TWI226298B - Method for positioning a substrate and inspecting apparatus using same - Google Patents
Method for positioning a substrate and inspecting apparatus using same Download PDFInfo
- Publication number
- TWI226298B TWI226298B TW092132587A TW92132587A TWI226298B TW I226298 B TWI226298 B TW I226298B TW 092132587 A TW092132587 A TW 092132587A TW 92132587 A TW92132587 A TW 92132587A TW I226298 B TWI226298 B TW I226298B
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- adsorption
- section
- holding
- alignment
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 412
- 238000000034 method Methods 0.000 title claims abstract description 36
- 230000007246 mechanism Effects 0.000 claims description 116
- 238000001179 sorption measurement Methods 0.000 claims description 76
- 238000007689 inspection Methods 0.000 claims description 47
- 238000012546 transfer Methods 0.000 claims description 22
- 230000003287 optical effect Effects 0.000 claims description 21
- 238000012545 processing Methods 0.000 claims description 14
- 238000003384 imaging method Methods 0.000 claims description 12
- 238000001514 detection method Methods 0.000 claims description 3
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 238000003825 pressing Methods 0.000 abstract description 12
- 230000003028 elevating effect Effects 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 13
- 238000005259 measurement Methods 0.000 description 7
- 238000007664 blowing Methods 0.000 description 6
- 238000005452 bending Methods 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- 238000010276 construction Methods 0.000 description 3
- 238000002789 length control Methods 0.000 description 3
- 238000012423 maintenance Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- ZSLUVFAKFWKJRC-IGMARMGPSA-N 232Th Chemical compound [232Th] ZSLUVFAKFWKJRC-IGMARMGPSA-N 0.000 description 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 241000255925 Diptera Species 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 241000406668 Loxodonta cyclotis Species 0.000 description 1
- 241000238413 Octopus Species 0.000 description 1
- 241000251133 Sphyrna tiburo Species 0.000 description 1
- 229910052776 Thorium Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 239000007779 soft material Substances 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
- 210000000707 wrist Anatomy 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Length Measuring Devices By Optical Means (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002337504 | 2002-11-21 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200424093A TW200424093A (en) | 2004-11-16 |
| TWI226298B true TWI226298B (en) | 2005-01-11 |
Family
ID=35634171
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW092132587A TWI226298B (en) | 2002-11-21 | 2003-11-20 | Method for positioning a substrate and inspecting apparatus using same |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR100582695B1 (ko) |
| TW (1) | TWI226298B (ko) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4642610B2 (ja) * | 2005-09-05 | 2011-03-02 | 東京エレクトロン株式会社 | 基板位置合わせ装置および基板収容ユニット |
| KR100807254B1 (ko) * | 2007-02-28 | 2008-02-28 | 삼성전자주식회사 | 결함 검사 장치 |
| JP2012151418A (ja) * | 2011-01-21 | 2012-08-09 | Topcon Corp | 吸着ステージ |
| CN108962794B (zh) * | 2018-07-20 | 2020-08-21 | 北京北方华创微电子装备有限公司 | 一种升针方法及应用其的顶针升降装置 |
| CN113330273B (zh) * | 2019-01-24 | 2023-11-21 | 株式会社高迎科技 | 检查装置用移送机构、检查装置及利用其的对象物检查方法 |
| KR102304578B1 (ko) * | 2019-12-20 | 2021-09-27 | 주식회사 탑 엔지니어링 | 스크라이빙 장치 |
-
2003
- 2003-11-20 KR KR1020030082468A patent/KR100582695B1/ko active IP Right Grant
- 2003-11-20 TW TW092132587A patent/TWI226298B/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| KR100582695B1 (ko) | 2006-05-23 |
| KR20040045324A (ko) | 2004-06-01 |
| TW200424093A (en) | 2004-11-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US9327488B2 (en) | Alignment method, transfer method and transfer apparatus | |
| TWI517290B (zh) | A substrate position alignment device, a substrate alignment method, and a manufacturing method of a multilayer semiconductor | |
| TWI490478B (zh) | 基板檢驗裝置 | |
| KR102176254B1 (ko) | 본딩 정렬을 위한 디바이스 및 방법 | |
| TWI322479B (en) | Exposing apparatus having substrate chuck of good flatness | |
| JP5353892B2 (ja) | アラインメント装置およびアラインメント方法 | |
| JP2006266722A (ja) | 基板検査システム及び基板検査方法 | |
| JP2009217008A (ja) | ガラスマスクとマスクホルダの位置合わせ装置 | |
| TW201019055A (en) | Exposure device | |
| TWI226298B (en) | Method for positioning a substrate and inspecting apparatus using same | |
| CN1670939A (zh) | 标记方法及标记装置和检查装置 | |
| JP4546066B2 (ja) | 基板の位置決め方法及びこの方法を用いた検査装置 | |
| JP4560898B2 (ja) | 検査装置及び検査方法 | |
| TW201019053A (en) | Proximity exposure device, its mask transportation method, and production method of panel substrates | |
| JPH0194631A (ja) | ウエハプローバ | |
| JP2004325217A (ja) | 搬送装置 | |
| JP2008251944A (ja) | 露光装置 | |
| JP5793410B2 (ja) | パターン形成装置 | |
| JP5473793B2 (ja) | プロキシミティ露光装置、及びプロキシミティ露光装置のギャップ制御方法 | |
| JP2006093604A (ja) | 近接露光装置 | |
| JP5826087B2 (ja) | 転写方法および転写装置 | |
| JP2006066747A (ja) | 基板の位置決め装置及び位置決め方法 | |
| JP5806603B2 (ja) | アライメント装置 | |
| JP2004172480A (ja) | ウェハ検査装置 | |
| KR20220149477A (ko) | 흡착 행거를 포함하는 부품 검사 장치 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MK4A | Expiration of patent term of an invention patent |