TW200612486A - A precise wafer etching method - Google Patents
A precise wafer etching methodInfo
- Publication number
- TW200612486A TW200612486A TW093131076A TW93131076A TW200612486A TW 200612486 A TW200612486 A TW 200612486A TW 093131076 A TW093131076 A TW 093131076A TW 93131076 A TW93131076 A TW 93131076A TW 200612486 A TW200612486 A TW 200612486A
- Authority
- TW
- Taiwan
- Prior art keywords
- wafer
- nozzle
- etching method
- revolution
- precise
- Prior art date
Links
Landscapes
- Weting (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Drying Of Semiconductors (AREA)
Abstract
The present invention provides a precise wafer etching method, which disposes a nozzle at one end, which the nozzle could spray an etchant on a wafer; places the wafer on the opposite end of the nozzle, and carries the wafer by a rotation device which can move the wafer relatively along a revolution path centered by the nozzle and also result in an automatic self-revolution capability of the wafer in the revolution process, so that the etchant could be distributed uniformly on the wafer surface for more precise control over the etching level for removing certain type of material from the wafer surface.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW93131076A TWI240323B (en) | 2004-10-14 | 2004-10-14 | A precise wafer etching method |
JP2005298610A JP2006121075A (en) | 2004-10-14 | 2005-10-13 | High-precision etching method for wafer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW93131076A TWI240323B (en) | 2004-10-14 | 2004-10-14 | A precise wafer etching method |
Publications (2)
Publication Number | Publication Date |
---|---|
TWI240323B TWI240323B (en) | 2005-09-21 |
TW200612486A true TW200612486A (en) | 2006-04-16 |
Family
ID=36538609
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW93131076A TWI240323B (en) | 2004-10-14 | 2004-10-14 | A precise wafer etching method |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP2006121075A (en) |
TW (1) | TWI240323B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI730266B (en) * | 2017-11-15 | 2021-06-11 | 台灣積體電路製造股份有限公司 | A method for etching with a reactor and an etch system |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI564952B (en) * | 2015-01-30 | 2017-01-01 | Ventilation process equipment | |
CN111554610A (en) * | 2020-04-16 | 2020-08-18 | 清华大学 | Microcavity etching substrate holding device and microcavity etching system |
-
2004
- 2004-10-14 TW TW93131076A patent/TWI240323B/en active
-
2005
- 2005-10-13 JP JP2005298610A patent/JP2006121075A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI730266B (en) * | 2017-11-15 | 2021-06-11 | 台灣積體電路製造股份有限公司 | A method for etching with a reactor and an etch system |
US11227747B2 (en) | 2017-11-15 | 2022-01-18 | Taiwan Semiconductor Manufacturing Co., Ltd. | Etch process with rotatable shower head |
Also Published As
Publication number | Publication date |
---|---|
JP2006121075A (en) | 2006-05-11 |
TWI240323B (en) | 2005-09-21 |
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