KR20090015656A - Apparatus for treating substrate - Google Patents

Abstract

An apparatus for treating substrate is provided to improve the efficiency of processing a substrate per hour by processing a substrate with five chambers at the same time. In an apparatus for treating substrate, a substrate processing apparatus includes a buffer module(100), a first and second transport modules(110,120), and first or fifth process module(131-135). A cassette(160) in which the substrate to be processed or the finished substrate is mounted is placed on the front of a buffer module. The loading and the unloading system(150) for substrate are arranged between the buffer module and the cassette. The buffer module is between a first and the second transport module which are assembled. A robot arm(112,122) or a handler for loading or unloading is arranged inside the first and the second transport module.

Description

Substrate Processing Equipment {APPARATUS FOR TREATING SUBSTRATE}

The present invention relates to a substrate processing apparatus, and more particularly, to a substrate processing apparatus capable of improving processing efficiency and yield of a substrate.

In general, to manufacture a display device or a semiconductor device, a thin film deposition process for depositing a thin film of a specific material on a substrate, a photolithography process for exposing or hiding selected areas of the thin films using a photosensitive material, and removing the thin film of the selected area Patterning as desired and the like (etching) process, etc., each of these processes is carried out in a chamber designed for the optimal environment for the process.

In particular, in recent years, a process chamber in which a process for a substrate is processed to process a large amount of substrates in a short time, a load lock chamber (or sometimes referred to as a buffer chamber) that is a buffer region for entering and exiting a substrate, a load lock chamber and a process Background Art A cluster type substrate processing apparatus in which a transfer chamber for transferring a substrate between chambers and the like is integrally connected is widely used.

On the other hand, the number of process chambers in the cluster type substrate processing apparatus greatly affects the substrate processing capability. That is, since the number of substrates that can be processed at the same time may increase as the number of process chambers increases, as many process chambers as possible may be provided to improve substrate processing capability.

However, the conventional substrate processing apparatus has a structural problem in which it is difficult to increase the number of process chambers by a certain amount or more, and thus there is a problem in that the substrate processing capability is limited.

That is, in the conventional substrate processing apparatus, as the number of process chambers increases, the size of the transfer chamber must also increase. Since the inside of the transfer chamber must be maintained in a vacuum state, the transfer chamber must have a certain limit in increasing size and volume. There is a problem in that the number of process chambers installed around the chamber is limited to limit the substrate processing ability.

Accordingly, in recent years, some countermeasures have been proposed to further improve the substrate processing capability of the substrate processing apparatus, but the development thereof is urgently required.

Accordingly, the present invention has been made to solve the above problems, and provides a substrate processing apparatus capable of improving the processing efficiency and production of the substrate.

In particular, the present invention provides a substrate processing apparatus capable of improving a substrate processing capacity per hour by allowing a plurality of substrates to be processed simultaneously through five process modules.

According to a preferred embodiment of the present invention for achieving the above object of the present invention, the substrate processing apparatus is provided with a buffer module is formed in the entrance and exit through which the substrate is entered, the first and which are provided for transporting the substrate and connected to both sides of the buffer module; The second transfer module, the first and second process modules connected to the circumference of the first transfer module to process the substrate, and the third to fifth process modules connected to the circumference of the second transfer module to process the substrate.

The structure and shape of the first and second transfer modules may be variously changed according to the required conditions. For example, the first and the second transfer module may be formed in a polygonal shape of five or more. Therefore, some of the five process modules may be connected to the side of the first transfer module, and the rest of the five process modules may be connected to the side of the second transfer module. In some cases, the first and second transfer modules may be formed in a hexagonal shape or a polygonal shape of eight or more, or alternatively, the first and second transfer modules may be formed in a circular shape.

Here, each process module has a substantially very long length so that it can be arranged without interference with each other. To this end, the first process module is connected to the left side of the first transfer module and is connected to the rear of the first transfer module so that the second process module is disposed within 90 ° with respect to the first process module. In addition, the third process module is connected to the right side of the second transfer module, the fifth process module is connected to the rear of the second transfer module to be disposed within 160 degrees with respect to the third process module, the fourth process module is connected to the third It is connected to the rear of the second transfer module to be disposed between the process module and the process module.

In addition, an alignment module for at least one side of the first and second transfer modules may be provided adjacent to an alignment module for adjusting a flat zone or notch of the substrate in a predetermined direction. It can be arranged in a space independent of the first and second transfer module. In addition, since the alignment module has a substantially short length, the alignment module may be disposed in front of the first and second transfer modules.

Alternatively, two alignment modules may be provided to correspond to the first and second transfer modules, and the first and second alignment modules may be integrally connected to have the same vacuum space as the respective transfer modules. That is, the first alignment module may be integrally connected to the first transfer module, and the second alignment module may be integrally connected to the second transfer module, but the first alignment module may have the same vacuum space as the first transfer module. The second align module may be provided to have the same vacuum space as the second transfer module.

Alternatively, the alignment module may be integrally connected to one side of the buffer module, and the alignment module connected to the buffer module may have the same vacuum space as that of the buffer module.

The substrate treating apparatus according to the present invention has the effect of improving the processing efficiency and the yield of the substrate.

In particular, according to the present invention, by allowing a plurality of substrates to be processed at the same time through five process chambers, there is an effect that can improve the substrate processing capacity per hour.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings, but the present invention is not limited or limited by the embodiments. For reference, in the present description, the same numbers refer to substantially the same elements, and may be described by quoting the contents described in other drawings under the above rules, and the contents repeated or deemed apparent to those skilled in the art may be omitted.

1 is a block diagram showing the structure of a substrate processing apparatus according to the present invention.

As shown in FIG. 1, the substrate processing apparatus according to the present invention includes a buffer module 100, first and second transfer modules 110 and 120, and first to fifth process modules 131 to 135.

The buffer module 100 is provided to form a buffer area for entering and leaving the substrate. To this end, a space is selectively formed inside the buffer module 100 to block the outside air, and an entrance for opening and closing the substrate supplied from the outside is formed at the front side, and the entrance is opened and closed by a general opening and closing device. Can be.

The buffer module 100 may be formed in various shapes and structures according to required conditions and design specifications. Hereinafter, the buffer module 100 is formed in an approximately trapezoidal shape, and an example in which an entrance is formed at the front side corresponding to the bottom will be described.

In front of the buffer module 100, a cassette 160 on which a substrate for processing (or a processed substrate) is mounted is disposed, and a cassette 160 is disposed between the buffer module 100 and the cassette 160. There is a loading device 150 for loading and unloading a substrate. As the loading device 150, a conventional robot arm or a handler capable of linear movement or rotational movement may be used, and the present invention is not limited or limited by the manner and structure of the loading device 150.

The first and second transfer modules 110 and 120 are integrally connected to both sides of the buffer module 100 with the buffer module 100 interposed therebetween, and five process modules along the circumference of each transfer module 110 and 120. 131-135) are connected. In addition, the interior of the first and second transfer module (110, 120) is provided with a conventional robot arm (112, 122) or handler for loading and unloading the substrate, respectively.

On the other hand, since the interior of the first and second transfer module (110,120) must be able to maintain a vacuum state has a certain limit to increase the size and volume, a process connected to the circumference of the first and second transfer module (110, 120) The number of modules also has a limit. That is, some of the circumferences of the respective transfer modules 110 and 120 should be emptied in consideration of the connection with the buffer module 100 and securing the moving line of the cassette 160, which may be connected to the circumferences of the respective transfer modules 110 and 120. The number of process modules can only be limited. Therefore, the first and second transfer modules 110 and 120 should be able to be formed in a structure and a shape that can connect a relatively large number of process modules without increasing the size and volume, and the process modules should also be optimally arranged.

For example, the first and second transfer modules 110 and 120 may be formed in at least five polygonal shapes. Hereinafter, the first and second transfer modules 110 and 120 may be formed in a pentagonal shape and have a buffer module ( An example of connecting to both side portions of the buffer module 100 with the interposed between 100 will be described. In some cases, the first and second transfer modules may be formed in a hexagonal shape or a polygonal shape of eight or more, or alternatively, the first and second transfer modules may be formed in a circular shape.

As such, five process modules 131 to 135 may be connected to the first and second transfer modules 110 and 120. Hereinafter, the first and second process modules may be formed around the first transfer module 110. 131 and 132 are connected, and the third to fifth process modules 133, 134 and 135 are connected to the circumference of the second transfer module 120. In some cases, three process modules may be connected to the circumference of the first transfer module 110, and two process modules may be connected to the circumference of the second transfer module 120.

In addition, since the process modules 131 to 135 have a substantially very long length, they should be arranged without interference with each other. To this end, the first process module is connected to the left side of the first transfer module and is connected to the rear of the first transfer module so that the second process module is disposed within 90 ° with respect to the first process module. In addition, the third process module is connected to the right side of the second transfer module, the fifth process module is connected to the rear of the second transfer module to be disposed within 160 ° with respect to the third process module, the fourth process The module is connected to the rear of the second transfer module to be disposed between the third process module and the process module.

Herein, the second process module disposed within 90 ° with respect to the first process module means that an angle between the second process module and the first process module is smaller than 90 °, and preferably, the second process module The angle between the first process module may be configured to 72 °.

In addition, the fifth process module disposed within 160 ° with respect to the third process module means that an angle between the fifth process module and the third process module is smaller than 160 °, and preferably, the fifth process module. And an angle between the third process module and 144 °.

In addition, the second process module and the fifth process module may be disposed in parallel to each other so as to prevent interference between the second process module and the fifth process module in advance.

In the first to fifth process modules 131 to 135, treatment processes such as deposition, etching, and heat treatment may be performed, respectively. In each of the process modules 131 to 135, ordinary heating means and susceptor may be used. Etc., and a vacuum device for vacuum treatment may be connected.

Meanwhile, an alignment module 140 for aligning the substrate may be provided on at least one side of the first and second transfer modules 110 and 120. That is, the alignment module 140 is provided to match a flat zone or notch of a substrate to a predetermined direction, and the present invention is limited by the structure and method of the alignment module 140. It is not limited or restricted. Therefore, the substrate may be aligned by the alignment module 140 before being transferred to the buffer module 100.

In addition, since the alignment module 140 has a relatively short length compared to each of the process modules 131 to 135, the alignment module 140 may be disposed in front of the first and second transfer modules 110 and 120.

In the exemplary embodiment of the present invention, an example in which one alignment module 140 is adopted adjacent to the first transfer module 110 will be described. However, in some cases, the first and second transfer modules 110 and 120 may be used. Two alignment modules may be employed adjacent to each other.

Hereinafter, the operating state of the present invention configured as described above will be described.

The cassette 160 having a plurality of substrates mounted thereon is transported adjacent to the loading apparatus 150 through a conventional transport apparatus, and the substrate in the cassette 160 is loaded into the buffer module 100 through the loading apparatus 150. do.

At this time, the substrate is first passed through the alignment module 140 before being transferred to the buffer module 100, and thus the substrate may be transferred to the buffer module 100 in an aligned state. In addition, when the substrate transfer to the buffer module 100 is completed, the buffer module 100 is maintained in a vacuum state so that foreign substances such as dust do not remain inside.

Subsequently, the substrate transferred to the buffer module 100 is transferred to the first to fifth process modules by the robot arms of the first and second transfer modules 110 and 120, and the first to fifth process modules 131 ˜. In step 135), a processing process related to the substrate, that is, the deposition, etching, and heat treatment of the substrate, is performed sequentially or simultaneously.

When the processing process for the substrate is completed, the substrates in the first to fifth process modules 131 to 135 are returned to the buffer module 100 by the robot arms 112 and 122 of the first and second transfer modules 110 and 120. Transported and then mounted on the cassette 160 via the loading device 150.

Meanwhile, in the above-described and illustrated embodiments of the present invention, although each of the transfer modules 110 and 120 (or the process module) and the loading device 150 are described as being operated with a time difference from each other, substantially each transfer module 110 and 120 is described. The loading device 150 may also be operated at the same time that the (or process module) is operated. That is, while the robot arms 112 and 122 of each transfer module 110 and 120 transfer the substrate seated on the buffer module 100 to each process module 131 to 135 (or while the substrate is processed in each process module). The loading device 150 may transfer another substrate from the cassette 160 to the buffer module 100.

On the other hand, Figure 2 is a block diagram showing the structure of a substrate processing apparatus according to another embodiment of the present invention. In addition, the same or equivalent reference numerals are given to the same or equivalent components as those described above, and detailed description thereof will be omitted.

In the above-described and illustrated embodiments of the present invention, the alignment module for aligning the substrate is described as an example in which the alignment module is independently disposed on the outside of each transfer module, but differently, two alignment modules correspond to each transfer module. Each alignment module may be provided to have the same vacuum space as the corresponding transfer module.

That is, as shown in FIG. 2, the first alignment module 142 may be integrally connected to one circumference of the first transfer module 110, and the second ear may be connected to one circumference of the second transfer module 120. The line module 144 may be integrally connected. At this time, the first alignment module 142 is provided to have the same vacuum space as the first transfer module 110, the second alignment module 144 is the same vacuum space as the second transfer module 120 It is provided to have.

In addition, since the first and second alignment modules 12 and 1440 have a relatively short length compared to the process modules 131 to 135, they may be disposed in front of the first and second transfer modules 110 and 120. have.

In such a structure, the substrate can be transferred directly from the cassette 160 to the buffer module 100 without having to be aligned in advance before the substrate is transferred from the cassette 160 to the buffer module 100, and the buffer module. The substrate in the 100 passes through the first and second alignment modules 142 and 144 by the robot arms 112 and 122 before being transferred to the respective process modules 131 to 135, and then, in the aligned state, the process modules ( 131 to 135 may be transported and processed.

In the above-described and illustrated other embodiments of the present invention, the first and second alignment modules 142 and 144 are provided to correspond to the first and second transfer modules 110 and 120, but in some cases, the first and second alignment modules 142 and 144 may be provided. An alignment module having the same vacuum space as the first transfer module 110 or the second transfer module 120 may be installed on only one side of the second transfer module 110 or 120.

Alternatively, an alignment module (not shown) may be integrally connected to one side of the buffer module 100, and the alignment module connected to the buffer module 100 may have the same vacuum space as that of the buffer module 100. It can be provided to have.

As described above, while having been described with reference to the preferred embodiment of the present invention, those skilled in the art various modifications and changes within the scope of the present invention without departing from the spirit and scope of the present invention described in the claims below. It will be appreciated that it can be changed.

1 is a block diagram showing the structure of a substrate processing apparatus according to the present invention.

2 is a block diagram showing the structure of a substrate processing apparatus according to another embodiment of the present invention.

<Description of the symbols for the main parts of the drawings>

100: buffer module 110: first transfer module

120: second transfer module 131 ~ 135: process module

140: alignment module 150: loading device

160: cassette

Claims (7)

A buffer module in which an entrance to and from a substrate is formed; First and second transfer modules provided to transfer the substrate and connected to both sides of the buffer module; First and second process modules connected to a circumference of the first transfer module to process the substrate; And And third to fifth process modules connected to the circumference of the second transfer module to process the substrate. The method of claim 1, The first process module is connected to the left side of the first transfer module, the second process module is connected to the rear of the first transfer module to be disposed within 90 ° with respect to the first process module, The third process module is connected to the right side of the second transfer module, the fifth process module is connected to the rear of the second transfer module to be disposed within 160 ° with respect to the third process module, and the fourth process The module is a substrate processing apparatus, characterized in that connected to the rear of the second transfer module to be disposed between the third process module and the process module. The method of claim 2, And the second process module and the fifth process module are disposed in parallel to each other. The method of claim 2, The first and second transfer module substrate processing apparatus, characterized in that formed in a pentagonal shape. The method of claim 1, And an alignment module provided adjacent to at least one of the first and second transfer modules to align the substrate. The method of claim 1, A first alignment module connected to the first transfer module to have the same vacuum space as the first transfer module, and a second alignment module connected to the second transfer module to have the same vacuum space as the second transfer module; Further comprising a substrate processing apparatus. The method of claim 1, And an alignment module connected to the buffer module to have the same vacuum space as the buffer module.

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