TWD213830S - Nozzles for liquid ejection - Google Patents
Nozzles for liquid ejection Download PDFInfo
- Publication number
- TWD213830S TWD213830S TW108306619F TW108306619F TWD213830S TW D213830 S TWD213830 S TW D213830S TW 108306619 F TW108306619 F TW 108306619F TW 108306619 F TW108306619 F TW 108306619F TW D213830 S TWD213830 S TW D213830S
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate processing
- article
- liquid ejection
- substrate
- nozzles
- Prior art date
Links
- 239000007788 liquid Substances 0.000 title abstract description 7
- 239000000758 substrate Substances 0.000 abstract description 12
- 239000004065 semiconductor Substances 0.000 abstract description 4
- 238000005530 etching Methods 0.000 abstract description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 230000002093 peripheral effect Effects 0.000 abstract description 2
- 235000012431 wafers Nutrition 0.000 abstract description 2
- 238000000034 method Methods 0.000 abstract 2
Images
Abstract
【物品用途】;本設計物品係使用於基板處理裝置之液體噴吐用噴嘴，該基板處理裝置係於半導體元件等之製程中，藉由對於半導體晶圓等基板供給處理液，而實施蝕刻等既定之基板處理。如同「表示使用狀態之參考圖」所示，本設計物品係安裝於基板處理裝置而使用，並使處理液從本設計物品的前端對於基板之周緣部(斜角部)噴吐而進行該基板處理。;【設計說明】;無。[Use of article]: This designed article is a liquid ejection nozzle used in a substrate processing device that performs etching and other established processes by supplying processing liquid to substrates such as semiconductor wafers in the process of manufacturing semiconductor devices. substrate processing. As shown in the "reference drawing showing the usage state", this designed article is installed and used in a substrate processing device, and the processing liquid is ejected from the front end of the designed article to the peripheral part (bevel part) of the substrate to perform the substrate processing. . ;[Design Description];None.
Description
本設計物品係使用於基板處理裝置之液體噴吐用噴嘴，該基板處理裝置係於半導體元件等之製程中，藉由對於半導體晶圓等基板供給處理液，而實施蝕刻等既定之基板處理。如同「表示使用狀態之參考圖」所示，本設計物品係安裝於基板處理裝置而使用，並使處理液從本設計物品的前端對於基板之周緣部(斜角部)噴吐而進行該基板處理。This design article is used in the liquid ejection nozzle of a substrate processing device, which is used in the manufacturing process of semiconductor devices, etc., by supplying processing liquid to substrates such as semiconductor wafers, and performing predetermined substrate processing such as etching. As shown in the "reference drawing showing the state of use", this design article is installed in a substrate processing device for use, and the processing liquid is sprayed from the tip of this design article to the peripheral edge (beveled portion) of the substrate to perform the substrate processing .
無。without.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPD2019-9324F JP1646388S (en) | 2019-04-25 | 2019-04-25 | |
| JP2019-009324 | 2019-04-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWD213830S true TWD213830S (en) | 2021-09-11 |
Family
ID=68610921
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW108306619F TWD213830S (en) | 2019-04-25 | 2019-10-24 | Nozzles for liquid ejection |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | USD929534S1 (en) |
| JP (1) | JP1646388S (en) |
| TW (1) | TWD213830S (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD960300S1 (en) * | 2019-09-18 | 2022-08-09 | P. Bekkers Holding B.V. | Nozzle for fluid distribution |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD481743S1 (en) | 2001-05-18 | 2003-11-04 | Oy Trail Ab | Nozzle |
| USD771248S1 (en) | 2014-10-01 | 2016-11-08 | Adhezion Biomedical, Llc | Dispensing applicator having a curved elongated nozzle |
| USD783784S1 (en) | 2015-01-30 | 2017-04-11 | Criser, S.A. De C.V. | Nozzle for a drain hose |
| TWI580479B (en) | 2009-04-24 | 2017-05-01 | Musashi Engineering Inc | A nozzle rotating mechanism and a coating device provided with the same |
| USD789790S1 (en) | 2014-04-10 | 2017-06-20 | 3M Innovative Properties Company | Nozzle for syringe |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD341418S (en) * | 1991-02-22 | 1993-11-16 | Tokyo Electron Limited | Supply nozzle for applying liquid resist to a semiconductor wafer |
| USD637267S1 (en) * | 2010-01-27 | 2011-05-03 | Sintokogio, Ltd. | Nozzle for an air blast process |
| USD636845S1 (en) * | 2010-01-27 | 2011-04-26 | Sintokogio, Ltd. | Nozzle for an air blast process |
| USD824966S1 (en) * | 2016-10-14 | 2018-08-07 | Oerlikon Metco (Us) Inc. | Powder injector |
| USD823906S1 (en) * | 2017-04-13 | 2018-07-24 | Oerlikon Metco (Us) Inc. | Powder injector |
| USD906485S1 (en) * | 2017-09-27 | 2020-12-29 | Natural Gas Solutions North America, Llc | Shaft seal |
| USD907744S1 (en) * | 2018-08-01 | 2021-01-12 | Lutz Pumpen Gmbh | Dispenser nozzle |
| USD903836S1 (en) * | 2019-05-29 | 2020-12-01 | Carefusion 303, Inc. | Y-spigot body |
-
2019
- 2019-04-25 JP JPD2019-9324F patent/JP1646388S/ja active Active
- 2019-10-23 US US29/710,426 patent/USD929534S1/en active Active
- 2019-10-24 TW TW108306619F patent/TWD213830S/en unknown
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD481743S1 (en) | 2001-05-18 | 2003-11-04 | Oy Trail Ab | Nozzle |
| TWI580479B (en) | 2009-04-24 | 2017-05-01 | Musashi Engineering Inc | A nozzle rotating mechanism and a coating device provided with the same |
| USD789790S1 (en) | 2014-04-10 | 2017-06-20 | 3M Innovative Properties Company | Nozzle for syringe |
| USD771248S1 (en) | 2014-10-01 | 2016-11-08 | Adhezion Biomedical, Llc | Dispensing applicator having a curved elongated nozzle |
| USD783784S1 (en) | 2015-01-30 | 2017-04-11 | Criser, S.A. De C.V. | Nozzle for a drain hose |
Also Published As
| Publication number | Publication date |
|---|---|
| JP1646388S (en) | 2021-11-15 |
| USD929534S1 (en) | 2021-08-31 |
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