TWM489451U - Package substrate - Google Patents

Package substrate

Info

Publication number
TWM489451U
TWM489451U TW103206018U TW103206018U TWM489451U TW M489451 U TWM489451 U TW M489451U TW 103206018 U TW103206018 U TW 103206018U TW 103206018 U TW103206018 U TW 103206018U TW M489451 U TWM489451 U TW M489451U
Authority
TW
Taiwan
Prior art keywords
conductive
wiring
package substrate
dielectric layer
layer
Prior art date
Application number
TW103206018U
Other languages
Chinese (zh)
Inventor
Yung-Ching Lin
Original Assignee
Unimicron Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Unimicron Technology Corp filed Critical Unimicron Technology Corp
Priority to TW103206018U priority Critical patent/TWM489451U/en
Publication of TWM489451U publication Critical patent/TWM489451U/en

Links

Abstract

A package substrate including a wiring structure and a conductive bump is provided. The wiring structure includes a dielectric layer and a wiring layer. The dielectric layer has a first surface, a second surface opposite to the first surface and at least one through-hole passing through the dielectric layer. The wiring layer includes a conductive wiring and at least one conductive pillar, wherein the conductive wiring is located on the first surface, the conductive pillar is located in the through-hole and connected with the conductive wiring. The conductive bump is disposed at a bottom portion of the conductive pillar adjacent to the second surface, and electrically connected to the wiring layer through the conductive pillar.
TW103206018U 2014-04-08 2014-04-08 Package substrate TWM489451U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW103206018U TWM489451U (en) 2014-04-08 2014-04-08 Package substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW103206018U TWM489451U (en) 2014-04-08 2014-04-08 Package substrate

Publications (1)

Publication Number Publication Date
TWM489451U true TWM489451U (en) 2014-11-01

Family

ID=60626543

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103206018U TWM489451U (en) 2014-04-08 2014-04-08 Package substrate

Country Status (1)

Country Link
TW (1) TWM489451U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI624011B (en) * 2015-06-29 2018-05-11 矽品精密工業股份有限公司 Package structure and the manufacture thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI624011B (en) * 2015-06-29 2018-05-11 矽品精密工業股份有限公司 Package structure and the manufacture thereof

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Legal Events

Date Code Title Description
MM4K Annulment or lapse of a utility model due to non-payment of fees