JP1683121S - Nozzle for liquid ejection - Google Patents

Nozzle for liquid ejection

Info

Publication number
JP1683121S
JP1683121S JP2020011295F JP2020011295F JP1683121S JP 1683121 S JP1683121 S JP 1683121S JP 2020011295 F JP2020011295 F JP 2020011295F JP 2020011295 F JP2020011295 F JP 2020011295F JP 1683121 S JP1683121 S JP 1683121S
Authority
JP
Japan
Prior art keywords
substrate
liquid ejection
article
substrate processing
nozzle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2020011295F
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP2020011295F priority Critical patent/JP1683121S/en
Priority to US29/744,996 priority patent/USD930796S1/en
Priority to TW108306619D01F priority patent/TWD215672S/en
Application granted granted Critical
Publication of JP1683121S publication Critical patent/JP1683121S/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Abstract

本物品は、半導体デバイス等の製造プロセスにおいて、半導体ウェハ等の基板に対し、処理液を供給することによってエッチング等の所定の基板処理を施す基板処理装置に使用する液体吐出用ノズルである。本物品は基板処理装置に取り付けて使用され、基板の周縁部（べベル部）に対して本物品の先端から処理液を吐出させて前記基板処理を行う。This article is a liquid ejection nozzle used in a substrate processing apparatus for performing predetermined substrate processing such as etching by supplying a processing liquid to a substrate such as a semiconductor wafer in the manufacturing process of semiconductor devices and the like. The article is used by being attached to a substrate processing apparatus, and the substrate processing is performed by ejecting the processing liquid from the tip of the article onto the peripheral edge portion (bevel portion) of the substrate.

JP2020011295F 2020-06-08 2020-06-08 Nozzle for liquid ejection Active JP1683121S (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2020011295F JP1683121S (en) 2020-06-08 2020-06-08 Nozzle for liquid ejection
US29/744,996 USD930796S1 (en) 2020-06-08 2020-08-03 Liquid discharge nozzle for semiconductor substrate processing apparatus
TW108306619D01F TWD215672S (en) 2020-06-08 2020-08-04 Nozzle for liquid ejection

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2020011295F JP1683121S (en) 2020-06-08 2020-06-08 Nozzle for liquid ejection

Publications (1)

Publication Number Publication Date
JP1683121S true JP1683121S (en) 2021-04-12

Family

ID=75378233

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020011295F Active JP1683121S (en) 2020-06-08 2020-06-08 Nozzle for liquid ejection

Country Status (3)

Country Link
US (1) USD930796S1 (en)
JP (1) JP1683121S (en)
TW (1) TWD215672S (en)

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD341418S (en) * 1991-02-22 1993-11-16 Tokyo Electron Limited Supply nozzle for applying liquid resist to a semiconductor wafer
USD469790S1 (en) 2001-05-18 2003-02-04 Oy Trial Ab Nozzle
JP5638768B2 (en) 2009-04-24 2014-12-10 武蔵エンジニアリング株式会社 Nozzle rotation mechanism and coating apparatus having the same
USD637267S1 (en) * 2010-01-27 2011-05-03 Sintokogio, Ltd. Nozzle for an air blast process
USD636845S1 (en) * 2010-01-27 2011-04-26 Sintokogio, Ltd. Nozzle for an air blast process
USD774908S1 (en) 2014-04-10 2016-12-27 3M Innovative Properties Company Nozzle for syringe
USD771248S1 (en) 2014-10-01 2016-11-08 Adhezion Biomedical, Llc Dispensing applicator having a curved elongated nozzle
USD783784S1 (en) 2015-01-30 2017-04-11 Criser, S.A. De C.V. Nozzle for a drain hose
USD824966S1 (en) * 2016-10-14 2018-08-07 Oerlikon Metco (Us) Inc. Powder injector
USD823906S1 (en) * 2017-04-13 2018-07-24 Oerlikon Metco (Us) Inc. Powder injector
USD906485S1 (en) * 2017-09-27 2020-12-29 Natural Gas Solutions North America, Llc Shaft seal
USD910145S1 (en) * 2018-08-01 2021-02-09 Lutz Pumpen Gmbh Dispenser nozzle
USD903836S1 (en) * 2019-05-29 2020-12-01 Carefusion 303, Inc. Y-spigot body

Also Published As

Publication number Publication date
TWD215672S (en) 2021-12-01
USD930796S1 (en) 2021-09-14

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