TWI221399B - Electronic apparatus - Google Patents

Electronic apparatus Download PDF

Info

Publication number
TWI221399B
TWI221399B TW092100539A TW92100539A TWI221399B TW I221399 B TWI221399 B TW I221399B TW 092100539 A TW092100539 A TW 092100539A TW 92100539 A TW92100539 A TW 92100539A TW I221399 B TWI221399 B TW I221399B
Authority
TW
Taiwan
Prior art keywords
heat
electronic device
groove
display
liquid
Prior art date
Application number
TW092100539A
Other languages
English (en)
Chinese (zh)
Other versions
TW200401599A (en
Inventor
Takashi Naganawa
Shigeo Ohashi
Yoshihiro Kondo
Rintaro Minamitani
Tsuyoshi Nakagawa
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of TW200401599A publication Critical patent/TW200401599A/zh
Application granted granted Critical
Publication of TWI221399B publication Critical patent/TWI221399B/zh

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/203—Cooling means for portable computers, e.g. for laptops
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
TW092100539A 2002-07-15 2003-01-10 Electronic apparatus TWI221399B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002204978A JP2004047843A (ja) 2002-07-15 2002-07-15 電子装置

Publications (2)

Publication Number Publication Date
TW200401599A TW200401599A (en) 2004-01-16
TWI221399B true TWI221399B (en) 2004-09-21

Family

ID=29997154

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092100539A TWI221399B (en) 2002-07-15 2003-01-10 Electronic apparatus

Country Status (4)

Country Link
US (1) US20040008485A1 (enExample)
JP (1) JP2004047843A (enExample)
CN (1) CN1195253C (enExample)
TW (1) TWI221399B (enExample)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3629257B2 (ja) * 2002-08-30 2005-03-16 株式会社東芝 電子機器
JP2004139185A (ja) * 2002-10-15 2004-05-13 Toshiba Corp 電子機器
JP2004139186A (ja) * 2002-10-15 2004-05-13 Toshiba Corp 電子機器
JP2005190091A (ja) * 2003-12-25 2005-07-14 Matsushita Electric Ind Co Ltd 冷却装置およびこれを備えた電子機器
JP4234621B2 (ja) * 2004-02-16 2009-03-04 株式会社日立製作所 液冷システムおよび電子装置
JP2006039663A (ja) * 2004-07-22 2006-02-09 Hitachi Ltd 液循環システム及びこれを用いる液冷システム
JP2006057920A (ja) * 2004-08-20 2006-03-02 Hitachi Ltd 電子機器の液冷システム、及び、これを用いた電子機器
JP2006065940A (ja) * 2004-08-26 2006-03-09 Ricoh Co Ltd 電装冷却装置、画像形成装置
JP2007009787A (ja) * 2005-06-30 2007-01-18 Hitachi Ltd モータ一体型内接歯車式ポンプ及び電子機器
JP2007095902A (ja) * 2005-09-28 2007-04-12 Toshiba Corp 冷却装置および冷却装置を有する電子機器
US20080285226A1 (en) * 2006-01-26 2008-11-20 Fujitsu Limited Electronic device
KR20120135771A (ko) * 2011-06-07 2012-12-17 엘지전자 주식회사 공기 조화기의 실외기 및 그 제어방법
KR102412060B1 (ko) 2017-04-26 2022-06-23 엘지전자 주식회사 냉장고
CN109673128B (zh) * 2017-10-13 2021-02-12 神讯电脑(昆山)有限公司 导热模块及其显示装置和可携式电子装置
CN112714582A (zh) * 2019-10-25 2021-04-27 研能科技股份有限公司 液体散热模块
EP4660746A2 (en) * 2023-02-27 2025-12-10 Samsung Electronics Co., Ltd. Electronic device including thermal hinge assembly

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5566048A (en) * 1994-06-02 1996-10-15 Hewlett-Packard Company Hinge assembly for a device having a display
US5646822A (en) * 1995-08-30 1997-07-08 Intel Corporation Heat pipe exchanger system for cooling a hinged computing device
US5606341A (en) * 1995-10-02 1997-02-25 Ncr Corporation Passive CPU cooling and LCD heating for a laptop computer
US5757615A (en) * 1996-07-01 1998-05-26 Compaq Computer Corporation Liquid cooled computer apparatus and associated methods
JP3518242B2 (ja) * 1997-04-14 2004-04-12 株式会社日立製作所 電子装置
US6069791A (en) * 1997-08-14 2000-05-30 Fujikura Ltd. Cooling device for notebook personal computer
US5953206A (en) * 1997-10-15 1999-09-14 Hewlett-Packard Company Thermal dissipation and EMI shielding structure for notebook computers
US6031716A (en) * 1998-09-08 2000-02-29 International Business Machines Corporation Computer incorporating heat dissipator with hinged heat pipe arrangement for enhanced cooling capacity
EP1162533A4 (en) * 1999-03-11 2007-10-17 Fujitsu Ltd ELECTRICAL DEVICE AND ELECTRICAL PART
US6507488B1 (en) * 1999-04-30 2003-01-14 International Business Machines Corporation Formed hinges with heat pipes
JP2002099356A (ja) * 2000-09-21 2002-04-05 Toshiba Corp 電子機器用冷却装置および電子機器
JP3607608B2 (ja) * 2000-12-19 2005-01-05 株式会社日立製作所 ノート型パソコンの液冷システム
JP2002189535A (ja) * 2000-12-20 2002-07-05 Hitachi Ltd 液冷システムおよびこれを用いたパーソナルコンピュータ
JP2002188876A (ja) * 2000-12-20 2002-07-05 Hitachi Ltd 液冷システムおよびこれを用いたパーソナルコンピュータ
JP2002232174A (ja) * 2001-02-06 2002-08-16 Hitachi Ltd 電子装置
US6587336B2 (en) * 2001-06-27 2003-07-01 International Business Machines Corporation Cooling system for portable electronic and computer devices
JP4512296B2 (ja) * 2001-08-22 2010-07-28 株式会社日立製作所 可搬型情報処理装置の液冷システム

Also Published As

Publication number Publication date
JP2004047843A (ja) 2004-02-12
US20040008485A1 (en) 2004-01-15
CN1195253C (zh) 2005-03-30
CN1469220A (zh) 2004-01-21
TW200401599A (en) 2004-01-16

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees