JPH09321117A - Vacuum treating apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To facilitate adding, changing and expanding of a vacuum treating chamber with reduced space by placing a first treating chamber at nearer position to an entrance/ejection chamber than a second treating chamber to suppress the lateral size increase in plan layout. SOLUTION: Two second large-outer diameter treating chambers 36A, 36C are parallel disposed at the far side of a load lock chamber 34 and longitudinally to a vacuum conveying chamber 37. Two first smaller-outer diameter treating chambers 36B, 36D are disposed approximately at both sides of the chamber 37 at the near side of the load lock chamber 34. This suppresses the lateral size increase in plan layout and length increase of a vacuum treating apparatus 300 away from the load lock chamber 34, thereby saving the entire space. This also minimizes the sample conveying length of a pneumatic conveying means, improves the throughput with adapting to large apertures of samples and suppresses the production cost rise.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a vacuum processing apparatus, and more particularly to a vacuum processing apparatus for a sample which is a semiconductor element substrate such as Si.
Vacuum processing equipment suitable for single-wafer processing such as etching, CVD (chemical vapor deposition), sputtering, milling, ashing, baking, and rinsing (water washing), and semiconductor manufacturing using the same to manufacture semiconductor devices It is about lines.

[0002]

2. Description of the Related Art A vacuum processing apparatus for processing a sample is roughly divided into a cassette block and a vacuum processing block. The cassette block has a front surface extending in a longitudinal direction facing a bay passage of a semiconductor manufacturing line. There are a cassette for sample, an alignment unit for adjusting the orientation of the sample, and an atmospheric robot. The vacuum processing block includes a load-side load lock chamber, an unload-side load lock chamber, a vacuum processing chamber, a post-processing chamber, a vacuum pump, a vacuum robot, and the like.

In these vacuum processing apparatuses, a sample taken out of a cassette in a cassette block is transported to a load-side load lock chamber of the vacuum processing block by an atmospheric robot. The sample further transferred from the load side load lock chamber to the processing chamber by the vacuum robot and set on the electrode structure is subjected to processing such as plasma etching. Thereafter, it is transported to a post-processing chamber and processed as needed. The processed sample is transported to the cassette of the cassette block by the vacuum robot and the atmospheric robot.

Examples of vacuum processing apparatuses for performing plasma etching of a sample include, for example, Japanese Patent Publication No. 61-8153, Japanese Patent Application Laid-Open No. 63-133532, and Japanese Patent Application Laid-Open No. 3-19.
252, JP-A-4-226048, JP-B-6-30369, JP-A-6-314729, JP-A-6-314730, U.S. Pat.
No. 14,509.

[0005]

In the prior art vacuum processing apparatus described above, the processing chamber and the load lock chamber are arranged concentrically or rectangularly. For example, US Pat.
The apparatus described in Japanese Patent Application No. 14,509 has a vacuum robot near the center of a vacuum processing block, and three processing chambers arranged concentrically around the vacuum robot. A lock chamber and an unload-side load lock chamber are provided. In addition, JP-A-3-19
252 and JP-A-4-226048 also have a vacuum robot near the center of a vacuum processing block, and a plurality of processing chambers and load lock chambers arranged concentrically around the vacuum robot.

In these apparatuses, a plurality of processing chambers and load lock chambers are arranged concentrically, and the rotation angle of the transfer arm of the robot is large. Therefore, the outside dimensions of the apparatus including the vacuum pumps attached to each processing chamber are included. In particular, there is a problem that the horizontal length between the vacuum processing apparatuses is increased, and the required floor area of the plurality of vacuum processing apparatuses as a whole is large.

On the other hand, it is necessary to regularly and irregularly perform maintenance such as inspection and repair of a processing chamber in a vacuum processing block of a vacuum processing apparatus, a vacuum pump, and other various piping devices. Therefore, in general, a door is provided around the vacuum processing block, and by opening this door, inspection and repair of the load lock chamber, the unload lock chamber, the processing chamber, the vacuum robot, and various piping devices can be performed. It has become.

[0008] In the conventional vacuum processing apparatus, the diameter d of the sample to be handled is 8 inches (about 200 mm) or less, but the external dimension Cw of the cassette is also about 250 mm. Had become. Further, considering handling a sample having a large diameter such as a diameter d of 12 inches (about 300 mm), the external dimensions Cw of the cassette are as follows.
As a result, the width of the cassette block for accommodating a plurality of cassettes also increases. If the width of the vacuum processing block is determined according to this width, the entire vacuum processing apparatus requires a large space. As an example, consider a cassette block containing four cassettes, the width of the cassette block is at least about 40 when the sample diameter d is 8 inches to 12 inches.
It must be larger than cm.

On the other hand, in order to perform a large amount of processing while performing various kinds of processing on a sample, in a general semiconductor manufacturing line, a plurality of vacuum processing apparatuses performing the same processing are collected in the same bay, and conveyance between the bays is automatically performed. Or do it manually. Since such a semiconductor manufacturing line requires a high degree of cleanliness, the entire semiconductor manufacturing line is installed in a large clean room. The increase in the size of the vacuum processing apparatus accompanying the increase in the diameter of the sample is accompanied by an increase in the area occupied by the clean room, which further increases the construction cost of the clean room, which originally has a high construction cost. If a vacuum processing apparatus having a large occupied area is installed in a clean room having the same area, the total number of vacuum processing apparatuses must be reduced, or the interval between the vacuum processing apparatuses must be reduced. The decrease in the number of vacuum processing apparatuses installed in a clean room having the same area necessarily entails a decrease in the productivity of the semiconductor production line and an increase in the semiconductor production cost.
On the other hand, when the interval between the vacuum processing apparatuses is reduced, a maintenance space for inspection and repair is insufficient, and the maintainability of the vacuum processing apparatuses is significantly impaired.

[0010] On the other hand, as the diameter of the sample increases, it is a major problem to improve the throughput per occupied floor area of the semiconductor manufacturing apparatus (the number of processed substrates per time).

A first object of the present invention is to provide a vacuum processing apparatus or semiconductor manufacturing apparatus which suppresses an increase in an occupied area, that is, a lateral dimension in a planar arrangement, and which can save space, easily add, change, or expand a vacuum processing chamber. Is to do.

A second object of the present invention is to provide a vacuum processing apparatus or a semiconductor manufacturing apparatus in which functions can be easily added and expanded with addition, change, and expansion of a vacuum processing chamber, and a control method thereof.

[0013]

Means for Solving the Problems In order to achieve the first object of the present invention, the present invention comprises a loading / unloading chamber for loading / unloading a sample and a processing chamber for vacuum-treating the sample. ,
The processing chamber has a first processing chamber and a second processing chamber which is larger than the first processing chamber.
And a vacuum transfer means for transferring the sample between the processing chamber and the loading / unloading chamber via a vacuum transfer chamber, wherein the processing chamber and the loading / unloading chamber are connected to the vacuum transfer chamber. In a vacuum processing apparatus arranged along the periphery, a first processing chamber is provided at a position closer to the loading / unloading chamber than a second processing chamber.

According to the present invention, two second processing chambers (etching chambers) having a large outer diameter are arranged on the side far from the load lock chamber, and are arranged substantially vertically with the vacuum transfer chamber, and are close to the load lock chamber. On the side, two first processing chambers (ashing chambers) each having a relatively small outer diameter can be arranged on both sides substantially laterally of the vacuum transfer chamber.

That is, when the etching chamber and the ashing chamber are compared with each other, the etching chamber which requires various precise control elements for controlling the etching shape is accompanied by many devices. It will be large in comparison. When such an etching chamber and an ashing chamber are combined in a common unit, the etching unit, which is a large unit, is arranged vertically with respect to the vacuum transfer chamber, and the ashing chamber, which is a small unit, is placed in the horizontal direction of the vacuum transfer chamber. The arrangement is effective in saving the entire space while suppressing an increase in the occupied area, that is, the lateral dimension in the plane arrangement. As a result, it is possible to arrange two etching chambers and two ashing chambers having different outer dimensions around the vacuum transfer chamber while effectively utilizing the space. As a result, it is possible to suppress the increase in the lateral size of the vacuum processing apparatus and also suppress the increase in the length of the vacuum processing apparatus in the vertical direction, that is, the direction away from the load lock chamber, and to make the whole compact.

Such an effect is another feature of the present invention, in which the sample transfer path by the vacuum transfer means is radially arranged with respect to each processing chamber from the center of rotation of the vacuum transfer means.
The load lock chamber and the unload lock chamber can also be obtained by a non-radial configuration.

Further, according to the present invention, the first and second etching chambers are arranged on the side opposed to both load lock chambers with the vacuum transfer chamber interposed therebetween, and the first and second etching chambers and both load chambers are arranged. Since the first and second ashing chambers are arranged between the lock chambers, the sample transfer path by the vacuum transfer means can be minimized, the transfer processing time is not increased, and the sample diameter is increased. While improving the throughput,
As a result, a vacuum processing apparatus capable of suppressing an increase in manufacturing cost can be provided.

According to another feature of the present invention, the first and second etching chambers are arranged on the side facing the both load lock chambers with the vacuum transfer chamber interposed therebetween, and the first and second etching chambers and The first and second ashing chambers are arranged between the load lock chambers. When combining the etching chamber and the ashing chamber into a common unit, the large-sized etching chamber should be arranged vertically with respect to the vacuum transfer chamber, and the small-sized ashing chamber should be arranged horizontally with the vacuum transfer chamber. However, this is effective in saving the entire space while suppressing an increase in the occupied area, that is, the lateral dimension in the planar arrangement.

Further, by incorporating the vacuum processing apparatus of the present invention into a semiconductor manufacturing line, it is possible to secure a necessary number of installed vacuum processing apparatuses while suppressing an increase in manufacturing cost while coping with an increase in the diameter of a sample. It is possible to provide a semiconductor manufacturing line in which maintainability is not impaired.

A second feature of the present invention is that, in a vacuum processing apparatus, a main device for controlling a processing chamber such as etching and a plurality of slave devices for assisting the operation of the processing chamber have a common information transmission means, that is, I. It is connected by an / O channel bus, and the control information of the slave device is given by writing it in the memory of the master device, so that the control information of the slave device can be provided independently of the hardware configuration of the entire vacuum processing apparatus. Is being done.

Therefore, only one of the main device and the slave device can be upgraded independently, or the memory can be rewritten to change the form and mounting position of the slave device. Therefore, when adding, changing, or expanding a processing chamber to be used, the control information in the memory is rewritten, so that the function of the vacuum processing apparatus or the semiconductor manufacturing line can be easily added or expanded.

[0022]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The structure of a vacuum processing apparatus 300 according to an embodiment of the present invention will be described below with reference to FIGS. The vacuum processing device includes a cassette block 10 and a vacuum processing block 30. The cassette block 10 includes a table 11 on which a cassette 12 can be arranged and an atmospheric transfer robot 9 for transferring a sample. Cassettes 12 for product samples are cassettes 12A, 12B, and 12C. On the table 11, cassettes 12A, 12B, 12C and an orientation flat alignment 12D are sequentially arranged (see FIG. 1).
In the vertical direction). All of the sample cassettes 12 store a product sample or a product and a dummy sample. Samples for checking foreign substances and cleaning are stored at the top and bottom of the cassette. Further, the wafer search mechanisms 121A to 121A are provided around each cassette 12.
1B is provided, and when the cassette 12 is set, the wafer search mechanism recognizes the sample 3 in each cassette. That is, the storage position, the number, and the like of the samples 3 in each cassette are recognized.

The vacuum processing chamber 36 of the vacuum processing block 30.
Is a room for processing samples one by one, for example, an etching process and a post-process (ashing process). Vacuum transfer chamber 37
Between the load lock chamber 34 and the unload lock chamber 35
The etching chambers 36A and 38C are provided on the side opposite to the above, and the ashing chambers 36B and 36D are provided beside them. The two load lock chambers 34 are arranged close to each other, and extend in a direction perpendicular to the longitudinal direction of the atmospheric cassette unit, that is, the cassette block 10. Further, first and second etching chambers 36A and 36C are arranged on the side opposite to the load lock chambers 34 and 35 with the vacuum transfer chamber 37 interposed therebetween.
Between the second etching chamber and both load lock chambers, the first,
Second ashing chambers 36B and 36D are arranged.

Reference numeral 15 is a ring-shaped gate valve that opens and closes the communication between the chambers. The vacuum processing chamber 36 is provided with a sample stage for placing a sample, which also serves as an electrode of a discharging means for etching and ashing, a microwave introducing means 130, and a vacuum pump 38. A sample lifting mechanism 14A is provided inside the etching discharge electrode. Reference numeral 40 denotes a viewing window made of quartz.

As shown in FIG. 1, both load lock chambers 3
Line L1 connecting the centers of 4 and 35, line L2 connecting the centers of the first and second ashing chambers 36B and 36D, the first and the second
Line L3 connecting the centers of the etching chambers 36A and 36C of
And a line L4 connecting the centers of both vacuum pumps 38A and 38C
Are parallel to each other along the longitudinal direction of the atmosphere cassette portion.

A vacuum robot 39 is provided in the vacuum transfer chamber 37. A gate valve 34A between the cassette block 10 and the vacuum processing block 30 serves as a wafer loading port into the load lock chamber 34 of the vacuum processing block 30 and a wafer loading port from the unload lock chamber 35.
Is provided. Note that the orientation flat of the cassette block 10 may be omitted, and the notch of the sample may be adjusted in the load lock chamber.

The atmospheric transfer robot 9 is provided so as to be able to travel on a rail installed in the cassette block 10 in parallel with the cassette table 11, and the cassette 12 and the load lock chamber 34 and the unload chamber of the vacuum processing block 30. The sample 3 is conveyed between the lock chambers 35 via the gate valve 34A of FIG. The atmosphere transfer robot 9 is
Four-axis control of left / right, up / down, and rotation is possible.

In the atmosphere transfer robot 9, the locus of the arm 92 which expands and contracts while moving on the rail 91 is such that the cassette 1 is moved.
2. The trajectory includes the orientation flat 12D, the load lock chamber 34, and the unload lock chamber 35.

The vacuum robot 39 has a load lock chamber 34.
From the etching chambers 36A and 36C, the unload lock chamber 35, and the post-processing chambers 36B and 36D. The vacuum robot 39 has a telescopic arm 101, and is provided in the vacuum processing block 30 such that a turning locus of the telescopic arm is a locus including the load lock chamber 34 and the vacuum processing chamber 36. The sample lock mechanism 14B is provided in each of the load lock chambers 34 and 35, and the sample 3 is attached to the telescopic arms 91 and 101 of the robots 9 and 39, respectively.
Can be delivered.

The inside of the load lock chamber 34 is shut off from the vacuum atmosphere of the vacuum processing block 30 and is in an atmospheric state. The unprocessed sample held in the rake of the atmospheric transfer robot 9 is loaded into the load lock chamber 34 in this state, and
It passes from the rake section into the funnel lock chamber 34. The atmosphere transfer robot 9 that has transferred the sample before processing into the funnel lock chamber 34 is retracted to a predetermined position in preparation for the next operation.

As shown in FIG. 3, the load lock chamber 34,
The unload lock chamber 35 and the vacuum transfer chamber 37 are integrally formed as one base frame. The vacuum transfer chamber 37 includes etching chambers 36A,
A plurality of openings (37A to 37D) for connecting 6C and the post-processing chambers 36B and 36D are provided. For example, a processing chamber 36A for etching is connected to the opening 37A. Out of the openings 37A to 37D, those not connected to any of the processing chambers are sealed by a lid member (not shown).

Further, the load lock chamber, the unload lock chamber and the vacuum transfer chamber are integrally formed as one base frame, and the base frame and the atmospheric block are connected to each other by T
It can also be arranged in a letter shape.

Next, referring to FIGS. 5 and 6, the vacuum processing apparatus 3
The processing operation of the sample in 00 will be briefly described by taking a plasma etching process as an example. First, the atmospheric transfer robot 9 of the cassette block 10 is moved on the rail 91 so as to approach, for example, the load side cassette 12A, and the arm 92 is further extended toward the cassette 12A, so that a rake portion (not shown) is formed. The sample 3 is inserted below the sample 3, and the sample 3 is transferred onto the rake portion. Next, the atmosphere transfer robot 9 is set to the orientation flat 1
2D, the arm 92 is moved to the orientation flat alignment 12D, and the atmosphere transfer robot 9 is moved.
Is slightly lowered to align the orientation flat 12
The sample 3 is placed on D. When the orientation flat alignment of the sample 3 is completed, the sample 3 is transferred to the rake portion again by the reverse operation of the atmospheric transfer robot 9.

Next, the wafer 3 is transferred from the atmospheric transfer robot 9 to the vacuum processing unit 30. The sample lifting mechanism 14B allows the support member 34B to hermetically contact the seal portion 41 on the side surface of the load lock chamber 34 to form an upper closed space of the load lock chamber 34, and further opens the gate valve 34A of the load lock chamber 34. In this state, the arm of the atmospheric transfer robot 9 is moved to the load lock chamber 34 and the sample 3 is loaded.

The locus of the arm of the vacuum robot 39 is, for example, the sample 3 in the load lock chamber 34, the etching chamber 36A and the post-treatment chamber 36B, and the unload lock chamber 35.
Considering the state where there is no wafer, the following is obtained. That is, the arm of the vacuum robot 39 is first moved to the post-processing chamber 36.
One sample 3B is moved to the unload lock chamber 35, and the sample 3 in the etching chamber 36A is moved to the post-processing chamber 36B. Next, the sample 3 in the load lock chamber 34 is transferred to the etching chamber 36A. Further, the sample 3 in the etching chamber 36A
To the post-processing chamber 36B. The arm of the vacuum robot 39 repeats the same trajectory.

FIG. 6A is a diagram showing an operation when the wafer 3 is transferred from the atmospheric transfer robot 9 to the vacuum processing unit 30.
The gate valve 34A of the load lock chamber 34 is opened, and the sample lifting mechanism 14B is operated to support the sample 3 on the support member 34.
Place on B. Thereafter, the gate valve 34A is closed,
The inside of the load lock chamber 34 is evacuated. The load lock chamber 34 is separated from the outside by a seal portion 41. After evacuation of the load lock chamber, the wafer support member 34B is lowered. The state at that time is shown in FIG. 6B, and the load lock chamber 34 and the vacuum transfer chamber 37 communicate with each other.

Next, the sample pushing mechanism 14B is operated again, the arm of the vacuum robot 39 provided in the vacuum transfer chamber 37 is extended, and the sample 3 in the load lock chamber 34 is placed on the blade 42 on the arm.

In this way, the sample 3 is delivered to the arm of the vacuum robot 39, and is transferred to the processing chamber in the transfer path in the vacuum processing block, that is, the vacuum transfer chamber 37.

If two blades are provided on the arm of the vacuum transfer robot, two blades are used to transfer the sample from the processing chamber 36A, and after the processed sample 3 is placed on one of the blades, By bringing the unprocessed sample 3 placed on the other blade close to the processing chamber 36A, the time required to move the arm of the vacuum transfer robot can be shortened.

When the gate lock 34A is closed and the load lock chamber 34 is evacuated, the unload lock chamber 35 and the load lock chamber 34 are partitioned from each other.
The structure prevents foreign substances from being mixed between the two chambers. After evacuation of the load lock chamber 34, the support member 34B on which the sample is placed is lowered by the sample lifting mechanism 14B, and the state shown in FIG. 6B is obtained. At this time, since there is no partition between the load lock chamber 34 and the unload lock chamber 35 as shown in FIG. Mixing can be prevented. In other words, contamination of foreign substances between samples is reduced by shortening the time during which the sample is mounted on the lower part of the load lock chamber 34 or the unload lock chamber 35 compared with the time when the sample is mounted on the upper part. Control to prevent.

Further, the sample 3 is conveyed to the unload side cassette position of the cassette block 10 by the operation reverse to the above operation. In the post-processing chamber 36B, plasma post-processing such as ashing is performed on the sample 3 that has been subjected to the etching processing.

FIG. 7 is a block diagram of a controller of a vacuum processing apparatus according to an embodiment of the present invention. A unit 300 uses the vacuum processing apparatus as an etching processing apparatus. A main unit 100 is connected to an operation unit 200, an etching unit 300, an exhaust unit 500, a gas flow controller unit 600, and a power supply unit 700 via a communication medium 150. Reference numeral 250 denotes operation / display means. 320, 520, 620, and 720 are slave devices that control the respective units 300 to 700.

FIG. 8 is a diagram showing a system configuration example of the control device shown in FIG. Main device 100 includes CPU 11
0, VME bus 112, memory (bidirectional RAM) 12
0, a local bus 122, an I / O controller microcomputer 130, and a communication control unit 140. Slave device 32
The I / O unit constituting 0 includes a communication control unit 322, a bus 324, and a DI / O 326. Bus 324
Includes an address bus, a data bus, and a control SIG. The DI / O 326 includes a Do unit for starting and stopping the device and a Di unit for inputting a status signal from the device. The DI / O 326 is connected to a power supply, an exhaust pump, a gas flow controller, an air operation valve, a sensor, and the like as devices to be controlled. Other slave device 52
0, 620, and 720 also include I / O units having a similar configuration.

The CPU 110 outputs to each device (200 to 700) to be controlled according to the procedure of device control,
Each process of sensor input from each device is executed by a write / read operation to the memory (bidirectional RAM) 120. I
The I / O controller microcomputer 130 periodically transmits the data in the memory 120 to the I / O units (320, 520, 62).
0, 720), and the response of each device is
The device information (Di / O) from the O unit is received and written to the corresponding memory address. Read / write to / from shared memory of CPU 110 and I / O controller 1
Reading from and writing to the shared memory by 30 are performed asynchronously.

The CPU 110 controls the output of data to each device to be controlled and the reading of device information by programs A, B, ... Program N and memory data A. On the other hand, the I / O controller microcomputer 130
Controls the control of each device to be controlled, the writing of device information, and the like by the program a, the program b,..., The program n, and the data a of the memory. The CPU 110 starts the device operation program A in order to perform start-up output to each device to be controlled according to the device control procedure, and stores the output data in the address of the memory 120 allocated for output to the device. Write. When the writing of the output data is completed, the output data written flag is set, and the process proceeds to the next step. The CPU 110 starts the device operation program B in order to read an input signal such as a sensor input indicating the operation state of each device to be controlled according to the device control procedure, and is assigned to the input from the device. The data at the address of the memory 120 is read. When the reading of the input data is completed, the input data reading completed flag is set, and the process proceeds to the next processing.

The I / O controller 130 includes slave devices 320, 520, 620, 720 connected to the master device.
Fetches the status information of the sensor 1
20 is written periodically or continuously.

FIG. 9 is a diagram showing an example of the operation flow of the etching processing unit according to the embodiment of the present invention. When the auto-etching mode is selected, the cassette 12 is set, and then the etching conditions are set. further,
Activating the etching unit 300 and loading the cassette 12
The auto-etching process is repeated until all the samples in are processed. Once all samples in the cassette have been processed,
The cassette is collected and the process is completed. This operation flow includes the equipment operation programs A, B... And the programs a, b.
Is achieved by performing.

According to the present invention, the sample transfer path by the vacuum transfer means can be minimized, the transfer processing time is not increased, and the increase in manufacturing cost can be suppressed.

The sample is conveyed and processed in the following order during the auto etching process. Checking the storage position in the cassette The number of stages in the cassette 12A from which the unprocessed sample delivered to the funnel lock chamber 34 is taken out is sequentially stored in the host computer.

Extraction of Sample from Cassette by Atmosphere Transfer Robot 9 Carrying in to Load Lock Chamber 34 by Atmosphere Transfer Robot 9 The inside of the funnel lock chamber 34 that has received the sample before processing is shielded from the atmosphere and evacuated. . Thereafter, the block with the vacuum processing block 30 is released, and the block is communicated with the vacuum transfer chamber 37.

Load lock chamber 34 by vacuum robot
From the sample to the vacuum processing area.
Is transferred to the vacuum transfer chamber 37 of the vacuum processing block 30.

Vacuum Processing in Vacuum Processing Area The sample is subjected to a predetermined vacuum processing in the processing chamber of the vacuum processing area.

Transfer from Vacuum Processing Area to Unload Lock Chamber 35 by Vacuum Robot The sample (processed sample) for which vacuum processing has been completed is transferred from the vacuum processing area to the unload lock chamber 35 by the vacuum robot 39, It is brought into the room.

Carrying out from the unload lock chamber by the atmospheric transfer robot After carrying in the processed sample, the inside of the unload lock chamber 35 is
The vacuum transfer chamber 37 is shut off, and the internal pressure is adjusted to the atmospheric pressure. The interior of the unload lock chamber 35 whose internal pressure has become atmospheric pressure is opened to the atmosphere. In this state, the rake portion of the atmospheric transfer robot 9 is inserted into the unload lock chamber 35, and the processed sample is delivered to the rake portion. The rake part that received the processed sample is unload lock 3
It is carried out to the outside of the 5 rooms. After that, unload lock room 3
The inside of 5 is shielded from the atmosphere and evacuated in preparation for the next loading of the processed sample. On the other hand, the atmospheric transfer robot 9 having the processed sample in the scoop portion is moved to a position where the processed sample can be returned into the cassette 12A and stopped.

Storing in the original position in the cassette by the atmospheric transfer robot After that, the rake part having the processed sample is in that state,
It is inserted into the cassette 12A. Here, the insertion position is controlled by the host computer so that the processed sample is returned to the position where it was originally stored. After completing the insertion of the rake portion having the processed sample, the cassette 12A
Is raised or the rake is lowered. As a result, the processed sample is returned to the position where the sample was originally stored and is stored again in the cassette 12A.

Such an operation is similarly performed on the remaining unprocessed sample in the cassette 12A and the unprocessed sample in the cassette 12B.

As described above, each time the sample moves, the number of the sample in each station is
The data of the host computer is sequentially updated. The updating process is performed for each sample. This manages each sample, that is, the number of the sample at which station.

In the case where the orientation of the untreated sample is adjusted, the step is performed between the above steps.

The above-mentioned operation is instructed and controlled by the host computer, for example. Such management / control of the movement of the sample is performed even when the vacuum processing block 30 has a plurality of vacuum processing regions.

For example, assume that the vacuum processing block 30 has two vacuum processing regions. In this case, the sample is subjected to series processing or parallel processing according to the processing information. Here, the series processing means that the sample is 1
Vacuum processing in one vacuum processing area, and the vacuum-processed sample is continuously vacuum-processed in the remaining vacuum processing area. Parallel processing means that the sample is vacuum-processed in one vacuum processing area, Is vacuum-processed in the remaining vacuum processing area.

For example, in the case of series processing, the sample numbered by the host computer is processed in that order and then returned to its original position in the cassette.

Further, in the case of parallel processing, since how the numbered sample in which vacuum processing area is processed is controlled and controlled by the host computer, in this case as well, each processed sample is stored in the cassette. Returned to its original position.

In the case of parallel processing, the number of stages in the cassette taken out and the number of samples
Which vacuum processing area to use may be managed and controlled by a host computer.

Further, the series processing and the parallel processing are
Even in the case where they are mixed, since the number of samples processed in which vacuum processing area is managed and controlled by the host computer,
Each processed sample is returned to its original position in the cassette.

As a plurality of vacuum processing areas, for example,
The same or different plasma generation method
Examples include a combination of an etching region, a combination of a plasma etching region and a post-processing region such as ashing, and a combination of an etching region and a film formation region.

According to the above configuration, when the input / output control is increased in order to expand the function, only the main device or the slave device is expanded and the other main device or the slave device is expanded without being changed. You can For example, when adding a mutual interlock of input / output signals from the slave device to the control procedure, the control means of the main device is changed because the input / output signal is originally information (data) held in the main device. And
Slave devices can be expanded (upgraded) without change.

Thus, according to another feature of the present invention,
Main device 100, slave devices 320, 520, 620, 720
Only one of them can be upgraded independently. Further, by rewriting the memory 120, the form and mounting position of the slave device can be changed. Also, by rewriting the control information of the memory 120, functions can be added,
Expansion becomes easy, and development of control software can be performed in parallel.

FIG. 10 shows an example in which the usage of the vacuum processing apparatus of the embodiment described in FIG. 1 is changed, and shows an example when the number of processing chambers used is small. When the number of processing chambers to be used is small, for example, one etching chamber 38A is provided on the side opposite to the load lock chamber, and one
By arranging the two ashing chambers 38B, a compact vacuum processing apparatus can be configured.

Next, FIG. 11 shows a vacuum processing apparatus according to another embodiment of the present invention. This embodiment is different from the vacuum processing apparatus of the embodiment described with reference to FIG.
The difference is that an 8C turbo molecular vacuum pump is arranged below each etching chamber. Also in this case, the etching chambers 36A and 38C are provided on the opposite sides of the load lock chamber 34 and the unload lock chamber 35 with the vacuum transfer chamber 37 interposed therebetween, and the ashing chambers 36B and 36D are provided beside them. In addition, both load lock chambers are closely arranged in parallel,
A line connecting the centers of the first and second etching chambers, a line connecting the centers of the first and second ashing chambers, and a line connecting the centers of both the load lock chambers are parallel to each other.

In the vacuum processing apparatus shown in FIG. 11, when the number of processing chambers to be used is small, one etching chamber 38A is arranged on the opposite side of the load lock chamber and one ashing chamber 38B is arranged next to it. Thus, a compact vacuum processing device can be configured.

Incidentally, in response to an increase in required processing capacity, it is possible to construct a vacuum processing apparatus in which two etching chambers and two ashing chambers are connected to a plurality of openings as processing chambers.

Further, by incorporating the vacuum processing apparatus of the present invention into a semiconductor manufacturing line, it is possible to secure a necessary number of installed vacuum processing apparatuses while suppressing an increase in manufacturing cost while coping with an increase in the diameter of a sample. Thus, it is possible to provide a semiconductor manufacturing line that does not impair maintenance.

As described above, according to the present invention, the number of vacuum processing chambers installed in a clean room having the same area is not reduced as compared with the conventional one, despite the increase in the diameter of the sample. There is no reduction in productivity. Therefore, while responding to the increase in sample diameter,
An increase in manufacturing cost can be suppressed.

[0074]

According to the present invention, a vacuum processing apparatus having a good space factor can be always provided for a user using a single chamber and a user using a multi-chamber.

Further, according to the present invention, it is possible to secure a necessary number of installed units in a space-saving manner while suppressing an increase in manufacturing cost while coping with an increase in the diameter of a sample, and to add a vacuum processing chamber in a space-saving manner. A vacuum processing apparatus that can be easily changed and expanded can be provided. Further, it is possible to provide a device that does not impair the maintainability. Therefore, it is possible to provide a vacuum processing apparatus capable of suppressing an increase in manufacturing cost while coping with an increase in sample diameter.

Further, by incorporating the vacuum processing apparatus of the present invention into a semiconductor manufacturing line, it is possible to secure a necessary number of vacuum processing apparatuses installed while suppressing an increase in manufacturing cost while coping with an increase in the diameter of a sample. It is possible to provide a semiconductor manufacturing line in which maintainability is not impaired.

[Brief description of drawings]

FIG. 1 is a diagram showing a plan configuration of a vacuum processing apparatus according to an embodiment of the present invention.

FIG. 2 is a vertical sectional view of a main part of the vacuum processing apparatus taken along line II-II of FIG.

FIG. 3 is a cross-sectional view showing a configuration of a base frame portion of the vacuum processing apparatus of FIG.

FIG. 4 is a view showing an arrangement interval of each opening of the base frame unit of FIG. 3;

FIG. 5 is a diagram illustrating a sample processing operation in a vacuum processing apparatus.

FIG. 6 is a diagram illustrating an operation when a sample is transferred between an atmospheric transfer robot and a vacuum processing unit.

FIG. 7 is a block diagram of a control device of the vacuum processing apparatus according to one embodiment of the present invention.

8 is a diagram illustrating an example of a system configuration of the control device illustrated in FIG. 7;

FIG. 9 is a diagram showing an example of an operation flow of the etching processing unit according to one embodiment of the present invention.

FIG. 10 is an explanatory diagram of a use mode of the vacuum processing apparatus of FIG. 1;

FIG. 11 shows another embodiment of the present invention, which is a vacuum processing chamber apparatus in which a turbo-separation vacuum pump is arranged below an etching chamber.

[Explanation of symbols]

3 ... sample, 10 ... cassette block, 12 ... cassette 1
2, 30: vacuum processing block, 34: load lock chamber,
35 ... Unload lock chamber, 36 ... Vacuum processing chamber, 37 ...
Vacuum transfer chamber

Claims (7)

[Claims] An apparatus has a loading / unloading chamber for loading / unloading a sample and a processing chamber for vacuum-treating the sample, wherein the processing chamber is a first processing chamber.
And a vacuum transfer means for transferring the sample between the processing chamber and the loading / unloading chamber via a vacuum transfer chamber. A vacuum processing apparatus, wherein the processing chamber and the loading / unloading chamber are arranged along the periphery of the vacuum transfer chamber, wherein a first processing chamber is provided at a position closer to the loading / unloading chamber than a second processing chamber. A vacuum processing apparatus. 2. A loading / unloading chamber for loading / unloading a sample, a processing chamber for vacuum-treating the sample, and a vacuum for transferring the sample between the processing chamber and the loading / unloading chamber via a vacuum transfer chamber. A vacuum processing apparatus comprising: a transfer unit, wherein the processing chamber and the loading / unloading chamber are arranged along the periphery of the vacuum transport chamber; wherein the plurality of processing chambers face the loading / unloading chamber with the vacuum transport chamber interposed therebetween. First and second etching chambers are disposed on the side of the first and second ashing chambers, and first and second ashing chambers are disposed between the first and second etching chambers and the loading / unloading chamber. A line connecting the centers of the etching chambers, a line connecting the centers of the first and second ashing chambers, and a line connecting the centers of the carry-in / out chambers are parallel to each other. 3. An air cassette section and a vacuum processing section, wherein the vacuum processing section includes a load-side load lock chamber and an unload-side load lock chamber for loading and unloading a sample. A processing chamber for vacuum processing the sample, and vacuum transfer means for transferring the sample between the processing chamber and the load lock chambers via a vacuum transfer chamber; In a vacuum processing apparatus in which a lock chamber is disposed along the periphery of the vacuum transfer chamber, the atmospheric cassette section includes a plurality of cassettes for storing a plurality of workpieces, and the vacuum processing section removes the workpieces from the cassettes and removes the vacuum from the cassette. The first transport mechanism for transporting to the processing unit, the planar shape is formed of a rectangular block, the two load lock chambers of the vacuum processing unit are disposed in close proximity and parallel, the plurality of processing chambers The vacuum transfer chamber is sandwiched between First and second etching chambers are arranged on the side opposite to the two load lock chambers, and first and second ashing chambers are provided between the first and second etching chambers and the two load lock chambers. A line connecting the centers of the first and second etching chambers, a line connecting the centers of the first and second ashing chambers, and a line connecting the centers of the two load lock chambers, A vacuum processing apparatus, wherein the two load-lock chambers extend in a direction perpendicular to the longitudinal direction of the atmospheric cassette portion, being parallel to each other along the longitudinal direction of the atmospheric cassette portion. 4. A vacuum processing apparatus according to claim 3, wherein said load lock chamber includes means for adjusting a phase of a notch or an orientation flat of said sample. 5. The vacuum processing apparatus according to claim 1, wherein an outer shape of the vacuum processing apparatus is radially formed around a vacuum transfer chamber. 6. A cassette block comprising a cassette block and a vacuum processing block. The cassette block is provided with a cassette table on which a plurality of cassettes each containing a sample are placed. A vacuum processing apparatus having a processing chamber for processing, a load lock chamber and an unload lock chamber, and a vacuum transfer chamber in which vacuum transfer means for transferring the sample between the processing chamber and the two load lock chambers is disposed. In the atmosphere block includes an orientation flat, a notch or a laser mark phase matching mechanism, the two load lock chambers are arranged in parallel in close proximity to each other, and around the vacuum transfer chamber, the processing chamber expansion connection A plurality of openings are formed, and as the plurality of processing chambers, on a side opposed to the load lock chambers with the vacuum transfer chamber interposed therebetween. First and second etching chambers are disposed, and first and second ashing chambers are disposed between the first and second etching chambers and the load lock chambers. The first and second etching chambers A vacuum processing apparatus, wherein a line connecting the centers of the chambers, a line connecting the centers of the first and second ashing chambers, and a line connecting the centers of the load lock chambers are parallel to each other. 7. The vacuum processing apparatus according to claim 1, further comprising: a main device for controlling the plurality of processing chambers; and a plurality of slave devices for assisting the operation of each of the processing chambers. A vacuum processing apparatus, wherein the master device and the slave device are connected by a common information transmitting means, and the master device includes a shared memory for writing control information of each slave device.