【物品用途】;本創作之覆晶晶片，係為設置於P型半導體與N型半導體之間，藉由特殊電極的設計，來做為一電性連接介面。;【設計說明】;本創作係有關一種覆晶晶片之設計，其外觀係經由創作人深思熟慮之後所設計完成，上述之覆晶晶片，在外觀佈列及線條設計上乃如附圖所示之造型，由上視圖先觀之，其中該覆晶晶片之表面具有複數個圓孔，該些圓孔排列為對稱的矩陣，本創作為5×5矩陣，但本創作不以此自限，再於俯視圖之左上方及左下方之孔卻改變呈一葫蘆形，該二葫蘆形孔具有電流分佈均勻之功能，該表面與一P型半導體(圖中未示)做一電性連接，而該些圓孔與一N型半導體(圖中未示)做一電性連接，而該表面與該些圓孔之間為絕緣；再者，請參閱下視圖，該表面右側具有一貫穿的直線區域，該直線區域將表面劃分為一大區域表面及一小區域表面，其中該大區域表面係與一N型半導體(圖中未示)做一電性連接，且該小區域表面係與一P型半導體(圖中未示)做一電性連接，而該直線區域係為一絕緣層，可隔絕該大區域表面與該小區域表面產生電性連接，以形成該覆晶晶片之整體外觀，給予人一種新穎、簡潔之視覺美感且能兼顧產品之方便性與實用性，足見創作人在整體之造型設計上倍下苦心；且該覆晶晶片從未被公開使用或見於任何刊物上，完全合乎「新穎性」及「創作性」之設計專利要件，申請人爰依法提出設計專利申請。[Item Usage];The flip chip of this creation is set between P-type semiconductor and N-type semiconductor, and serves as an electrical connection interface through the design of special electrodes.; [Design Description];This creation is about the design of a flip chip, and its appearance is designed after careful consideration by the creator. The above flip chip has a shape as shown in the attached figure in terms of appearance layout and line design. From the top view, the surface of the flip chip has a plurality of circular holes, which are arranged in a symmetrical matrix. This creation is a 5×5 matrix, but this creation The invention is not limited to this. The holes at the upper left and lower left of the top view are changed into a gourd shape. The two gourd-shaped holes have the function of evenly distributing the current. The surface is electrically connected to a P-type semiconductor (not shown in the figure), and the circular holes are electrically connected to an N-type semiconductor (not shown in the figure), and the surface and the circular holes are insulated. Furthermore, please refer to the bottom view. The surface on the right is The side has a straight line area that passes through, and the straight line area divides the surface into a large area surface and a small area surface, wherein the large area surface is electrically connected to an N-type semiconductor (not shown in the figure), and the small area surface is electrically connected to a P-type semiconductor (not shown in the figure), and the straight line area is an insulating layer that can isolate the large area surface from the small area surface. The flip chip is connected to form the overall appearance of the flip chip, giving people a novel and simple visual aesthetic and taking into account the convenience and practicality of the product, which shows that the creator has put a lot of effort into the overall design; and the flip chip has never been used publicly or appeared in any publication, which fully meets the design patent requirements of "novelty" and "creativity". The applicant therefore filed a design patent application in accordance with the law.