TWI240323B - A precise wafer etching method - Google Patents

A precise wafer etching method Download PDF

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Publication number
TWI240323B
TWI240323B TW93131076A TW93131076A TWI240323B TW I240323 B TWI240323 B TW I240323B TW 93131076 A TW93131076 A TW 93131076A TW 93131076 A TW93131076 A TW 93131076A TW I240323 B TWI240323 B TW I240323B
Authority
TW
Taiwan
Prior art keywords
wafer
etching
nozzle
wafers
precise
Prior art date
Application number
TW93131076A
Other languages
English (en)
Chinese (zh)
Other versions
TW200612486A (en
Inventor
Guo-Lung Sung
Original Assignee
Guo-Lung Sung
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Guo-Lung Sung filed Critical Guo-Lung Sung
Priority to TW93131076A priority Critical patent/TWI240323B/zh
Application granted granted Critical
Publication of TWI240323B publication Critical patent/TWI240323B/zh
Priority to JP2005298610A priority patent/JP2006121075A/ja
Publication of TW200612486A publication Critical patent/TW200612486A/zh

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  • Weting (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Drying Of Semiconductors (AREA)
TW93131076A 2004-10-14 2004-10-14 A precise wafer etching method TWI240323B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW93131076A TWI240323B (en) 2004-10-14 2004-10-14 A precise wafer etching method
JP2005298610A JP2006121075A (ja) 2004-10-14 2005-10-13 ウエハの高精度エッチング方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW93131076A TWI240323B (en) 2004-10-14 2004-10-14 A precise wafer etching method

Publications (2)

Publication Number Publication Date
TWI240323B true TWI240323B (en) 2005-09-21
TW200612486A TW200612486A (en) 2006-04-16

Family

ID=36538609

Family Applications (1)

Application Number Title Priority Date Filing Date
TW93131076A TWI240323B (en) 2004-10-14 2004-10-14 A precise wafer etching method

Country Status (2)

Country Link
JP (1) JP2006121075A (ja)
TW (1) TWI240323B (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI564952B (zh) * 2015-01-30 2017-01-01 Ventilation process equipment

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10529543B2 (en) * 2017-11-15 2020-01-07 Taiwan Semiconductor Manufacturing Co., Ltd. Etch process with rotatable shower head
CN111554610A (zh) * 2020-04-16 2020-08-18 清华大学 微腔刻蚀基底盛放装置及微腔刻蚀系统

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI564952B (zh) * 2015-01-30 2017-01-01 Ventilation process equipment

Also Published As

Publication number Publication date
JP2006121075A (ja) 2006-05-11
TW200612486A (en) 2006-04-16

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