arranged on both sides of the vacuum transfer chamber substantially laterally.

That is, when the etching chamber and the ashing chamber are composed of different plasma sources, the chambers have different sizes. For example, if the plasma source in the etching chamber is the ECR system and the plasma source in the ashing chamber is the inductive plasma source, the diameter of the inductive plasma source is smaller than that in the ECR system even if a coil is provided around the ashing chamber. Can be small. Further, the diameter of the ashing chamber can be further reduced by providing the coil above the ashing chamber.

When such an etching chamber and an ashing chamber are combined into a common unit, the etching chamber, which is a large unit, is arranged vertically with respect to the vacuum transfer chamber,
Arranging the ashing chamber, which is a small unit, in the lateral direction of the vacuum transfer chamber is effective in achieving an overall space saving while suppressing an increase in the occupied area, that is, the lateral dimension in the planar arrangement. As a result, it is possible to arrange two etching chambers and two ashing chambers having different outer dimensions around the vacuum transfer chamber while effectively utilizing the space. As a result, the lateral dimensions of the vacuum processing equipment
While suppressing the increase in the length of the vacuum processing apparatus in the vertical direction, that is, the direction away from the load lock chamber, the overall size can be made compact.

Such an effect, which is another feature of the present invention, is such that the sample transfer path by the vacuum transfer means is radially arranged with respect to each processing chamber from the center of rotation of the vacuum transfer means.
It can also be obtained by configuring the load lock chamber and unload lock chamber non-radially.

Further, according to the present invention, the first and second etching chambers are arranged on the side opposed to both load lock chambers with the vacuum transfer chamber interposed therebetween, and the first and second etching chambers and both load chambers are arranged. Since the first and second ashing chambers are arranged between the lock chambers, there are two etching chambers arranged next to each other.
Since a single chamber is installed,
Also in the case of the bleeding process, it is possible to minimize the sample transfer path by the vacuum transfer means, increase the transfer process time without increasing the transfer process time, and improve the throughput while supporting the increase in the sample diameter.
Consequently, it is possible to provide a vacuum processing apparatus that can suppress an increase in manufacturing cost.

According to another feature of the present invention, the first and second etching chambers are arranged on the side facing the both load lock chambers with the vacuum transfer chamber interposed therebetween, and the first and second etching chambers and the above-mentioned etching chamber are disposed. The first and second ashing chambers are arranged between the load lock chambers. When combining the etching chamber and ashing chamber into a common unit, the etching chamber, which is a large unit, should be placed vertically with respect to the vacuum transfer chamber, and the ashing chamber, which is a small unit, should be placed laterally with respect to the vacuum transfer chamber. However, it is effective in saving the entire space while suppressing an increase in the occupied area, that is, the lateral dimension in the planar arrangement.

Further, by incorporating the vacuum processing apparatus of the present invention into a semiconductor manufacturing line, it is possible to secure a necessary number of installed vacuum processing apparatuses while suppressing an increase in manufacturing cost while coping with an increase in the diameter of a sample. It is possible to provide a semiconductor manufacturing line in which maintainability is not impaired.

A second feature of the present invention is that in a vacuum processing apparatus, a main device for controlling a processing chamber such as etching and a plurality of slave devices for assisting the operation of the processing chamber have a common information transmission means, that is, I. It is connected by an / O channel bus, and the control information of the slave device is given by writing it in the memory of the master device, so that the control information of the slave device can be provided independently of the hardware configuration of the entire vacuum processing apparatus. Is being done.

Therefore, only one of the master device and the slave device can be upgraded independently, or the memory can be rewritten to change the form and mounting position of the slave device. Therefore, when the processing chamber to be used is added, changed, or expanded, the function of the vacuum processing apparatus or the semiconductor manufacturing line can be easily added or expanded by rewriting the control information of the memory.

As another feature of the present invention, the direction in which the transfer means transfers the sample to the plurality of processing chambers connected to both side surfaces of the vacuum transfer chamber and the direction in which the sample is transferred into and out of the transfer chamber. By providing the carry-in / out chamber and the processing chamber with the vacuum transfer means as the center so as to be substantially orthogonal to each other, the work space around the vacuum transfer means requiring maintenance can be widened, which is advantageous in workability.

Further, as another feature of the present invention, when the two samples are rotated and transported into the vacuum processing chamber, the loading / unloading chamber and the processing chamber are placed close to the virtual outermost circumference of the sample. Is provided, the lateral dimension of the vacuum processing apparatus can be reduced.

[0025]

BEST MODE FOR CARRYING OUT THE INVENTION The structure of a vacuum processing apparatus 300 according to an embodiment of the present invention will be described below with reference to FIGS. The vacuum processing apparatus includes a cassette block 10 and a vacuum processing block 30. The cassette block 10 has a table 11 on which a cassette 12 can be arranged and an atmospheric transfer robot 9 for transferring a sample. The cassettes 12 for product samples are cassettes 12A, 12B, 12C. The table 11 is provided with cassettes 12A, 12B, 12C and orientation flat alignment or notch alignment 12D sequentially (in the horizontal direction in FIG. 1). The sample cassette 12 accommodates all sample wafers or product wafers and dummy sample wafers . Samples, which are wafers for foreign matter check and cleaning, are stored at the top and bottom of the cassette. Also,
The wafer search mechanism 121A to
121C is provided, and when the cassette 12 is set, the wafer search mechanism recognizes the sample 3 in each cassette. That is, the storage position, the number, etc. of the samples 3 in each cassette are recognized.

The vacuum processing chamber 36 of the vacuum processing block 30.
Is a room where samples are processed one by one, for example, etching process and post-process (ashing process). Vacuum transfer chamber 37
Across the load lock chamber 34, unload lock chamber 35
Etching chambers 36A and 36C are provided on the opposite side to and ashing chambers 36B and 36D are provided beside them. Both the load lock chambers 34, 35 are arranged close, the sample transportable
The entrance / exit path is the atmosphere cassette part, that is, cassette block 1.
0 extends in a direction perpendicular to the longitudinal direction. Further, the first and second etching chambers 36A and 36C are arranged on the side facing the both load lock chambers 34 and 35 with the vacuum transfer chamber 37 interposed therebetween, and the first and second etching chambers and both load lock chambers are arranged. Between the first and second ashing chambers 36B and 36D
Are arranged.

As shown in FIG. 2, reference numeral 15 is a gate valve that opens and closes the communication between the chambers. In the vacuum processing chamber 36, a sample stage for placing a sample, which also serves as an electrode of a discharging means for etching and ashing, a microwave introducing means 13, and a vacuum pump 38.
Is provided. A sample lifting mechanism 14A is provided inside the sample table for mounting the sample. Reference numeral 40 is a viewing window made of quartz.

As shown in FIG . 1, both load lock chambers 3
A line L1 connecting the centers of 4, 35 and a line L2 connecting the centers of the first and second ashing chambers 36B, 36D, and the first, second
Line L3 connecting the centers of the etching chambers 36A and 36C of
And a line L4 connecting the centers of both vacuum pumps 38A and 38C
Are parallel to each other along the longitudinal direction of the atmosphere cassette unit.

A vacuum robot 39 is provided in the vacuum transfer chamber 37. In addition, between the cassette block 10 and the vacuum processing block 30, a gate valve 34A as a wafer loading port to the load lock chamber 34 of the vacuum processing block 30 and a wafer loading port from the unload lock chamber 35.
Is provided. The orientation flat alignment of the cassette block 10 may be omitted, and the notch alignment of the sample may be performed in the load lock chamber.

The atmospheric transfer robot 9 is provided so as to be able to travel on a rail 91 installed in the cassette block 10 in parallel with the table 11, and the cassette 12 and the load lock chamber 34 of the vacuum processing block 30 and the unloading chamber. The sample 3 is conveyed between the lock chambers 35 via the gate valve 34A shown in FIG. The atmosphere transfer robot 9 is
Four-axis control of left / right, up / down, and rotation is possible.

In the atmospheric transfer robot 9, the locus of the telescopic arm 92 that expands and contracts while moving on the rail 91 is a locus including the cassette 12, the orientation flat alignment 12D, the load lock chamber 34, and the unload lock chamber 35. Is configured.

The vacuum robot 39 has a load lock chamber 34.
To the vacuum processing chamber 36, the sample 3 is transferred between the etching chambers 36A and 36C, the unload lock chamber 35, and the post-processing chambers 36B and 36D. The vacuum robot 39 has a telescopic arm 101, and is provided in the vacuum processing block 30 so that the pivoting locus of the telescopic arm is a locus including the load lock chamber 34 and the vacuum processing chamber 36. The load lock chambers 34 and 35 are shown in FIG.
To sample lifting mechanism 14B is provided respectively,
Telescopic arms 92 and 101 of the robots 9 and 39, respectively.
The sample 3 can be handed over to the user.

The interior of the load lock chamber 34 is in an atmospheric state, which is cut off from the vacuum atmosphere of the vacuum processing block 30. Into the load lock chamber 34 in this state, the unprocessed sample held in the rake portion of the atmospheric transfer robot 9 is loaded, and
It is passed from the scoop portion into the load lock chamber 34. The atmosphere transfer robot 9 that has passed the sample before processing into the load lock chamber 34 is retracted to a predetermined position in preparation for the next operation.

In the embodiment of FIG. 1, the vacuum processing block 30
Around the Ru Oh so as to surround in the decorative plate 99.

Two vacuum robots are provided in the vacuum transfer chamber 37.
When the blade method is used, two wafers can be transferred at the same time, but the diameter of the vacuum transfer chamber 37 becomes large. When the diameter of the wafer becomes 300 mm, there is a problem that the diameter of the vacuum transfer chamber 37 becomes larger and larger. Then, as described above, the lateral dimension of the vacuum processing apparatus becomes large.

Therefore, as shown in FIG. 1, the etching chambers 36A and 36C are constituted by an ECR type plasma source, and an ashing chamber using an induction type plasma source smaller than the etching chamber is formed on the side surface of the vacuum transfer chamber 37. 36B, 36D
By providing the, it is possible to reduce the lateral size. Further, as shown in the embodiment of FIG. 12, when the vacuum robot 39 is of a two-blade type, two samples 3 can be transferred at the same time, and between the loading / unloading chambers 34 and 35 and the processing chambers 36A, 36B, 36C and 36D. The wafer transfer speed can be increased. In the case of this embodiment, the miniaturization is achieved as follows. When two wafers are simultaneously transferred in the vacuum transfer chamber 37, loading / unloading chambers 34 and 35 and ashing chambers 36B and 36D are provided in proximity to the virtual outermost circumference 121 of the wafer transfer path, so that the diameter of the vacuum transfer chamber 37 is increased. Can be set to 800 mm, and the diameter of the ashing chamber can be set to 65
If 0 mm, the horizontal dimension of the vacuum processing device is 2100 mm
Can be reduced to Here, the close distance is a necessary value including the dimension of the gate valve provided between the guaranty margin for axial deviation when the vacuum robot rotates and the ashing chamber and the like.

FIG. 2 shows the internal structure when cut along the line II-II in FIG. Here, an example in which the ECR method is used as the plasma source is shown in the processing chamber 36.

In order to make the surface of the wafer uniform as the diameter of the wafer becomes larger, the microwave introducing means 13 is used.
For example, the method described in Japanese Patent Application No. 8-78934 can be used.

The entire processing chamber is made compact,
In addition, a two-stage magnetic field coil 360 arranged in an L shape is used to form a necessary and sufficient magnetic field in the processing chamber.

As shown in FIG. 3, the load lock chamber 34,
The unload lock chamber 35 and the vacuum transfer chamber 37 are integrally formed as one base frame. The vacuum transfer chamber 37 has an etching chamber 36A, 3
6C and the post-processing chambers 36B and 36D are provided with a plurality of openings (37A to 37D). For example, the processing chamber 36A for etching is connected to the opening 37A. Of the openings 37A to 37D, those that are not connected to any of the processing chambers are sealed by a lid member (not shown). FIG. 4 shows the arrangement of the openings in the base frame portion of FIG.
Indicates the spacing.

Further, the load lock chamber, the unload lock chamber and the vacuum transfer chamber are integrally molded as one base frame, and the base frame and the atmospheric block are T-shaped.
It can also be arranged in a glyph.

Next, referring to FIGS. 5 and 6, the vacuum processing apparatus 3
The processing operation of the sample in 00 will be briefly described by taking the plasma etching processing as an example. First, the atmosphere transfer robot 9 of the cassette block 10 is moved on the rail 91 to approach, for example, the load side cassette 12A.
By extending the telescopic arm 92 toward the cassette 12A side, the scooping portion (not shown) is placed on the sample 3 in the cassette.
Underneath, and transfer the sample 3 onto the scoop part. Next, the atmosphere transfer robot 9 is moved in front of the orientation flat alignment 12D, the telescopic arm 92 is moved to a position above the orientation flat alignment 12D, and the atmosphere transportation robot 9 is slightly lowered to place the sample 3 on the orientation flat alignment 12D. To do. When the orientation flat alignment of the sample 3 is completed, the atmosphere transfer robot 9
The sample 3 is transferred again onto the scoop portion by the reverse operation of.

In FIGS. 5 and 10, the vacuum pump 38A,
Since each of 38B, 38C, and 38D is provided below each etching chamber 36A, 36B, 36C, and 36D, the area occupied by the vacuum processing apparatus 300 can be reduced.

Next, the sample 3 is transferred from the atmospheric transfer robot 9 to the vacuum processing unit 30. The support member 34B is brought into airtight contact with the seal portion 41 on the side surface of the load lock chamber 34 by the sample lifting mechanism 14B to form an upper closed space of the load lock chamber 34, and further the gate valve 34A of the load lock chamber 34 is opened. In this state, the arm of the atmosphere transfer robot 9 is moved to the load lock chamber 34, and the sample 3 is loaded.

The locus of the arm of the vacuum robot 39 is, for example, the sample 3 in the load lock chamber 34, the etching chamber 36A and the post-treatment chamber 36B, and the unload lock chamber 35.
Considering the situation where there is no wafer in the wafer, the result is as follows. That is, first, the arm of the vacuum robot 39 first receives the post-processing chamber 36.
The one sample 3 of B is moved to the unload lock chamber 35, and the sample 3 of the etching chamber 36A is moved to the post-treatment chamber 36B. Next, the sample 3 in the load lock chamber 34 is transported to the etching chamber 36A . The arm of the vacuum robot 39 repeats the same locus thereafter.

FIG. 6A is a diagram showing an operation when the sample 3 is transferred from the atmospheric transfer robot 9 to the vacuum processing unit 30. The gate valve 34A of the load lock chamber 34 is opened, and the sample lifting mechanism 14B is operated to support the sample 3 on the support member 34B.
Put it on top. Then, the gate valve 34A is closed and the load lock chamber 34 is evacuated. Load lock chamber 3
4 is separated from the outside by the seal portion 41. After evacuation of the load lock chamber, the wafer support member 34B is lowered. The state at that time is shown in FIG. 6B, and the load lock chamber 34 and the vacuum transfer chamber 37 communicate with each other.

Next, the sample pushing mechanism 14B is operated again, the arm of the vacuum robot 39 provided in the vacuum transfer chamber 37 is extended, and the sample 3 in the load lock chamber 34 is placed on the blade 42 on the arm.

In this way, the sample 3 is delivered to the arm of the vacuum robot 39, and is transferred to the processing chamber in the transfer path in the vacuum processing block, that is, the vacuum transfer chamber 37.

If two blades are provided on the arm of the vacuum transfer robot, two blades are used to transfer the sample from the processing chamber 36A, and after the processed sample 3 is placed on one blade, By bringing the unprocessed sample 3 placed on the other blade close to the processing chamber 36A, the time required to move the arm of the vacuum transfer robot can be shortened.

When the gate valve 34A is closed and the load lock chamber 34 is evacuated, the load lock chamber 3 is placed between the unload lock chamber 35 and the load lock chamber 34.
4 by the wafer support member 34B forming the upper closed space of
It has a structure that prevents foreign matter from entering between the two rooms. After evacuation of the load lock chamber 34, a support member 34B on which a sample is placed by the sample lifting mechanism 14B
By lowering, the state shown in FIG. At this time, as shown in FIG. 3, the load lock chamber 34
Since there is no partition between the unload lock chamber 35 and the unload lock chamber 35, foreign matter can be prevented from entering by performing the operation of transferring the sample to the vacuum transfer robot 39 in a short time. That is, by making the time of placing the sample on the lower part of the load lock chamber 34 or the unload lock chamber 35 shorter than the time of placing the sample on the lower part, contamination of foreign matter between the samples can be prevented. Control to prevent.

The sample 3 is conveyed to the unload side cassette position of the cassette block 10 by the operation reverse to the above operation. In the post-treatment chamber 36B, plasma post-treatment such as ashing is performed on the etched sample 3.

FIG. 7 is a block diagram of a controller of the vacuum processing apparatus according to the embodiment of the present invention. A unit 300 uses the vacuum processing apparatus as an etching processing apparatus. Reference numeral 100 denotes a main device, which is connected to an operation unit 200, an etching processing unit 300, an exhaust unit 500, a gas flow rate controller unit 600, and a power supply unit 700 via a communication medium 150. Reference numeral 250 is an operation / display means. Further, 320, 520, 620, and 720 are slave devices that control the respective units 300 to 700.

FIG. 8 is a diagram showing a system configuration example of the control device shown in FIG. The main device 100 includes a CPU 110,
VME bus 112, memory (bidirectional RAM) 120,
Local bus 122, I / O controller microcomputer 13
0 and the communication control unit 140. The I / O unit that constitutes the slave device 320 is the communication control unit 322, the bus 3
24 and DI / O 326. Bus 324
It includes an address bus, a data bus, and a control SIG.
The DI / O 326 includes a Do unit that starts and stops the device, and a Di unit that inputs a status signal from the device. D
The I / O 326 includes a power source, an exhaust pump, a gas flow rate controller, an air operation valve, as control target devices,
Sensors etc. are connected. Other slave devices 520, 62
The 0 and 720 also have I / O units of similar configuration.

The CPU 110 outputs to each device (200 to 700) to be controlled according to the procedure of device control,
Each process of sensor input from each device is stored in memory (bidirectional
It is executed by the write and read operations to the RAM 120. I / O
The controller microcomputer 130 periodically transfers the data in the memory 120 to the I / O units (320, 520, 620,
720) every time, as a response, the device information (Di / O) from the I / O unit of each device is received and written to the address of the corresponding memory. Read / write to the shared memory of the CPU 110 and the I / O controller 130
Read and write to the shared memory by the are executed asynchronously.

The CPU 110 controls the output of data to each device to be controlled and the reading of device information by the programs A, B, ... N and the data A in the memory. On the other hand, the I / O controller microcomputer 130
Controls the control of each device to be controlled, the writing of device information, etc. by the program a, the program b, the program n, and the data a of the memory. In accordance with the device control procedure, the CPU 110 activates the device operation program A in order to perform activation output to each device to be controlled, and outputs output data to the address of the memory 120 allocated for output to the device. Write. When the writing of the output data is completed, the output data written flag is set and the process proceeds to the next processing. In accordance with the device control procedure, the CPU 110 activates the device operation program B in order to read an input signal such as a sensor input indicating the operation state of each device to be controlled, and is assigned to an input from the device. The data of the address of the memory 120 is read. When the reading of the input data is completed, the input data read completion flag is set and the process proceeds to the next processing.

The I / O controller 130 fetches the status information of each slave device 320, 520, 620, 720 connected to the master device in the form of a sensor input or the like, and stores it in the memory 12.
Write to 0 periodically or continuously.

FIG. 9 is a diagram showing an example of the operation flow of the etching processing unit according to the embodiment of the present invention. When the auto etching mode is selected, the cassette 12 is installed, and then the etching processing conditions are set. further,
The vacuum processing apparatus 300, which is an etching processing unit , is activated, and the automatic etching processing is repeated until all the samples in the cassette 12 have been processed. When all the samples in the cassette have been processed, the cassette is recovered and the process is terminated. This operation flow is achieved by executing the device operation programs A, B ... And the programs a, b.

According to the present invention, the sample transfer path by the vacuum transfer means can be minimized, the transfer processing time is not increased, and the increase in manufacturing cost can be suppressed.

The sample is transported and processed in the following order during the auto etching process. Storage position check load in cassette The number of stages in the cassette 12A from which the unprocessed sample delivered to the lock chamber 34 is taken out is sequentially stored in the host computer. Atmospheric transfer robot 9 by introducing process before the load lock chamber 34 where the sample has received in the load lock chamber 34 by extraction atmospheric transfer robot 9 of the sample in the cassette is blocked from the atmosphere, and is evacuated. After that, the disconnection with the vacuum processing block 30 is released, and the vacuum processing block 37 is connected to the vacuum transfer chamber 37. Transfer from the load lock chamber 34 to the vacuum processing region by the vacuum robot The sample is transferred by the vacuum robot 39 to the load lock chamber 34.
Is transferred to the vacuum transfer chamber 37 of the vacuum processing block 30. Vacuum Processing in Vacuum Processing Area The sample is subjected to predetermined vacuum processing in the processing chamber of the vacuum processing area. Transfer from vacuum processing area by vacuum robot to unload lock chamber 35 A sample (processed sample) for which vacuum processing has been completed is transferred from the vacuum processing area to the unload lock chamber 35 by the vacuum robot 39 and carried into the chamber. To be done. After loading the sample that has been carried out from the unload lock chamber by the atmospheric transfer robot, the inside of the unload lock chamber 35 is
The vacuum transfer chamber 37 is shut off, and the internal pressure is adjusted to atmospheric pressure. The interior of the unload lock chamber 35 whose internal pressure has become atmospheric pressure is opened to the atmosphere. In this state, the rake portion of the atmospheric transfer robot 9 is inserted into the unload lock chamber 35, and the processed sample is passed to the rake portion. The rake part that received the processed sample is unload lock 3
It is carried out to the outside of the 5 rooms. After that, unload lock room 3
The inside of 5 is shielded from the atmosphere and evacuated in preparation for the next loading of the processed sample. On the other hand, the atmospheric transfer robot 9 having the processed sample in the scoop portion is moved to a position where the processed sample can be returned into the cassette 12A and stopped. Storage in the original position in the cassette by the atmospheric transfer robot After that, the rake portion with the processed sample, in that state,
It is inserted into the cassette 12A. Here, the insertion position is controlled by the host computer so that the processed sample is returned to the position where it was originally stored. After completing the insertion of the rake portion having the processed sample, the cassette 12A
Is raised or the rake is lowered. As a result, the processed sample is returned to the position where the sample was originally stored and is stored again in the cassette 12A.

Such an operation is similarly performed on the remaining unprocessed sample in the cassette 12A and the unprocessed sample in the cassette 12B.

As described above, every time the sample moves, what number of samples are in each station,
The data of the host computer is sequentially updated. The updating process is performed for each sample. By this, each sample, that is, which sample is in which station is managed.

When the orientation of the unprocessed sample is adjusted, the step is carried out between the above steps.

The above-described operation is instructed and controlled by, for example, a host computer.

Such management / control of the movement of the sample is carried out even when the vacuum processing block 30 has a plurality of vacuum processing regions. For example, assume that the vacuum processing block 30 has two vacuum processing regions. In this case, the sample is subjected to series processing or parallel processing depending on the processing information. Here, the series processing means that the sample is vacuum-processed in one vacuum processing area, and the vacuum-processed sample is subsequently vacuum-processed in the remaining vacuum processing area. The parallel processing means that the sample is processed in parallel. It means that vacuum processing is performed in one vacuum processing region, and another sample is vacuum processed in the remaining vacuum processing region.

For example, in the case of series processing, the sample numbered by the host computer is processed in the order and returned to the original position in the cassette.

Further, in the case of parallel processing, since how the numbered sample is processed in which vacuum processing area is controlled and controlled by the host computer, in this case as well, each processed sample is stored in the cassette. Returned to its original position.

In the case of parallel processing, from what stage of the cassette is taken out, and depending on what number of samples,
A host computer may manage and control which vacuum processing area is used.

Further, the series processing and the parallel processing are
Even in the case of mixed use, how the numbered sample was processed in which vacuum processing area is managed and controlled by the host computer.
Each processed sample is returned to its original position in the cassette.

As a plurality of vacuum processing areas, for example,
The plasma generation method is the same or different.
Examples include a combination of etching regions, a combination of a plasma etching region and a post-treatment region such as ashing, and a combination of an etching region and a film forming region.

According to the above configuration, when the input / output control is increased in order to expand the function, only the main device or the slave device is expanded and the other main device or the slave device is expanded without being changed. You can For example, when a mutual interlock of input / output signals from the slave device is added to the control procedure, the control means of the main device is changed because the input / output signal is originally information (data) held in the main device. Then
The slave device can be expanded (upgraded) without changing.

Thus, according to another feature of the present invention,
Only one of the main device 100 and the slave devices 320, 520, 620 and 720 can be independently upgraded. Further, the memory 120 can be rewritten to change the form and mounting position of the slave device. In addition, the function is added by rewriting the control information of the memory 120,
It is easy to expand, and control software can be developed in parallel.

FIG. 10 shows an example in which the usage of the vacuum processing apparatus of the embodiment described in FIG. 1 is changed, and shows an example when the number of processing chambers used is small. When the number of processing chambers to be used is small, for example, one etching chamber 38A is provided on the opposite side of the load lock chamber and one is provided beside it.
By arranging one ashing chamber 38B, a compact vacuum processing apparatus can be constructed.

Next, FIG. 11 shows a vacuum processing apparatus according to another embodiment of the present invention. This embodiment is different from the vacuum processing apparatus of the embodiment described in FIG.
The difference is that 8C turbo molecular vacuum pumps are arranged below each etching chamber. Even in this case, the etching chambers 36A and 38C are provided on the opposite sides of the load lock chamber 34 and the unload lock chamber 35 with the vacuum transfer chamber 37 interposed therebetween, and the ashing chambers 36B and 36D are provided next to the etching chambers 36A and 38C. In addition, both load lock chambers are arranged in close proximity to each other,
A line connecting the centers of the first and second etching chambers, a line connecting the centers of the first and second ashing chambers, and a line connecting the centers of both load lock chambers are parallel to each other.

In the vacuum processing apparatus shown in FIG. 11, when the number of processing chambers to be used is small, one etching chamber 38A is arranged on the opposite side of the load lock chamber and one ashing chamber 38B is arranged next to it. Thus, a compact vacuum processing device can be configured.

Incidentally, in response to an increase in required processing capacity, it is possible to construct a vacuum processing apparatus in which two etching chambers and two ashing chambers are connected to a plurality of openings as processing chambers.

Further, by incorporating the vacuum processing apparatus of the present invention into a semiconductor manufacturing line, it is possible to secure a necessary number of installed vacuum processing apparatuses while suppressing an increase in manufacturing cost while coping with an increase in the diameter of a sample. Thus, it is possible to provide a semiconductor manufacturing line that does not impair maintenance.

As described above, according to the present invention, the number of vacuum processing chambers installed in a clean room having the same area is not reduced as compared with the conventional one, even though the diameter of the sample is increased. There is no reduction in productivity. Therefore, while responding to the large diameter of the sample,
It is possible to suppress an increase in manufacturing cost.

[0078]

According to the present invention, it is possible to provide a vacuum processing apparatus which always has a good space factor for both users who use a single chamber and users who use a multi-chamber.

Further, according to the present invention, it is possible to secure a required number of installed units in a space-saving manner while suppressing the increase in manufacturing cost while coping with an increase in the diameter of the sample, and to save space in one vacuum processing apparatus. Therefore, it is true even if the required number of vacuum processing devices are installed.
Maintenance space without narrowing the space between empty processing units
It is possible to provide a vacuum processing apparatus that can secure the pace and that can easily add, change, and expand the vacuum processing chamber. Furthermore, it is possible to provide a device that does not impair the maintainability. Therefore, it is possible to provide a vacuum processing apparatus capable of suppressing an increase in manufacturing cost while coping with an increase in the diameter of a sample.

Further, by incorporating the vacuum processing apparatus of the present invention into a semiconductor manufacturing line, it is possible to secure the required number of installed vacuum processing apparatuses while suppressing an increase in manufacturing cost while coping with an increase in the diameter of a sample. It is possible to provide a semiconductor manufacturing line in which maintainability is not impaired.

[Brief description of drawings]

FIG. 1 is a diagram showing a planar configuration of a vacuum processing apparatus according to an embodiment of the present invention.

FIG. 2 is a longitudinal sectional view of a main part of the vacuum processing apparatus taken along the line II-II in FIG.

3 is a cross-sectional view showing a configuration of a base frame portion of the vacuum processing apparatus of FIG.

FIG. 4 is a diagram showing an arrangement interval of each opening of the base frame portion of FIG.

FIG. 5 is a diagram illustrating a sample processing operation in a vacuum processing apparatus.

FIG. 6 is a diagram showing an operation when a sample is delivered between an atmospheric transfer robot and a vacuum processing unit.

FIG. 7 is a block diagram of a controller of a vacuum processing apparatus according to an embodiment of the present invention.

8 is a diagram showing a system configuration example of the control device shown in FIG.

FIG. 9 is a diagram showing an example of an operation flow of an etching processing unit according to an embodiment of the present invention.

10 is an explanatory view of a usage pattern of the vacuum processing apparatus of FIG.

FIG. 11 is another embodiment of the present invention, which is a vacuum processing chamber apparatus in which a turbo compartment vacuum pump is arranged below the etching chamber.

FIG. 12 is a diagram showing another embodiment of the present invention, which is an embodiment when the vacuum robot is of a type having two blades.

[Explanation of Codes] 3 ... Sample, 10 ... Cassette Block, 12 ... Cassette,
30 ... Vacuum processing block, 34 ... Load lock chamber, 35
... unload lock chamber, 36 ... vacuum processing chamber, 37 ... vacuum transfer chamber.

─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. ⁷ Identification code FI H01L 21/3065 H01L 21/302 101G (72) Inventor Yoshinao Kawasaki 794 Azuma Higashitoyo, Hyomatsu City, Yamaguchi Prefecture Hitachi Kasado Plant (56) Reference JP-A-4-226048 (JP, A) JP-A-6-214731 (JP, A) JP-A-6-5688 (JP, A) JP-A-7-335711 (JP, A) JP-A-6-51260 (JP, A) (58) Fields investigated (Int.Cl. ⁷ , DB name) H01L 21/68 H01L 21/3065 H01L 21/302 H01L 21/306 H01L 21/461 H01L 21 / 027 H01L 21/46 H01L 21/203 H01L 21/363 H01L 21/205 H01L 21/31 H01L 21/365 H01L 21/469 H01L 21/86 C03F 1/00-4/04

Claims (9)

(57) [Claims] 1. A loading / unloading chamber for loading / unloading a sample, a plurality of processing chambers for vacuum- processing the sample, and a vacuum transfer means for transferring the sample between the processing chamber and the loading / unloading chamber. A vacuum processing apparatus comprising a vacuum transfer chamber, wherein the plurality of processing chambers and the carry-in / out chamber are arranged along the circumference of the vacuum transfer chamber, wherein the plurality of processing chambers include two units each including a first unit. A first processing chamber and two second processing chambers each having a second unit larger than the first unit and having a plasma source different from the plasma source of the first processing chamber, The two second processing chambers are arranged side by side in the vertical direction with respect to the vacuum transfer chamber on the far side, and the first processing chamber is provided on each of the left and right sides of the vacuum transfer chamber on the side closer to the loading / unloading chamber.
A vacuum processing apparatus characterized in that one by one is arranged. 2. A sample is loaded into or unloaded from the atmosphere and a vacuum atmosphere.
A carrying-in chamber and a carrying-out chamber for carrying out the sample, a plurality of processing chambers for vacuum-processing the sample, and carrying the sample between the processing chamber and the carrying-in or carrying-out chamber via a vacuum carrying chamber. Vacuum transfer means for controlling the processing chamber and the loading chamber.
And a vacuum processing apparatus in which a carry-out chamber is arranged along the periphery of the vacuum transfer chamber, wherein the vacuum transfer chamber is sandwiched between the plurality of processing chambers.
First and second etching chambers are arranged on the side facing the carry-in chamber and the carry-out chamber .
First and second ashing chambers are arranged between the carry-in chamber and the carry-out chamber, and a line connecting the centers of the first and second etching chambers and the centers of the first and second ashing chambers Connecting line, and the above
A vacuum processing apparatus, wherein lines connecting the centers of the carry-in chamber and the carry-out chamber are parallel to each other. 3. An atmosphere cassette unit and a vacuum processing unit, wherein the vacuum processing unit vacuum-processes the sample, and a load-side load lock chamber and an unload-side load lock chamber for loading and unloading the sample. A plurality of processing chambers, and a vacuum transfer means for transferring the sample between the processing chamber and the load-lock chambers via a vacuum transfer chamber, wherein the processing chambers and the load-lock chambers are vacuumed. In a vacuum processing apparatus arranged along the periphery of a transfer chamber, the atmospheric cassette unit takes out a plurality of cassettes for storing a plurality of objects to be processed and transfers the objects to be processed to the vacuum processing unit. The load transfer chambers of the vacuum processing unit are arranged in close proximity to each other and are parallel to each other, and the vacuum transfer is performed as the plurality of processing chambers. First and second etching chambers are arranged on the side facing the both load-lock chambers with the first and second etching chambers interposed between the first and second etching chambers. A chamber is arranged, and a line connecting the centers of the first and second etching chambers, a line connecting the centers of the first and second ashing chambers, and a line connecting the centers of the two load lock chambers are provided. A vacuum treatment , wherein the sample loading / unloading directions of the load lock chambers are parallel to each other along the longitudinal direction of the atmospheric cassette portion and extend in a direction perpendicular to the longitudinal direction of the atmospheric cassette portion. apparatus. 4. The vacuum processing apparatus according to claim 3, wherein the load lock chamber is provided with means for aligning the phase of the notch or orientation flat of the sample. 5. The vacuum processing apparatus according to claim 1, wherein the outer shape of the vacuum processing apparatus is radially arranged around the vacuum transfer chamber. 6. A cassette block and a vacuum processing block, wherein the cassette block is provided with a cassette table on which a plurality of cassettes containing samples are placed, and the vacuum processing block vacuumizes the sample. A plurality of processing chambers for processing, a load lock chamber and an unload lock chamber,
In a vacuum processing apparatus having a vacuum transfer chamber in which vacuum transfer means for transferring the sample between the processing chamber and the load lock chambers is arranged, the cassette block is an orientation flat,
A notch or a laser mark phasing mechanism, both load lock chambers are arranged in parallel in close proximity, a plurality of openings for the processing chamber expansion connection are formed around the vacuum transfer chamber, As the plurality of processing chambers, first and second etching chambers are arranged on the side facing the load lock chambers with the vacuum transfer chamber interposed therebetween, and the first and second etching chambers and the load lock chambers are disposed. First and second ashing chambers are arranged between the chambers, a line connecting the centers of the first and second etching chambers, a line connecting the centers of the first and second ashing chambers, and A vacuum processing apparatus, wherein lines connecting the centers of both load lock chambers are parallel to each other. 7. The vacuum processing apparatus according to claim 1, further comprising a main device that controls the plurality of processing chambers, and a plurality of slave devices that assist the operations of the processing chambers. A vacuum processing apparatus, wherein the main device and the slave device are connected by a common information transmission means, and the main device includes a shared memory for writing control information of each of the slave devices. 8. A loading / unloading chamber for loading / unloading a sample, a plurality of processing chambers for vacuum- processing the sample, and a vacuum transfer means for transferring the sample between the processing chamber and the loading / unloading chamber. A vacuum processing apparatus comprising a vacuum transfer chamber, wherein the plurality of processing chambers and the carry-in / out chamber are arranged along the circumference of the vacuum transfer chamber, wherein the plurality of processing chambers include two units each including a first unit. A first processing chamber and two second processing chambers each having a second unit larger than the first unit and having a plasma source different from the plasma source of the first processing chamber, The two second processing chambers are arranged side by side in the vertical direction with respect to the vacuum transfer chamber on the far side, and the first processing chamber is provided on each of the left and right sides of the vacuum transfer chamber on the side closer to the loading / unloading chamber.
One not a One place, the direction the arranged on both sides of the vacuum transfer chamber first of said conveying means to the two processing chamber sample is externally loading and unloading into the transport room and the direction for conveying the sample Is substantially orthogonal to each other, and the carry-in / out chamber and the first processing chamber are provided around the vacuum transfer means as a center. 9. A loading / unloading chamber for loading / unloading a sample, a plurality of processing chambers for vacuum- processing the sample, and a vacuum transfer means for transferring the sample between the processing chamber and the loading / unloading chamber. A vacuum processing apparatus comprising a vacuum transfer chamber, wherein the plurality of processing chambers and the loading / unloading chamber are arranged along the periphery of the vacuum transfer chamber, wherein the vacuum transfer chamber is rotatable with two samples arranged side by side. A size larger than the first unit having two first processing chambers each including a first unit and a plasma source different from the plasma source of the first processing chamber;
It is composed of two second processing chambers each composed of a unit, and two second processing chambers are arranged side by side in the vertical direction with respect to the vacuum transfer chamber on the side far from the loading / unloading chamber, and the second loading and unloading chamber The first side is provided on each of the left and right sides of the vacuum transfer chamber on the near side.
A vacuum processing apparatus characterized by arranging one processing chamber at a time .