TW587412B - Interlayer connection structure and its forming method - Google Patents

Abstract

A kind of method for forming interlayer connection structure is disclosed in the present invention. The interlayer connection structure connects the wiring layer or the metal layer formed on both faces of the insulation layer through the interlayer connection extrusion. The invention contains the followings: the step of sequentially disposing the sheet material capable of accommodating at least concave deformation, forming material of metal layer and forming material of thermal insulation layer in between the punching face and the laminated layer formed with the interlayer connection extrusion; the step of forming the laminated layer body having metal layer through the punching to perform heating punching so as to obtain extruding portion for the position corresponding to the interlayer connection extrusion under the disposition condition; the step of removing the extruding portion so as to expose the interlayer connection extrusion; and the step of electrically connecting the exposed interlayer connection extrusion with the nearby metal layer through the separation of the insulation layer. According to the present invention, a kind of interlayer connection structure forming method capable of leveling the insulation layer thickness, which is placed in between the layers, so as to control surface flatness and insulation layer thickness even the insulation layer contains the strengthened fiber, is provided. In addition, the invention also provides the interlayer connection structure and multi-layered wiring substrate formed by using the invented method.

Description

587412 发明 Description of the invention (The description of the invention should state: the technical field to which the invention belongs, the prior art, the content, the embodiments, and the drawings.) [Technical Field 3 of the Inventor's Family] Technical Field The present invention relates to a method for An interlayer connection structure forming a conductive connection structure or a heat release structure between layers in a multilayer wiring substrate or the like forms a method, and the interlayer connection structure and the multilayer wiring substrate formed by this method. Prior Art 3 Background Art In recent years, with the miniaturization and high performance of electronic devices and the like, there have been increasing demands for multilayering, thinning, and fine patterning of wiring boards for assembling electronic components. Therefore, the insulating layer and the wiring layer constituting the multilayer wiring substrate also tend to be thinner. When controlling the characteristic impedance in response to a high frequency signal, it is necessary to control the thickness of the insulating layer and the wiring layer with high accuracy. When manufacturing a multilayer wiring substrate, there must be a step of forming a metal layer 15 and a wiring pattern on an insulating layer. These methods are generally a method of laminating a copper foil with a resin, and etching a metal layer formed by the method.的 A method of forming a pattern and the like. A well-known method is to form a wiring layer on a transfer substrate, and then transfer it to a thermally-adhesive insulating layer provided on the outermost layer of the wiring substrate. In addition, in multilayer wiring substrates, it is necessary to use the There are several structures for conductive connection. Interlayer connection structures are formed by connecting wiring layers or metal layers formed on both sides of an insulating layer through interlayer connection protrusions. For example, Japanese Patent Laid-Open Publication No. Hei 6-314878 discloses a method of “attaching to a lower wiring layer” to build up a continuation page. (When the description page of the invention is insufficient, please note and use the continuation page.) 6发明 Description of the invention The description of the invention explains that after the anti-plating layer is opened on the continuation hole portion, a columnar metal body is formed inside the opening by electroplating copper, and then the anti-plating layer is removed, and then an insulating resin is coated on the entire surface to make it flat After conversion, an upper wiring layer is formed, thereby electrically connecting the wiring layers. In addition, WOOO / 52977 discloses a method in which, during etching of a metal constituting a columnar metal body, another metal exhibiting corrosion resistance is coated on a non-patterned portion including a lower wiring layer to form protection. After the metal layer is electrolytically plated on the entire surface of the protective metal layer to form an electroplated layer for forming the metal of the columnar metal body, an etching that can erode the protective metal layer is performed, and the non-patterned portion is removed by coating. After protecting the metal layer, the entire surface is coated with an insulating resin to flatten it, and then an upper wiring layer is formed, thereby electrically connecting the wiring layers. However, in the method of applying an insulating resin to form an insulating layer as described above, a series of steps such as coating, curing, and planarization are complicated, and it is difficult to maintain the thickness accuracy (planarity) of the insulating layer. On the other hand, there are several known methods of laminating a heat-adhesive resin sheet and a resin sheet with copper foil on a wiring layer on which a metal body protrusion (including a columnar metal body) is formed between wiring layer connections. This forms an insulating layer. Especially when the resin sheet with copper foil is laminated, since the copper foil is also laminated at the same time, there is an advantage in that it can be etched to form an upper wiring layer. However, in the conductive connection structure formed according to this, it is because the copper foil is a crimp metal bump and the resin is easily separated between the two, which makes it difficult to contact the ground from surface to surface, etc., so the conductive connection between the wiring layers Reliability is not sufficient. In particular, if the insulating layer contains reinforcing fibers, the reinforcing fibers may be harmful (please note and use the continuation sheet when using bribes is insufficient) 587412 connection. Therefore, an object of the present invention is to provide a method for forming an interlayer connection structure capable of flattening the thickness of an insulating layer between layers and controlling the surface flatness and the thickness of the insulating layer even when the insulating layer contains reinforcing fibers. The interlayer connection structure and the multilayer wiring substrate formed by this method. L SUMMARY OF THE INVENTION The invention can be achieved by the present invention described below. The method for forming an interlayer connection structure according to the present invention includes the first to third inventions. 10 That is, the first invention is a method for forming an interlayer connection structure, and the interlayer connection structure is connected to a wiring layer or a metal layer formed on both sides of the insulating layer through the interlayer connection protrusion, including: (la) in Steps of arranging at least 15 sheets that can tolerate concave deformation, a metal layer forming material, and a heat-adhesive insulating layer between the stamped surface and the laminated body on which the interlayer connection protrusions are formed; lb) In this configuration, a step of heating and pressing by a pressing surface to obtain a laminated body having a convex portion at a position corresponding to the interlayer connection protrusion and having a metal layer formed on the surface; (lc) removing the laminated body A step of exposing the interlayer connection protrusions to the convex portion; and (ld) a step of electrically connecting the exposed interlayer connection protrusions to the metal layer 20 adjacent to the insulating layer. According to the method for forming the interlayer connection structure according to the first invention, a sheet material that can tolerate concave deformation is arranged between the punched surface and the laminated body, and then the metal layer is formed into a material, the heat-adhesive insulating layer is formed into a material, and the laminated layer is formed. The body is heated and punched, so that it can generate a concave 0 sheet of the sheet at the position corresponding to the connection protrusions between the layers. (When the description page of the invention is insufficient, please note and use the continued page.) On / off ensure that the insulating layer forming material overflows. Therefore, the interlayer connection protrusions (peripheral, 'bar margin layer thickness is not easy to change, and because the convex portion equivalent to the overflow is removed in a subsequent step'), the top of the interlayer connection protrusions also become flat, which can be formed. While uniformizing the thickness of the insulating layer between the layers, and even when the insulating layer contains reinforcing fibers, the surface can be connected to a flat surface. The structure of the insulating layer is also due to the thermal adhesiveness. Comparing the layout methods, it can appropriately respond to the thinning of the insulating layer. Moreover, the interlayer connection protrusions are exposed after removing the convex part of the laminate, and then the exposed interlayer connection protrusions are conductively connected to the surrounding metal layer. Therefore, the metal layers on both sides of the insulating layer can be electrically connected. In addition, in the method using a concave-shaped deformable sheet, the same sheet can be used even when the formation positions of the interlayer connection protrusions are different, so it is suitable Mass production. It is suitable to use a release paper, a metal box, or a rubber sheet with release properties as the description sheet. At this time, 'on the sheet can be formed to produce a moderate concave deformation. The obtained convex portion of the laminated body is also easy to release the sheet and the metal layer of the laminated body. The second invention is a method for forming an interlayer connection structure, which is formed through interlayer connection protrusions and A wiring layer or a metal layer formed on both sides of the insulating layer is connected between the layers, including: (2a) a step of forming a recess at a position where the stamping surface is opposed to the interlayer connection protrusion, or a step of arranging a plate for forming the recess; ) A step of arranging at least a metal layer forming material and a heat-adhesive insulating layer forming material between the stamping surface and the laminated body on which the interlayer connection protrusions are formed; (2c) In this configuration state, borrow The stamping surface is heated and punched. 俾 Obtain the 0-continued page corresponding to the interlayer connection protrusions. (When the description page of the invention is insufficient, please note and use the continuation page.) 玖 The invention description invention description has a convex part at the position of the continued page. A step of forming a laminated body with a metal layer on the surface; (2d) a step of removing the protruding portion of the laminated body to expose the interlayer connection protrusions; and (2e) exposing the exposed interlayer connection protrusions, The step of conductively connecting to a metal layer close to the insulating layer. According to the method of forming the interlayer connection structure of Yidi 2 Maoming, because a punched surface having a recessed portion or a plate surface used to form the recessed portion is arranged opposite to the interlayer connection protrusion, This heats the stamped metal layer forming material, the thermally-adhesive insulating layer forming material, and the laminated body, so it is possible to ensure that there is an overflow of the insulating layer forming material at the position where the interlayer connection protrusions are formed. Therefore, the thickness of the insulation layer around the interlayer connection protrusions. It is not easy to change, and because the convex portion corresponding to the overflow is removed in the subsequent step, the upper part of the interlayer connection protrusion is also flattened. Therefore, the thickness of the insulating layer between the layers can be made uniform on one side, and even if the insulating layer is formed, When reinforcing fibers are included, the interlayer connection structure can be flattened while the surface is flat. Furthermore, since the heat-adhesive insulating layer forming material is sheet-shaped, it can appropriately respond to the thin layer of the insulating layer when compared with the coating method. Into. In addition, since the interlayer connection protrusions are exposed after the protruding portions of the laminated body are removed, the interlayer connection protrusions that have been evacuated are electrically connected to the surrounding metal layers, so the metal layers on both sides of the insulating layer can be electrically connected. The third invention is a method for forming an interlayer connection structure. The interlayer connection structure is formed by connecting wiring layers or metal layers formed on both sides of an insulating layer through interlayer connection protrusions. (3a) will be formed A step of integrating the laminated body of the interlayer connection protrusion, the heat-adhesive insulating layer forming material, and the metal layer forming material to integrate the upper layer of the interlayer connection protrusion near the surface of the metal layer forming material; (3 b) At least this metal 0 continuation page (if the description page of the invention is not enough, please note and use the continuation page) Invention Description Continuation Page 玖, Invention Description The step of turning the engraved field into an opening, (3e) removing at least a part of the insulating layer exposed from the slit, and exposing the top of the interlayer connection protrusion; and (3d) from the exposed interlayer connection protrusion The step of forming the conductive layer on the inner peripheral surface of the opening at least. According to the method for forming an interlayer connection structure according to the third invention, since the heating layer, the sintered layer forming material, and the metal layer forming material are used for lamination, the flatness of the surface is good, which is also advantageous for the manufacturing process. In addition, since the material for forming the heat-adhesive insulating layer is a thin sheet, compared with the coating method, it can appropriately respond to the thinning of the insulating layer.旻 Who_half 旯 Progress, since the portion overlapping with the upper surface of the interlayer connection protrusion is engraved to form an opening, the insulating layer is removed through the opening π to thereby expose the upper surface of the interlayer connection protrusion. By this, because the upper surface of the four interlayer connection protrusions from the road extends at least to the inner peripheral surface of the opening to form a conductive layer, the only connection structure of the conventional technique is different. Therefore, the reliability of the conductive connection between the wiring layer and the like and the inter-layer connection protrusion is high. ^ The surface-to-layer connection structure of Maoming Maoming is connected to the wiring layer or metal layer formed on both sides of the insulating layer via the interlayer connection I. The upper part of the interlayer connection protrusion is exposed from the insulating layer.fW The knife body f is connected to the wiring layer or the metal layer which is close to the insulating layer according to the interlayer connection structure of the present invention. Because the part of the interlayer connection protrusion exposed from the insulating layer is close to the insulating layer by the conductive layer. This wiring layer or metal layer is connected in advance, so it can be manufactured using the forming method of the present invention. ”Therefore, the thickness of the insulating layer between the layers can be made uniform, and even if the next page ) 587412 Description of the invention The If page can also flatten the surface and control the insulation, and the invention explains the interlayer connection structure when the insulation layer contains reinforcing fibers. Among the foregoing, the aforementioned conductive layer is preferably formed by plating. If the conductive layer is formed by applying a layer, an interlayer connection structure with higher reliability of conductive connection can be formed. 9 On the other hand, the multilayer wiring board of the present invention is characterized in that an interlayer connection structure as described above is provided between any layers. The multilayer wiring board according to the present invention has the aforementioned interlayer connection structure between any layers, so it has a uniform thickness of the insulating layer between the layers, and even if the insulating layer package 10 contains reinforcing fibers, it can also Multi-layer wiring board with an interlayer connection structure having a flat surface and controlled insulation layer thickness and high reliability of conductive connection. Brief Description of Drawings Figures 1 (1), (2) to 2 (3), ⑷, and (5) are step diagrams showing an example of a method for forming an interlayer connection structure of the first invention. 15 Figures 3 (a) and (b) are step diagrams showing another example of the method of forming the interlayer connection structure of the first invention. Figures 4 (a), ⑴ to 5 (a) are step diagrams showing an example of a method for forming an interlayer connection structure of the second invention. Figure 6 (1), (2), Figure 7 ⑺, ⑷, (5), Figure 8 (20 6), ⑺, ⑴, Figure 9 (9), (1〇), (⑴ system display Step diagram of an example of the method for forming an interlayer connection structure of the second invention. C Real method] 1 The best form for implementing the invention (the method of forming the interlayer connection structure of the first invention) 0 Continued page (Please note and use the continuation sheet when using it.) 587412 Description of the Invention 玖, Description of the Invention The example shown in this embodiment is formed by inter-layer connection protrusions B, and wiring layers 22 formed on both sides of the core substrate are connected between the layers, and Interlayer connection structure of the metal layer 27 formed on the upper layer via the insulating layer 26. 5 First, as shown in FIG. 1 (1), a laminated body L is prepared and tied to

The wiring layer 22 is patterned on both sides of the substrate 21, and interlayer connection protrusions B are formed on the wiring layer 22. At this time, the method for forming the pattern of the wiring layer 22 is not limited, and it can be produced by, for example, a method using an etching resistant layer or a method using a pattern plating resist. Generally, copper, nickel, tin, etc. can be used as the metal constituting the wiring layer 22, and copper is preferred. As the substrate 21, a substrate composed of glass fiber, various reaction-curable resins such as polyimide resin, and epoxy resin can be used. The thickness of the wiring layer 22 is, for example, about 5 to 50 // m.

The method of forming the interlayer connection protrusion B on the wiring layer 22 is not limited, as long as it is a method that can electrically connect the wiring layer 22 and the interlayer connection protrusion B, which is 15, for example, a method formed by etching of a metal layer, A method of forming by electroplating, a method of forming by conductive paste, and the like are examples. A method for forming the metal layer by etching is disclosed in detail in WO Publication Nos. 00/52977 and WO00 / 30420. A method for forming by metal plating is disclosed in detail in Japanese Patent Laid-Open Publication No. 6-314878 and the like. In this embodiment, an example in which the interlayer connection protrusion B is formed on the wiring layer 22 by the formation method described in WO Publication No. 00/52977 will be described. According to this formation method, the interlayer connection protrusion B is composed of the bottom conductive layer 10, the protective metal layer 11 and the plating layer 24. 0 Continued pages (please note and use continuation pages when the invention description page is not enough) 13 ridge, invention description Continued page Eight limbs and the method for forming the CT interlayer connection protrusion B includes: forming a columnar metal into the shaft In the case of metallic metal, another step of anti-pureness will be shown, which is covered with a substantially complete 'non-patterned part including wiring layer 22 of the lower layer, step of metal layer 11 / Cheng Bao 4; The step of protecting the roughly king surface of the metal layer into an electric bond layer 24 for forming the metal of the columnar metal body, and the step of forming a masking layer on the surface portion of the aforementioned columnar metal body forming the electric money layer 24; Performing the step of etching the aforementioned plating layer 24; and performing the step of etching at least the protective metal layer 11 and removing at least the protective metal layer n covering the non-patterned portion. At this time, electroless plating is performed on the king surface, including the unpatterned layer 邛 of the wiring layer 22, which is a patterned lower layer in advance, to form a bottom conductive layer. After that, the plating is further performed on a full scale to form the protective metal layer u. As shown in FIG. 1 (2), the step (la) of the present invention is between the stamping surface 1 and the laminated body L formed with the interlayer connection protrusion B, and at least the sheet 2 that can be deformed in a concave shape is deformed. The metal layer forming material 3 and the heat-adhesive insulating layer forming material 4 are arranged in this order. In the example shown in this embodiment, the resin-coated steel foil Rc is integrated by using the metal layer forming material 3 and the insulating layer forming material 4 laminated in advance, and the arrangement and the pressing surface are separate pieces.材 2。 Material 2. There are various types of copper foil RC with resin on the market, no matter which of these RCs are used. Alternatively, the metal layer-forming material 3 and the insulating layer-forming material 4 may be arranged separately. Copper, nickel, tin, etc. can be used. Any metal can be used as the metal layer forming material 3 which will become the metal layer 27. However, from the viewpoints of conductivity, easy etching, cost, etc. Note and use the continuation sheet) Invention description From the point of view of the invention, copper is widely used in wiring patterns. The surface of the layer-forming material 3 on the side of the insulating layer-forming material 4 is subjected to a blackening treatment for the purpose of improving adhesion to resin and the like. The thickness of the metal layer forming material 3 is, for example, approximately 5 to 50 // m. The insulating layer forming material 4 may be any material that can be deformed during curing and can be cured by heating or the like, and that has heat resistance required for the wiring board. Specifically, various reaction hardening resins such as polyimide resin, acetal resin, epoxy resin, and composites (polyester film) of these resins with fluorene fiber, aromatic ^ amine fiber, and the like can be mentioned. As an example. Among them, a material which can be hardened by heating and pressing to be laminated with the laminated layer µ is preferable. The thickness of the fine insulating layer forming material 4 is preferably such that the upper surface of the layer-connecting protrusions B is near or above the upper surface of the metal layer. Specifically, the thickness of the 'insulating layer forming material 4 should be the height of the interlayer connection protrusion B -40 " m ~ + 2 (^ m', especially the height of the interlayer connection protrusion B-Shan WM0㈣ is more preferable. In addition, since the present invention is not If the interlayer connection protrusion B and the metal layer forming material 3 are crimped to form a conductive connection by hot stamping, there is an advantage that the thickness accuracy of the insulating layer forming material 4 can not be particularly strictly required. As long as the moon material 2 can be recessed when hot stamping Deformed materials can be 'such as pad paper, rubber sheets, synthetic rubber sheets, non-woven fabrics, woven fabrics, porous sheets, foam sheets' metal boxes and these composites, for example. Especially pad paper, rubber It is preferable to have translatable deformation of a sheet, a synthetic rubber sheet, a foam sheet, these composites, etc. In addition, from the viewpoint of preventing the metal layer forming material 3 from being deformed in a concave shape during hot stamping, it is preferable. In the metal layer forming material 3, a metal drop that can tolerate concave deformation is used as a spacer. The metal drop _ and 13 are drawn on the next page (not enough pages to turn the description page, please note ^ ^ use the continuation page) 587412 发明, invention description invention Description Continued Shao / White and other deformable metals Further, it is better to use a release paper or a rubber sheet having a release property. The thickness of the sheet 2 should be thicker than half of the height of the interlayer connection protrusion B, and also thicker than the height of the interlayer connection protrusion B. By adjusting the thickness and hardness of the sheet 2, the height of the convex part 5 of the laminated body formed by heating and pressing can be controlled, and the thickness of the sheet 2 can be reduced or the hardness can be reduced. The height and volume of the convex part 5 of the laminated body. Square; when the two sides are laminated at the same time, the layers 10 can be laminated and arranged in the order shown in Section 1 ® (2) between the lower stamping surface worker and the upper stamping surface 1. As shown in FIG. 2 (3), the step (lb) of the present invention is based on the foregoing configuration, and the heating surface is pressed by the pressing surface 1 to obtain a convex portion 5 at a position corresponding to the interlayer connection protrusion B. And a laminated body having a metal layer 27 formed on the surface. In this step, since the sheet 2 has a concave deformation during heating and punching due to the presence of the interlayer connection 15 protrusion B, the laminated body will form a convex corresponding to it. Section 5. Especially when the insulating layer is formed only 4 When reinforcing fibers are included, the height and volume of the convex portion 5 will also increase. The method of heating and pressing can be performed by using a heating and pressing device (thermal laminator, heating press), etc. At this time, in order to avoid air mixing, also 20 environment can be vacuum (vacuum laminator). It can be set to the heating temperature and pressure conditions according to the material and thickness of the insulating layer forming material 4 and metal layer forming material 3, but it also corresponds to the layer to be formed. The total number of interlayer connection protrusions B in L is adjusted to a pressure in the range of 0.5 to 30 MPa. As a result, the insulating layer forming material 4 and the metal layer forming material 3 correspond to the surface of the laminated body L. Continued (When the description page of the invention is not enough, please note and use the continuation page.) 玖, the description of the invention ... u = shape and deformation, 后 After the hardened insulating layer 26 and gold are formed, the laminated body is usually demolded, cooled, etc. / As shown in FIG. 2 (4), the step (lc) of the present invention is to remove the convex part 5 of the limbs and expose the interlayer connection protrusion B. At this time, the portion where the interlayer connection protrusion B is higher than the upper surface of the metal layer U of the laminated body can be removed at the same time to make it flat. ^ It is preferable to use grinding and grinding as the method for removing the convex portion 5, and a grinding device having a hard rotary knife with a hard knife arranged with a large number of diamonds and other hard tools at the radius of the rotary plate, and a sander, a belt, Examples of the method include a grinder, a flat grinding disc, and a hard abrasive molded product. If a grinding device is used, the hard rotary blade can be rotated while it is being moved along a fixedly supported wiring board, thereby flattening the upper surface of the board. In addition, the polishing method may be a method of slightly grinding by using a belt, polishing, or the like. For example, if the convex portion 5 is formed on the laminated body according to the present invention, it is possible to easily grind only that portion, and more reliably perform the entire process. flattened. As shown in FIG. 2 (5), the step (ld) of the present invention is a conductive connection between the exposed interlayer connection protrusion B and the metal layer 27 which is close to the insulating layer 26. The example shown in this embodiment is a rough outline of the metal layer 27 including the upper surface of the interlayer connection protrusion B, and the conductive layer 28 is formed by an electric bond. Thereby, the interlayer connection protrusion b and the metal layer 27 can be electrically connected via the conductor layer 28 'bonded to the upper surface of the interlayer connection protrusion B. The formation of the conductor layer 28 by electroplating can be performed by electroless plating, a combination of electroless plating and electrolytic plating, sputtering or a combination of vapor deposition and electrolytic plating, and the like. However, in terms of improving the reliability of the conductive connection, it is beneficial to continue the next page (when the description page of the invention is insufficient, please note and use the next page) Invention Description Continuation Page 28 conductor layer, electroless plating and electrolytic The thickness of the shape-like combination is preferably 1 to 30 // m. In general, mineral liquids such as copper, copper, tin, etc. are used in these metals: The metal of the gaseous layer 27 is the same as that of the metal layer, and may be different from it. Among them, copper is used. There are various types of electro-mineral fluids without electrical keys on the market, which are known to all kinds of metals. In general, the liquid composition system includes a metal ion source, an empirical source, a reducing agent, a t-agent, a stabilizer, and the like. Alternatively, a plating catalyst such as palladium may be deposited before electroless plating. As for money, it can also be done using well-known methods. In the present invention, further, the conductive layer 28 and the metal layer 27 may be formed to form a metal pattern. When the conductor layer 28 and the metal constituting the metal layer 27 are the same, _ can be performed at the same time, and if they are different, it is only necessary to sequentially perform the money engraving. As shown in FIG. 2 (5), the interlayer connection structure of the present invention that can be performed according to the above is via the interlayer connection protrusion ^ B, and the wiring layer 22 or the metal layer formed on both sides of the insulating layer 26 is connected between the layers. 27, which is characterized in that the part of the interlayer connection protrusion B exposed from the insulating layer 26 is connected to the wiring layer 22 or the metal layer 27 adjacent to the insulating layer 26 through a conductor layer 28 (preferably a plating layer). . On the other hand, the multilayer wiring board of the present invention is characterized in that an interlayer connection structure as described above is provided between any layers. The example shown in the figure is a 4-layer substrate using the interlayer connection structure of the present invention in the connection between the first and second layers, and the third and fourth layers. Furthermore, the same interlayer connection structure is formed on the upper layers on both sides, thereby forming a multi-layered multilayer wiring substrate. Another 0 continuation pages (please note and use continuation pages when the invention description page is insufficient) 587412 Rose, invention description | turning_continuation page 'For core substrate and double-sided metal foil laminates, it can also form the interlayer connection of the present invention structure. (Another Embodiment of the First Invention) Next, another embodiment of the present invention will be described. (1) The example shown in the foregoing embodiment is a copper case with resin using a pre-laminated metal layer forming material and an insulating layer forming material and integrated, and the arrangement and the pressing surface are separated into individual sheets, but It can also be arranged as shown in Figs. 3 (a) to (b). The example shown in FIG. 3 (a) is a case in which a sheet 2 has been formed before the press surface 1 10. The sheet 2 may be directly formed on the punching surface 1, or an adhesive or an adhesive may be used to adhere to the sheet 2. A release layer may be provided on the surface of the sheet 2. It is better to use silicone film with excellent mold release and heat resistance. 15 The example shown in Fig. 3 (b) is between the stamping surface 1 and the laminated body L, and the sheet 2, the metal layer forming material 3, and the insulating layer forming a bucket are respectively arranged, and the sheet 2 and the metal layer are simultaneously arranged. A release sheet 6 is additionally disposed between the forming materials 3. The release sheet 6 can be exemplified by a fluororesin film, a silicone resin film, various release papers, a fiber-reinforced fluororesin film, a fiber-reinforced silicone resin film, and the like. Previously described

^ The formation of the wiring layer with interlayer connection protrusions to form the interlayer connection structure of the present invention, but for those who have not formed the wiring pattern or the metal layer before the wiring pattern has been formed, It can also be carried out in the same manner as the aforementioned embodiment to form the interlayer connection structure of the present invention. At this time, it is possible to carry out the same procedure except that the laminated body used is different. According to this, you can use it as a double-sided metal deposition & or the same as the previous page 0 (the description page of the invention is not enough, please note and use the continuation page) χ 19 ..., 20 发明, invention DESCRIPTION OF THE INVENTION The description of the invention is continued on the metal layer and the metal foil to form a pattern. Instead of forming a pattern on the metal layer, it may be used as a sealing layer or a power source layer. (3) In addition to the example shown in the embodiment, the conductor layer is formed by electroplating, but it can also be performed by the application of conductive paste, sputtering evaporation, vacuum evaporation, etc., and these methods and electrolysis can also be used. Electroplating and the like are combined to form a conductor layer. Although the conductive paste may be applied by a screen printing method, an extrusion method, or the like, the conductive paste may be used for any wiring substrate. (4) The example shown in the form of sodium perforation is based on the core substrate on which the wiring layer has been formed on both sides as the laminated body, and the heat-punching is carried out on the punching roof on both sides, and the interlayer connection structure is formed on both sides. However, the interlayer connection structure may be formed only on one side of the substrate. In this case, it is also possible to provide only one side of the stamped surface for heating. (Formation method of the interlayer connection structure of the second invention) The second invention is a method of forming an interlayer connection structure. The interlayer connection structure is connected to the wiring layer or the metal layer formed on both sides of the insulating layer through the interlayer connection protrusion. The method includes: (2a) forming a recess at a position where the punching surface is opposite to the interlayer connection protrusion, or arranging a plate for forming the recess; (2b) forming a recess on the punching surface and the interlayer connection protrusion. The steps of arranging at least the metal layer forming material and the heat-adhesive insulating layer forming material in this order between the bodies; (2c) In this configuration state, the pressing surface is subjected to heating and pressing to obtain the protrusions corresponding to the interlayer connection. A step of forming a laminated body having a convex portion at a position and forming a metal layer on the surface; ⑶) a step of removing the convex portion of the laminated body and exposing inter-layer connection protrusions; (Continued page for the sickle). Description of the invention Continued page 2e) The step of conducting the conductive connection between the exposed interlayer connection protrusions and the metal layer close to the insulating layer. Only steps (2a) and (2c) are different from the method of forming the interlayer connection structure described above. Only the differences will be described below. First, a description will be given of the arrangement in the state shown in FIG. 4 (a). “Heibei Kaikai” is a step (2a) in which a recessed portion la is formed at the position where the punching surface 1 and the interlayer connection protrusion B are opposite to each other. The opening shape and size of the recessed portion la of the pressing surface 1 can be determined according to the interlayer connection protrusion B. The opening area of the recessed portion 1 & should be larger than the area of the upper surface of the interlayer connection protrusion b. Also, the depth of the recessed portion la should be set to The 4 product of the recess & is approximately the same as or more than the volume of the interlayer connection protrusion B, and is preferably set to be approximately the same as the volume of the interlayer connection protrusion B. Specifically, for example, the depth of the recess ^ is 5 # m Above, 10 # m or more is preferred. The overall shape of the recessed part la of the pressing surface can be exemplified by a conical table, a cylinder, a square hammer table, a square column, etc., but the side wall is like a conical table or a square hammer table. A tapered shape is preferred. The method of forming the recessed la in the punching surface 1 can be exemplified by semi-etching using an anti-etching layer, casting, NC processing, etc. In particular, the pattern when forming the interlayer connection protrusions B is used for half Etching, accuracy and cost In the step (2b), at least the metal layer forming material 3 and the heat-adhesive insulating layer forming material 4 are formed between the pressing surface 1 and the laminated body L on which the interlayer connection protrusion B is formed, in this order. Configuration. In addition, the stamping surface and gold 0 can be continued (if the invention is not enough, please note and use the display) 发明 Description of the invention Description of the invention Continuation page The interval between the layer-forming materials 3 has a proper pad Material, mold release sheet, etc. Next, the case where it is arranged in the state shown in FIG. 4 (b) will be described. In this embodiment, in the step (2a), the punching surface 1 and the acoustic connection projection B are opposed to each other. A plate 7 is formed at a position for forming a recessed portion. The plate 7 is provided with a through hole 7a at the position where the recessed portion is formed. The material of the plate 7 can be any of metal and resin. The method of forming the through hole 7a can be anti-etching. The layer etching or semi-etching, casting, NC machining, punching, drilling, etc. are taken as examples. The position of the plate 7 can be appropriately adjusted according to the laminated body L. Further, the description is shown in FIG. 5 (a). The configuration is performed in the state. The example of this embodiment is in step (2a) In the punching surface! When the plate 8 for forming the recessed part 配置 is disposed at a position opposite to the interlayer connection protrusion B, the layer of the metal layer forming material 3 is formed before the plate 8 to arrange the metal layer formation in the (hole) step. Material 3. In the step (2a), a recessed portion ia may be formed before the punching surface 1 and the interlayer connection protrusion B are opposite to each other, and then the layer of the metal layer forming material 3 may be similarly formed on the punching surface 1. Alternatively, When the plate 8 or the layer of the metal layer forming material 3 is formed, the release layer is separated. The release layer is formed by electrolytic plating of the layer of the metal layer forming material 3. It is preferably made of metal. When the metal layer is In the case of copper, the metal release layer is preferably steel, stainless steel, especially nickel formed by non-electrical recording. If the mold release layer is an insulating material such as ceramics or resin, non-electrical electricity can be used. Forms a metal layer in combination with electrolytic money. (Formation method of the interlayer connection structure of the third invention) ★ The example shown in this embodiment is "continued pages on the two sides of the core substrate (continued, please note and use the continued pages) 587412 Invention The connection structure will be explained.玖 Interlayer connection protrusions of the wiring layer described in the invention to form the electrical conductivity of the present invention First, as shown in FIG. 6 (1), as in the first invention, a laminated body L is prepared and attached to both sides of the substrate 21. The wiring layer 22 is patterned 5 Next, as shown in FIG. 6 (2), the wiring layer 22 is formed on the wiring layer 22 between layers.

Interlayer connection protrusions B are formed for conductive connection. The method for forming the interlayer connection protrusion B may be a method that can electrically connect the wiring layer 22 and the interlayer connection protrusion B. For example, a method formed by etching a metal layer or a method formed by electroplating of a metal is taken as an example. . The detailed formation method of the former is disclosed in WO Publication Nos. 00/52977 and WO00 / 30420, and the detailed formation method of the latter is disclosed in Japanese Patent Laid-Open Publication No. 6-314878 and the like.

In this embodiment, an example in which the columnar metal body 24 is formed on the wiring layer 22 by the forming method described in WO Publication No. 00/52977 will be described. According to the formation method of 15, the bottom conductive layer 10 and the protective metal layer 11 are spaced between the columnar metal body 24 and the wiring layer 22. These layers are not necessarily required in the present invention, and may be omitted when the columnar metal body 24 and the wiring layer 22 are formed of other metals. On the other hand, the present invention uses a heat-adhesive insulating layer forming material and a metal layer forming material, and integrates these materials in the layered volume to integrate them. The insulating layer forming material and the metal layer forming material may be Individuals can also be integrated for pre-layering. The example shown in this embodiment uses a metal foil 27 on which an adhesive insulating layer 26a has been formed. There are various types of laminates on the market, and any of them can be used. For example, any metal can be used as the metal foil 27, but from the viewpoints of conductivity, easy etching, cost, etc. 0 continued pages (when the description page of the invention is not enough, please note and use the continued pages) 23 1. Invention The description of the description of the invention is continued on the following page. It is best to use copper widely used for wiring patterns. In addition, ^ 7 can be subjected to a blackening treatment on the surface of the metal ~ box 27 on the side of the thinner insulating layer for the purpose of improving the adhesion with the wax. The | ±, ,, bar, and plutonium layers 26a may be any plutonium that can be deformed during heating and can be cured by heating or the like, and has the heat resistance required for the wiring substrate. Specifically, 'may include various reaction-curable resins such as polyimide resins, epoxy resins, etc.', and composites (polyvinyl acetate film) of these resins with ceramic fibers, aromatic polyamine fibers, and the like are example. Among them, a material that can be hardened by heat and pressure (thermal build-up) to integrate with the core substrate and simplify the manufacturing process is preferred. The thickness of the insulating layer 26a is preferably such that the upper surface of the interlayer connection protrusion 24 is located near the surface of the metal foil 27 described below after the connection. Specifically, it only needs to correspond to the height from the surface of the substrate 21 to the upper surface of the interlayer connection protrusion 24. In addition, since the present invention is not a person who crimps the interlayer connection protrusion 24 and the metal foil 27 to the conductive connection by the aforementioned lamination step, there is an advantage that the thickness accuracy of the insulating layer 26a can not be particularly strictly required. As shown in FIG. 7 (3), the step (3a) of the present invention integrates the wiring layer 22 on which the interlayer connection protrusion 24 has been formed, and the metal foil 27 on which the adhesive insulating layer 26a has been formed. The upper surface 24 a of the interlayer connection protrusion 24 is located near the surface of the metal foil 27. Here, the vicinity of the surface of the metal foil 27 is accessible to the metal foil 27, and a distance of 10 / zm or less is preferable. Alternatively, a metal layer before forming a wiring pattern may be used instead of the wiring layer 22 (this is described later). The method of lamination integration is based on the interlayer connection protrusions that have been formed. Continued pages (When the description page of the invention is insufficient, please note and use the continued page.) The metal box with the insulating layer 26a is arranged to be laminated, and then the force can be applied by pressing (heat lamination, hot stamping). At this time, in order to avoid working pressure> t dagger ’can also etch Li Yan Gu Li J so that% soil brother is vacuum (vacuum lamination). In addition, conditions such as the heating temperature can be appropriately set for the material of the μ-square and the bark layer 26a, so that the insulating layer 2 6 a can be deformed and hardened in accordance with the surface shape of the core substrate. As shown in Figs. 7 (4) to (5), the step (3b) of the present invention is at least, the part of the metal box 27 overlapping with the upper surface 24a of the interlayer connection protrusion B is etched to form an opening 27a. Here, the upper surface of the columnar metal body 24 corresponding to the interlayer 10 connection protrusion B need not be completely flat. 'If it is formed by electroplating, it tends to be a curved surface. At this time, the portion other than the peripheral wall of the columnar metal body 24 is the upper surface 24a. In addition, in the present invention, the upper surface 2 of the so-called interlayer connection protrusion B is heavy. (M knife system refers to the area where the upper surface of the interlayer connection protrusion B is projected on the metal 15 and 27 overlaps with the area of the opening 27a (including the case where it is completely consistent, and some of them include one of the cases). The present invention expands the conductive connection. From an area point of view, it is preferable to use interlayer connection protrusions B, that is, 80% or more of the area where the upper surface 24a of the columnar metal body 24 is projected on the metal foil 27, especially 100% is included in the area of the opening 27a. However, If the area of the opening 27a of the metal foil 27 is too large, the width of the metal moire 27 remaining around it will also increase, which is not conducive to the refinement of the wiring pattern. Therefore, the area of the opening 27a should be an interlayer connection. 0.8 to 5 times the area of the upper surface 24a of the protrusion β. The dry etching can also be used in the rest, but wet etching is preferred, especially 0. Continued pages (When the description page of the invention is insufficient, please note and use the continued page ) Description of the invention, description of the invention Description of the continuation sheet M It is better to use a photosensitive resin such as a dry film resist. The so-called photosensitive M is intended to include light that can be decomposed by light, photobridged, or photopolymerized. Of-knife And / or the resin composition of molecular weight components. As for the coating, the method of laminating dry film and the method of coating and curing the photosensitive resin composition can be used. The dry film (photoresist) is organic solvent. The image type and the alkaline aqueous solution development type are heat-sealed (laminated) by a dry film laminator having a heating and pressing roller, etc. The coating of the photosensitive resin composition can be performed by various coaters. Next, the The part where the opening 27a is formed or the opposite part is exposed and developed, and the former is removed. This type of exposure is a direct exposure line separated by a mask film or a photoelectric plotter and the like, and an exposure machine is usually used, such as ultraviolet rays. For the development, a developing solution or the like corresponding to the type of the dry film can be used, for example, trichloroethane or the like can be used for an organic solvent development type, or sodium carbonate can be used for a diagnostic aqueous solution development type. According to the foregoing, an anti-etching layer 38 having an opening 38a as shown in FIG. 7 (4) can be formed. Then, as shown in FIG. 7 (5), an etching solution corresponding to the material of the metal foil 27 is used to An opening 27a is formed. Examples of the etching solution include commercially available alkaline etching solutions, gaseous etching solutions, ammonium persulfate, hydrogen chloride / sulfuric acid, etc. After the etching is completed, the anti-etching layer 38 may be removed as necessary, which may correspond to the anti-etching layer 38. The type is appropriately selected, such as chemical removal, peeling removal, etc. For example, if it is a dry film resist, for example, methylene chloride can be used for an organic solvent development type, and hydroxide can be used for an alkaline aqueous solution development type. Sodium etc. for peeling. In addition, the removal of the anti-etching layer 38 can also be followed by (3c) 0 Continued pages (If the description page is not enough, please note and use the continued page) 587412 Step 15 is performed simultaneously. As shown in FIG. 8 (6), step (3c) of the present invention is to remove at least a part of the insulating layer 26 exposed from the opening 27a, and expose the upper surface 24a of the interlayer connection protrusion 24. Here, it is not necessary to fully expose the upper surface 24a of the interlayer connection protrusion 24, but from the viewpoint of enlarging the area of the conductive connection, it is desirable to fully expose the upper surface 24a. As the method of removing the insulating layer 26, polishing, abrasive tape, mechanical grinding, laser irradiation, plasma etching, transfer peeling, etc. may be used, but it is preferable to selectively remove the exposure from the opening 27a by sandblasting or chemical etching. Of the insulating layer 26. The sandblasting process such as sandblasting can obtain the grinding effect even on the concave portion of the surface, and the insulating layer such as resin can be removed faster than metal, so that the upper surface of the columnar metal body can be exposed more reliably. In addition, the chemical etching can similarly and selectively remove the insulating layer. Sand blasting can be exemplified by dry or wet blasting and metal particle blasting. For chemical etching, a chemical solution or the like that can selectively decompose resin can be used. In addition, when the insulating layer 26 is removed, the previously provided anti-etching layer 38 can also be used as a shielding material. At this time, the anti-etching layer 38 is removed after the step (3c). As shown in FIG. 8 (7), the step (3d) of the present invention is to form the conductive layer 29 by extending the upper surface 24a of the exposed interlayer connection protrusion 24 to at least the inner peripheral surface of the opening 27a. In the example shown in this embodiment, the conductor layer 29 is formed almost entirely by electroplating the metal foil 27 including the upper surface 24a. Thereby, the interlayer connection protrusion 24 and the metal foil 27 can be electrically connected through the conductor layer 29a bonded to the upper surface 24a, the conductor layer 29b bonded to the inner peripheral surface of the opening 27a, and the conductor layer 29c around it.

0 Continued pages (Please note and use the continuation page when the invention description page is insufficient.) 27 20 / 叶 丄 z / 叶 丄 z Mei, the description of the invention is continued, the formation of the conductive layer 29 by electroplating can be borrowed. The combination of non-electric power ore and electrolytic power ore is carried out. However, in terms of improving the reliability of the conductive connection, it is better to use a combination of bad electroplating and electrolytic plating to form it. At this time, the thickness of the conductive layer 29 is preferably 50 Å.

10 15 Electroless plating usually uses copper, nickel, tin and other key liquids. The gold ^ «Cheng Jinxin 27 is the same metal, but it can also be different from it. Among them, various types are sold on the surface. * The electric clock liquid without electricity and electricity can correspond to a variety of metals and is well known ... Generally speaking, the liquid composition system includes a metal ion source, an empirical source, a reducing agent, a chelating agent, a stable solution, and the like. In addition, you can also make the waiting electricity to sink to the hall before the electricity is released. As for the power smelting, it is also possible to use a well-known method. As shown in FIGS. 8 (a) to 9 (10), this embodiment is further advanced. The conductor layer 29 and the metal box 27 can be etched to perform the step of forming a metal pattern. When the conductor layer 29 and the metal constituting the metal box 27 are the same, the etching can be performed at the same time.

Just # ticks. First, as shown in FIG. 8 (8), a dry film anti-surname agent is laminated, and as shown in FIG. 9 (9), exposure is performed in accordance with the shape of the metal pattern, and development is performed to form an anti-etching layer 30a. Next, as shown in FIG. 9 (10), 20 is used as the last name engraving liquid corresponding to the material of the conductor layer 29 and the metal index 27 to form a metal pattern 27b. Thereafter, as shown in FIG. 9 (11), the anti-etch-off layer 30a is removed. These steps can be carried out in the same way as step (3b). As shown in Figure 9 (U), the present invention can be carried out according to the above mentioned. 1¾ Buy the next page. ) 28. Description of the invention Description of the invention The interlayer connection structure on the continuation page includes: inter-plant connection protrusions 24 for connecting between the layers; arranged around the inter-layer connection protrusions 24 and at least making the inter-layer connection protrusions A part of the exposed insulating layer 26 on the upper surface 24a of 24 is laminated on the insulating layer 26, and the metal pattern 27b is re-opened with the upper surface 24a of the interlayer connection protrusion 24; and the upper surface 24a is connected by the interlayer connection, It extends to at least the inner peripheral surface of the opening 2 of the metal pattern 27b to form a conductor layer 29. (Another Embodiment of the Third Invention) Next, another embodiment of the present invention will be described. (1) The examples shown in the foregoing embodiments are formed by using the method described in WO 00 Publication No. 00/52977 to form interlayer connection protrusions. However, similar to the first invention, they may be formed by other methods. (2) The example shown in the foregoing embodiment is a method of forming the conductive connection structure of the present invention for a wiring layer on which interlayer connection protrusions have been formed, but has not been applied to a metal layer before a wiring pattern has been formed or before a wiring pattern has been formed. The interlayer connection protrusions may be formed in the same manner as in the aforementioned embodiment to form the conductive connection structure of the present invention. At this time, it is only necessary to integrate the metal layer without the wiring pattern and the metal foil that has been formed next to the edge layer, and the upper surface of the interlayer connection protrusion is located near the surface of the metal foil, and thereafter The steps are almost exactly the same. However, the obtained one can be used as a double-sided metal foil laminate, and the aforementioned metal layer and metal foil can be simultaneously etched to form a pattern. The metal layer may be used as a power source layer instead of a pattern. (3) The example shown in the previous embodiment will include the interlayer connection process_second page (invention is not enough to make the scale 3, please note and show it). The electroplating is generally performed to form the conductor layer, but electroplating can also be used to form the conductor layer from the exposed interlayer connection protrusions to at least the inner peripheral surface of the opening. At this time, after the anti-clock layer 5 is provided which coincides with or slightly overlaps with the opening, a conductor layer is formed. At this time, it is better to selectively apply money on the inside of the opening portion. If electric money is used, it can also be a non-electrical layer with a conductive bottom layer before the anti-money layer is provided. In addition, the conductive to layer is formed by using no electricity, and the catalyst can be selectively adsorbed inside the opening. (4) In addition to the example shown in the form of continuous application, 10 layers of conductors are formed by plating, but they can also be formed by filling with conductive paste, base ball, vacuum steaming, and the like. In addition, these methods may be combined with electroplating to form a conductor layer. When filling the conductive paste, it can be filled by screen printing, method, etc. through the opening of the metal foil, and the conductive paste can be used for wiring substrates. Furthermore, it is preferable to fill the conductive paste with a height of approximately 15 from the surface of the metal wire. As a result, the metal pattern can be flattened, and it is easy to form an upper interlayer connection protrusion directly above the interlayer connection protrusion. As for sputtering and vacuum evaporation, as long as it can form a conductive thin film, any conventionally known thin film forming method can be used. In addition, before the anti-mine layer in (3) is provided, first, vacuum bonding and vacuum bonding may be performed to form a bottom conductive layer when the conductive layer is formed by electroplating. INDUSTRIAL APPLICABILITY According to the present invention, a method for forming an interlayer connection structure capable of flattening the thickness of an insulating layer between layers and controlling the surface flatness and the thickness of the insulating layer even when the insulating layer contains reinforcing fibers can be provided. Continue to the next page by this method (note the use of the continuation page if the description page of the invention is insufficient) 玖. Interlayer connection structure and multilayer wiring board of the invention description continuation page. Therefore, the industrial availability of the present invention is high. [Brief description of the drawings] Figures 1 (1), (2) to 2 (3), (4), and 2 (3), (4), and 2 (3), (4), and (2) are step diagrams showing an example of the method for forming the interlayer connection structure in the first test. Figures 3 (a) and (b) are step diagrams showing another example of the method for forming the interlayer connection structure belt of the first invention. 4 (a), (b) to 5 (a) are step diagrams showing an example of a method for forming an interlayer connection structure of the second invention. Figure 6 (1), (2), Figure 7 (3), (4), (5), Figure 8 (6), (7), (8), Figure 9 (9), (1 〇) and (11) are step diagrams showing an example of a method for forming an interlayer connection structure of the second invention. 0 Continued pages (when the invention description page is insufficient, please note and use the continuation page) 587412

发明 Description of the invention [Representative symbols of the main elements of the drawing] Body layers 30a, 38 ... Anti-etching layer L ... Laminated body RC ... Copper foil with resin 1. Pressed surface 1 a, 8a ... .. Recess 2 ... Sheet 3. Metal layer forming material 4. Insulating layer forming material 5 .. Protrusion 6 .. Release sheet 7, 8 ... Plate 7a ... Through hole 10 — Bottom conductive layer 11 ... Protective metal layer 21 ... Substrate 22 ... Wiring layer 24, B ..... Interlayer connection protrusion (plating layer; columnar metal body) 24a ... Upper surface 26, 26a ... Insulating layer 27 .. Metal layer (metal foil) 27a, 38a .. Opening 27b. .. metal pattern 28, 29, 29a, 29b, 29c ... conductive 32

Claims (1)

Scope of patent application: · A method for forming an interlayer connection structure, which is connected to a wiring layer or a metal layer formed on both sides of an insulating layer through an interlayer connection protrusion, including: (1 a) Steps of arranging at least a sheet material that can tolerate concave deformation, a metal layer forming material, and a heat-adhesive insulating layer forming material between the stamped surface and the laminated body on which the interlayer connection protrusions are formed; ( lb) In this configuration state, a step of heating and pressing 'by pressing a stamping surface to obtain a laminated body having a convex portion at a position corresponding to an interlayer connection protrusion' and forming a metal layer on the surface; (1 c) removing the laminated body A step of exposing the interlayer connection protrusions to the convex portion; and (id) a step of electrically connecting the exposed interlayer connection protrusions to a metal layer close to the insulating layer. 2. The method of forming an interlayer connection structure according to item 丨 in the scope of application for patent ′, which uses a release paper, a metal foil, or a rubber sheet having a mold release property as the aforementioned sheet material. A method for forming an interlayer connection structure, wherein the interlayer connection structure is formed by two or more interlayer connection protrusions, and a wiring layer or a metal layer formed on both sides of an insulating layer is connected between the layers, including: (2a) between the stamping surface and the A step of forming a recessed portion at an opposite position of the interlayer connection protrusion, or arranging a plate for forming the recessed portion; (2b) between the stamped surface and the laminated body on which the interlayer connection protrusion is formed, 'at least the metal layer forming material and the heat Subsequent insulation [v ^ | ('Be-Shen patent patent is not enough to make contact, please note and pay attention to it) Pick up the scope of the patent application, apply for the patent application ^ sheet layer forming materials, and configure the steps in this order; (2 c) In this configuration state, a step of heating and pressing by a pressing surface to obtain a laminated body having a convex portion at a position corresponding to the interlayer connection protrusion and forming a metal layer on the surface; (2d) removing the laminated layer A step of exposing the interlayer connection protrusions on the convex portion of the body; and (2e) a step of electrically connecting the exposed interlayer connection protrusions with a metal layer close to the insulating layer. 4. A method of forming an interlayer connection structure, which is formed by connecting layers or wiring layers formed on both sides of an insulating layer through interlayer connection protrusions, including (3a) the interlayer will be formed A step of connecting the laminated body of the protrusion, the heat-adhesive insulating layer forming material, and the metal layer forming material to integrate them so that the upper surface of the interlayer connecting protrusion is located near the surface of the metal layer forming material; (3b) at least The step (3c) of engraving a portion of the metal layer forming material that is above the interlayer connection protrusion to form an opening removes at least a part of the insulation layer exposed from the opening, so that the interlayer connection protrusion is The step of being exposed above; and (3) the step of forming the conductor layer from the exposed upper surface of the interlayer connection protrusion to at least the inner peripheral surface of the opening. 5.-Interlayer connection structure, which is through the interlayer connection protrusions, and the wiring layer or metal layer formed on both sides of the insulating layer is connected between the layers. 587412 The last page of the scope of patent application and the scope of patent application are characterized in that the part of the interlayer connection protrusion exposed from the insulation layer is connected to the wiring layer or the metal layer close to the insulation layer through the conductor layer. 5 6. The interlayer connection structure according to item 5 of the scope of patent application, wherein the aforementioned conductor layer is formed by plating. 7 · A multi-layer wiring substrate, which is provided with an inter-layer connection structure such as item 5 or 6 of the scope of patent application between any layers. 10 15 35