TWD159647S - Flip Chip - Google Patents
Flip ChipInfo
- Publication number
- TWD159647S TWD159647S TW102302736F TW102302736F TWD159647S TW D159647 S TWD159647 S TW D159647S TW 102302736 F TW102302736 F TW 102302736F TW 102302736 F TW102302736 F TW 102302736F TW D159647 S TWD159647 S TW D159647S
- Authority
- TW
- Taiwan
- Prior art keywords
- flip chip
- type semiconductor
- design
- circular holes
- electrically connected
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 abstract 6
- 230000003796 beauty Effects 0.000 abstract 1
- 230000000007 visual effect Effects 0.000 abstract 1
Abstract
【物品用途】;本創作之覆晶晶片，係為設置於P型半導體與N型半導體之間，藉由特殊電極的設計，來做為一電性連接介面。;【設計說明】;本創作係有關一種覆晶晶片之設計，其外觀係經由創作人深思熟慮之後所設計完成，上述之覆晶晶片，在外觀佈列及線條設計上乃如附圖所示之造型，由上視圖先觀之，其中該覆晶晶片之表面具有複數個圓孔，該些圓孔排列為奇數列圓孔位置相同，且偶數列圓孔位置相同，而該奇數列與偶數列圓孔位置具有一位差，該表面與一P型半導體(圖中未示)做一電性連接，而該些圓孔與一N型半導體(圖中未示)做一電性連接，而該表面與該些圓孔之間為絕緣；再者，請參閱下視圖，該表面右側具有一貫穿的直線區域，該直線區域將表面劃分為一大區域表面及一小區域表面，其中該大區域表面係與一N型半導體(圖中未示)做一電性連接，且該小區域表面係與一P型半導體(圖中未示)做一電性連接，而該直線區域係為一絕緣層，可隔絕該大區域表面與該小區域表面產生電性連接，以形成該覆晶晶片之整體外觀，給予人一種新穎、簡潔之視覺美感且能兼顧產品之方便性與實用性，足見創作人在整體之造型設計上倍下苦心；且該覆晶晶片從未被公開使用或見於任何刊物上，完全合乎「新穎性」及「創作性」之設計專利要件，申請人爰依法提出設計專利申請。[Item Usage]: The flip chip in this invention is placed between a P-type semiconductor and an N-type semiconductor, and serves as an electrical connection interface through the design of special electrodes. ;[Design Description];This creation is about the design of a flip chip, and its appearance is designed after careful consideration by the creator. The above flip chip is shaped as shown in the attached figure in terms of appearance layout and line design. From the top view, the surface of the flip chip has a plurality of circular holes, and the circular holes are arranged in the same position in odd-numbered rows and the same position in even-numbered rows, and there is a position difference between the positions of the circular holes in the odd-numbered rows and the even-numbered rows. The surface is electrically connected to a P-type semiconductor (not shown in the figure), and the circular holes are electrically connected to an N-type semiconductor (not shown in the figure), and the surface and the circular holes are insulated; furthermore, please refer to the bottom view, the right side of the surface has a straight line area that passes through, and the straight line area is located in the middle of the surface. The line area divides the surface into a large area surface and a small area surface, wherein the large area surface is electrically connected to an N-type semiconductor (not shown in the figure), and the small area surface is electrically connected to a P-type semiconductor (not shown in the figure), and the straight area is an insulating layer, which can isolate the large area surface from the small area surface to form the overall appearance of the flip chip, giving people a novel and simple visual beauty and taking into account the convenience and practicality of the product, which shows that the creator has put a lot of effort into the overall design; and the flip chip has never been publicly used or seen in any publication, which fully meets the design patent requirements of "novelty" and "creativity", and the applicant has therefore filed a design patent application in accordance with the law.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW102302736F TWD159647S (en) | 2013-04-18 | 2013-04-18 | Flip Chip |
| US29/466,876 USD715234S1 (en) | 2013-04-18 | 2013-09-12 | Flip chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW102302736F TWD159647S (en) | 2013-04-18 | 2013-04-18 | Flip Chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWD159647S true TWD159647S (en) | 2014-04-01 |
Family
ID=51661506
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW102302736F TWD159647S (en) | 2013-04-18 | 2013-04-18 | Flip Chip |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | USD715234S1 (en) |
| TW (1) | TWD159647S (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9497570B2 (en) | 2014-02-06 | 2016-11-15 | Nimbelink Corp. | Embedded wireless modem |
| USD731491S1 (en) * | 2014-02-07 | 2015-06-09 | NimbeLink L.L.C. | Embedded cellular modem |
| USD887998S1 (en) * | 2017-02-17 | 2020-06-23 | Stat Peel Ag | Chip |
| USD1090469S1 (en) * | 2023-12-29 | 2025-08-26 | Zhuhai Pantum Electronics Co., Ltd. | Chip for cartridge for laser printers |
Family Cites Families (31)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD345963S (en) * | 1991-10-30 | 1994-04-12 | Sanyo Electric Co., Ltd. | Hybrid integrated circuit |
| USD379350S (en) * | 1993-08-10 | 1997-05-20 | International Business Machines Corporation | Expanded jacketted circuit card |
| USD365092S (en) * | 1993-08-12 | 1995-12-12 | Siemens Aktiengesellschaft | Chipcard module |
| JP2917868B2 (en) * | 1995-07-31 | 1999-07-12 | 日本電気株式会社 | Semiconductor device and manufacturing method thereof |
| US6211572B1 (en) * | 1995-10-31 | 2001-04-03 | Tessera, Inc. | Semiconductor chip package with fan-in leads |
| USD406821S (en) * | 1997-03-06 | 1999-03-16 | Siemens Aktiengesellschaft | Carrier element for a semiconductor chip for integration into a chipcard, or a chipcard module |
| USD406822S (en) * | 1997-03-06 | 1999-03-16 | Siemens Aktiengesellschaft | Carrier element for a semiconductor chip for integration into a chipcard, or a chipcard module |
| US5905639A (en) * | 1997-09-29 | 1999-05-18 | Raytheon Company | Three-dimensional component stacking using high density multichip interconnect decals and three-bond daisy-chained wedge bonds |
| US6040622A (en) * | 1998-06-11 | 2000-03-21 | Sandisk Corporation | Semiconductor package using terminals formed on a conductive layer of a circuit board |
| USD416236S (en) * | 1998-09-02 | 1999-11-09 | Citizen Electronics Co., Ltd. | Integrated circuit package |
| JP2001175834A (en) * | 1999-12-17 | 2001-06-29 | Toshiba Corp | Card type electronic device and method of manufacturing the same |
| USD456787S1 (en) * | 2000-12-08 | 2002-05-07 | Taiyo Yuden Co., Ltd. | Hybrid integrated circuit device |
| USD456367S1 (en) * | 2000-12-15 | 2002-04-30 | Protek Devices, Lp | Semiconductor chip |
| USD460456S1 (en) * | 2001-03-16 | 2002-07-16 | Kabushiki Kaisha Toshiba | IC memory card |
| US6462273B1 (en) * | 2001-03-16 | 2002-10-08 | Micron Technology, Inc. | Semiconductor card and method of fabrication |
| USD503691S1 (en) * | 2001-03-28 | 2005-04-05 | International Rectifier Corporation | Conductive clip for a semiconductor package |
| USD465463S1 (en) * | 2001-06-15 | 2002-11-12 | Taiyo Yuden Co., Ltd. | Hybrid integrated circuit device |
| USD453746S1 (en) * | 2001-07-26 | 2002-02-19 | Taiyo Yuden Co., Ltd. | Hybrid integrated circuit device |
| USD466873S1 (en) * | 2001-10-31 | 2002-12-10 | Siliconix Incorporated | Semiconductor chip package |
| USD472528S1 (en) * | 2001-10-31 | 2003-04-01 | Siliconix Incorporated | Semiconductor chip package |
| USD492314S1 (en) * | 2003-10-21 | 2004-06-29 | Siliconware Precision Industries Co., Ltd. | IC card type circuit module |
| USD529031S1 (en) * | 2004-07-27 | 2006-09-26 | Siliconware Precision Industries Co., Ltd. | IC card type circuit module |
| USD504874S1 (en) * | 2004-08-11 | 2005-05-10 | Semiconductor Components Industries, Llc | Semiconductor device package |
| USD510728S1 (en) * | 2004-08-11 | 2005-10-18 | Semiconductor Components Industries Llc | Semiconductor device package |
| USD522979S1 (en) * | 2005-05-27 | 2006-06-13 | Danville Automation Holdings Llc | Funnel plate |
| USD673921S1 (en) * | 2011-04-21 | 2013-01-08 | Kabushiki Kaisha Toshiba | Portion of a substrate for an electronic circuit |
| USD673922S1 (en) * | 2011-04-21 | 2013-01-08 | Kabushiki Kaisha Toshiba | Portion of a substrate for an electronic circuit |
| USD674364S1 (en) * | 2011-07-08 | 2013-01-15 | Nihon Dempa Kogyo Co., Ltd. | Crystal unit |
| TWD148146S (en) * | 2011-10-28 | 2012-07-11 | 旭明光電股份有限公司 | Led chip |
| TWD149025S (en) * | 2011-11-08 | 2012-09-01 | 精工愛普生股份有限公司 | Circuit board for ink cartridge |
| USD706733S1 (en) * | 2013-09-16 | 2014-06-10 | Photonics Electronics Technology Research Association (PETRA) | Signal conversion device |
-
2013
- 2013-04-18 TW TW102302736F patent/TWD159647S/en unknown
- 2013-09-12 US US29/466,876 patent/USD715234S1/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| USD715234S1 (en) | 2014-10-14 |
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