JP1733769S - - Google Patents
Info
- Publication number
- JP1733769S JP1733769S JP2022017170F JP2022017170F JP1733769S JP 1733769 S JP1733769 S JP 1733769S JP 2022017170 F JP2022017170 F JP 2022017170F JP 2022017170 F JP2022017170 F JP 2022017170F JP 1733769 S JP1733769 S JP 1733769S
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022017170F JP1733769S (cs) | 2022-08-10 | 2022-08-10 | |
| TW110305062D01F TWD236269S (zh) | 2022-08-10 | 2023-01-10 | 基板處理裝置用反射板 |
| US29/883,098 USD1053157S1 (en) | 2022-08-10 | 2023-01-24 | Heat reflector for semiconductor manufacturing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022017170F JP1733769S (cs) | 2022-08-10 | 2022-08-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP1733769S true JP1733769S (cs) | 2023-01-06 |
Family
ID=84601522
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022017170F Active JP1733769S (cs) | 2022-08-10 | 2022-08-10 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | USD1053157S1 (cs) |
| JP (1) | JP1733769S (cs) |
| TW (1) | TWD236269S (cs) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP1746404S (ja) * | 2023-01-11 | 2023-06-15 | サセプタカバーベース |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5088006A (en) * | 1991-04-25 | 1992-02-11 | International Business Machines Corporation | Liquid film interface cooling system for semiconductor wafer processing |
| US6035100A (en) * | 1997-05-16 | 2000-03-07 | Applied Materials, Inc. | Reflector cover for a semiconductor processing chamber |
| US6108491A (en) * | 1998-10-30 | 2000-08-22 | Applied Materials, Inc. | Dual surface reflector |
| JP3859072B2 (ja) * | 2001-03-08 | 2006-12-20 | 信越半導体株式会社 | 熱線反射材料及びそれを用いた加熱装置 |
| KR100621777B1 (ko) * | 2005-05-04 | 2006-09-15 | 삼성전자주식회사 | 기판 열처리 장치 |
| USD654884S1 (en) * | 2010-10-21 | 2012-02-28 | Tokyo Electron Limited | Top plate for reactor for manufacturing semiconductor |
| USD654883S1 (en) * | 2010-10-21 | 2012-02-28 | Tokyo Electron Limited | Top plate for reactor for manufacturing semiconductor |
| TWD174921S (zh) * | 2014-12-17 | 2016-04-11 | 日本碍子股份有限公司 | 複合基板之部分 |
| JP1565116S (cs) * | 2016-02-10 | 2016-12-12 | ||
| US10283637B2 (en) * | 2016-07-18 | 2019-05-07 | Taiwan Semiconductor Manufacturing Co, Ltd. | Individually-tunable heat reflectors in an EPI-growth system |
| USD804437S1 (en) * | 2016-09-30 | 2017-12-05 | Norton (Waterford) Limited | Circuit board |
| US10453713B2 (en) * | 2016-11-29 | 2019-10-22 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method for controlling temperature of furnace in semiconductor fabrication process |
| JP1624353S (cs) | 2018-07-19 | 2019-02-12 | ||
| JP1700781S (ja) * | 2021-03-22 | 2021-11-29 | 基板処理装置用断熱板 | |
| JP1706320S (cs) * | 2021-06-28 | 2022-01-31 |
-
2022
- 2022-08-10 JP JP2022017170F patent/JP1733769S/ja active Active
-
2023
- 2023-01-10 TW TW110305062D01F patent/TWD236269S/zh unknown
- 2023-01-24 US US29/883,098 patent/USD1053157S1/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| TWD236269S (zh) | 2025-02-11 |
| USD1053157S1 (en) | 2024-12-03 |