TW590847B - Apparatus for edge polishing uniformity control - Google Patents

Apparatus for edge polishing uniformity control Download PDF

Info

Publication number
TW590847B
TW590847B TW091106452A TW91106452A TW590847B TW 590847 B TW590847 B TW 590847B TW 091106452 A TW091106452 A TW 091106452A TW 91106452 A TW91106452 A TW 91106452A TW 590847 B TW590847 B TW 590847B
Authority
TW
Taiwan
Prior art keywords
sub
region
platform
area
wafer
Prior art date
Application number
TW091106452A
Other languages
English (en)
Chinese (zh)
Inventor
Travis Robert Taylor
Cangshan Xu
Jeff Gasparitsch
Robert Taff
Kenneth J Bahng
Original Assignee
Lam Res Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/823,722 external-priority patent/US6729945B2/en
Application filed by Lam Res Corp filed Critical Lam Res Corp
Application granted granted Critical
Publication of TW590847B publication Critical patent/TW590847B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/12—Lapping plates for working plane surfaces
    • B24B37/16—Lapping plates for working plane surfaces characterised by the shape of the lapping plate surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/04—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
TW091106452A 2001-03-30 2002-03-29 Apparatus for edge polishing uniformity control TW590847B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/823,722 US6729945B2 (en) 2001-03-30 2001-03-30 Apparatus for controlling leading edge and trailing edge polishing
US10/029,958 US6991512B2 (en) 2001-03-30 2001-12-21 Apparatus for edge polishing uniformity control

Publications (1)

Publication Number Publication Date
TW590847B true TW590847B (en) 2004-06-11

Family

ID=26705511

Family Applications (1)

Application Number Title Priority Date Filing Date
TW091106452A TW590847B (en) 2001-03-30 2002-03-29 Apparatus for edge polishing uniformity control

Country Status (7)

Country Link
US (1) US6991512B2 (https=)
EP (1) EP1372909A1 (https=)
JP (1) JP2005510368A (https=)
KR (1) KR20030090698A (https=)
CN (1) CN1230278C (https=)
TW (1) TW590847B (https=)
WO (1) WO2002078904A1 (https=)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6623329B1 (en) * 2000-08-31 2003-09-23 Micron Technology, Inc. Method and apparatus for supporting a microelectronic substrate relative to a planarization pad
US6887338B1 (en) 2002-06-28 2005-05-03 Lam Research Corporation 300 mm platen and belt configuration
US7018273B1 (en) 2003-06-27 2006-03-28 Lam Research Corporation Platen with diaphragm and method for optimizing wafer polishing
KR100807046B1 (ko) * 2003-11-26 2008-02-25 동부일렉트로닉스 주식회사 화학기계적 연마장치
KR20060045167A (ko) * 2004-11-09 2006-05-17 동성에이앤티 주식회사 폴리싱 패드 및 그 제조방법
US8128461B1 (en) * 2008-06-16 2012-03-06 Novellus Systems, Inc. Chemical mechanical polishing with multi-zone slurry delivery
KR101698615B1 (ko) * 2008-12-10 2017-01-20 램 리써치 코포레이션 실리콘 전극 연마를 용이하게 하는 플래튼 및 어댑터 어셈블리
CN102294646A (zh) * 2010-06-23 2011-12-28 中芯国际集成电路制造(上海)有限公司 研磨头及化学机械研磨机台
KR102319571B1 (ko) * 2017-03-06 2021-11-02 주식회사 케이씨텍 에어 베어링 및 이를 구비하는 기판 연마 장치
KR102389438B1 (ko) * 2017-03-23 2022-04-25 주식회사 케이씨텍 기판 지지 유닛 및 이를 포함하는 기판 연마 시스템, 기판 연마 방법
KR102318972B1 (ko) * 2017-03-28 2021-11-02 주식회사 케이씨텍 기판 연마 장치
CN109671664A (zh) * 2018-12-14 2019-04-23 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） 晶圆载片台
CN109648460A (zh) * 2018-12-20 2019-04-19 丰豹智能科技(上海)有限公司 一种无电流多分区可拆卸感应装置
CN113579990B (zh) * 2021-07-30 2022-07-26 上海积塔半导体有限公司 固定研磨粒抛光装置及抛光方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08195363A (ja) 1994-10-11 1996-07-30 Ontrak Syst Inc 流体軸受を有する半導体ウェーハポリシング装置
US5916012A (en) * 1996-04-26 1999-06-29 Lam Research Corporation Control of chemical-mechanical polishing rate across a substrate surface for a linear polisher
US6328642B1 (en) * 1997-02-14 2001-12-11 Lam Research Corporation Integrated pad and belt for chemical mechanical polishing
US6062959A (en) 1997-11-05 2000-05-16 Aplex Group Polishing system including a hydrostatic fluid bearing support
US6336845B1 (en) * 1997-11-12 2002-01-08 Lam Research Corporation Method and apparatus for polishing semiconductor wafers
US6186865B1 (en) * 1998-10-29 2001-02-13 Lam Research Corporation Apparatus and method for performing end point detection on a linear planarization tool
US6093089A (en) * 1999-01-25 2000-07-25 United Microelectronics Corp. Apparatus for controlling uniformity of polished material
US6155915A (en) * 1999-03-24 2000-12-05 Advanced Micro Devices, Inc. System and method for independent air bearing zoning for semiconductor polishing device
US6712679B2 (en) * 2001-08-08 2004-03-30 Lam Research Corporation Platen assembly having a topographically altered platen surface

Also Published As

Publication number Publication date
US20020151256A1 (en) 2002-10-17
JP2005510368A (ja) 2005-04-21
WO2002078904A1 (en) 2002-10-10
US6991512B2 (en) 2006-01-31
KR20030090698A (ko) 2003-11-28
EP1372909A1 (en) 2004-01-02
CN1500028A (zh) 2004-05-26
CN1230278C (zh) 2005-12-07

Similar Documents

Publication Publication Date Title
TW590847B (en) Apparatus for edge polishing uniformity control
KR101109160B1 (ko) 슬러리 소모량을 감소시키기 위한 홈 배열을 갖는 연마 패드
US6955588B1 (en) Method of and platen for controlling removal rate characteristics in chemical mechanical planarization
CN1400636A (zh) 研磨半导体晶片的复合研磨垫及其制作方法
JP2009255292A (ja) キャリアヘッド及び基板の化学機械研磨のためのシステム
US7905764B2 (en) Polishing head using zone control
US6869345B2 (en) Method and apparatus for chemical-mechanical planarization of microelectronic substrates with a carrier and membrane
CN1897226A (zh) 一种化学机械抛光机
US6939212B1 (en) Porous material air bearing platen for chemical mechanical planarization
US6132295A (en) Apparatus and method for grinding a semiconductor wafer surface
CN114473855A (zh) 一种研磨垫及化学机械抛光设备
JPH11347919A (ja) 半導体素子の研磨平坦化装置及び研磨平坦化方法
US20040123951A1 (en) Retaining ring having reduced wear and contamination rate for a polishing head of a CMP tool
US6769970B1 (en) Fluid venting platen for optimizing wafer polishing
US6729945B2 (en) Apparatus for controlling leading edge and trailing edge polishing
US6790128B1 (en) Fluid conserving platen for optimizing edge polishing
TW479000B (en) Polish pad for polishing semiconductor wafer
US6336853B1 (en) Carrier having pistons for distributing a pressing force on the back surface of a workpiece
JP2001237206A (ja) 平坦化加工方法
US20030077986A1 (en) Front-reference carrier on orbital solid platen
US6849547B2 (en) Apparatus and process for polishing a workpiece
US6379216B1 (en) Rotary chemical-mechanical polishing apparatus employing multiple fluid-bearing platens for semiconductor fabrication
US6887338B1 (en) 300 mm platen and belt configuration
US20050118932A1 (en) Adjustable gap chemical mechanical polishing method and apparatus
JP2001308047A (ja) ウエハ研磨装置

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees