TWI237335B - Bonding method and apparatus - Google Patents

Bonding method and apparatus Download PDF

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Publication number
TWI237335B
TWI237335B TW092110035A TW92110035A TWI237335B TW I237335 B TWI237335 B TW I237335B TW 092110035 A TW092110035 A TW 092110035A TW 92110035 A TW92110035 A TW 92110035A TW I237335 B TWI237335 B TW I237335B
Authority
TW
Taiwan
Prior art keywords
resin
substrate
heating
temperature
mounting member
Prior art date
Application number
TW092110035A
Other languages
English (en)
Chinese (zh)
Other versions
TW200401381A (en
Inventor
Akira Yamauchi
Original Assignee
Toray Eng Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Eng Co Ltd filed Critical Toray Eng Co Ltd
Publication of TW200401381A publication Critical patent/TW200401381A/zh
Application granted granted Critical
Publication of TWI237335B publication Critical patent/TWI237335B/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29298—Fillers
    • H01L2224/29399—Coating material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01023—Vanadium [V]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19043—Component type being a resistor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress
    • H01L2924/3511—Warping

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
TW092110035A 2002-04-30 2003-04-29 Bonding method and apparatus TWI237335B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002128468 2002-04-30
JP2002292580A JP4014481B2 (ja) 2002-04-30 2002-10-04 ボンディング方法およびその装置

Publications (2)

Publication Number Publication Date
TW200401381A TW200401381A (en) 2004-01-16
TWI237335B true TWI237335B (en) 2005-08-01

Family

ID=29405300

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092110035A TWI237335B (en) 2002-04-30 2003-04-29 Bonding method and apparatus

Country Status (5)

Country Link
JP (1) JP4014481B2 (enExample)
KR (1) KR100978697B1 (enExample)
CN (1) CN100375256C (enExample)
TW (1) TWI237335B (enExample)
WO (1) WO2003094222A1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI423359B (zh) * 2007-11-01 2014-01-11 夏普股份有限公司 半導體安裝裝置及半導體安裝方法
TWI607884B (zh) * 2016-06-04 2017-12-11 Usun Technology Co Ltd Pressing method of thin film display and flexible circuit board and pressing device thereof

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* Cited by examiner, † Cited by third party
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JP2005347303A (ja) * 2004-05-31 2005-12-15 Canon Inc 熱圧着装置
JP4687273B2 (ja) * 2005-06-23 2011-05-25 住友電気工業株式会社 電子部品の実装方法
JP4628234B2 (ja) * 2005-09-30 2011-02-09 オプトレックス株式会社 圧着装置および圧着方法
KR100825799B1 (ko) * 2007-01-03 2008-04-29 삼성전자주식회사 다이 접착 공정의 보이드 형성을 억제하는 반도체 칩 및이를 포함하는 반도체 패키지
KR20090066593A (ko) * 2007-12-20 2009-06-24 삼성전자주식회사 플립칩 본딩장치 및 플립칩 본딩방법
KR101119541B1 (ko) * 2009-11-30 2012-02-22 (주)멜파스 Ａｃｆ본딩을 위한 압착 장치 및 상기 압착 장치의 동작 방법
JP5496141B2 (ja) * 2011-03-30 2014-05-21 富士フイルム株式会社 電子部品の製造方法
KR101331590B1 (ko) * 2011-04-06 2013-11-20 주식회사 휴템 전자기파 가열을 이용한 웨이퍼 본더
CN102520221B (zh) * 2011-12-21 2014-02-19 中微光电子(潍坊)有限公司 一种电致发光测试电极的制作方法
TWI501828B (zh) * 2012-03-13 2015-10-01 印能科技股份有限公司 晶片壓合裝置及方法
CH707480B1 (de) * 2013-01-21 2016-08-31 Besi Switzerland Ag Bondkopf mit einem heiz- und kühlbaren Saugorgan.
US9093549B2 (en) 2013-07-02 2015-07-28 Kulicke And Soffa Industries, Inc. Bond heads for thermocompression bonders, thermocompression bonders, and methods of operating the same
US9659902B2 (en) * 2014-02-28 2017-05-23 Kulicke And Soffa Industries, Inc. Thermocompression bonding systems and methods of operating the same
KR102158822B1 (ko) * 2014-06-10 2020-09-22 세메스 주식회사 본딩 헤드 및 이를 포함하는 다이 본딩 장치
KR102295986B1 (ko) 2014-12-01 2021-08-31 삼성디스플레이 주식회사 칩 본딩 장치 및 칩 본딩 방법
CN107210239B (zh) * 2015-02-03 2021-03-05 东丽工程株式会社 安装装置和安装方法
JP6752722B2 (ja) * 2015-02-03 2020-09-09 東レエンジニアリング株式会社 実装装置および実装方法
CN114300346B (zh) 2016-02-16 2025-10-28 Ev集团E·索尔纳有限责任公司 用于接合衬底的方法
KR102439617B1 (ko) * 2017-06-27 2022-09-05 주식회사 미코세라믹스 본딩 헤드 및 이를 갖는 본딩 장치
CN109429438B (zh) * 2017-08-25 2020-08-14 阳程科技股份有限公司 薄膜显示器与软性电路板的压合方法及其压合装置
CN108822749B (zh) * 2018-08-20 2023-10-20 江苏省特种设备安全监督检验研究院 一种环氧树脂加热加压装置
KR101959215B1 (ko) * 2018-11-16 2019-03-19 (주)제이스텍 디스플레이 패널 또는 터치패널의 저추력 본딩장치
CN110491802B (zh) * 2019-07-16 2022-03-01 盐城瑾诚科技有限公司 用于集成电路封装过程中的散热设备
KR102604789B1 (ko) * 2020-11-30 2023-11-21 세메스 주식회사 히터 조립체 및 이를 포함하는 본딩 헤드
CN119901573B (zh) * 2025-01-21 2025-09-23 马鞍山钢铁股份有限公司 一种大直径圆柱钢铁试样的自动热顶锻试验装置及方法

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JPH1187429A (ja) * 1997-05-09 1999-03-30 Citizen Watch Co Ltd 半導体チップの実装方法
US6077382A (en) * 1997-05-09 2000-06-20 Citizen Watch Co., Ltd Mounting method of semiconductor chip
JPH11186300A (ja) * 1997-12-19 1999-07-09 Sony Corp 半導体装置の封止方法
JP3937270B2 (ja) * 1998-08-31 2007-06-27 日立化成工業株式会社 半導体装置の製造方法
JP3376968B2 (ja) * 1999-08-30 2003-02-17 ソニーケミカル株式会社 実装方法
JP3815149B2 (ja) * 1999-11-04 2006-08-30 セイコーエプソン株式会社 部品実装方法および電気光学装置の製造方法
JP2002057186A (ja) * 2000-05-31 2002-02-22 Nippon Avionics Co Ltd フリップチップ実装方法およびプリント配線板
JP3646056B2 (ja) * 2000-11-06 2005-05-11 日本アビオニクス株式会社 フリップチップ実装方法
JP4626839B2 (ja) * 2001-05-21 2011-02-09 日本電気株式会社 半導体装置の実装方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI423359B (zh) * 2007-11-01 2014-01-11 夏普股份有限公司 半導體安裝裝置及半導體安裝方法
TWI607884B (zh) * 2016-06-04 2017-12-11 Usun Technology Co Ltd Pressing method of thin film display and flexible circuit board and pressing device thereof

Also Published As

Publication number Publication date
JP4014481B2 (ja) 2007-11-28
TW200401381A (en) 2004-01-16
WO2003094222A1 (en) 2003-11-13
CN100375256C (zh) 2008-03-12
KR20050000499A (ko) 2005-01-05
KR100978697B1 (ko) 2010-08-30
CN1650415A (zh) 2005-08-03
JP2004031885A (ja) 2004-01-29

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