KR100342298B1 - Cluster tool for manufacturing a wafer - Google Patents

Abstract

The present invention relates to a cluster tool for transferring a wafer directly to a process module in a load lock chamber without going through a vacuum transfer module in order to proceed with a process during semiconductor manufacturing.

In the semiconductor manufacturing apparatus of the present invention, when a wafer transfer robot is installed in a load lock chamber to process a wafer, the wafer loaded in the load lock chamber is transferred directly to a process module using a vacuum transfer arm in the load lock chamber to perform a process. After the process is completed, the wafer is transferred back to the load lock chamber using a vacuum transfer arm in the load lock chamber.

Description

Cluster tool for wafer processing {CLUSTER TOOL FOR MANUFACTURING A WAFER}

TECHNICAL FIELD The present invention relates to a cluster tool in a semiconductor manufacturing apparatus, and more particularly, to a cluster tool for processing a wafer through a process during semiconductor manufacturing.

In general, in the process of manufacturing a semiconductor, a wafer, which is a semiconductor substrate, is subjected to various steps such as a deposition process of a material layer, an etching process of a deposited material layer, a cleaning process, and a drying process. In such a process, the wafer is placed under the most suitable conditions for carrying out the process. To do this, the wafer must be transferred into the process module that performs the process. The vacuum cluster tool is used here.

1 is a structural diagram of a cluster tool of a conventional semiconductor manufacturing apparatus.

The first and second load ports 10 and 12 for loading the wafers, and the wafers loaded in the first and second load ports 10 and 12 in a space not contaminated in the atmospheric state Front end system 20 having an ATM robot 22 for transfer and an ATM aligner 24 for aligning the position of the wafer transferred by the ATM robot 22. And a shelf located at the center of the system main frame, and the shelf until the ATM robot 22 transports all the wafers in the first and second load ports 10 and 12. The first and second node lock chambers 30 and 32 loaded in the wafer and the wafer are transferred to the process chamber, and the wafers on which the process is completed are transferred to the first and second node lock chambers 30 and 32. 32) a vacuum transfer module 40 having a vacuum robot 42 for transferring to the wafer, and a wafer In order to proceed with the process (PROCESS) is composed of first to second process modules (50, 52) divided into two by position.

When the ATM robot 22 transfers the wafer loaded in the first load port 10 or the second load port 12 and places it on the ATM aligner 24, the ATM aligner 24 removes the transferred wafer. Position them so that they lie exactly in the first to fourth process modules 52, 54. At this time, the ATM robot 22 transfers and loads wafers one by one into the shelf of the load lock chambers 30 and 32. When the wafers loaded in the first load port 10 or the second load port 12 are transferred to the first load lock chamber 30 or the second load lock chamber 32, the first and second load ports 10 and 12 are completed. The load lock chambers 30 and 32 close the door and extract the pressure so that impurities do not enter into the vacuum state. The vacuum robot 42 of the vacuum transfer module 40 then loads the wafers loaded on the shelves of the first load lock chamber 30 or the second load lock chambers 30 and 32 from the first to second processor modules 50. , 52) to proceed with the process. When the process progress of the wafer is completed in this way, the wafer whose process progress is completed is transferred to the shelf of the first load lock chamber 30 or the second load lock chamber 32 by the vacuum robot 42 again. When the first load lock chamber 30 or the second load lock chamber 32 is conveyed to the shelf, the first load lock chamber 30 or the second load lock chamber 32 is vented to normal pressure.

After this, the first and second load lock chambers 30 and 32 are prepared to transfer the wafer to the first load port 10 or the second load port 12, thereby providing a first and second load lock chamber ( Open the doors of 30 and 32). Then, the ATM robot 22 transfers the wafer loaded on the shelf of the first load lock chamber 30 or the second load lock chamber 32 to the first load port 10 or the second load port 12. This operation is repeated to process multiple wafers.

However, such a conventional cluster tool has a problem in that the wafer loaded in the load lock chamber is transferred to the process module by the vacuum robot of the vacuum transfer module, which results in complicated structure, high footprint, and high manufacturing cost. .

Accordingly, an object of the present invention is to reduce the manufacturing cost and footprint (footprint) by transferring the wafer from the load lock chamber to the process module for processing, or directly transfer the wafer from the process module to the load lock chamber. To provide a cluster tool to make.

It is another object of the present invention to provide a cluster tool that installs a vacuum transfer arm in a load lock chamber to transfer wafers directly from the load lock chamber to a process module, thereby simplifying the structure of the system.

1 is a structural diagram of a cluster tool in a conventional semiconductor manufacturing apparatus

2 is a schematic structural diagram of a cluster tool in a semiconductor manufacturing apparatus according to an embodiment of the present invention;

3 is a detailed structural diagram of a cluster tool in a semiconductor manufacturing apparatus according to an embodiment of the present invention.

4A is a plan view illustrating an extended state of the left arm of the vacuum transfer arm mounted in FIG. 3 according to one embodiment of the present invention;

4B is a plan view of the vacuum transfer arm mounted in FIG. 3 according to an embodiment of the present invention, in which a wafer is loaded into a load lock chamber.

4C is a front view of the vacuum transfer arm mounted in FIG. 3 according to an embodiment of the present invention, in which a wafer is loaded into a load lock chamber.

5 is a perspective view of the vacuum transfer arm mounted in FIG. 3 according to an embodiment of the present invention;

6 is a structural diagram of a cluster tool having a load lock chamber having one vacuum transfer arm according to another embodiment of the present invention.

Explanation of symbols on the main parts of the drawings

100, 102: first and second load port 200: front end system

202: ATM robot 204: ATM aligner

300, 302: first and second load lock chambers

400, 402: first and second slot valves

500, 502: first to second process modules

In the cluster tool of the semiconductor manufacturing apparatus of the present invention for achieving the above object, the first and second load ports carrying the wafer, and the first and second load ports in the space that is not contaminated in the air state A front end system having an ATM robot for transporting the loaded wafers, an ATM aligner for aligning the positions of the wafers carried by the ATM robot, and a central end of the main frame, which is transported by the ATM robot. First and second vacuum transfer arms for loading wafers into the first and second end effects and transferring the loaded wafers for processing, and transferring the finished wafers to the first and second end effects. First and second load lock chambers respectively provided, and a first for separating the first and second load lock chambers from the first and second process modules, respectively. First to second process modules including a second slot valve and first and second process chambers divided into two positions for each process to process wafers transferred from the first and second load lock chambers. It is characterized by the configuration.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the following description of the present invention, if it is determined that a detailed description of a related known function or configuration may unnecessarily obscure the subject matter of the present invention, the detailed description thereof will be omitted.

2 is a structural diagram of a cluster tool in a semiconductor manufacturing apparatus according to an embodiment of the present invention.

The first and second load ports 100 and 102 for loading the wafers, and the wafers loaded in the first and second load ports 100 and 102 in a space which is not contaminated in the atmospheric state FRONT END SYSTEM 200 having an ATM robot 202 for transferring and an ATM aligner 204 for aligning the position of the wafer transferred by the ATM robot 202. And a wafer which is installed at the center of the main frame and which is transported by the ATM robot in the first and second end effects 311 and 312, respectively, and alternately loads the loaded wafer. The wafers are transferred to the second process chambers 504 and 506, and the wafers having the process progressed from the first and second process chambers 504 and 506 are mounted on the first and second end effects 311 and 312 and transferred. First and second load locks having first and second vacuum transfer arms 304 and 306, respectively LOAD LOCK CMAMBER (300, 302), and first and second slots for separating the first and second load lock chamber (300, 302) and the first and second process modules (500, 502) The valves 400 and 402 and the wafers transferred from the first and second load lock chambers 300 and 302 are divided into two positions by the first and second process chambers in order to proceed with the process. It consists of the 1st-2nd process modules 500 and 502 provided with the 504 and 506. As shown in FIG. The first and second vacuum transfer arms 304 and 306 each consist of two arms for transferring two wafers.

3 is a detailed structural diagram of a cluster tool in a semiconductor manufacturing apparatus according to an embodiment of the present invention.

The vacuum transfer arm 304 of the first load lock chamber 300 extends the arm on the left side of the two arms to transfer the wafer to the first process module 500 or indicates a state for transferring the wafer on which the process is completed. have. The vacuum transfer arm 304 of the second load lock chamber 302 extends the arm on the right side of the two arms to transfer the wafer to the second process module 502 or to transfer the wafer on which the process is completed. It is shown.

4A is a plan view illustrating an extended state of the left arm of the vacuum transfer arm mounted in FIG. 3 according to one embodiment of the present invention;

4B is a plan view of the vacuum transfer arm mounted in FIG. 3 according to an embodiment of the present invention, in which a wafer is loaded into a load lock chamber;

4C is a front view of the vacuum transfer arm mounted in FIG. 3 according to an embodiment of the present invention, in which a wafer is loaded into a load lock chamber.

Two arms are installed at the left and right sides, and the left arm has a first linkage 313 installed at the first rotation shaft 322, and a first connection rod 319 at the end of the first linkage 313. The second link 314 is installed, the end effect 311 is installed in the vertical direction by the second connecting rod 318 at the end of the second link 314. The right arm has a third linkage 315 installed on the second rotation shaft 323, and a fourth linkage 316 installed on the end of the third linkage 315 by the third connection rod 320. In addition, an end effect 311 is installed in the vertical direction by a fourth connecting rod 321 at the end of the fourth link 316.

5 is a perspective view of a vacuum transfer arm mounted in FIG. 3 according to an embodiment of the present invention, in which a wafer is not loaded into a load lock chamber.

2 to 5, the operation of the preferred embodiment of the present invention will be described in detail.

When the ATM robot 202 transfers the wafer loaded in the first load port 100 or the second load port 102 and places it on the ATM aligner 204, the ATM aligner 204 removes the transferred wafer. Align the positions so that they lie exactly in the first to second process modules 500, 502. At this time, the ATM robot 202 transfers the aligned wafer to the first end effect 311 of the first vacuum transfer arm 304 installed in the first load lock chamber 300. When the transfer of the wafer to the first end effect 311 is completed, the ATM robot 202 places the wafer loaded on the first load port 100 or the second load port 102 on the ATM aligner 204. When placed, the ATM aligner 204 aligns the positions so that the transferred wafers are accurately placed in the first to second process modules 500, 502. The ATM robot 202 then transfers the aligned wafer to the second end effect 312 of the first vacuum transfer arm 304 installed in the first load lock chamber 300. When the wafers are transferred to the first and second ends of the first load lock chamber 300 to the facts 311 and 312, the door of the first load lock chamber 300 is closed and the pressure is extracted to prevent impurities from entering. Make a vacuum. Thereafter, the first vacuum transfer arm 304 transfers the wafer 310 mounted on the first end effect 311 to the first process module 500 by operating the left arm as shown in FIG. 3. The first vacuum transfer arm 304 waits until the first end effect 311 returns to the first load lock chamber 300 as shown in FIG. 5 to complete the wafer processing process in the first process module 500. do. When the wafer processing process is completed in the first process module 500, the door of the first process module 500 is opened. At this time, the first vacuum transfer arm 304 receives the wafer from which the process is completed from the first process module 500. The end is transferred to the first load lock chamber 300 in a state where it is put on the fact (311). Thereafter, the first vacuum transfer arm 304 operates the right arm to transfer the wafer mounted on the second end effect 312 to the first process module 500 so that the wafer processing process can be performed. In the first vacuum transfer arm 304, the second end effect 312 is returned into the first load lock chamber 300 as shown in FIG. 5.

Then the first load lock chamber 300 is vented to atmospheric pressure to open the door. Then, the ATM robot 202 transfers the wafer on which the process placed on the first end effect 311 of the first load lock chamber 300 is completed to the first load port 100 or the second load port 102. The ATM robot 202 then transfers the unprocessed wafers in the first load port 100 or the second load port 102 to the ATM aligner 204 to align them, and then loads the aligned wafers in the first load. The first end effect 311 of the lock chamber 300 is transferred. Then, the first load lock chamber 300 closes the door and extracts the pressure so that impurities do not enter into the vacuum state and waits. Then, when the process of the wafer supplied to the first process module 500 is completed, the first slot valve 400 is opened, and the right arm of the first vacuum transfer arm 304 operates to operate the second end effect as shown in FIG. 5. The wafer on which the process placed on 312 is completed is transferred into the first load lock chamber 300. Then, the first load lock chamber 300 is vented to atmospheric pressure and the door is opened. The ATM robot 202 transfers the wafer on which the process placed on the second end effect 312 of the first load lock chamber 300 is completed to the first load port 100 or the second load port 102. This operation is repeated to process multiple wafers.

In addition, the second load lock chamber 302 and the second process module 502, which are not described, allow the wafer to be processed in the same manner as the operations of the first load lock chamber 300 and the first process module 502.

6 is a structural diagram of a cluster tool having a load lock chamber having one vacuum transfer arm according to another embodiment of the present invention.

ATM for transporting the wafers loaded on the first and second load ports 400 and 402 in the wafer and the first and second load ports 400 and 402 in a space not contaminated in the atmospheric state. FRONT END SYSTEM 404 having a robot 408, an ATM aligner ALI for aligning the position of the wafer conveyed by the ATM robot 408, and a wafer. The first and second metal shelves 418 and 420 for loading and the first and second cooling devices 422 and 424 for cooling the wafers loaded on the first and second metal shelves 418 and 420 are provided. It is loaded on the first and second metal shelves (418, 420) until the ATM robot 408 transports all the wafers in the first and second load ports (400, 402). First and second cooling the wafers on which the process is completed are loaded on the first and second metal shelves 418 and 420 and then performing cooling. Cooling apparatuses 422 and 424 and wafers are transferred to the first and second process modules 430 and 432 and wafers having the process progressed are transferred to the first and second metal shelves 418 and 420. The first and second load lock chambers 410 and 412 on which the first and second vacuum transfer arms 414 and 416 are installed, and are divided into two for each position to proceed the corresponding process for the transferred wafers. First to second process modules 430 and 432. The first and second vacuum transfer arms 414 and 416 each have one arm.

Referring to FIG. 6 described above, the operation of transferring the wafer of the embodiment of the present invention directly from the load lock chamber to the process module to cool the hot wafer in the load lock chamber upon completion of the process will be described.

When the ATM robot 408 transfers the wafer loaded in the first load port 400 or the second load port 402 and places the wafer on the ATM aligner 406, the ATM aligner 406 removes the transferred wafer. Align the positions so that they lie exactly in the first to second process modules 430, 432. At this time, the ATM robot 408 transfers the aligned wafers to the first and second metal shelves 418 and 420 installed in the first and second load lock chambers 410 and 412. Thus, for example, two or three wafers loaded in the first load port 400 or the second load port 402 are transferred to the first load lock chamber 410 or the second load lock chamber 412. When this is completed, the first and second load lock chambers 400 and 402 close the doors and extract the pressure to prevent impurities from being introduced into a vacuum state. Thereafter, the first and second vacuum transfer arms 414 and 416 supply wafers loaded on the first and second metal shelves 418 and 420 to the first to second processor modules 430 and 432 to process the corresponding wafers. Proceed. When the process of the wafer is completed, the temperature of the wafer is 550 ° to 780 °, and the wafer is processed again by the first and second vacuum transfer arms 410 and 412. 418, 420. Thereafter, the first and second vacuum transfer arms 410 and 412 supply wafers loaded on the first and second metal shelves 418 and 420 to the first and second process modules 430 and 432 to process the process. Proceed. When the process of the wafer is completed from the first and second process modules 430 and 432, the wafer having completed the process is first and second metal shelves by the first and second vacuum transfer arms 410 and 412. 418, 420. For example, if two or three wafers are transferred to the first and second metal shelves 418 and 420, the first load lock chamber 410 or the second load lock chamber 412 may be repeatedly performed. For example, two or three wafers mounted on the first and second metal shelves 418 and 420 are cooled by the first and second cooling devices 420 and 422. At this time, the gas is supplied to the first load lock chamber 410 or the second load lock chamber 412 so that the first load lock chamber 410 or the second load lock chamber 412 is at atmospheric pressure.

Thereafter, the wafer is prepared to be transferred to the first load port 400 or the second load port 402 to open the doors of the first and second load lock chambers 410 and 412. The ATM robot 408 may then load the wafers loaded on the first and second metal shelves 418 and 420 of the first load lock chamber 410 or the second load lock chamber 412. Transfer to the second load port 402. In this way, for example, two or three wafers are transferred to both the first load port 400 and the second load port 402.

As described above, in the semiconductor manufacturing apparatus, when a wafer transfer robot is installed in a load lock chamber in a semiconductor manufacturing apparatus, the wafer loaded in the load lock chamber is transferred directly to a process module using a vacuum transfer arm in the load lock chamber. As the process progresses, the processed wafer is transferred back to the load lock chamber using the vacuum transfer arm in the load lock chamber, thereby reducing the manufacturing cost of the cluster tool and reducing the footprint (FOOTPRINT). Since there is no separate transport vacuum module installed, there is an advantage that the cluster tool can be simplified.

Claims (5)

In the cluster tool of the semiconductor manufacturing apparatus, First and second load ports carrying wafers, A front end having an ATM robot for transporting wafers loaded in the first and second load ports in an uncontaminated space in an atmospheric state, and an ATM aligner for aligning positions of wafers transported by the ATM robot. System, The wafer is installed in the center of the main frame and the wafer transferred by the ATM robot is loaded on the first and second end facts and transferred for processing the loaded wafer, and the wafers on which the process is completed are transferred to the first and second. First and second load lock chambers each having a first and a second vacuum transfer arm for transferring to an end effect; First and second slot valves for separating the first and second load lock chambers and the first and second process modules; Characterized in that the wafers transferred from the first and second load lock chambers are composed of first to second process modules having first and second process chambers divided into two positions for each process to process the wafer. Cluster tool for wafer processing. The method of claim 1, And the first and second vacuum transfer arms have two arms to alternately transfer wafers for process progress to the first and second process chambers. The method of claim 2, wherein the first and second bent transport arm, Arms are provided at left and right sides, respectively, and the left arm has a first linkage 313 installed at a first rotation shaft 322, and a first connection rod 319 at an end of the first link 313. The second link 314 is installed, the end effect 311 is installed in the vertical direction by the second connecting rod 318 at the end of the second link 314, the right arm is The third link 315 is installed on the second rotating shaft 323, the fourth link 316 is installed by the third connecting rod 320 at the end of the third link 315, the fourth link Clustering tool for wafer processing characterized in that the end effect (311) is installed in the vertical direction by the fourth connecting rod (321) at the end of the (316). First and second load ports carrying wafers, A front end having an ATM robot for transporting wafers loaded in the first and second load ports in an uncontaminated space in an atmospheric state, and an ATM aligner for aligning positions of wafers transported by the ATM robot. System, First and second metal shelves for loading wafers, and first and second cooling devices for cooling wafers loaded on the first and second metal shelves, wherein the ATM robot includes the first and second metal shelves. The first and second metal shelves are loaded into the first and second metal shelves until all of the wafers in the second load port are transferred, and the first and second wafers are cooled after loading the wafers on which the process is completed. First and second vacuum transfer arms provided with a second cooling device and a wafer to transfer the wafers to the first and second process modules, and to transfer the completed wafers to the first and second metal shelves; The second load lock chamber, First and second slot valves for separating the first and second load lock chambers and the first and second process modules; Clustering tool for wafer processing, characterized in that consisting of the first to second process modules divided into two for each position in order to proceed with the process for the transferred wafer. The method of claim 4, wherein And the first and second vacuum transfer arms each comprise one arm.