TWD243492S - 基板處理裝置用充填塊 - Google Patents

基板處理裝置用充填塊

Info

Publication number
TWD243492S
TWD243492S TW113304575F TW113304575F TWD243492S TW D243492 S TWD243492 S TW D243492S TW 113304575 F TW113304575 F TW 113304575F TW 113304575 F TW113304575 F TW 113304575F TW D243492 S TWD243492 S TW D243492S
Authority
TW
Taiwan
Prior art keywords
processing apparatus
substrate processing
filler block
item
accumulation
Prior art date
Application number
TW113304575F
Other languages
English (en)
Chinese (zh)
Inventor
岡嶋優作
Original Assignee
日商國際電氣股份有限公司 (日本)
日商國際電氣股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商國際電氣股份有限公司 (日本), 日商國際電氣股份有限公司 filed Critical 日商國際電氣股份有限公司 (日本)
Publication of TWD243492S publication Critical patent/TWD243492S/zh

Links

TW113304575F 2024-03-08 2024-09-05 基板處理裝置用充填塊 TWD243492S (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2024004871F JP1778590S (https=) 2024-03-08 2024-03-08
JP2024-004871 2024-03-08

Publications (1)

Publication Number Publication Date
TWD243492S true TWD243492S (zh) 2026-03-21

Family

ID=92499660

Family Applications (1)

Application Number Title Priority Date Filing Date
TW113304575F TWD243492S (zh) 2024-03-08 2024-09-05 基板處理裝置用充填塊

Country Status (3)

Country Link
US (1) USD1108381S1 (https=)
JP (1) JP1778590S (https=)
TW (1) TWD243492S (https=)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI610721B (zh) 2015-03-26 2018-01-11 思可林集團股份有限公司 基板處理裝置及處理氣體供給噴嘴

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD326273S (en) * 1988-07-25 1992-05-19 Tel Sagami Limited Heat insulating cylinder for thermal treatment of semiconductor wafers
USD326272S (en) * 1988-07-25 1992-05-19 Tel Sagami Limited Heat insulating cylinder for thermal treatment of semiconductor wafers
JP5661523B2 (ja) * 2011-03-18 2015-01-28 東京エレクトロン株式会社 成膜方法及び成膜装置
US9679751B2 (en) * 2012-03-15 2017-06-13 Lam Research Corporation Chamber filler kit for plasma etch chamber useful for fast gas switching
JP1565116S (https=) * 2016-02-10 2016-12-12
US20180005851A1 (en) * 2016-07-01 2018-01-04 Lam Research Corporation Chamber filler kit for dielectric etch chamber
CN120432376A (zh) * 2019-11-29 2025-08-05 Asm Ip私人控股有限公司 基板处理设备
TW202202649A (zh) * 2020-07-08 2022-01-16 荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 基板處理方法
JP2022054653A (ja) * 2020-09-28 2022-04-07 東京エレクトロン株式会社 凹部埋め込み方法及び基板処理装置
JP1706320S (https=) * 2021-06-28 2022-01-31
JP1706321S (https=) * 2021-06-28 2022-01-31

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI610721B (zh) 2015-03-26 2018-01-11 思可林集團股份有限公司 基板處理裝置及處理氣體供給噴嘴

Also Published As

Publication number Publication date
USD1108381S1 (en) 2026-01-06
JP1778590S (https=) 2024-08-28

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