TWI232332B - Outer leaded bonding system - Google Patents

Outer leaded bonding system Download PDF

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TWI232332B
TWI232332B TW92115915A TW92115915A TWI232332B TW I232332 B TWI232332 B TW I232332B TW 92115915 A TW92115915 A TW 92115915A TW 92115915 A TW92115915 A TW 92115915A TW I232332 B TWI232332 B TW I232332B
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Taiwan
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panel
bonding system
integrated circuit
patent application
machine
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TW92115915A
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Chinese (zh)
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TW200428078A (en
Inventor
Chung-Hao Hsieh
Yu-Chih Chiang
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Chi Mei Optoelectronics Corp
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Priority to TW92115915A priority Critical patent/TWI232332B/en
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Publication of TWI232332B publication Critical patent/TWI232332B/en

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Abstract

An outer leaded bonding (OLB) system is used to bonding the tape carrier package IC (TCP-IC), which protrude from the panel and deviate from the plane direction of the panel, to the panel. Furthermore, the outer leaded bonding system comprising: the stage, which can support the panel; the thermal press apparatus, which has the supporter and thermal press head, the supporter is opposite to the stage, and the thermal press head is disposed on the supporter, the stage is used to transfer the tape carrier package IC into the space between the supporter and the thermal press head, and then the thermal press head can bond the tape carrier package IC to the panel; and the blower apparatus, which can provide air force to the tape carrier package IC, which is out of the plane direction of the panel, therefore, the tape carrier package IC does not touch the thermal press apparatus when the stage transfer the tape carrier package IC into the space between the supporter and the thermal press head.

Description

12323321232332

【發明所屬之技術領域】 本發明是有關於-種外引腳接合系統,且特別是有關 於一種使用於薄膜電晶體液晶顯示器之製程的外引腳接合 系統。 【先前技術】 在薄膜電晶體液晶顯示器面板(TFT —lcd panel )與 驅動積體電路(driver ic )的接合方式上,以往以熱轉 印(heat seal )的結合方式已足以應付。但現今在線路 的線距(pitch )被日益要求縮小的情形下,於是便有了 π狀自動接合製私(tape automated bonding,TAB)與 日日粒-軟板接合製程(chip 〇n fiim,cqf)等製程的產 生。 TAB與C0F均是以異方向導電膜(anis〇tr〇pic conductive film,ACF)為介面,將配置有驅動積體電路 的卷W與TFT-LCD面板接合的製程(在配置有驅動積體電 路的卷V與TFT-LCD面板正式接合之前,須先使配置有驅 動積體電路的卷帶與TFT —LCD面板做預接合。),而此種 製程則通稱為外引腳接合(outer leaded b〇nding, 〇LB )製程(製程系統則稱為外引腳接合系統)。而RE與 C0F的差異,則主要在於c〇F係可將原先於印刷電路板 (printed circuit board,PCB)上的被動元件連同驅動 積體電路一併配置於卷帶上。TAB與C0F的另一項差異,則 在於C0F所使用的卷帶較薄、可撓性較佳,使TFT-LCD的設 計可以較 1232332 索號 92115915 ±_η 曰 修正 五、發明說明(2) 具彈性。 請參照第1圖’其所繪示乃傳統之外引腳接合系統的 示意圖。外引腳接合系統1 0 0主要包括有台軌1 1 0、機台 120及熱壓機130 ’熱壓機130則具有支撐座i3〇a及熱壓頭 130b。 機台1 2 0係設置於台執1 1 〇上,且機台丨2 〇係可沿台執 110如圖示中所示之箭號方向來回移動。支撐座13〇a係與 機台120相對’且熱壓頭130b係設置於支樓座i3〇a上方。 配置有驅動積體電路的卷帶係為帶狀接合封裝積體電 路(tape carrier package 1C,以下簡稱為TCP-1C) 140。機台120則用以承載與TCP-IC 140預接合之例如是 TFT-LCD面板150的面板,且機台120係可沿台執將TCP -1C 140送入支撐座130a與熱壓頭130b之間。熱壓頭13〇1:)則 用以壓著送入支撐座130a與熱壓頭130b之間的TCP-1C 140,使 TCP-1C 140 可與 TFT-LCD 面板 150 接合。 綜上所述,無論於TAB或是C〇F的製程中,傳統之外引 腳接合系統100的機台120,於載送TFT-LCD面板150朝向熱 壓機130前進的過程中,均極易使得突出於TFT — LCD面板… 150且下垂的TCP-1C 140觸碰到支撐座130a (卷帶因承載 驅動積體電路而下垂)。TCP-1C 140觸碰到支撐座13〇a, 則容易使得TCP-1C折損,甚或使得TCP-1C 140上的驅動 積體電路損毁,造成TFT-LCD面板無法再使用,因而影塑 TFT-LCD整體的製程。進一步造成廠商鉅大的損失,使& 製造成本增加。 '[Technical field to which the invention belongs] The present invention relates to an external pin bonding system, and more particularly, to an external pin bonding system used in the process of a thin film transistor liquid crystal display. [Prior art] In the method of bonding a thin film transistor liquid crystal display panel (TFT-lcd panel) and a driver integrated circuit (driver ic), a combination of heat seals has been sufficient in the past. But nowadays, under the situation that the pitch of the line is increasingly required to be reduced, there is a π-shaped tape automated bonding (TAB) and a chip-fiber bonding process (chip 〇 fim, cqf) and other processes. Both TAB and C0F use an anisotropic conductive film (ACF) as an interface, and a process of bonding a roll W configured with a driver integrated circuit and a TFT-LCD panel (where a driver integrated circuit is configured) Before the roll V and the TFT-LCD panel are officially joined, the roll tape equipped with the driving integrated circuit must be pre-bonded with the TFT-LCD panel.), And this process is commonly known as outer leaded b 〇nding, 〇LB) process (the process system is called the external pin bonding system). The difference between RE and C0F is mainly that coF can arrange passive components on the printed circuit board (PCB) together with the drive integrated circuit on the tape. Another difference between TAB and C0F is that the tape used by C0F is thinner and more flexible, so that the design of TFT-LCD can be better than that of 1232332, cable number 92115915 ± _η. elasticity. Please refer to FIG. 1 ', which shows a schematic diagram of a conventional pin bonding system. The external pin bonding system 100 mainly includes a platform rail 110, a machine 120, and a hot press 130. The hot press 130 has a support base i30a and a hot head 130b. The machine 1 2 0 is set on the machine 1 1 0, and the machine 2 20 can be moved back and forth along the direction of the arrow 110 shown in the figure. The support base 13a is opposite to the machine base 120 ', and the thermal head 130b is disposed above the support base i30a. The tape and reel equipped with the driving integrated circuit is a tape carrier package 1C (hereinafter referred to as TCP-1C) 140. The machine 120 is used to carry a panel pre-bonded with the TCP-IC 140, such as a TFT-LCD panel 150, and the machine 120 can send TCP-1C 140 into the support base 130a and the thermal head 130b along the platform. between. The thermal head 1301 :) is used to press the TCP-1C 140 fed between the support base 130a and the thermal head 130b, so that the TCP-1C 140 can be connected to the TFT-LCD panel 150. To sum up, in the process of TAB or COF, the machine 120 of the conventional external pin bonding system 100 is extremely stable in the process of carrying the TFT-LCD panel 150 toward the hot press 130. It is easy for the protruding TCP-1C 140 to protrude from the TFT — LCD panel ... 150 and touch the support base 130a (the tape is sagging due to the drive integrated circuit). When the TCP-1C 140 touches the support seat 13a, it is easy for the TCP-1C to be damaged, or even the driver integrated circuit on the TCP-1C 140 to be damaged, which makes the TFT-LCD panel unusable, so it shadows the TFT-LCD. The overall process. It further caused huge losses to manufacturers and increased & manufacturing costs. '

1111 92127T1V-修正.ptc 第7頁1111 92127T1V-Fix.ptc Page 7

1232332 案號 92115915 五、發明說明(3) 【發明目的及概述】 ^有鑑於此:本發明的目的就是在提供一種外引腳接合 系統,用以使受機台載送至熱壓機的TCP_IC不會碰 壓機。此將能夠確保TCP—IC不會因折損而影響到tft_lcd,、 的品質,並且能使得TCP-IC*會因碰觸到熱壓機而損毀, 使TAB或是COF的製程得以有效進行。 、 根據上述目的,本發明提出一種外引腳接合系統, ㊁Π出5ίΐϊ離Γ板之面方向的帶狀接合封裝積體 ί機=支吹氣裝置。機台用以承載面板= [機具有支撐座與熱壓頭,支撐座係與機台㈣,而 頭則係設置於支撐座上方。機台用以人 ”、、 電路送入支撐座盥埶壓頭之門蚀勒r a封裝積體 又倚茂兴熱座頭之間,使熱壓頭 ,裝?體電路,以令帶狀接合封裝積體電路可與面板接口 5 °吹氣裝置則包括壓縮機及管件。壓縮機 (compressor)設置於外引腳接合系統中,且 氣源。管件則設置於機台上,管件伟 :用以扣供 件係連通至I縮機,使氣源可由=排= = 且管 :::㈣面方向之帶狀接合封裝積體電 接合封裝積體電路送入支撐座與熱 :::將帶$ 狀接合封裝積體電路不會觸碰到熱壓機。S 、匕程中,f 根據上述目的,本發明另提出—種外引 主要包括:機台、熱壓機以及吹 σ糸、,,’ 叹巩衷置。機台用以承 第8頁 921277^-修正.ptc 1232332 畫號92115915_年月日 倐π: 五、發明說明(4) 載面板。熱壓機具有支撐座與熱壓頭,支撐座係與機台相 對而熱壓頭則係設置於支撐座上方。機台用以將帶狀接 ft裝積體電路送入支撐座與熱壓頭之間,使熱壓頭可壓 著帶狀接合封裝積體電路,以令帶狀接合封裝積體電路可 與面板接合。吹/吸氣裝置主要包括:氣壓源/真空源及管 ,。氣壓源/真空源設置於外引腳接合系統中且用以提供 氣源/負壓氣源。管件則設置於靠近熱壓機之一側,管件 係具有多個開孔,且管件係連通至氣壓源/真空源,使氣 源1負壓氣源可透過開孔而可提供氣流施力予偏離面方向 之V狀接合封裝積體電路。使機台將帶狀接合封裝積體電 $送入支撐座與熱壓頭之間的過程中,帶狀接合封裝積體 電路不會觸碰到熱壓機。 、 另外,根據上述目的,本發明提出一種外引腳接合之 触用以使突出面板且偏離面板之面方向的帶狀接合封 J積體電路可與面板接合。此外引腳接合之方法至少= 進列動:板朝向具有支撐座與熱壓頭之熱壓機行 供= >,,L施力予偏離面方向之帶狀接合封裝積體電 的過程中,-站接人= 支撐座與熱壓頭之間 中▼狀接S封裝積體電路不會觸碰到埶壓機。、类 過熱壓頭壓著帶狀接合封裝… 透 積體電路與面板接合。積體電路’以令帶狀接合封裝 為讓本發明之上述目的 4主 下文特舉較佳實施例,廿:人和優點能更明顯易憧, 下。 Μ ]並配合所附圖A,作詳細說明如1232332 Case No. 92115915 V. Description of the invention (3) [Objective and summary of the invention] ^ In view of this, the purpose of the present invention is to provide an external pin bonding system for TCP_IC carried by a receiver to a hot press Does not touch the press. This will ensure that TCP-IC will not affect the quality of tft_lcd, and due to the breakage, and will cause TCP-IC * to be damaged by touching the hot press, so that the TAB or COF process can be effectively carried out. According to the above object, the present invention proposes an external pin bonding system, in which a strip-shaped joint packaging package in a direction away from the surface of the Γ board is provided. The machine is a branch blowing device. The machine is used to carry the panel = [the machine has a support base and a thermal head, the support base is connected to the machine base, and the head is arranged above the support base. The machine is used by people. ”The circuit is fed into the door of the support seat and the indenter. The ra package is integrated between the thermal head and the thermal indenter, and the body circuit is installed to make the band joint package. The integrated circuit can be connected to the panel. The blowing device includes a compressor and pipe fittings. The compressor is set in the external pin bonding system and the air source. The pipe fittings are set on the machine. The pipe fittings are used to: The buckle supply is connected to the I shrink machine, so that the gas source can be = row = =, and the tube ::: ribbon-shaped joint packaging package in the direction of the electric plane, the electrical joint packaging package circuit is sent into the support and the heat ::: The $ -shaped bonding package integrated circuit will not touch the hot press. In the process of S and D, according to the above-mentioned purpose, the present invention further proposes a kind of external introduction, which mainly includes: a machine, a hot press and a blower "The sigh is in the heart. The machine is used to carry on page 8 921277 ^ -correction. Ptc 1232332 picture number 92115915_year month day π: 5. Description of the invention (4) Carrier panel. The hot press has a support base and heat The indenter and the support base are opposite to the machine and the thermal indenter is set above the support base. The machine is used to connect the belt The ft package integrated circuit is sent between the support base and the thermal head, so that the thermal head can be pressed against the tape joint package integrated circuit, so that the tape joint package integrated circuit can be bonded to the panel. Blowing / suction device It mainly includes: air pressure source / vacuum source and tube. Air pressure source / vacuum source is set in the external pin bonding system and is used to provide air source / negative pressure air source. The pipe fitting is set near one side of the hot press and the pipe fitting The system has multiple openings, and the pipe is connected to the air pressure source / vacuum source, so that the negative pressure air source of the air source 1 can pass through the openings to provide air force to the V-shaped junction package integrated circuit that is off-plane. During the process of feeding the tape-shaped junction packaged package into the support base and the thermal head, the tape-shaped packaged package circuit does not touch the hot press. In addition, according to the above object, the present invention proposes a The contact of the outer pin bonding is used to make the strip-shaped joint sealing J circuit which protrudes the panel and deviates from the surface direction of the panel can be bonded to the panel. In addition, the method of pin bonding is at least = moving in: the board is oriented with a support and heat Supply of the hot press of the indenter = > ,, L In the process of the strip-shaped joint packaging package electricity from the direction of the surface,-standing person = between the support base and the thermal head ▼ the shape of the S package integrated circuit will not touch the pressing machine. The head is pressed with the tape joint package ... The integrated circuit is bonded to the panel. The integrated circuit is used to make the tape joint package for the above purpose of the present invention. 4 The main embodiments are specifically described below. 廿: People and advantages can be more Obviously easy to read, next. Μ] and in conjunction with the attached Figure A, a detailed description such as

92127TW-修正.ptc 第9頁 1232332 __案號92115915_年月曰_^__ 五、發明說明(5) 【實施方式】 請參照第2 A圖’其所纟會示乃依照本發明較佳實施例之 外引腳接合系統的示意圖。外引腳接合系統2 0 0,係用以 使突出於例如是TFT-LCD面板25 0,且偏離TFT-LCD面板250 之面板的面方向XI (面方向XI即為TFT-LCD面板250的平面 之法線向量)的帶狀接合封裝積體電路(tape carrier package IC,以下簡稱TCP-IC ) 24 0 可與TFT-LCD 面板250 接合。(如第1圖所繪示,TCP-IC 140的面方向X〇 (面方 向X0即為TCP-1C 140的平面之法線向量)即偏離TFT-LCD 面板150之面方向XI。亦即,面方向χ〇與面方向XI的方向 不同。) 外引腳接合系統2 0 0主要包括有機台220、台執210、 熱壓機230以及吹氣裝置260。熱壓機230則具有支撐座 230a與熱壓頭230b。 機台220係設置於台軌210上,且機台220係用以承載 TFT-LCD面板250。熱壓機23 0的支撐座230a係與機台220相 對,且熱壓頭230b係設置於支撐座230a上方。吹氣裝置 2 6 0中之例如是壓縮機2 7 0的氣壓源係設置於機台2 2 0中, 壓縮機270係用以提供氣源,以提供吹氣裝置260使用。而 管件280則係設置於機台220上。 機台220係可沿台軌2 10將TCP-1C 240送入支撐座230a 與熱壓頭230b之間,使熱壓頭230b可壓著TCP-IC 240,以 令TCP-IC 240可與TFT-LCD面板2 5 0接合。92127TW-Amendment.ptc Page 9 1232332 __ Case No. 92115915_ Year Month _ ^ __ V. Description of the Invention (5) [Embodiment] Please refer to FIG. 2A 'It will be shown in accordance with the present invention is better Schematic diagram of a pin bonding system outside the embodiments. The external pin bonding system 200 is used to make the TFT-LCD panel 250 project from the surface direction XI of the panel of the TFT-LCD panel 250 (the surface direction XI is the plane of the TFT-LCD panel 250) A tape carrier package IC (hereinafter referred to as TCP-IC) 24 0 can be bonded to the TFT-LCD panel 250. (As shown in FIG. 1, the plane direction X of the TCP-IC 140 (the plane direction X0 is the normal vector of the plane of the TCP-1C 140) is deviated from the plane direction XI of the TFT-LCD panel 150. That is, The plane direction x0 is different from the plane direction XI.) The outer pin bonding system 2000 mainly includes an organic table 220, a table holder 210, a heat press 230, and an air blowing device 260. The heat press 230 has a support base 230a and a heat head 230b. The machine 220 is disposed on the platform rail 210, and the machine 220 is used to carry the TFT-LCD panel 250. The support base 230a of the heat press 230 is opposite to the machine base 220, and the heat head 230b is disposed above the support base 230a. An air pressure source of the air blowing device 2 600 is, for example, a compressor 2 70, which is provided in the machine 2 20, and a compressor 270 is used to provide an air source for the air blowing device 260. The tube 280 is disposed on the machine 220. The machine 220 can send TCP-1C 240 between the support base 230a and the thermal head 230b along the track 2 10, so that the thermal head 230b can press the TCP-IC 240, so that the TCP-IC 240 can communicate with the TFT. -LCD panel 2 5 0 joint.

92127TW·修正.ptc 第10頁 1232332 _案號92115915_年月日__ 五、發明說明(6)92127TW · Amendment.ptc Page 10 1232332 _Case No. 92115915_year month__ V. Description of the invention (6)

請同時參照第2A圖與第2B圖,第2B圖其所繪示乃第2A 圖中部分元件與裝置的俯視圖。吹氣裝置2 6 0的管件2 8 0係 具有多個開孔285,且管件280係透過管路275連通至壓縮 機2 70,使氣源可由開孔28 5排出,而可提供氣流施力pi予 偏離面方向XI的TCP-1C 240 (TCP-IC 240偏離面方向XI的 含意即為:TCP-1C 24 0的平面之法線向量與TFT-LCD面板 2 5 0的平面之法線向量,二平面之法線向量在方向上不 同。以下所論及者,意義皆同。),使機台220將TCP-1CPlease refer to FIG. 2A and FIG. 2B at the same time. FIG. 2B is a top view of some components and devices in FIG. 2A. The pipe fitting 2 8 0 of the air blowing device 2 60 has a plurality of openings 285, and the pipe fitting 280 is connected to the compressor 2 70 through a pipe 275, so that the air source can be discharged through the opening 28 5 and can provide air force. pi 予 TCP-1C 240 deviating from plane direction XI (TCP-IC 240 means deviating from plane direction XI means: TCP-1C 24 0 plane normal vector and TFT-LCD panel 2 5 0 plane normal vector , The normal vectors of the two planes are different in directions. The meanings mentioned below are the same.), So that the machine 220 converts TCP-1C

240送入支撐座230a與熱壓頭230b之間的過程中,TCP-IC 240不會觸碰到熱壓機230。 值得注意的是,氣壓源除了可以是壓縮機2 7 〇外,亦 可以是鼓風機等可用以提供氣壓的裝置。管件28〇可以運 用可調整開孔285之朝向的方式設置於機台22〇上。而開孔 285的最佳朝向,以管件28〇可將Tcp—IC 24〇吹向趨於面方 向XI ’使隨機台220被送往熱壓機2 30的TCP-1C 240不會碰 觸到熱壓機230為目的。而壓縮機270並不限定只能設置於 機台220中,壓縮機270亦可以設置於外引腳接合系統2〇q 中的其他任何地方。The TCP-IC 240 does not touch the heat press 230 during the 240 feeding process between the support base 230a and the heat head 230b. It is worth noting that in addition to the compressor 270, the air pressure source can also be a device such as a blower that can provide air pressure. The pipe fitting 28 can be arranged on the machine table 22 by adjusting the orientation of the opening 285. The best orientation of the opening 285 is to use the pipe 28 to blow the Tcp-IC 24 to the direction XI 'so that the random station 220 is sent to the TCP-1C 240 of the hot press 2 30 without touching it. The purpose of the hot press 230 is. The compressor 270 is not limited to being installed in the machine 220, and the compressor 270 may also be installed anywhere in the external pin bonding system 20q.

通常的情況是,因為TCP_ IC 24〇上具有需承載的驅3 積體電路,且因TCP-IC 240的厚度較薄,故TCP_IC 24〇1 有下垂的現象,使TCP_IC 24〇易偏離TFT一LCD面板25〇的^ 方向XI。但是,本發明之内引腳接合系統2〇〇並不獨只能 :決T;p-ic 240於向下垂時的情況,任何偏離面方向xu 情況(例如TCP-IC 240為向上翹時的情況),均能利用;In general, because TCP_IC 24〇 has a driver 3 integrated circuit that needs to be carried, and because the thickness of TCP-IC 240 is thin, TCP_IC 24〇1 has a sagging phenomenon, which makes TCP_IC 24〇 easily deviate from TFT. ^ Direction XI of the LCD panel 25. However, the pin-bonding system 2000 in the present invention is not unique: the situation when p-ic 240 sags downward, any deviation from the plane direction xu (such as when TCP-IC 240 is upturned) ), Can be used;

1232332 修正 案號 92115915 五、發明說明(7) 發明之内引腳接合系統2 〇 〇來加以解決。 第2A圖中所繪示之吹氣裝置260的設置位置,亦不獨 只成设置於機台2 2 0上,設置於任意位置,且可使本發明 之内引腳接合系統達成本發明之功效者皆可。請參照第3 圖’其所繪示乃内引腳接合系統的吹氣裝置設置於熱壓機 之一側的示意圖。於第2 A圖中,吹氣裝置2 6 〇係設置於機 台220上。第3圖中所繪示之吹氣裝置360,係設置於靠近 熱壓機33 0的一側(可設置於支撐座33〇a之一側)。管件 3 8 0的結構係與第2 A圖中之管件2 8 0的結構相同,亦即,管 件380係具有多個開孔385,且管件380係透過管路375連通 至例如是壓縮機370的氣壓源。使氣源可由開孔385排出而 可提供氣流施力F2予偏離面方向X2的TCP-1C 340,使機台 32 0將TCP-1C 340送入支撐座330a與熱壓頭330b之間的過 程中,TCP-1C 340不會觸碰到熱壓機330。 上述之吹氣裝置3 6 0,亦可以吸氣裝置取代。請參照 第4圖’其所繪示乃内引腳接合系統的吸氣裝置設置於熱 壓機之一側的示意圖。於第3圖中的吹氣裝置3 6 〇,可以如 第4圖中所繪示的吸氣裝置4 6 0加以取代。亦即,吸氣裝置 460係設置於靠近熱壓機430的一側(可設置於熱壓頭430b 之一側)。吸氣裝置46 0的結構亦與第2A圖中之吹氣裝置 2 6 0的結構相同,所不同的地方,僅在於吹氣裝置2 6 〇係以 吹氣的方式提供TCP-1C 240氣流施力F1,而吸氣裝置460 則係以吸氣的方式提供TCP-1C 440氣流施力F3。與第3圖 中的管件380相同,管件480係具有多個開孔485,且吸氣 件4 6 0係透過1232332 Amendment No. 92115915 V. Description of the invention (7) The pin bonding system within the invention is to be solved. The installation position of the air blowing device 260 shown in FIG. 2A is not only set on the machine 2 2 0, but also at any position, and can make the lead bonding system in the present invention achieve the effect of the invention. Anyone can. Please refer to Fig. 3 ', which shows a schematic view of the air blowing device of the internal pin bonding system installed on one side of the hot press. In FIG. 2A, the blowing device 26 is installed on the machine 220. The air blowing device 360 shown in FIG. 3 is disposed on the side close to the heat press 33 0 (it may be disposed on one side of the support base 33 0a). The structure of the pipe fitting 380 is the same as the structure of the pipe fitting 280 in FIG. 2A, that is, the pipe fitting 380 has a plurality of openings 385, and the pipe fitting 380 is connected to the compressor 370 through a pipe 375, for example. Pressure source. The process of making the air source be discharged from the opening 385 and providing the airflow force F2 to the TCP-1C 340 that deviates from the plane direction X2, so that the machine 32 0 sends the TCP-1C 340 into the support seat 330a and the thermal head 330b In the middle, TCP-1C 340 does not touch the heat press 330. The above-mentioned air blowing device 360 can also be replaced by an air suction device. Please refer to FIG. 4 ′, which shows a schematic diagram of the air-intake device of the internal pin bonding system disposed on one side of the heat press. The blowing device 3 6 0 in FIG. 3 may be replaced by the suction device 4 6 0 shown in FIG. 4. That is, the suction device 460 is disposed on a side close to the heat press 430 (may be disposed on one side of the heat head 430b). The structure of the suction device 46 0 is also the same as the structure of the blowing device 26 0 in FIG. 2A, except that the blowing device 2 6 〇 provides TCP-1C 240 air flow application by blowing. Force F1, and the suction device 460 provides TCP-1C 440 airflow force F3 by suction. Similar to the pipe fitting 380 in Fig. 3, the pipe fitting 480 has a plurality of openings 485, and the suction member 460 is transparent.

92127T1V-修正.Ptc 第12頁 1232332 --------案 5虎 92115915___壬_^_S_修正___ 五、發明說明(8) 官路475連通至例如是真空幫浦470的真空源。使負壓氣源 可、經由開孔485流動而可提供氣流施力F3予偏離面方向X3 的TCP-IC 440,使機台42 0將TCP-IC 440送入支撐座430a 與熱壓頭430b之間的過程中,TCP-1C 440不會觸碰到熱壓 機43 0。而上述之真空源除了可以是真空幫浦4 7〇外,亦可 以是鼓風機。 第2圖、第3圖與第4圖中的壓縮機270、壓縮機370與 真空幫浦4 7 0不限制只能設置於機台2 2 0、機台3 2 0及機台 420中。壓縮機270、壓縮機370與真空幫浦470係可分別設 置於外引腳接合系統2 0 0 '外引腳接合系統30 0與外引腳接 合系統4 0 0中的任意位置。並且,上述之外引腳接合系統 20 0、外引腳接合系統3〇〇與外引腳接合系統4〇〇,更可包 括有台執210、310與410,機台220、320與420係分別設置 於台軌210、310、410上,且可分別沿台執210、310、410 分別將TCP-1C 240、340、440分別送入支撐座230a、 330a、43 0a 與熱壓頭 230b、330b、430b 之間。 上述本發明之外引腳接合系統200、300與400,係可 用於帶狀自動接合製程(tape automated bonding, TAB)與晶粒-軟板接合製程(chip 〇n film,C0F)。 以下係另外提出本發明之外引腳接合的方法。請同時 參照第2 A圖與第5圖,第5圖其所繪示乃本發明較佳實施例 之外引腳接合的方法之流程圖。第5圖中之外引腳接合的 方法,係用以使突出於例如是TFT-LCD面板2 50的面板,且 偏離TFT-LCD面板2 50的面方向XI的TCP-1C 240可與TFT-92127T1V-correction. Ptc page 121232332 -------- case 5 tiger 92115915 ___ ___S_ amendment ___ 5. Description of the invention (8) The official road 475 is connected to the vacuum of the vacuum pump 470, for example source. Allow the negative pressure air source to flow through the opening 485 to provide the airflow force F3 to the TCP-IC 440 that deviates from the plane direction X3, and make the machine 42 0 send the TCP-IC 440 into the support base 430a and the thermal head 430b. In the process, TCP-1C 440 will not touch the heat press 43 0. The above vacuum source can be a vacuum pump 470 or a blower. The compressor 270, compressor 370, and vacuum pump 4 70 in FIGS. 2, 3, and 4 are not limited to being installed in the machine 2 20, the machine 3 2 0, and the machine 420. The compressor 270, the compressor 370, and the vacuum pump 470 series can be respectively placed in any of the external pin bonding system 2000 'and the external pin bonding system 300' and the external pin bonding system 400 '. In addition, the above-mentioned external pin bonding system 200, external pin bonding system 300, and external pin bonding system 400 may further include Taiwan executives 210, 310, and 410, and machines 220, 320, and 420. They are set on the platform rails 210, 310, and 410, respectively. TCP-1C 240, 340, and 440 can be sent to the support bases 230a, 330a, 43 0a, and thermal heads 230b, 230a, 330a, and 440, respectively, along the platform holders 210, 310, and 410, respectively. 330b, 430b. The above-mentioned lead bonding systems 200, 300 and 400 outside the present invention are applicable to tape automated bonding (TAB) and die-to-chip bonding (chip ONF). The following is a method of pin bonding other than the present invention. Please refer to FIG. 2A and FIG. 5 at the same time. FIG. 5 shows a flowchart of the pin bonding method outside the preferred embodiment of the present invention. The method of pin bonding outside of FIG. 5 is used to make a panel protruding from, for example, the TFT-LCD panel 2 50, and away from the surface direction XI of the TFT-LCD panel 2 50.

92127T1V-修正.ptc 第13頁 1232332 ---_案號 92115915_年 月_a_修正_ 五、發明說明(9) L C D面板2 5 0接合。此外引腳接合的方法主要包括以下步 驟:於步驟5 0 0中,開始TCP-1C 24 0與TFT-LCD面板2 5 0的 接合。接著,於步驟510中,移動TFT-LCD面板2 50朝向具 有支撐座230a與熱壓頭230b的熱壓機230行進。然後,於 步驟520甲,提供氣流施力F1予偏離面方向XI的了(^-1(: 240,使將TCP-IC 240送入支撐座2 30a與熱壓頭230b之間 的過程中,TCP-1C 240不會觸碰到熱壓機23 0。之後,於 步驟53 0中,透過熱壓頭230b壓著TCP-1C 240,以令TCP-1C 240與TFT-LCD面板250接合。最後,於步驟54〇中, TCP-IC 240與TFT-LCD面板250的接合即告完成。 因此’由上述之實施例可知,本發明所揭露之外引腳 接合糸統及外引腳接合之方法,至少具有之優點為:於 TAB或是COF的製程中,本發明之外引腳接合系統的機台, 於載送TFT-LCD面板朝向熱壓機前進的過程中,因有吹/吸 氣裝置的作用’使得突出於TFT-LCD面板且偏離Tj?T-LCD面 板之面方向的TCP-1C (例如TCP-1C為下垂的情況)不致觸 碰到熱壓機。此將使得TCP-1C不會因觸碰到支撐座,而使 TCP-1C折損,甚或使得TCP-1C上的驅動積體電路損毀,造 成TFT-LCD面板無法再使用,因而影響TFT — LCD整體的製 程。進一步造成廠商鉅大的損失,使得製造成本增加。 綜上所述,雖然本發明已以實施例揭露如上,然盆 非用以限定本發明,任何熟習此技藝者,I不脫離:發明 之精神和範圍内,當可作各種之更動與潤飾,因此ς 之保護範圍當視後附之申請專利範圍所界定者為準。又92127T1V-correction.ptc page 13 1232332 ---_ case number 92115915_year month_a_correction__ 5. Description of the invention (9) L C D panel 2 5 0 joint. In addition, the pin bonding method mainly includes the following steps: In step 500, the bonding of TCP-1C 240 and the TFT-LCD panel 250 is started. Next, in step 510, the mobile TFT-LCD panel 250 is moved toward the heat press 230 having the support base 230a and the heat head 230b. Then, in step 520A, the airflow force F1 is provided to deviate from the plane direction XI (^ -1 (: 240, so that the TCP-IC 240 is sent into the process between the support seat 2 30a and the thermal head 230b, The TCP-1C 240 does not touch the heat press 23 0. After that, in step 53 0, the TCP-1C 240 is pressed by the heat head 230b to connect the TCP-1C 240 with the TFT-LCD panel 250. Finally In step 54, the joining of the TCP-IC 240 and the TFT-LCD panel 250 is completed. Therefore, according to the above-mentioned embodiment, it is known that the external pin bonding system and the external pin bonding method disclosed in the present invention At least, it has the advantage that, in the process of TAB or COF, the machine of the pin bonding system other than the present invention, during the process of carrying the TFT-LCD panel toward the hot press, due to blowing / suction The function of the device is such that the TCP-1C protruding from the TFT-LCD panel and deviating from the surface direction of the Tj? T-LCD panel (for example, when the TCP-1C is sagging) will not touch the hot press. This will make TCP-1C Will not damage TCP-1C due to touching the support base, or even damage the driver integrated circuit on TCP-1C, making the TFT-LCD panel unusable Therefore, it affects the overall manufacturing process of TFT-LCD. It further causes huge losses to manufacturers and increases manufacturing costs. In summary, although the present invention has been disclosed as above with the embodiments, it is not intended to limit the present invention. Anyone familiar with this technology However, I do not leave: within the spirit and scope of the invention, various modifications and retouching can be made, so the scope of protection shall be determined by the scope of the attached patent application.

921271^-修正.ptc 第14頁 1232332 _案號92115915_年月日_魅_ 圖式簡單說明 【圖式簡單說明】 第1圖繪示乃傳統之外引腳接合系統的示意圖。 第2 A圖繪示乃依照本發明較佳實施例之外引腳接合系 統的不意圖。 第2B圖繪示乃第2A圖中部分元件與裝置的俯視圖。 第3圖繪示乃外引腳接合系統的吹氣裝置設置於熱壓 機之一側的示意圖。 第4圖繪示乃外引腳接合系統的吸氣裝置設置於熱壓 機之一側的示意圖。 第5圖繪示乃本發明較佳實施例之外引腳接合的方法 之流程圖。 圖式標號說明 100 、2 0 0 、3 0 0 、40 0 :夕卜引腳接合系統 110、210、310、410 :台軌 120 、 220 、 320 、 420 :機台 130、230、330、430 :熱壓機 130a、230a、3 3 0a、43 0a :支撐座 130b、230b、330b、43 0b :熱壓頭921271 ^ -Rev.ptc Page 14 1232332 _Case No. 92159915_Year Month and Day_Charm_ Brief Description of the Drawings [Simplified Description of the Drawings] Figure 1 shows a schematic diagram of a conventional pin bonding system. FIG. 2A shows the intention of the pin bonding system outside the preferred embodiment of the present invention. Figure 2B is a top view of some components and devices in Figure 2A. Fig. 3 is a schematic view showing that the blowing device of the external pin bonding system is arranged on one side of the hot press. Fig. 4 is a schematic view showing that the suction device of the outer pin bonding system is arranged on one side of the heat press. FIG. 5 is a flowchart of a pin bonding method outside the preferred embodiment of the present invention. Description of drawing symbols 100, 2 0, 3 0 0, 40 0: Xibu pin bonding system 110, 210, 310, 410: table rail 120, 220, 320, 420: machine 130, 230, 330, 430 : Hot presses 130a, 230a, 3 3 0a, 43 0a: Support bases 130b, 230b, 330b, 43 0b: Hot press

140 、 240 、 340 、 440 : TCP-IC 150、2 5 0 : TFT-LCD 面板 X0 、 XI 、 X2 、 X3 :面方向 2 6 0、3 6 0 :吹氣裝置 2 7 0、3 7 0 :壓縮機140, 240, 340, 440: TCP-IC 150, 2 5 0: TFT-LCD panel X0, XI, X2, X3: plane direction 2 6 0, 3 6 0: air blowing device 2 7 0, 3 7 0: compressor

921271-修正.ptc 第15頁 1232332921271-fix.ptc page 15 1232332

921271^-修正.ptc 第16頁921271 ^ -Fix.ptc Page 16

Claims (1)

93. 10. 15 案號 92115915 身·、申通專利載g 年月日_ 1· 一 種外引腳接合(outer leaded bonding,〇LB) 系統’用以使突出一面板且偏離該面板之一面方向之一帶 狀接合封裝積體電路(tape carrier package 1C,TCP-I C )可與該面板接合,該外引腳接合系統至少包括: 一機台,用以承載該面板; 一熱壓機,具有一支撐座與一熱壓頭,,該機台用以 將該帶狀接合封裝積體電路送入該支撐座與該熱壓頭之 間’使該熱壓頭可壓著該帶狀接合封裝積體電路,以令該 帶狀接合封裝積體電路可與該面板接合;以及 一吹氣裝置,包括: 一氣壓源,設置於該外引腳接合系統中,該氣壓 源係用以提供一氣源;及 一管件,設置於該機台上’該管件係具有複數個 開孔’且該管件係連通至該氣壓源’使該氣源可由該開孔 排出而可提供一氣流施力予偏離該面方向之該帶狀接合封 裝積體電路,使該機台將該帶狀接合封裝積體電路送入該 支撑座與該熱壓頭之間的過程中,該帶狀接合封裴積體電 路不會觸碰到該熱壓機。 2 ·如申請專利範圍第1項所述之外引腳接合系統,复 中該管件係以可調整該開孔之朝向的方式設置於該機a、 3 ·如申請專利範圍第1項所述之外引腳接合系统,复 中該氣壓源係設置於該機台中。 ^ 4 ·如申請專利範圍第1項所述之外引腳接合系統, ,其93. 10. 15 Case No. 92115915 Applicable to Shentong Patent __ 1 · An outer leaded bonding (〇LB) system is used to project a panel and deviate from the direction of one side of the panel. A tape carrier package 1C (TCP-I C) can be bonded to the panel. The external pin bonding system includes at least: a machine for carrying the panel; a heat press machine having A support base and a thermal head, the machine is used to send the tape-shaped joint packaging integrated circuit between the support base and the thermal head, so that the thermal head can press the belt-shaped joint package. An integrated circuit so that the tape-bonded package integrated circuit can be bonded to the panel; and an air blowing device including: a pressure source provided in the external pin bonding system, the pressure source is used to provide a A gas source; and a pipe fitting provided on the machine 'the pipe fitting has a plurality of openings' and the pipe fitting is connected to the pressure source' so that the gas source can be discharged from the opening and can provide an airflow force to deviate from the Face-to-face strip bonding package Circuits of the machine joining the band-shaped stage integrated circuit package into the process between the thermal head to the support base, the sealing strip engages Pei integrated circuit does not touch the hot press. 2 · As for the pin bonding system described in item 1 of the scope of patent application, the pipe fitting is set on the machine a, 3 so that the direction of the opening can be adjusted. · As described in item 1 of the scope of patent application Outside the pin bonding system, the air pressure source is set in the machine. ^ 4 · Pin-bonding system as described in item 1 of the scope of patent application, 1232332 _案號92115915_年月日__^正 六、申請專利範圍 中該外引腳接合系統係用於帶狀自動接合製程( automated bonding , TAB ) 〇 5 ·如申請專利範圍第1項所述之外引腳接合系統,其 中該外引腳接合系統係用於晶粒-軟板接合製程(chip二 film , COF )。 6 ·如申請專利範圍第1項所述之外引腳接合系統,其 中該氣壓源係一壓縮機(compressor)。 7·如申請專利範圍第1項所述之外引腳接合系統,其 中該氣壓源係一鼓風機(blower)。 8.如申請專利範圍第1項所述之外引腳接合系統,其 中該面板係薄膜電晶體液晶顯示器面板(TFT —lcd ’、 pane 1 ) ° 9·如申請專利範圍第1項所述之外引腳接合系統,其 中更包括一台執,該機台係設置於該台執上且可沿該台執 將該帶狀接合封裝積體電路送入該支撐座與該熱壓頭之 ^ ° ..... 10· 一種外引腳接合系統,用以使突出一面板且偏離 該面板之一面方向之一帶狀接合封裝積體電路可與該面板 接合,該外引腳接合系統至少包括: 一機台,用以承載該面板; 一熱壓機,具有一支撐座與一熱壓頭,該機台用以將 該帶狀接合封裝積體電路送入該支撐座與該熱壓頭之間, 使該熱壓頭可壓著該帶狀接合封裝積體電路,以令該帶狀 接合封裝積體電路可與該面板接合;以及1232332 _Case No. 92115915_Year Month Date __ ^ Sixth, in the scope of the patent application, the outer pin bonding system is used for the automated belt bonding process (TAB). 〇5 As described in the first patent application scope An external pin bonding system, wherein the external pin bonding system is used in a die-flex board bonding process (chip two film, COF). 6 The pin bonding system as described in item 1 of the patent application scope, wherein the air pressure source is a compressor. 7. The pin bonding system described in item 1 of the scope of patent application, wherein the air pressure source is a blower. 8. The pin bonding system as described in item 1 of the scope of patent application, wherein the panel is a thin film transistor liquid crystal display panel (TFT-lcd ', pane 1) ° 9 · As described in item 1 of the scope of patent application The external pin bonding system further includes a holder, and the machine is arranged on the holder and the strip-shaped joint package integrated circuit can be sent to the support base and the thermal head along the holder. ° ..... 10 · An outer pin bonding system, which is used to enable a strip-bonding package integrated circuit protruding from a panel and deviating from one side direction of the panel to be bonded to the panel. The outer pin bonding system is at least Including: a machine for carrying the panel; a heat press with a support base and a heat head, the machine is used to send the strip-shaped joint package integrated circuit into the support base and the heat press Between the heads, so that the thermal head can be pressed against the tape-shaped junction package integrated circuit, so that the tape-shaped junction package integrated circuit can be bonded with the panel; and 1232332 -SS__92U5915 修正一 月 曰 六、申請專利範圍 一吹氣裝置,包括·· 一氣麼源,設置於該外引腳接合系統中,該壓縮 機係用以提供一氣源;及 ” 、 一管件,設置於靠近該熱壓機之一側,該管件係 /、、复數個開孔’且遠管件係連通至該氣壓源,使該氣源 Z由該開孔排出而可提供一氣流施力予偏離該面方向之該 π狀彳妾合封裝積體電路,使該機台將該帶狀接合封裝積體 電路送入該支樓座與該熱壓頭之間的過程中,該帶狀接人 封裝積體電路不會觸碰到該熱壓機。 口 11·如申請專利範圍第1 〇項所述之外引腳接合系統, 其中該軋壓源係設置於該機台中。 12·如申請專利範圍第丨〇項所述之外引腳接合系統, 其中该外引腳接合系統係用於帶狀自動接合製程。 13·如申請專利範圍第丨0項所述之外引腳接合系統, 其中該外引腳接合系統係用於晶粒-軟板接合製程。 14·如申請專利範圍第丨〇項所述之外引腳接合系統, 其中該氣壓源係一壓縮機(c〇mpreSsor)。 15·如申請專利範圍第丨〇項所述之外引腳接合系統, 其中該氣壓源係一鼓風機(bi〇wer)。 16·如申請專利範圍第丨〇項所述之外引腳接合系統, 其中該面板係薄膜電晶體液晶顯系器面板。 17·如申請專利範圍第丨〇項所述之外引腳接合系統, 其中更包括一台執,該機台係設置於該台執上且可沿該台 軌將該帶狀接合封裝積體電路送入該支撐座與該熱壓頭之1232332 -SS__92U5915 Amendment on January 6th, patent application scope of an air blowing device, including ... an air source, set in the outer pin joint system, the compressor is used to provide an air source; and a pipe fitting Is located near one side of the hot press, the pipe system /, a plurality of openings, and the remote pipe system is connected to the air pressure source, so that the air source Z is exhausted from the opening and can provide an air force to deviate The π-shaped coupling packaged integrated circuit in the direction of the plane causes the machine to send the tape-shaped bonded packaged integrated circuit into the process between the support and the thermal head. The packaged integrated circuit will not touch the hot press. Port 11 · The pin bonding system described in item 10 of the patent application scope, wherein the rolling source is set in the machine. 12 · If applied The out-of-lead bonding system described in the scope of the patent No. 丨 0, wherein the out-of-lead bonding system is used for the strip-shaped automatic bonding process. The external pin bonding system is used for die -Flexible board bonding process. 14. The pin bonding system as described in item No. 0 of the scope of the patent application, wherein the air pressure source is a compressor (commperSsor). The external pin-bonding system described above, wherein the air pressure source is a blower. 16. The external pin-bonding system as described in the patent application No. 丨 0, wherein the panel is a thin film transistor liquid crystal display system 17. The pin-bonding system described in item No. 丨 0 of the scope of patent application, which further includes a holder, which is arranged on the holder and can be connected along the rail along the band. The packaged integrated circuit is fed into the support base and the thermal head 921271^·修正.ptc 第19頁 1232332921271 ^. Correction.ptc Page 19 1232332 _案號 92115915 六、申請專利範圍 間。 18· 一種外引腳接合系統,用以使突出一面板且偏離 該面板之一面方向之一帶狀接合封裝積體電路可與該面板 接合’該外引腳接合糸統至少包括: 一機台,用以承載該面板;_ Case No. 92115915 6. Between patent applications. 18. · An external pin bonding system for enabling a strip-bonding package integrated circuit protruding from a panel and deviating from one face direction of the panel to be bonded to the panel. The external pin bonding system includes at least: a machine To carry the panel; 一熱壓機’具有一支撐座與一熱壓頭,該機台用以將 該帶狀接合封裝積體電路送入該支撐座與該熱壓頭之間, 使該熱壓頭可壓著該帶狀接合封裝積體電路,以令該帶狀 接合封裝積體電路可與該面板接合;以及 一吸氣裝置,包括: 一真空源,設置於該外引腳接合系統中,該真空 源係用以提供一負壓氣源;及 一管件,設置於靠近該熱壓機之一側,該管件係 具有複數個開孔,且該管件係連通至該真空源’使該負壓 氣源可提供一氣流施力予偏離該面方向之該帶狀接合封裝 積體電路,使該機台將該帶狀接合封裝積體電路送入該支 撐座與該熱壓頭之間的過程中,該帶狀接合封裝積體電路 不會觸碰到該熱壓機。A thermal press' has a support base and a thermal head, and the machine is used to send the strip-shaped joint package integrated circuit between the support base and the thermal head so that the thermal head can be pressed. The tape-bonded package integrated circuit, so that the tape-bonded package integrated circuit can be bonded to the panel; and a suction device, including: a vacuum source disposed in the outer pin bonding system, the vacuum source It is used to provide a negative pressure air source; and a tube is arranged near one side of the hot press, the tube has a plurality of openings, and the tube is connected to the vacuum source to make the negative pressure air source An air current can be provided to the tape-shaped joint package integrated circuit deviating from the plane direction, so that the machine can send the tape-shaped joint package integrated circuit into the process between the support base and the thermal head. The shape-joint packaged integrated circuit does not touch the hot press. 19·如申請專利範圍第丨8項所述之外引腳接合系統, 其中該真空源係設置於該機台中。 2 0 ·如申請專利範圍第丨8項所述之外引腳接a系、洗 其中該外引腳接合系統係用於帶狀自動接合製程。/ 21 ·如申請專利範圍第1 8項所述之外引腳接/糸、 其中該外引腳接合系統係用於晶粒-軟板接合製程。19. The pin bonding system described in item 8 of the patent application scope, wherein the vacuum source is set in the machine. 2 0 The external lead bonding system is described in item 8 of the patent application scope, and the external lead bonding system is used for a strip-shaped automatic bonding process. / 21 · As described in the 18th item of the patent application scope, the outer pin bonding system is used for the die-flex board bonding process. 92127T1V-修正.ptc 第20頁 123233292127T1V-fix.ptc page 20 1232332 修正 1 2 2·如申請專利範圍第丨8項所述之外引腳接合系統, 其中该真空源係一真空幫浦(vacuum pump )。 2 3·如申請專利範圍第丨8項所述之外引腳接合系統, '、中該真空源係一鼓風機(b 1 〇 w e r )。 2 4 ·如申請專利範圍第丨8項所述之外引腳接合系統, 其中該面板係薄膜電晶體液晶顯示器面板。 2 5·如申請專利範圍第丨8項所述之外引腳接合系統, 其中更包括一台執,該機台係設置於該台執上且可沿該台 執將該帶狀接合封裝積體電路送入該支撐座與該熱壓頭之 間。 一種外引腳接合之方法,用以使突出一面板且偏 離該面板之一面方向之一帶狀接合封裝積體電路可與該面 板接合’該外引腳接合之方法至少包括: 7一移動該面板朝向一具有一支撐座與一熱壓頭之熱壓機 提供一氣流施力予偏離該面方向之該帶狀接合 ,電路,使將該帶狀接合封裝積體電路送入該支樓座= 熱壓頭之間的過程中’肖帶狀接合封襞二 到該熱壓機;以及 电峪不θ觸娅 透過該熱壓機壓著該帶狀接合封袭積體電 帶狀接合封裝積體電路與該面板接合。 7該Amendment 1 2 2 · The pin bonding system described in item 8 of the patent application scope, wherein the vacuum source is a vacuum pump. 2 3. According to the pin bonding system described in item 8 of the scope of the patent application, the vacuum source is a blower (b 1 0 w e r). 24. The pin bonding system described in item 8 of the patent application scope, wherein the panel is a thin film transistor liquid crystal display panel. 2 5 · The pin bonding system described in item 8 of the patent application scope, which further includes a holder, which is set on the holder and can be used to package the strip-shaped joint along the holder. The body circuit is sent between the support base and the thermal head. A method for external pin bonding, used to make a strip-bonding package integrated circuit protruding from a panel and deviating from one surface direction of the panel can be bonded with the panel. The method of external pin bonding includes at least: The panel faces a hot press with a support base and a thermal head to provide an airflow force to the strip-shaped joints and circuits that deviate from the direction of the surface, so that the strip-shaped joint package integrated circuit is sent to the support base = heat During the process between the indenters, 'Shaw-shaped bonding seals were brought to the hot press; and the electric press was not pressed by the hot-press to press the tape-shaped bonding seals, and the electric tape-shaped bonding packages were sealed. The circuit is bonded to the panel. 7 the
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