CN100350568C - Cluster type asher equipment used for manufacture of semiconductor device - Google Patents

Cluster type asher equipment used for manufacture of semiconductor device Download PDF

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Publication number
CN100350568C
CN100350568C CNB038186101A CN03818610A CN100350568C CN 100350568 C CN100350568 C CN 100350568C CN B038186101 A CNB038186101 A CN B038186101A CN 03818610 A CN03818610 A CN 03818610A CN 100350568 C CN100350568 C CN 100350568C
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CN
China
Prior art keywords
wafer
process chamber
buffer table
cluster type
equipment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB038186101A
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Chinese (zh)
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CN1675748A (en
Inventor
朴炅洙
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PSK Inc
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PSK Inc
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Publication of CN1675748A publication Critical patent/CN1675748A/en
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Publication of CN100350568C publication Critical patent/CN100350568C/en
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Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G03F7/427—Stripping or agents therefor using plasma means only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67167—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers surrounding a central transfer chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67294—Apparatus for monitoring, sorting or marking using identification means, e.g. labels on substrates or labels on containers

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Plasma & Fusion (AREA)
  • Drying Of Semiconductors (AREA)

Abstract

Disclosed is asher equipment used for manufacture of a semiconductor device, including a transfer module which is provided with a substrate transfer robot capable of simultaneously transferring at least two substrates and being defined with process chambers. A buffer stage is arranged in a manner such that, before introduction of the wafers into the respective process chambers, alignment and OCR processes can be implemented in a standby state of the wafers which is to be transferred to be introduced into the respective process chambers by the substrate transfer robot.

Description

The cluster type asher equipment that is used for producing the semiconductor devices
Technical field
The present invention relates to make the cluster type asher equipment (cluster type asher equipment) of semiconductor device.
Especially, the cluster type asher equipment that the present invention relates to be used for producing the semiconductor devices, wherein be used for implementing to aim at and OCR (optical character recognition, optical character identification) unit of function is arranged in the buffer table (buffer stage), thereby can aim at OCR technology when wafer is arranged in buffer table.
In addition, the cluster type asher equipment that the present invention relates to be used for producing the semiconductor devices, a plurality of transport modules (transfer module) wherein are provided, each transport module is used for transmitting a wafer to a process chamber, thereby semiconductor fabrication process can carry out a plurality of wafers, and these a plurality of wafers are introduced the process chamber from stand-by state simultaneously; And wherein in buffer table, arranged to implement the unit of aligning and OCR function, thereby when being arranged in buffer table, can aim at wafer with OCR technology.
In addition, the cluster type asher equipment that the present invention relates to be used for producing the semiconductor devices, a plurality of transport modules wherein are provided, each transport module is used for transmitting a wafer to process chamber, thereby semiconductor fabrication process can carry out a plurality of wafers, and these a plurality of wafers are introduced the process chamber from stand-by state simultaneously.
Background technology
The cluster type equipment that is generally used for making semiconductor device is as multiple reactor type composite semiconductor manufacturing equipment, cluster platform, a plurality of processing modules that are positioned at each side of cluster platform and the add-on module (for example sheet cartridge module) etc. that comprise the single common transport module with substrate transport robot, be made up of a plurality of isolating valves and attached vacuum unit.
Fig. 1 illustrative the structure of the conventional cluster type equipment 100 that is used for producing the semiconductor devices.With reference to Fig. 1, be positioned in the substrate transport module 132 that can transmit substrate 140 automatically under the state of core of polygon transport module 130, polygon transport module 130 is used as basic platform.Process chamber 110a, 110b and 110c and first and second vacuum are advanced each side that sheet chamber (loadlock chamber) 120a and 120b are each defined in polygon transport module 130.Substrate is loaded into first and second vacuum respectively and advances sheet chamber 120a and 120b or advance sheet chamber 120a and 120b unloading from first and second vacuum.
The operation of the conventional cluster type equipment 100 of structure as described above will be described below.
At first, the film magazine (not shown) that is inserted with substrate is loaded onto first vacuum and advances among the 120a of sheet chamber.Then, the air pressure that first vacuum is advanced among the 120a of sheet chamber by vacuum pump is reduced to predeterminated level.If the air pressure that first vacuum is advanced among the 120a of sheet chamber has been reduced to predeterminated level, substrate transport robot 132 takes out substrate and substrate is placed on the aligner (aligner) 122 to aim at the flat region of substrate from film magazine so.Thereby the substrate of Dui Zhuning is introduced experience special process among the first process chamber 110a by the substrate transport robot 132 of transport module 130 like this.In specific technology is under the situation that the substrate to heating carries out, after special process was finished, substrate was taken out from the first process chamber 110a and is placed on by substrate transport robot 132 on the coldplate 124 that is called intercooler (InCooler) to cool off substrate to ambient temperature.Each substrate is carried out operation above all: in being loaded in the film magazine of vacuum advance the sheet chamber, take out substrate, substrate is introduced in the process chamber, carry out special process, and the substrate of special process has been experienced in cooling on coldplate.
Yet conventional cluster type equipment has such shortcoming: owing to be used to implement to aim at a side that places film magazine or substrate transport robot with the unit of OCR function, the size of cluster type equipment has to increase.In addition, because aligning and OCR technology were carried out separately, therefore finish time cycle and thereby reduction productivity ratio that whole arts demand prolongs before substrate (being wafer) is introduced in the process chamber.
In addition, in traditional cluster type equipment, when using vacuum to enter the sheet chamber wafer is carried out semiconductor fabrication process, because wafer is to be transmitted singly and to introduce in the process chamber, so the transmission time vacuum condition under is than length under stand-by state and thereby reduction productivity ratio.
In addition, in traditional cluster type equipment, because wafer is to be transferred to singly in each process chamber through entering the sheet chamber as the vacuum of vacuum transfer chamber, enter the sheet chamber and prepare the vacuumizing robot so must limit vacuum separately, thus manufacturing equipment need the cost increase of having to.Therefore, when in the light etching system (Lite Etch system) at asher that does not need the vacuum transfer chamber or main etcher during implementing process, be not suitable for using expensive conventional cluster type equipment, for example be used to promote the both arms transferring robot of the throughput of buffered station, it comprises can not need must keep vacuum condition and the OCR part of managing each wafer before introducing wafer in the process chamber, and the alignment portion that can increase craft precision.
Summary of the invention
Therefore, draw the present invention in order to overcome the obstacle that occurs in the prior art, and the purpose of this invention is to provide the cluster type asher equipment that is used for producing the semiconductor devices, the unit that wherein is used to implement to aim at the OCR function is arranged in the buffer table, thereby when being in the buffer table, wafer can carry out OCR technology, allow not to be based in batches and be based on the expensive wafer (for example wafer of 300mm) of individual management thus increasing output, thereby and the Alignment Process that allows to add guarantee accurate wafer aligned and improve craft precision.
Another object of the present invention provides the cluster type asher equipment that is used for producing the semiconductor devices, a plurality of transport modules wherein are provided, each transport module is used for wafer transmission making a plurality of wafers to be introduced at the same time in the process chamber to process chamber, thereby improves the throughput of equipment.
To achieve these goals, according to an aspect of the present invention, a kind of incineration equipment that is used for producing the semiconductor devices is provided, comprise a transport module, this transport module has been equipped the substrate transport robot that can transmit at least two substrates simultaneously and be limited by process chamber, wherein arrange buffer table to make before wafer is introduced each process chamber to aim at and OCR technology can be carried out at the stand-by state of wafer, introduce each process chamber thereby these wafers will be transmitted by the substrate transport robot.
According to another aspect of the present invention, incineration equipment comprises that also being connected being used in the substrate transport robot will experience at buffer table and aim at and a plurality of wafers of OCR technology are incorporated into a plurality of transport modules in each process chamber.
According to another aspect of the present invention, buffer table comprises an aligner; And when wafer is positioned on the aligner, thereby aligner holds wafer, rotation wafer, and the notch part alignment wafer of identification wafer by vacuum.
Description of drawings
By the detailed description below in conjunction with accompanying drawing, above-mentioned purpose of the present invention and other feature and advantage will better be understood, wherein:
Fig. 1 is the schematic diagram of the conventional cluster type equipment that is used for producing the semiconductor devices;
Fig. 2 is the structure chart that is used to illustrate the cluster type asher equipment that is used for producing the semiconductor devices according to a preferred embodiment of the invention;
Fig. 3 is used for describing in detail that the incineration equipment shown in Fig. 2 adopts and comprises the perspective view of the buffer table of alignment modules and OCR technical module;
Fig. 4 is the perspective view that is used to illustrate according to the transport module of one embodiment of the invention;
Fig. 5 is a perspective view, is used to illustrate the state of wafer being introduced process chamber by transport module according to an embodiment of the invention.
Embodiment
To be more detailed now, its example be described in the accompanying drawings with reference to the preferred embodiments of the present invention.As possible, in drawing and description, use identical Reference numeral to represent same or analogous part all the time.
As shown in Figures 2 and 3, in cluster type asher equipment 200 according to an embodiment of the invention, the aligner 218 that can carry out Alignment Process is arranged in the buffer table 210 under the cooling bench 216.In addition, OCR module 220 is arranged in the buffer table 210 in the upper end side of aligner 218 and in the lower end side of cooling bench 216.
Therefore, when carrying out specific semiconductor fabrication process, each wafer is placed on the transport module 212 in buffer table 210, thereby is transmitted singly by substrate transport robot 214 and introduce in the process chamber 222.Be arranged in 220 pairs of the aligner 218 of buffer table 210 and OCR modules and carry out its aligning and OCR technology separately at the wafer that buffer table 210 remains in stand-by state.
In addition, in the time of on the aligner 218 in wafer is held in place buffer table 210, thereby aligner 218 holds wafer, rotation wafer, and the notch part alignment wafer of identification wafer by vacuum.
In the present invention, two transport module 212a and 212b form in the mode that is connected on the substrate transport module 214, thereby can transmit two wafers at every turn.Therefore, the two plates that has experienced aligning and OCR technology when keeping stand-by state in buffer table 210 is incorporated in the process chamber 222 by substrate transport robot 214, thereby carries out next semiconductor fabrication process.
Apparent from top description, the cluster type asher equipment that is used for producing the semiconductor devices according to the present invention provides such advantage: because the unit that is used for implementing to aim at the OCR function is arranged at buffer table, thereby allow when wafer is placed in the buffer table, to aim at technology with OCR, so got rid of aiming at the needs with independent time cycle of OCR technology, improved productivity ratio thus.
In addition, in the present invention, because a plurality of transport modules are provided, wherein each transport module is used for wafer transmission to process chamber, thereby can carry out semiconductor fabrication process, so can improve the throughput of equipment and can increase productivity ratio a plurality of wafers of introducing simultaneously in the process chamber.
In addition, in the present invention, can promote the throughput of buffered station, this buffered station comprises that needn't keep vacuum condition before introducing wafer in the process chamber can manage the OCR part of each wafer and the alignment portion that can improve craft precision.
Typical preferred embodiment of the present invention is disclosed in drawing and description, although and used specific term, but just use they rather than the purpose in order to limit on general and the meaning described, scope of the present invention proposes in the claims.

Claims (3)

1. incineration equipment that is used for producing the semiconductor devices, it comprises transport module and process chamber, this transport module is equipped with the substrate transport robot that can transmit at least two substrates simultaneously, wherein arrange buffer table according to a kind of mode, made before wafer is introduced into each process chamber, aim at and OCR technology can be carried out under the stand-by state of wafer, thereby described wafer will be transmitted by described substrate transport robot and be introduced in each process chamber.
2. incineration equipment as claimed in claim 1, also comprise be connected with described substrate transport robot be used for being incorporated into a plurality of described transport module in each process chamber at a plurality of wafers that this buffer table has experienced described aligning and described OCR technology.
3. incineration equipment as claimed in claim 1, wherein said buffer table comprises aligner; And when wafer is positioned on this aligner, thereby this aligner holds the notch part alignment wafer of wafer, rotation wafer and identification wafer by vacuum.
CNB038186101A 2002-12-12 2003-02-10 Cluster type asher equipment used for manufacture of semiconductor device Expired - Fee Related CN100350568C (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020020078996 2002-12-12
KR1020020078996A KR100382245B1 (en) 2002-12-12 2002-12-12 Asher equipment for semiconductor device manufacturing including cluster method

Publications (2)

Publication Number Publication Date
CN1675748A CN1675748A (en) 2005-09-28
CN100350568C true CN100350568C (en) 2007-11-21

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JP (1) JP2006502591A (en)
KR (1) KR100382245B1 (en)
CN (1) CN100350568C (en)
AU (1) AU2003206246A1 (en)
SG (1) SG127690A1 (en)
TW (1) TWI240349B (en)
WO (1) WO2004053969A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004036803A1 (en) 2004-07-29 2006-03-23 Robert Bosch Gmbh Method for etching a layer on a substrate
KR100896472B1 (en) * 2007-02-28 2009-05-14 세메스 주식회사 Multi-chamber system for manufacturing semiconductor device and method for treating substrate
KR101330225B1 (en) * 2012-05-25 2013-11-18 피에스케이 주식회사 Method for bonding of substrate and substrate reflow treatment apparatus
CN113097047B (en) * 2021-03-10 2022-04-22 长江存储科技有限责任公司 Ashing apparatus and ashing method

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5286296A (en) * 1991-01-10 1994-02-15 Sony Corporation Multi-chamber wafer process equipment having plural, physically communicating transfer means
JPH1092900A (en) * 1996-09-13 1998-04-10 Hitachi Ltd Vacuum processing apparatus

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3136615B2 (en) * 1991-01-10 2001-02-19 ソニー株式会社 Multi-chamber process apparatus and semiconductor device manufacturing method
US6481956B1 (en) * 1995-10-27 2002-11-19 Brooks Automation Inc. Method of transferring substrates with two different substrate holding end effectors
US6478532B1 (en) * 1999-11-30 2002-11-12 Asyst Technologies, Inc. Wafer orienting and reading mechanism
US6852194B2 (en) * 2001-05-21 2005-02-08 Tokyo Electron Limited Processing apparatus, transferring apparatus and transferring method

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5286296A (en) * 1991-01-10 1994-02-15 Sony Corporation Multi-chamber wafer process equipment having plural, physically communicating transfer means
JPH1092900A (en) * 1996-09-13 1998-04-10 Hitachi Ltd Vacuum processing apparatus

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Publication number Publication date
AU2003206246A1 (en) 2004-06-30
TWI240349B (en) 2005-09-21
JP2006502591A (en) 2006-01-19
CN1675748A (en) 2005-09-28
KR100382245B1 (en) 2003-05-01
WO2004053969A1 (en) 2004-06-24
TW200410354A (en) 2004-06-16
SG127690A1 (en) 2006-12-29

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