KR20030090698A - 엣지 연마를 균일하게 조절하는 장치 - Google Patents

엣지 연마를 균일하게 조절하는 장치 Download PDF

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Publication number
KR20030090698A
KR20030090698A KR10-2003-7012785A KR20037012785A KR20030090698A KR 20030090698 A KR20030090698 A KR 20030090698A KR 20037012785 A KR20037012785 A KR 20037012785A KR 20030090698 A KR20030090698 A KR 20030090698A
Authority
KR
South Korea
Prior art keywords
platen
subregion
pressure
wafer
polishing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR10-2003-7012785A
Other languages
English (en)
Korean (ko)
Inventor
캉샨 슈
제프 가스파릿츠
로버트 타프
케네스 제이 방
파울 스타시에위츠
에릭 에이치 잉그달
트래비스 로버트 테일러
Original Assignee
램 리서치 코포레이션
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/823,722 external-priority patent/US6729945B2/en
Application filed by 램 리서치 코포레이션 filed Critical 램 리서치 코포레이션
Publication of KR20030090698A publication Critical patent/KR20030090698A/ko
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/12—Lapping plates for working plane surfaces
    • B24B37/16—Lapping plates for working plane surfaces characterised by the shape of the lapping plate surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/04—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
KR10-2003-7012785A 2001-03-30 2002-03-29 엣지 연마를 균일하게 조절하는 장치 Ceased KR20030090698A (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US09/823,722 US6729945B2 (en) 2001-03-30 2001-03-30 Apparatus for controlling leading edge and trailing edge polishing
US09/823,722 2001-03-30
US10/029,958 2001-12-21
US10/029,958 US6991512B2 (en) 2001-03-30 2001-12-21 Apparatus for edge polishing uniformity control
PCT/US2002/009858 WO2002078904A1 (en) 2001-03-30 2002-03-29 Support for a polishing belt

Publications (1)

Publication Number Publication Date
KR20030090698A true KR20030090698A (ko) 2003-11-28

Family

ID=26705511

Family Applications (1)

Application Number Title Priority Date Filing Date
KR10-2003-7012785A Ceased KR20030090698A (ko) 2001-03-30 2002-03-29 엣지 연마를 균일하게 조절하는 장치

Country Status (7)

Country Link
US (1) US6991512B2 (https=)
EP (1) EP1372909A1 (https=)
JP (1) JP2005510368A (https=)
KR (1) KR20030090698A (https=)
CN (1) CN1230278C (https=)
TW (1) TW590847B (https=)
WO (1) WO2002078904A1 (https=)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20060045167A (ko) * 2004-11-09 2006-05-17 동성에이앤티 주식회사 폴리싱 패드 및 그 제조방법
KR20110105772A (ko) * 2008-12-10 2011-09-27 램 리써치 코포레이션 실리콘 전극 연마를 용이하게 하는 플래튼 및 어댑터 어셈블리
KR20180101895A (ko) * 2017-03-06 2018-09-14 주식회사 케이씨텍 에어 베어링 및 이를 구비하는 기판 연마 장치
KR20180107974A (ko) * 2017-03-23 2018-10-04 주식회사 케이씨텍 기판 지지 유닛 및 이를 포함하는 기판 연마 시스템, 기판 연마 방법
KR20180109463A (ko) * 2017-03-28 2018-10-08 주식회사 케이씨텍 기판 연마 장치

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6623329B1 (en) * 2000-08-31 2003-09-23 Micron Technology, Inc. Method and apparatus for supporting a microelectronic substrate relative to a planarization pad
US6887338B1 (en) 2002-06-28 2005-05-03 Lam Research Corporation 300 mm platen and belt configuration
US7018273B1 (en) 2003-06-27 2006-03-28 Lam Research Corporation Platen with diaphragm and method for optimizing wafer polishing
KR100807046B1 (ko) * 2003-11-26 2008-02-25 동부일렉트로닉스 주식회사 화학기계적 연마장치
US8128461B1 (en) * 2008-06-16 2012-03-06 Novellus Systems, Inc. Chemical mechanical polishing with multi-zone slurry delivery
CN102294646A (zh) * 2010-06-23 2011-12-28 中芯国际集成电路制造(上海)有限公司 研磨头及化学机械研磨机台
CN109671664A (zh) * 2018-12-14 2019-04-23 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） 晶圆载片台
CN109648460A (zh) * 2018-12-20 2019-04-19 丰豹智能科技(上海)有限公司 一种无电流多分区可拆卸感应装置
CN113579990B (zh) * 2021-07-30 2022-07-26 上海积塔半导体有限公司 固定研磨粒抛光装置及抛光方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08195363A (ja) 1994-10-11 1996-07-30 Ontrak Syst Inc 流体軸受を有する半導体ウェーハポリシング装置
US5916012A (en) * 1996-04-26 1999-06-29 Lam Research Corporation Control of chemical-mechanical polishing rate across a substrate surface for a linear polisher
US6328642B1 (en) * 1997-02-14 2001-12-11 Lam Research Corporation Integrated pad and belt for chemical mechanical polishing
US6062959A (en) 1997-11-05 2000-05-16 Aplex Group Polishing system including a hydrostatic fluid bearing support
US6336845B1 (en) * 1997-11-12 2002-01-08 Lam Research Corporation Method and apparatus for polishing semiconductor wafers
US6186865B1 (en) * 1998-10-29 2001-02-13 Lam Research Corporation Apparatus and method for performing end point detection on a linear planarization tool
US6093089A (en) * 1999-01-25 2000-07-25 United Microelectronics Corp. Apparatus for controlling uniformity of polished material
US6155915A (en) * 1999-03-24 2000-12-05 Advanced Micro Devices, Inc. System and method for independent air bearing zoning for semiconductor polishing device
US6712679B2 (en) * 2001-08-08 2004-03-30 Lam Research Corporation Platen assembly having a topographically altered platen surface

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20060045167A (ko) * 2004-11-09 2006-05-17 동성에이앤티 주식회사 폴리싱 패드 및 그 제조방법
KR20110105772A (ko) * 2008-12-10 2011-09-27 램 리써치 코포레이션 실리콘 전극 연마를 용이하게 하는 플래튼 및 어댑터 어셈블리
KR20180101895A (ko) * 2017-03-06 2018-09-14 주식회사 케이씨텍 에어 베어링 및 이를 구비하는 기판 연마 장치
KR20180107974A (ko) * 2017-03-23 2018-10-04 주식회사 케이씨텍 기판 지지 유닛 및 이를 포함하는 기판 연마 시스템, 기판 연마 방법
KR20180109463A (ko) * 2017-03-28 2018-10-08 주식회사 케이씨텍 기판 연마 장치

Also Published As

Publication number Publication date
US20020151256A1 (en) 2002-10-17
JP2005510368A (ja) 2005-04-21
TW590847B (en) 2004-06-11
WO2002078904A1 (en) 2002-10-10
US6991512B2 (en) 2006-01-31
EP1372909A1 (en) 2004-01-02
CN1500028A (zh) 2004-05-26
CN1230278C (zh) 2005-12-07

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