TWM489451U - Package substrate - Google Patents
Package substrateInfo
- Publication number
- TWM489451U TWM489451U TW103206018U TW103206018U TWM489451U TW M489451 U TWM489451 U TW M489451U TW 103206018 U TW103206018 U TW 103206018U TW 103206018 U TW103206018 U TW 103206018U TW M489451 U TWM489451 U TW M489451U
- Authority
- TW
- Taiwan
- Prior art keywords
- conductive
- wiring
- package substrate
- dielectric layer
- layer
- Prior art date
Links
Abstract
A package substrate including a wiring structure and a conductive bump is provided. The wiring structure includes a dielectric layer and a wiring layer. The dielectric layer has a first surface, a second surface opposite to the first surface and at least one through-hole passing through the dielectric layer. The wiring layer includes a conductive wiring and at least one conductive pillar, wherein the conductive wiring is located on the first surface, the conductive pillar is located in the through-hole and connected with the conductive wiring. The conductive bump is disposed at a bottom portion of the conductive pillar adjacent to the second surface, and electrically connected to the wiring layer through the conductive pillar.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW103206018U TWM489451U (en) | 2014-04-08 | 2014-04-08 | Package substrate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW103206018U TWM489451U (en) | 2014-04-08 | 2014-04-08 | Package substrate |
Publications (1)
Publication Number | Publication Date |
---|---|
TWM489451U true TWM489451U (en) | 2014-11-01 |
Family
ID=60626543
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW103206018U TWM489451U (en) | 2014-04-08 | 2014-04-08 | Package substrate |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWM489451U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI624011B (en) * | 2015-06-29 | 2018-05-11 | 矽品精密工業股份有限公司 | Package structure and the manufacture thereof |
-
2014
- 2014-04-08 TW TW103206018U patent/TWM489451U/en not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI624011B (en) * | 2015-06-29 | 2018-05-11 | 矽品精密工業股份有限公司 | Package structure and the manufacture thereof |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4K | Annulment or lapse of a utility model due to non-payment of fees |