TWI232332B - Outer leaded bonding system - Google Patents

Abstract

An outer leaded bonding (OLB) system is used to bonding the tape carrier package IC (TCP-IC), which protrude from the panel and deviate from the plane direction of the panel, to the panel. Furthermore, the outer leaded bonding system comprising: the stage, which can support the panel; the thermal press apparatus, which has the supporter and thermal press head, the supporter is opposite to the stage, and the thermal press head is disposed on the supporter, the stage is used to transfer the tape carrier package IC into the space between the supporter and the thermal press head, and then the thermal press head can bond the tape carrier package IC to the panel; and the blower apparatus, which can provide air force to the tape carrier package IC, which is out of the plane direction of the panel, therefore, the tape carrier package IC does not touch the thermal press apparatus when the stage transfer the tape carrier package IC into the space between the supporter and the thermal press head.

Description

1232332

[Technical field to which the invention belongs] The present invention relates to an external pin bonding system, and more particularly, to an external pin bonding system used in the process of a thin film transistor liquid crystal display. [Prior art] In the method of bonding a thin film transistor liquid crystal display panel (TFT-lcd panel) and a driver integrated circuit (driver ic), a combination of heat seals has been sufficient in the past. But nowadays, under the situation that the pitch of the line is increasingly required to be reduced, there is a π-shaped tape automated bonding (TAB) and a chip-fiber bonding process (chip 〇 fim, cqf) and other processes. Both TAB and C0F use an anisotropic conductive film (ACF) as an interface, and a process of bonding a roll W configured with a driver integrated circuit and a TFT-LCD panel (where a driver integrated circuit is configured) Before the roll V and the TFT-LCD panel are officially joined, the roll tape equipped with the driving integrated circuit must be pre-bonded with the TFT-LCD panel.), And this process is commonly known as outer leaded b 〇nding, 〇LB) process (the process system is called the external pin bonding system). The difference between RE and C0F is mainly that coF can arrange passive components on the printed circuit board (PCB) together with the drive integrated circuit on the tape. Another difference between TAB and C0F is that the tape used by C0F is thinner and more flexible, so that the design of TFT-LCD can be better than that of 1232332, cable number 92115915 ± _η. elasticity. Please refer to FIG. 1 ', which shows a schematic diagram of a conventional pin bonding system. The external pin bonding system 100 mainly includes a platform rail 110, a machine 120, and a hot press 130. The hot press 130 has a support base i30a and a hot head 130b. The machine 1 2 0 is set on the machine 1 1 0, and the machine 2 20 can be moved back and forth along the direction of the arrow 110 shown in the figure. The support base 13a is opposite to the machine base 120 ', and the thermal head 130b is disposed above the support base i30a. The tape and reel equipped with the driving integrated circuit is a tape carrier package 1C (hereinafter referred to as TCP-1C) 140. The machine 120 is used to carry a panel pre-bonded with the TCP-IC 140, such as a TFT-LCD panel 150, and the machine 120 can send TCP-1C 140 into the support base 130a and the thermal head 130b along the platform. between. The thermal head 1301 :) is used to press the TCP-1C 140 fed between the support base 130a and the thermal head 130b, so that the TCP-1C 140 can be connected to the TFT-LCD panel 150. To sum up, in the process of TAB or COF, the machine 120 of the conventional external pin bonding system 100 is extremely stable in the process of carrying the TFT-LCD panel 150 toward the hot press 130. It is easy for the protruding TCP-1C 140 to protrude from the TFT — LCD panel ... 150 and touch the support base 130a (the tape is sagging due to the drive integrated circuit). When the TCP-1C 140 touches the support seat 13a, it is easy for the TCP-1C to be damaged, or even the driver integrated circuit on the TCP-1C 140 to be damaged, which makes the TFT-LCD panel unusable, so it shadows the TFT-LCD. The overall process. It further caused huge losses to manufacturers and increased & manufacturing costs. '

1111 92127T1V-Fix.ptc Page 7

1232332 Case No. 92115915 V. Description of the invention (3) [Objective and summary of the invention] ^ In view of this, the purpose of the present invention is to provide an external pin bonding system for TCP_IC carried by a receiver to a hot press Does not touch the press. This will ensure that TCP-IC will not affect the quality of tft_lcd, and due to the breakage, and will cause TCP-IC * to be damaged by touching the hot press, so that the TAB or COF process can be effectively carried out. According to the above object, the present invention proposes an external pin bonding system, in which a strip-shaped joint packaging package in a direction away from the surface of the Γ board is provided. The machine is a branch blowing device. The machine is used to carry the panel = [the machine has a support base and a thermal head, the support base is connected to the machine base, and the head is arranged above the support base. The machine is used by people. ”The circuit is fed into the door of the support seat and the indenter. The ra package is integrated between the thermal head and the thermal indenter, and the body circuit is installed to make the band joint package. The integrated circuit can be connected to the panel. The blowing device includes a compressor and pipe fittings. The compressor is set in the external pin bonding system and the air source. The pipe fittings are set on the machine. The pipe fittings are used to: The buckle supply is connected to the I shrink machine, so that the gas source can be = row = =, and the tube ::: ribbon-shaped joint packaging package in the direction of the electric plane, the electrical joint packaging package circuit is sent into the support and the heat ::: The $ -shaped bonding package integrated circuit will not touch the hot press. In the process of S and D, according to the above-mentioned purpose, the present invention further proposes a kind of external introduction, which mainly includes: a machine, a hot press and a blower "The sigh is in the heart. The machine is used to carry on page 8 921277 ^ -correction. Ptc 1232332 picture number 92115915_year month day π: 5. Description of the invention (4) Carrier panel. The hot press has a support base and heat The indenter and the support base are opposite to the machine and the thermal indenter is set above the support base. The machine is used to connect the belt The ft package integrated circuit is sent between the support base and the thermal head, so that the thermal head can be pressed against the tape joint package integrated circuit, so that the tape joint package integrated circuit can be bonded to the panel. Blowing / suction device It mainly includes: air pressure source / vacuum source and tube. Air pressure source / vacuum source is set in the external pin bonding system and is used to provide air source / negative pressure air source. The pipe fitting is set near one side of the hot press and the pipe fitting The system has multiple openings, and the pipe is connected to the air pressure source / vacuum source, so that the negative pressure air source of the air source 1 can pass through the openings to provide air force to the V-shaped junction package integrated circuit that is off-plane. During the process of feeding the tape-shaped junction packaged package into the support base and the thermal head, the tape-shaped packaged package circuit does not touch the hot press. In addition, according to the above object, the present invention proposes a The contact of the outer pin bonding is used to make the strip-shaped joint sealing J circuit which protrudes the panel and deviates from the surface direction of the panel can be bonded to the panel. In addition, the method of pin bonding is at least = moving in: the board is oriented with a support and heat Supply of the hot press of the indenter = > ,, L In the process of the strip-shaped joint packaging package electricity from the direction of the surface,-standing person = between the support base and the thermal head ▼ the shape of the S package integrated circuit will not touch the pressing machine. The head is pressed with the tape joint package ... The integrated circuit is bonded to the panel. The integrated circuit is used to make the tape joint package for the above purpose of the present invention. 4 The main embodiments are specifically described below. 廿: People and advantages can be more Obviously easy to read, next. Μ] and in conjunction with the attached Figure A, a detailed description such as

92127TW-Amendment.ptc Page 9 1232332 __ Case No. 92115915_ Year Month _ ^ __ V. Description of the Invention (5) [Embodiment] Please refer to FIG. 2A 'It will be shown in accordance with the present invention is better Schematic diagram of a pin bonding system outside the embodiments. The external pin bonding system 200 is used to make the TFT-LCD panel 250 project from the surface direction XI of the panel of the TFT-LCD panel 250 (the surface direction XI is the plane of the TFT-LCD panel 250) A tape carrier package IC (hereinafter referred to as TCP-IC) 24 0 can be bonded to the TFT-LCD panel 250. (As shown in FIG. 1, the plane direction X of the TCP-IC 140 (the plane direction X0 is the normal vector of the plane of the TCP-1C 140) is deviated from the plane direction XI of the TFT-LCD panel 150. That is, The plane direction x0 is different from the plane direction XI.) The outer pin bonding system 2000 mainly includes an organic table 220, a table holder 210, a heat press 230, and an air blowing device 260. The heat press 230 has a support base 230a and a heat head 230b. The machine 220 is disposed on the platform rail 210, and the machine 220 is used to carry the TFT-LCD panel 250. The support base 230a of the heat press 230 is opposite to the machine base 220, and the heat head 230b is disposed above the support base 230a. An air pressure source of the air blowing device 2 600 is, for example, a compressor 2 70, which is provided in the machine 2 20, and a compressor 270 is used to provide an air source for the air blowing device 260. The tube 280 is disposed on the machine 220. The machine 220 can send TCP-1C 240 between the support base 230a and the thermal head 230b along the track 2 10, so that the thermal head 230b can press the TCP-IC 240, so that the TCP-IC 240 can communicate with the TFT. -LCD panel 2 5 0 joint.

92127TW · Amendment.ptc Page 10 1232332 _Case No. 92115915_year month__ V. Description of the invention (6)

Please refer to FIG. 2A and FIG. 2B at the same time. FIG. 2B is a top view of some components and devices in FIG. 2A. The pipe fitting 2 8 0 of the air blowing device 2 60 has a plurality of openings 285, and the pipe fitting 280 is connected to the compressor 2 70 through a pipe 275, so that the air source can be discharged through the opening 28 5 and can provide air force. pi 予 TCP-1C 240 deviating from plane direction XI (TCP-IC 240 means deviating from plane direction XI means: TCP-1C 24 0 plane normal vector and TFT-LCD panel 2 5 0 plane normal vector , The normal vectors of the two planes are different in directions. The meanings mentioned below are the same.), So that the machine 220 converts TCP-1C

The TCP-IC 240 does not touch the heat press 230 during the 240 feeding process between the support base 230a and the heat head 230b. It is worth noting that in addition to the compressor 270, the air pressure source can also be a device such as a blower that can provide air pressure. The pipe fitting 28 can be arranged on the machine table 22 by adjusting the orientation of the opening 285. The best orientation of the opening 285 is to use the pipe 28 to blow the Tcp-IC 24 to the direction XI 'so that the random station 220 is sent to the TCP-1C 240 of the hot press 2 30 without touching it. The purpose of the hot press 230 is. The compressor 270 is not limited to being installed in the machine 220, and the compressor 270 may also be installed anywhere in the external pin bonding system 20q.

In general, because TCP_IC 24〇 has a driver 3 integrated circuit that needs to be carried, and because the thickness of TCP-IC 240 is thin, TCP_IC 24〇1 has a sagging phenomenon, which makes TCP_IC 24〇 easily deviate from TFT. ^ Direction XI of the LCD panel 25. However, the pin-bonding system 2000 in the present invention is not unique: the situation when p-ic 240 sags downward, any deviation from the plane direction xu (such as when TCP-IC 240 is upturned) ), Can be used;

1232332 Amendment No. 92115915 V. Description of the invention (7) The pin bonding system within the invention is to be solved. The installation position of the air blowing device 260 shown in FIG. 2A is not only set on the machine 2 2 0, but also at any position, and can make the lead bonding system in the present invention achieve the effect of the invention. Anyone can. Please refer to Fig. 3 ', which shows a schematic view of the air blowing device of the internal pin bonding system installed on one side of the hot press. In FIG. 2A, the blowing device 26 is installed on the machine 220. The air blowing device 360 shown in FIG. 3 is disposed on the side close to the heat press 33 0 (it may be disposed on one side of the support base 33 0a). The structure of the pipe fitting 380 is the same as the structure of the pipe fitting 280 in FIG. 2A, that is, the pipe fitting 380 has a plurality of openings 385, and the pipe fitting 380 is connected to the compressor 370 through a pipe 375, for example. Pressure source. The process of making the air source be discharged from the opening 385 and providing the airflow force F2 to the TCP-1C 340 that deviates from the plane direction X2, so that the machine 32 0 sends the TCP-1C 340 into the support seat 330a and the thermal head 330b In the middle, TCP-1C 340 does not touch the heat press 330. The above-mentioned air blowing device 360 can also be replaced by an air suction device. Please refer to FIG. 4 ′, which shows a schematic diagram of the air-intake device of the internal pin bonding system disposed on one side of the heat press. The blowing device 3 6 0 in FIG. 3 may be replaced by the suction device 4 6 0 shown in FIG. 4. That is, the suction device 460 is disposed on a side close to the heat press 430 (may be disposed on one side of the heat head 430b). The structure of the suction device 46 0 is also the same as the structure of the blowing device 26 0 in FIG. 2A, except that the blowing device 2 6 〇 provides TCP-1C 240 air flow application by blowing. Force F1, and the suction device 460 provides TCP-1C 440 airflow force F3 by suction. Similar to the pipe fitting 380 in Fig. 3, the pipe fitting 480 has a plurality of openings 485, and the suction member 460 is transparent.

92127T1V-correction. Ptc page 121232332 -------- case 5 tiger 92115915 ___ ___S_ amendment ___ 5. Description of the invention (8) The official road 475 is connected to the vacuum of the vacuum pump 470, for example source. Allow the negative pressure air source to flow through the opening 485 to provide the airflow force F3 to the TCP-IC 440 that deviates from the plane direction X3, and make the machine 42 0 send the TCP-IC 440 into the support base 430a and the thermal head 430b. In the process, TCP-1C 440 will not touch the heat press 43 0. The above vacuum source can be a vacuum pump 470 or a blower. The compressor 270, compressor 370, and vacuum pump 4 70 in FIGS. 2, 3, and 4 are not limited to being installed in the machine 2 20, the machine 3 2 0, and the machine 420. The compressor 270, the compressor 370, and the vacuum pump 470 series can be respectively placed in any of the external pin bonding system 2000 'and the external pin bonding system 300' and the external pin bonding system 400 '. In addition, the above-mentioned external pin bonding system 200, external pin bonding system 300, and external pin bonding system 400 may further include Taiwan executives 210, 310, and 410, and machines 220, 320, and 420. They are set on the platform rails 210, 310, and 410, respectively. TCP-1C 240, 340, and 440 can be sent to the support bases 230a, 330a, 43 0a, and thermal heads 230b, 230a, 330a, and 440, respectively, along the platform holders 210, 310, and 410, respectively. 330b, 430b. The above-mentioned lead bonding systems 200, 300 and 400 outside the present invention are applicable to tape automated bonding (TAB) and die-to-chip bonding (chip ONF). The following is a method of pin bonding other than the present invention. Please refer to FIG. 2A and FIG. 5 at the same time. FIG. 5 shows a flowchart of the pin bonding method outside the preferred embodiment of the present invention. The method of pin bonding outside of FIG. 5 is used to make a panel protruding from, for example, the TFT-LCD panel 2 50, and away from the surface direction XI of the TFT-LCD panel 2 50.

92127T1V-correction.ptc page 13 1232332 ---_ case number 92115915_year month_a_correction__ 5. Description of the invention (9) L C D panel 2 5 0 joint. In addition, the pin bonding method mainly includes the following steps: In step 500, the bonding of TCP-1C 240 and the TFT-LCD panel 250 is started. Next, in step 510, the mobile TFT-LCD panel 250 is moved toward the heat press 230 having the support base 230a and the heat head 230b. Then, in step 520A, the airflow force F1 is provided to deviate from the plane direction XI (^ -1 (: 240, so that the TCP-IC 240 is sent into the process between the support seat 2 30a and the thermal head 230b, The TCP-1C 240 does not touch the heat press 23 0. After that, in step 53 0, the TCP-1C 240 is pressed by the heat head 230b to connect the TCP-1C 240 with the TFT-LCD panel 250. Finally In step 54, the joining of the TCP-IC 240 and the TFT-LCD panel 250 is completed. Therefore, according to the above-mentioned embodiment, it is known that the external pin bonding system and the external pin bonding method disclosed in the present invention At least, it has the advantage that, in the process of TAB or COF, the machine of the pin bonding system other than the present invention, during the process of carrying the TFT-LCD panel toward the hot press, due to blowing / suction The function of the device is such that the TCP-1C protruding from the TFT-LCD panel and deviating from the surface direction of the Tj? T-LCD panel (for example, when the TCP-1C is sagging) will not touch the hot press. This will make TCP-1C Will not damage TCP-1C due to touching the support base, or even damage the driver integrated circuit on TCP-1C, making the TFT-LCD panel unusable Therefore, it affects the overall manufacturing process of TFT-LCD. It further causes huge losses to manufacturers and increases manufacturing costs. In summary, although the present invention has been disclosed as above with the embodiments, it is not intended to limit the present invention. Anyone familiar with this technology However, I do not leave: within the spirit and scope of the invention, various modifications and retouching can be made, so the scope of protection shall be determined by the scope of the attached patent application.

921271 ^ -Rev.ptc Page 14 1232332 _Case No. 92159915_Year Month and Day_Charm_ Brief Description of the Drawings [Simplified Description of the Drawings] Figure 1 shows a schematic diagram of a conventional pin bonding system. FIG. 2A shows the intention of the pin bonding system outside the preferred embodiment of the present invention. Figure 2B is a top view of some components and devices in Figure 2A. Fig. 3 is a schematic view showing that the blowing device of the external pin bonding system is arranged on one side of the hot press. Fig. 4 is a schematic view showing that the suction device of the outer pin bonding system is arranged on one side of the heat press. FIG. 5 is a flowchart of a pin bonding method outside the preferred embodiment of the present invention. Description of drawing symbols 100, 2 0, 3 0 0, 40 0: Xibu pin bonding system 110, 210, 310, 410: table rail 120, 220, 320, 420: machine 130, 230, 330, 430 : Hot presses 130a, 230a, 3 3 0a, 43 0a: Support bases 130b, 230b, 330b, 43 0b: Hot press

140, 240, 340, 440: TCP-IC 150, 2 5 0: TFT-LCD panel X0, XI, X2, X3: plane direction 2 6 0, 3 6 0: air blowing device 2 7 0, 3 7 0: compressor

921271-fix.ptc page 15 1232332

921271 ^ -Fix.ptc Page 16

Claims (1)

93. 10. 15 Case No. 92115915 Applicable to Shentong Patent __ 1 · An outer leaded bonding (〇LB) system is used to project a panel and deviate from the direction of one side of the panel. A tape carrier package 1C (TCP-I C) can be bonded to the panel. The external pin bonding system includes at least: a machine for carrying the panel; a heat press machine having A support base and a thermal head, the machine is used to send the tape-shaped joint packaging integrated circuit between the support base and the thermal head, so that the thermal head can press the belt-shaped joint package. An integrated circuit so that the tape-bonded package integrated circuit can be bonded to the panel; and an air blowing device including: a pressure source provided in the external pin bonding system, the pressure source is used to provide a A gas source; and a pipe fitting provided on the machine 'the pipe fitting has a plurality of openings' and the pipe fitting is connected to the pressure source' so that the gas source can be discharged from the opening and can provide an airflow force to deviate from the Face-to-face strip bonding package Circuits of the machine joining the band-shaped stage integrated circuit package into the process between the thermal head to the support base, the sealing strip engages Pei integrated circuit does not touch the hot press. 2 · As for the pin bonding system described in item 1 of the scope of patent application, the pipe fitting is set on the machine a, 3 so that the direction of the opening can be adjusted. · As described in item 1 of the scope of patent application Outside the pin bonding system, the air pressure source is set in the machine. ^ 4 · Pin-bonding system as described in item 1 of the scope of patent application, 1232332 _Case No. 92115915_Year Month Date __ ^ Sixth, in the scope of the patent application, the outer pin bonding system is used for the automated belt bonding process (TAB). 〇5 As described in the first patent application scope An external pin bonding system, wherein the external pin bonding system is used in a die-flex board bonding process (chip two film, COF). 6 The pin bonding system as described in item 1 of the patent application scope, wherein the air pressure source is a compressor. 7. The pin bonding system described in item 1 of the scope of patent application, wherein the air pressure source is a blower. 8. The pin bonding system as described in item 1 of the scope of patent application, wherein the panel is a thin film transistor liquid crystal display panel (TFT-lcd ', pane 1) ° 9 · As described in item 1 of the scope of patent application The external pin bonding system further includes a holder, and the machine is arranged on the holder and the strip-shaped joint package integrated circuit can be sent to the support base and the thermal head along the holder. ° ..... 10 · An outer pin bonding system, which is used to enable a strip-bonding package integrated circuit protruding from a panel and deviating from one side direction of the panel to be bonded to the panel. The outer pin bonding system is at least Including: a machine for carrying the panel; a heat press with a support base and a heat head, the machine is used to send the strip-shaped joint package integrated circuit into the support base and the heat press Between the heads, so that the thermal head can be pressed against the tape-shaped junction package integrated circuit, so that the tape-shaped junction package integrated circuit can be bonded with the panel; and 1232332 -SS__92U5915 Amendment on January 6th, patent application scope of an air blowing device, including ... an air source, set in the outer pin joint system, the compressor is used to provide an air source; and a pipe fitting Is located near one side of the hot press, the pipe system /, a plurality of openings, and the remote pipe system is connected to the air pressure source, so that the air source Z is exhausted from the opening and can provide an air force to deviate The π-shaped coupling packaged integrated circuit in the direction of the plane causes the machine to send the tape-shaped bonded packaged integrated circuit into the process between the support and the thermal head. The packaged integrated circuit will not touch the hot press. Port 11 · The pin bonding system described in item 10 of the patent application scope, wherein the rolling source is set in the machine. 12 · If applied The out-of-lead bonding system described in the scope of the patent No. 丨 0, wherein the out-of-lead bonding system is used for the strip-shaped automatic bonding process. The external pin bonding system is used for die -Flexible board bonding process. 14. The pin bonding system as described in item No. 0 of the scope of the patent application, wherein the air pressure source is a compressor (commperSsor). The external pin-bonding system described above, wherein the air pressure source is a blower. 16. The external pin-bonding system as described in the patent application No. 丨 0, wherein the panel is a thin film transistor liquid crystal display system 17. The pin-bonding system described in item No. 丨 0 of the scope of patent application, which further includes a holder, which is arranged on the holder and can be connected along the rail along the band. The packaged integrated circuit is fed into the support base and the thermal head 921271 ^. Correction.ptc Page 19 1232332 _ Case No. 92115915 6. Between patent applications. 18. · An external pin bonding system for enabling a strip-bonding package integrated circuit protruding from a panel and deviating from one face direction of the panel to be bonded to the panel. The external pin bonding system includes at least: a machine To carry the panel; A thermal press' has a support base and a thermal head, and the machine is used to send the strip-shaped joint package integrated circuit between the support base and the thermal head so that the thermal head can be pressed. The tape-bonded package integrated circuit, so that the tape-bonded package integrated circuit can be bonded to the panel; and a suction device, including: a vacuum source disposed in the outer pin bonding system, the vacuum source It is used to provide a negative pressure air source; and a tube is arranged near one side of the hot press, the tube has a plurality of openings, and the tube is connected to the vacuum source to make the negative pressure air source An air current can be provided to the tape-shaped joint package integrated circuit deviating from the plane direction, so that the machine can send the tape-shaped joint package integrated circuit into the process between the support base and the thermal head. The shape-joint packaged integrated circuit does not touch the hot press. 19. The pin bonding system described in item 8 of the patent application scope, wherein the vacuum source is set in the machine. 2 0 The external lead bonding system is described in item 8 of the patent application scope, and the external lead bonding system is used for a strip-shaped automatic bonding process. / 21 · As described in the 18th item of the patent application scope, the outer pin bonding system is used for the die-flex board bonding process. 92127T1V-fix.ptc page 20 1232332 Amendment 1 2 2 · The pin bonding system described in item 8 of the patent application scope, wherein the vacuum source is a vacuum pump. 2 3. According to the pin bonding system described in item 8 of the scope of the patent application, the vacuum source is a blower (b 1 0 w e r). 24. The pin bonding system described in item 8 of the patent application scope, wherein the panel is a thin film transistor liquid crystal display panel. 2 5 · The pin bonding system described in item 8 of the patent application scope, which further includes a holder, which is set on the holder and can be used to package the strip-shaped joint along the holder. The body circuit is sent between the support base and the thermal head. A method for external pin bonding, used to make a strip-bonding package integrated circuit protruding from a panel and deviating from one surface direction of the panel can be bonded with the panel. The method of external pin bonding includes at least: The panel faces a hot press with a support base and a thermal head to provide an airflow force to the strip-shaped joints and circuits that deviate from the direction of the surface, so that the strip-shaped joint package integrated circuit is sent to the support base = heat During the process between the indenters, 'Shaw-shaped bonding seals were brought to the hot press; and the electric press was not pressed by the hot-press to press the tape-shaped bonding seals, and the electric tape-shaped bonding packages were sealed. The circuit is bonded to the panel. 7 the