TWD215716S - Upper shield with showerhead for a process chamber - Google Patents

Upper shield with showerhead for a process chamber Download PDF

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Publication number
TWD215716S
TWD215716S TW109305849F TW109305849F TWD215716S TW D215716 S TWD215716 S TW D215716S TW 109305849 F TW109305849 F TW 109305849F TW 109305849 F TW109305849 F TW 109305849F TW D215716 S TWD215716 S TW D215716S
Authority
TW
Taiwan
Prior art keywords
upper shield
showerhead
design
process chamber
processing chamber
Prior art date
Application number
TW109305849F
Other languages
Chinese (zh)
Inventor
薩拉斯 巴布
安恩克斯納 朱普迪
岳生 歐
魏俊琪
泰銘 莫
康 張
和田優一
Original Assignee
美商應用材料股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 美商應用材料股份有限公司 filed Critical 美商應用材料股份有限公司
Publication of TWD215716S publication Critical patent/TWD215716S/en

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Abstract

【物品用途】;本設計係關於用於處理腔室的具噴頭的上護罩的外觀設計。;【設計說明】;圖式所揭露之虛線部分，為本案不主張設計之部分。【Use of article】;This design is about the appearance design of the upper shield with nozzle used in the processing chamber. ;[Design Description];The dotted line portion disclosed in the drawing is the part of this case that does not require design.

Description

用於處理腔室的具噴頭的上護罩 Upper shield with spray head for processing chamber

本設計係關於用於處理腔室的具噴頭的上護罩的外觀設計。 This design relates to the appearance design of the upper shield with spray head used in the processing chamber.

圖式所揭露之虛線部分，為本案不主張設計之部分。 The dotted line disclosed in the diagram is a part of this case that does not advocate design.

TW109305849F 2020-04-22 2020-10-22 Upper shield with showerhead for a process chamber TWD215716S (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US29/732,229 USD973609S1 (en) 2020-04-22 2020-04-22 Upper shield with showerhead for a process chamber
US29/732,229 2020-04-22

Publications (1)

Publication Number Publication Date
TWD215716S true TWD215716S (en) 2021-12-01

Family

ID=84568644

Family Applications (2)

Application Number Title Priority Date Filing Date
TW109305849F TWD215716S (en) 2020-04-22 2020-10-22 Upper shield with showerhead for a process chamber
TW109305849D01F TWD215717S (en) 2020-04-22 2020-10-22 Upper shield with showerhead for a process chamber

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW109305849D01F TWD215717S (en) 2020-04-22 2020-10-22 Upper shield with showerhead for a process chamber

Country Status (2)

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US (1) USD973609S1 (en)
TW (2) TWD215716S (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP1646504S (en) * 2018-12-06 2019-11-25
JP1646505S (en) * 2018-12-07 2019-11-25

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Publication number Priority date Publication date Assignee Title
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US7147749B2 (en) 2002-09-30 2006-12-12 Tokyo Electron Limited Method and apparatus for an improved upper electrode plate with deposition shield in a plasma processing system
JP4141234B2 (en) * 2002-11-13 2008-08-27 キヤノンアネルバ株式会社 Plasma processing equipment
USD557425S1 (en) * 2005-08-25 2007-12-11 Hitachi High-Technologies Corporation Cover ring for a plasma processing apparatus
US7981262B2 (en) 2007-01-29 2011-07-19 Applied Materials, Inc. Process kit for substrate processing chamber
JP2009088298A (en) * 2007-09-29 2009-04-23 Tokyo Electron Ltd Plasma treatment apparatus and plasma treatment method
USD642605S1 (en) * 2010-04-02 2011-08-02 Applied Materials, Inc. Lid assembly for a substrate processing chamber
USD703160S1 (en) * 2011-01-27 2014-04-22 Hitachi High-Technologies Corporation Grounded electrode for a plasma processing apparatus
US9245717B2 (en) 2011-05-31 2016-01-26 Lam Research Corporation Gas distribution system for ceramic showerhead of plasma etch reactor
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JP1537312S (en) * 2014-11-20 2015-11-09
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JP1551512S (en) * 2015-06-12 2016-06-13
JP1546799S (en) * 2015-06-12 2016-03-28
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JP1584241S (en) * 2017-01-31 2017-08-21
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JP1625994S (en) 2018-04-20 2019-03-04
JP1625995S (en) 2018-04-20 2019-03-04
USD933725S1 (en) * 2019-02-08 2021-10-19 Applied Materials, Inc. Deposition ring for a substrate processing chamber
USD942516S1 (en) * 2019-02-08 2022-02-01 Applied Materials, Inc. Process shield for a substrate processing chamber
USD891382S1 (en) * 2019-02-08 2020-07-28 Applied Materials, Inc. Process shield for a substrate processing chamber
USD913979S1 (en) * 2019-08-28 2021-03-23 Applied Materials, Inc. Inner shield for a substrate processing chamber
USD941371S1 (en) * 2020-03-20 2022-01-18 Applied Materials, Inc. Process shield for a substrate processing chamber
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USD940765S1 (en) * 2020-12-02 2022-01-11 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
US20220223367A1 (en) * 2021-01-12 2022-07-14 Applied Materials, Inc. Reduced substrate process chamber cavity volume

Also Published As

Publication number Publication date
USD973609S1 (en) 2022-12-27
TWD215717S (en) 2021-12-01

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