TWD183005S - 半導體製造裝置之隔熱組件外罩 - Google Patents

半導體製造裝置之隔熱組件外罩

Info

Publication number
TWD183005S
TWD183005S TW105304350F TW105304350F TWD183005S TW D183005 S TWD183005 S TW D183005S TW 105304350 F TW105304350 F TW 105304350F TW 105304350 F TW105304350 F TW 105304350F TW D183005 S TWD183005 S TW D183005S
Authority
TW
Taiwan
Prior art keywords
semiconductor manufacturing
article
insulating component
thermal insulation
outer cover
Prior art date
Application number
TW105304350F
Other languages
English (en)
Chinese (zh)
Inventor
Takatomo Yamaguchi
Original Assignee
日立國際電氣股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日立國際電氣股份有限公司 filed Critical 日立國際電氣股份有限公司
Publication of TWD183005S publication Critical patent/TWD183005S/zh

Links

TW105304350F 2016-02-10 2016-07-28 半導體製造裝置之隔熱組件外罩 TWD183005S (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JPD2016-2843F JP1565116S (cs) 2016-02-10 2016-02-10

Publications (1)

Publication Number Publication Date
TWD183005S true TWD183005S (zh) 2017-05-11

Family

ID=57482774

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105304350F TWD183005S (zh) 2016-02-10 2016-07-28 半導體製造裝置之隔熱組件外罩

Country Status (3)

Country Link
US (1) USD818961S1 (cs)
JP (1) JP1565116S (cs)
TW (1) TWD183005S (cs)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11631567B2 (en) * 2020-03-12 2023-04-18 Applied Materials, Inc. Ion source with single-slot tubular cathode
JP1706321S (cs) 2021-06-28 2022-01-31
JP1706320S (cs) 2021-06-28 2022-01-31
JP1733769S (cs) * 2022-08-10 2023-01-06

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD493873S1 (en) * 2002-05-24 2004-08-03 Tokyo Electron Limited Heating gas supplier for semiconductor manufacturing equipment
JP3845370B2 (ja) * 2002-11-29 2006-11-15 本田技研工業株式会社 蓄電素子モジュール
USD522456S1 (en) * 2002-11-29 2006-06-06 Honda Giken Kogyo Kabushiki Kaisha Capacitor cell
US7440258B2 (en) * 2005-03-14 2008-10-21 Maxwell Technologies, Inc. Thermal interconnects for coupling energy storage devices
JP5031611B2 (ja) * 2008-02-18 2012-09-19 株式会社日立国際電気 基板処理装置、半導体装置の製造方法及び天井断熱体
US8098479B1 (en) * 2008-09-19 2012-01-17 Cornell Dubilier Marketing, Inc. Capacitor having zinc coated common edge with welded aluminum terminal
KR101049282B1 (ko) * 2009-03-03 2011-07-13 주식회사 네스캡 전기에너지 저장장치
US8456795B2 (en) * 2009-11-13 2013-06-04 American Radionic Company, Inc. Hard start kit for multiple replacement applications
JP5645718B2 (ja) * 2011-03-07 2014-12-24 東京エレクトロン株式会社 熱処理装置
US8570767B2 (en) * 2011-03-21 2013-10-29 Deere & Company Capacitor assembly
JP6247566B2 (ja) * 2014-02-28 2017-12-13 東洋炭素株式会社 加熱処理容器、加熱処理容器集合体、及び、半導体素子製造装置
JP1541104S (cs) * 2014-12-12 2016-01-12

Also Published As

Publication number Publication date
JP1565116S (cs) 2016-12-12
USD818961S1 (en) 2018-05-29

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