TWD209438S

TWD209438S - Parts of nozzles for liquid ejection

Info

Publication number: TWD209438S
Application number: TW108306622F
Authority: TW
Inventors: 天野嘉文; 相浦一博
Original assignee: 日商東京威力科創股份有限公司
Priority date: 2019-04-25
Filing date: 2019-10-24
Publication date: 2021-01-21
Also published as: USD934991S1; JP1646389S

Abstract

【物品用途】;本設計物品係使用於基板處理裝置的液體噴吐用噴嘴之零件，該基板處理裝置係於半導體元件等之製程中，對於半導體晶圓等基板供給處理液，而實施蝕刻等既定之基板處理。如同「表示使用狀態之參考圖」所示，本設計物品係安裝於基板處理裝置之處理液噴吐用噴嘴的前端而使用，並使處理液從本設計物品的前端對於基板之周緣部(斜角部)噴吐而進行該基板處理。本設計物品欲主張部分設計之部分，為可對於該噴嘴進行本設計物品之安裝、更換的部分。在使用本設計物品時，為防止處理液洩漏，將環部嵌入「裝上環部的狀態之參考前視圖」所示的位置後，將本設計物品安裝至處理液噴吐用噴嘴的端部。;【設計說明】;圖式所揭露之虛線部分，為本案不主張設計之部分；以實線表示之部分，則為欲主張部分設計之部分。[Use of article] This designed article is a part of a liquid ejection nozzle used in a substrate processing device that supplies processing liquid to substrates such as semiconductor wafers and performs etching and other established processes in the process of manufacturing semiconductor devices. substrate processing. As shown in the "Reference Drawing Showing the Used State", this design article is mounted on the front end of the processing liquid ejection nozzle of the substrate processing device, and the processing liquid is directed from the front end of the design article to the peripheral edge (bevel) of the substrate. part) to perform the substrate processing. The part of this design article that is intended to be partially designed is the part where the nozzle can be installed or replaced with this design article. When using this design item, in order to prevent the leakage of the processing fluid, insert the ring part into the position shown in "Reference front view of the state with the ring part attached", and then attach this design object to the end of the nozzle for spraying the processing fluid. ;[Design Description];The dotted line parts disclosed in the drawing are the parts for which design is not advocated in this case; the parts indicated by solid lines are the parts for which partial design is intended to be advocated.

Description

Parts of nozzles for liquid ejection

本設計物品係使用於基板處理裝置的液體噴吐用噴嘴之零件，該基板處理裝置係於半導體元件等之製程中，對於半導體晶圓等基板供給處理液，而實施蝕刻等既定之基板處理。如同「表示使用狀態之參考圖」所示，本設計物品係安裝於基板處理裝置之處理液噴吐用噴嘴的前端而使用，並使處理液從本設計物品的前端對於基板之周緣部(斜角部)噴吐而進行該基板處理。本設計物品欲主張部分設計之部分，為可對於該噴嘴進行本設計物品之安裝、更換的部分。在使用本設計物品時，為防止處理液洩漏，將環部嵌入「裝上環部的狀態之參考前視圖」所示的位置後，將本設計物品安裝至處理液噴吐用噴嘴的端部。This design article is a part of a nozzle for liquid ejection used in a substrate processing apparatus that supplies processing liquid to substrates such as semiconductor wafers during the manufacturing process of semiconductor devices, and performs predetermined substrate processing such as etching. As shown in the "reference drawing showing the state of use", this design article is installed at the tip of the processing liquid ejection nozzle of the substrate processing apparatus and used, and the processing liquid is directed from the tip of the design article to the peripheral edge of the substrate (oblique angle Part) The substrate processing is performed by ejecting. The part of this design article to claim partial design is the part that can be installed and replaced for this nozzle. When using this design, in order to prevent the treatment liquid from leaking, insert the ring into the position shown in "Refer to the front view of the state with the ring installed", and then install this design to the end of the nozzle for discharging treatment liquid.

圖式所揭露之虛線部分，為本案不主張設計之部分；以實線表示之部分，則為欲主張部分設計之部分。The dotted line exposed in the diagram is the part that does not advocate design in this case; the part represented by the solid line is the part that wants to claim partial design.