TW200612486A - A precise wafer etching method - Google Patents

A precise wafer etching method

Info

Publication number
TW200612486A
TW200612486A TW093131076A TW93131076A TW200612486A TW 200612486 A TW200612486 A TW 200612486A TW 093131076 A TW093131076 A TW 093131076A TW 93131076 A TW93131076 A TW 93131076A TW 200612486 A TW200612486 A TW 200612486A
Authority
TW
Taiwan
Prior art keywords
wafer
nozzle
etching method
revolution
precise
Prior art date
Application number
TW093131076A
Other languages
Chinese (zh)
Other versions
TWI240323B (en
Inventor
Guo-Long Song
Original Assignee
Guo-Long Song
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Guo-Long Song filed Critical Guo-Long Song
Priority to TW93131076A priority Critical patent/TWI240323B/en
Application granted granted Critical
Publication of TWI240323B publication Critical patent/TWI240323B/en
Priority to JP2005298610A priority patent/JP2006121075A/en
Publication of TW200612486A publication Critical patent/TW200612486A/en

Links

Landscapes

  • Weting (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Drying Of Semiconductors (AREA)

Abstract

The present invention provides a precise wafer etching method, which disposes a nozzle at one end, which the nozzle could spray an etchant on a wafer; places the wafer on the opposite end of the nozzle, and carries the wafer by a rotation device which can move the wafer relatively along a revolution path centered by the nozzle and also result in an automatic self-revolution capability of the wafer in the revolution process, so that the etchant could be distributed uniformly on the wafer surface for more precise control over the etching level for removing certain type of material from the wafer surface.
TW93131076A 2004-10-14 2004-10-14 A precise wafer etching method TWI240323B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW93131076A TWI240323B (en) 2004-10-14 2004-10-14 A precise wafer etching method
JP2005298610A JP2006121075A (en) 2004-10-14 2005-10-13 High-precision etching method for wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW93131076A TWI240323B (en) 2004-10-14 2004-10-14 A precise wafer etching method

Publications (2)

Publication Number Publication Date
TWI240323B TWI240323B (en) 2005-09-21
TW200612486A true TW200612486A (en) 2006-04-16

Family

ID=36538609

Family Applications (1)

Application Number Title Priority Date Filing Date
TW93131076A TWI240323B (en) 2004-10-14 2004-10-14 A precise wafer etching method

Country Status (2)

Country Link
JP (1) JP2006121075A (en)
TW (1) TWI240323B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI730266B (en) * 2017-11-15 2021-06-11 台灣積體電路製造股份有限公司 A method for etching with a reactor and an etch system

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI564952B (en) * 2015-01-30 2017-01-01 Ventilation process equipment
CN111554610A (en) * 2020-04-16 2020-08-18 清华大学 Microcavity etching substrate holding device and microcavity etching system

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI730266B (en) * 2017-11-15 2021-06-11 台灣積體電路製造股份有限公司 A method for etching with a reactor and an etch system
US11227747B2 (en) 2017-11-15 2022-01-18 Taiwan Semiconductor Manufacturing Co., Ltd. Etch process with rotatable shower head

Also Published As

Publication number Publication date
JP2006121075A (en) 2006-05-11
TWI240323B (en) 2005-09-21

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