TW580714B - Thin slice with attached contact plate - Google Patents

Thin slice with attached contact plate Download PDF

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Publication number
TW580714B
TW580714B TW91137667A TW91137667A TW580714B TW 580714 B TW580714 B TW 580714B TW 91137667 A TW91137667 A TW 91137667A TW 91137667 A TW91137667 A TW 91137667A TW 580714 B TW580714 B TW 580714B
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TW
Taiwan
Prior art keywords
sheet
hole
contact board
plate
contact
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TW91137667A
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Chinese (zh)
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TW200302498A (en
Inventor
Hisaya Iwama
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Alps Electric Co Ltd
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Publication of TW200302498A publication Critical patent/TW200302498A/en
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Publication of TW580714B publication Critical patent/TW580714B/en

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Abstract

A kind of thin slice with attached contact plate is provided in the present invention, in which the thin slice is capable of increasing contact reliability between contact plate and the fixed contact on the base board facing the user. The upper thin slice 2 is adhered on the transmission thin slice 7 where there is no inserted component in the through hole 5 for the contact plate 4. The thin slice body 1 having the attached contact plate 4 is installed under the thin slice 2. By passing the transmission sticking layer 7b installed under the transmission thin slice 7 to stick the protection thin slice 8 inserted into the through hole 5, it is capable of preventing the external peripheral portion under the contact plate 4, which contacts the fixed contact point on one side of the base board facing the user, from being stuck by the adhesive.

Description

580714 ⑴ 玖、發明說明 (發明說明應敘明:發明所屬之技術領域、先前技術、内容、實施方式及圖式簡單說明) 【發明所屬技術領域】 本發明是關於作為手機等數位通訊裝置操作用鍵開關 使用的附接點板之薄片(sheet)。 【習知技術】 習知附接點板薄片的結構及其製造方法的例子有曰本 專利特開平9-2 82974號等公開的發明。下面就如圖9所示 的薄片剖面示意圖簡要說明該種薄片結構。·要提醒注意的 是,圖中所有尺寸中,厚度方向的放大倍數遠大於平面方 向的放大倍數。 在數位通訊裝置等各類電子裝置中作為構件而被組裝 起來的附接點板薄片體8 1由上板82、粘附在上板82下面的 間隔板(s p a c e r s h e e t) 8 3和接點板8 4組成。上述接點板8 4 粘附在上板8 2下面,並插入設置在間隔板8 3的通孔8 5中。 上板82由上板82a和上粘著層82b組成,通過該上粘著層 82b與間隔板83粘接。間隔板83由間隔薄膜83 a和間隔粘著 層8 3b組成。此外,薄片體81上設有裝配LED等構件用的 通孔8 6。 具有上述結構的薄片體8 1通過間隔粘著層8 3 b粘附在帶 狀傳送板87上。該傳送板87下面粘接帶狀保護板88。該保 護板8 8是為薄片對8 1裝配到電子裝置以前防止接點板8 4 上落上贓物等而設置的。該保護板8 8由保護板8 8 a和保護 钻著層88b形成。 該產品的製造方法簡略敘述如下。首先,裝備好帶狀傳 (2)580714 玖 发明, description of the invention (the description of the invention should state: the technical field, prior art, content, embodiments, and drawings of the invention briefly) [Technical Field of the Invention] The present invention relates to the operation of digital communication devices such as mobile phones. A sheet of attachment point plates used by key switches. [Known Technology] Examples of the structure of the attachment point plate sheet and its manufacturing method are disclosed in Japanese Patent Laid-Open No. 9-2 82974 and the like. The schematic diagram of the cross section of the sheet shown in Fig. 9 will briefly explain the structure of the sheet. · Please note that the magnification in the thickness direction is much larger than the magnification in the plane direction among all the dimensions in the figure. An attachment point plate sheet 8 assembled as a component in various electronic devices such as digital communication devices is composed of an upper plate 82, a spacer sheet 8 adhered to the lower surface of the upper plate 82, and a contact plate 8 4 Composition. The above-mentioned contact plate 8 4 is adhered under the upper plate 82 and inserted into the through hole 85 provided in the spacer plate 8 3. The upper plate 82 is composed of an upper plate 82a and an upper adhesive layer 82b, and the upper plate 82 is bonded to the spacer plate 83 through the upper adhesive layer 82b. The spacer plate 83 is composed of a spacer film 83a and a spacer adhesive layer 83b. The sheet 81 is provided with through holes 86 for mounting components such as LEDs. The sheet body 81 having the above-mentioned structure is adhered to the belt-shaped transfer plate 87 via the spacer adhesive layer 8 3b. A band-shaped protective plate 88 is adhered to the lower surface of the transfer plate 87. The protection plate 88 is provided to prevent the boot plate 8 4 from getting stolen or the like before the sheet pair 81 is assembled to the electronic device. The protective plate 88 is formed of a protective plate 88a and a protective drilling layer 88b. The manufacturing method of this product is briefly described as follows. First, equip the Ribbon (2)

580714 运板87並形成搬運用引導孔(圖中表示)—— >在傳送板87 上轴接帶狀的間隔板(包含有形成間隔板83的部分)——> 形成通孔85 〉粘接帶狀的上板(包含有形成上板82的 ^刀) >形成通孔86-->為了在形成薄片體81外形的 4刀加入裂縫,對於帶狀的上板和帶狀間隔板進行半切割 (傳运板不被切割)一 一 >將成為薄片體8丨部分以外的帶狀 上薄片和帶狀間隔板(即殘餘部分)在捲纏的過程中剝 離— >將接點板84從通孔85下面插入並與上板82枯 接 > 使保遵板8 8粘接在傳送板8 7下面,然後將其捲纏 在滚筒上。 此外,還有其他結構,如無間隔板83型或在上述結構中 在通孔85中插入別的薄片的塞入型等各種形式的結構。 【發明所欲解決之課題】 上述薄片體81裝配在電子裝置基板上時的狀態如圖1 所不。在電子裝置的組裝工序中,將薄片體81從傳送1〇 上剝離後粘接到電子裝置產品的基板上。產品的烏:87 口 第一固定接點9 1和第2固定接點9 2,當操作者用 指在接點板84上按壓時,第t固定接點91和第2固定=手 之間導通。在這種結構中,要求接點板84下面的外=92 8 4 c與第1固定接點9 i能穩定接觸。 。P分 仁疋’在習知結構中’到組裝到電子裝置上為止 板84下面的外周部分84c與保護枯著層8讣接近點 觸。由於傳送板安裝或搬運時的溫度等條件變化,保:接 者層州的枯接劑有可能枯附到接點板84。所設置部:枯 -6 - 580714580714 Carry the plate 87 and form a guide hole for conveyance (shown in the figure)-> A belt-shaped spacer plate (including the portion forming the spacer plate 83) is axially connected to the conveying plate 87-> Forming a through hole 85〉 Adhesive band-shaped upper plate (including the knife forming the upper plate 82) > Forming a through hole 86-> In order to add a crack to the four blades forming the shape of the sheet 81, the band-shaped upper plate and the band Half-cut the spacer (the transport plate is not cut) one by one > The strip-shaped upper sheet and the strip-shaped spacer (ie, the residual part) other than the 8/8 part of the sheet body are peeled off during the winding process-> Insert the contact plate 84 from below the through hole 85 and dry it with the upper plate 82> Adhere the guaranty plate 8 8 to the underside of the conveying plate 87, and wind it around the drum. In addition, there are other structures, such as a non-spacer plate type 83 or a plug-in type in which another sheet is inserted into the through hole 85 in the above-mentioned structure. [Problems to be Solved by the Invention] The state when the sheet body 81 is mounted on an electronic device substrate is shown in FIG. 1. In the assembling process of the electronic device, the sheet body 81 is peeled from the conveyance 10, and then bonded to the substrate of the electronic device product. Wu of the product: 87 mouths of the first fixed contact 91 and the second fixed contact 92, when the operator presses on the contact board 84 with a finger, the t fixed contact 91 and the second fixed = between the hands Continuity. In this structure, it is required that the outer surface of the contact plate 84 = 92 8 4 c and the first fixed contact 9 i be in stable contact. . The P-points are in the conventional structure until they are assembled on the electronic device. The outer peripheral portion 84c under the plate 84 is in close contact with the protective layer 8a. Due to changes in conditions such as the temperature during the installation or transportation of the transfer board, it is possible that the dry contact agent of the relay layer may adhere to the contact board 84. Set Department: Dry -6-580714

(3) 【用以解決課題之手段】 為了解決上述課題,本發明的技術手段1所對應的結構 中,具有接點板、貼附在上述接點板上面的上薄片、設有 使上述接點板可從外部插入的通孔且支撐上述上薄片並 使其可剝離的傳送薄片、保持在上述傳送薄片下面並覆蓋 上述通孔和上述接點板的保護薄片;在上述傳送薄片下面 設有傳送粘著層、通過該傳送粘著層粘著並保持上述保護 薄片的上面。 在第二技術手段中,由具有低於上述上薄片與上述傳送 薄片之間粘結力的微粘著材料形成上述傳送粘著層。 在第三技術手段中,具有接點板、粘接在該接點板上面 的上薄片、設有能將上述接點板從外部插入的通孔、保持 上述上薄片使其能剝離的傳送薄片、被保持在上述傳送薄 片下面並覆蓋了上述通孔和上述接點板的保護薄片;上述 保護薄片粘附在上述傳送薄片下面、該保護模片的下面由 比其寬的固定薄片覆蓋。 在第四技術手段中,把上述傳送薄片、上述保護薄片、 上述固定薄片連續形成帶狀,並能連續供給多個上述上薄 在第五技術手段中,把上述固定薄片的寬度形成為去除 上述傳送薄片的進給裝置上的定位孔所得到的寬度。 【發明的實施形式】 下面,根據圖1〜圖4說明本發明實施例1。圖1是傳送薄 片的俯視圖,圖2是沿薄片、傳送方向的剖視圖、圖3是沿 580714(3) [Means for solving the problems] In order to solve the above-mentioned problems, the structure corresponding to the technical means 1 of the present invention includes a contact plate, an upper sheet attached to the contact plate, and a contact plate. The point plate can be inserted through the through hole from the outside and supports the upper sheet and makes it peelable. A conveying sheet that is held under the conveying sheet and covers the through hole and the contact plate. The transport adhesive layer is used to adhere and hold the upper surface of the protective sheet by the transport adhesive layer. In the second technical means, the transfer adhesive layer is formed of a micro-adhesive material having a lower adhesive force between the upper sheet and the transfer sheet. The third technical means includes a contact board, an upper sheet adhered to the contact board, a through hole through which the contact board can be inserted from the outside, and a transport sheet that holds the upper sheet so that it can be peeled off. A protective sheet that is held under the transport sheet and covers the through hole and the contact board; the protective sheet is adhered to the transport sheet, and the protective sheet is covered with a fixing sheet wider than the protective sheet. In a fourth technical means, the conveying sheet, the protective sheet, and the fixed sheet are continuously formed into a belt shape, and a plurality of the upper sheets can be continuously supplied. In a fifth technical means, the width of the fixed sheet is formed to remove the above. The resulting width of the positioning holes in the feeding device of the sheet. [Embodiment of the invention] Hereinafter, Embodiment 1 of the present invention will be described with reference to FIGS. 1 to 4. Fig. 1 is a top view of the conveying sheet, Fig. 2 is a cross-sectional view along the sheet and the conveying direction, and Fig. 3 is along 580714

(4) 薄片寬度方向的剖視圖,圖4是製造工序過程的示意圖。 須提起注意的是,下面各圖中薄厚方向的尺寸放大倍數遠 大於平面方向。 如圖1所示,附有接點板的薄片體i的部分與傳統例相 同,即由上薄片2、粘附在上薄片2下面的間隔薄片3和接 點板4構成。上述接點板4粘附在上薄片2的下面並被插入 到設在間隔薄片3的通孔5内。上薄片2由上薄片2 a和上粘 著層2b構成,並通過上粘著層“粘接在間隔薄片3上。該 間隔薄片3由間隔薄膜3 a和間隔粘著層3 b形成。此外,薄 片體1具有為裝配LED等構件而設置的通孔6。 具有上述結構的薄片體i由間隔粘著層3 b粘著在帶狀傳 送薄片7上,到此為止與現有技術相似。但是,傳送薄片 7(如圖2所示)由傳送薄片7a和傳送粘著層7b形成,其下面 粘附有帶狀保護薄片8,但該保護薄片8上未設粘著層,這 一點與現有技術不同。所以,在接點板4下面外周部分钭 處不會附著粘接劑,且如圖3所示殘留在定位孔7c下面的 傳送隔板7b的寬度方向兩側部分、當為了輸送把傳送薄片 7 ’捲在滾筒上時,相互沒有枯連。 下面根據圖4說明上述結構的製造工序過程。首先,由 傳送薄片7a、傳送點著層7b和傳送隔板^層積而成的傳送 薄片7以捲纏在滾筒7R上的狀態被放置’然後被拉入到加 工線中。另一方面’由間隔薄膜3a、間隔枯著層3b和間隔 隔板3C層積而成的間隔薄片3以捲纏在滾筒311上的狀態 被放置,然後被拉出。當祜知山始 叫阳> 〜 拉出後’間隔隔板立刻被剝離(4) A cross-sectional view of the sheet width direction. FIG. 4 is a schematic view of a manufacturing process. It should be noted that the magnification of the dimension in the thickness direction is much greater than that in the plane direction in the following figures. As shown in FIG. 1, the portion of the sheet body i with the contact plate is the same as the conventional example, that is, it is composed of the upper sheet 2, the spacer sheet 3 adhered to the lower sheet 2, and the contact plate 4. The above-mentioned contact plate 4 is adhered to the lower surface of the upper sheet 2 and is inserted into a through hole 5 provided in the spacer sheet 3. The upper sheet 2 is composed of an upper sheet 2 a and an upper adhesive layer 2 b, and is “bonded” to the spacer sheet 3 by the upper adhesive layer. The spacer sheet 3 is formed of the spacer film 3 a and the spacer adhesive layer 3 b. The sheet 1 has a through-hole 6 provided for assembling a component such as an LED. The sheet i having the above-mentioned structure is adhered to the belt-shaped conveying sheet 7 by the spacer adhesive layer 3 b, which is similar to the prior art so far. However, The conveying sheet 7 (shown in FIG. 2) is formed of a conveying sheet 7 a and a conveying adhesive layer 7 b. A strip-shaped protective sheet 8 is adhered to the lower part of the conveying sheet 7. However, the protective sheet 8 is not provided with an adhesive layer. The technology is different. Therefore, no adhesive is adhered to the outer peripheral part 下面 of the contact plate 4, and the two sides of the width direction of the transmission partition 7b remaining under the positioning hole 7c as shown in FIG. When the conveying sheet 7 ′ is rolled on the drum, there is no mutual connection. The following describes the manufacturing process of the above structure according to FIG. 4. First, the conveying sheet 7 a, the conveying point landing layer 7 b, and the conveying partition ^ are laminated. The sheet 7 is placed in a state of being wound on the drum 7R. It is then drawn into the processing line. On the other hand, the spacer sheet 3 laminated with the spacer film 3a, the spacer spacer layer 3b, and the spacer spacer 3C is placed in a state of being wound on the drum 311 and then Pulled out. When Yu Zhishan started to call Yang > ~ After pulling out 'spacer partition was peeled off immediately

580714 成為殘片被捲到滾筒3 S上。 傳送薄片7和間隔薄片3粘著在一起後,由沖顾5 P加工出 定位孔7c和接點板的通孔5。這時,由於傳送钻著層7b由 弱粘著材料形成,所以很難附著在加工裝置上(下面的加 工過程中同此道理)。上薄片2a、上粘著層2b和上隔板2c 層積而成的上薄片2從滾筒2R中拉出後,上隔板2c立刻被 剝離,成為殘片被捲到滾筒2S上。而殘留的上薄片2a和上 粘著層2b被粘著在間隔薄片3上。 由半圓沖頭1Η在薄片體1部分的外形上形成切槽。同 時,由沖頭6Ρ沖出通孔6。然後,上薄片2和間隔薄片3的 無用部分一起被剝離、並作為殘片被捲到滾筒2Τ上。接 點板4通過插入機4 I、從相對於殘留薄片體1的下面插入通 孔5、並與上粘著層2b的下面粘接。 然後,通孔空著的傳送隔板7 d被當作殘片捲走,只留有 傳送薄片7的定位孔7c下面一側的部分。並且傳送薄片7 的下面(除定位孔7 c下面一側的部分)由從滾筒8 R供給的 保護薄片8覆蓋。最後,成品被捲入滾筒7T。 下面根據圖5〜圖8說明本發明實施形式2。圖5是傳送薄 片的俯視圖,圖6是沿薄片片傳送方向的剖視圖,圖7是薄 片片寬度方向的剖視圖、圖8是製造工序過程示意圖。結 構與實施例1相同的部分說明從略。與附接點板薄片體的 實施例1相比較,不同之處就是沒有間隔薄片3這一點。這 種情況下,當用戶在產品基板上連接時,上薄片2的接點 板4的部分伸出呈凸狀。此外,傳送薄片7和下面的保護薄 580714580714 becomes debris and is rolled onto the drum 3S. After the conveyance sheet 7 and the spacer sheet 3 are adhered together, the positioning hole 7c and the through hole 5 of the contact board are processed by the punch 5P. At this time, since the transfer drilling layer 7b is formed of a weakly adhesive material, it is difficult to attach it to the processing device (the same applies to the following processing). After the upper sheet 2a laminated with the upper sheet 2a, the upper adhesive layer 2b, and the upper partition 2c is pulled out from the roller 2R, the upper partition 2c is immediately peeled off, and the residual sheet is rolled onto the roller 2S. The remaining upper sheet 2a and the upper adhesive layer 2b are adhered to the spacer sheet 3. A cutout is formed in the outer shape of the sheet 1 by a semicircular punch 1Η. At the same time, the through hole 6 is punched out by the punch 6P. Then, the useless portions of the upper sheet 2 and the spacer sheet 3 are peeled off together, and are wound onto the drum 2T as a residual sheet. The contact plate 4 is inserted into the through-hole 5 from the lower surface with respect to the residual sheet 1 by an inserter 41 and bonded to the lower surface of the upper adhesive layer 2b. Then, the conveying partition 7d with the through hole empty is taken up as a scrap, leaving only the portion on the lower side of the positioning hole 7c of the conveying sheet 7. And the lower surface of the conveyance sheet 7 (except the part on the lower side of the positioning hole 7c) is covered with the protective sheet 8 supplied from the roller 8R. Finally, the finished product is taken up in the drum 7T. Next, a second embodiment of the present invention will be described with reference to Figs. 5 to 8. Fig. 5 is a plan view of the conveyed sheet, Fig. 6 is a sectional view along the sheet conveying direction, Fig. 7 is a sectional view of the sheet width direction, and Fig. 8 is a schematic view of a manufacturing process. The description of the same parts as those of the first embodiment will be omitted. Compared with Example 1 to which the dot plate sheet is attached, the difference is that there is no spacer sheet 3. In this case, when the user connects on the product substrate, a part of the contact plate 4 of the upper sheet 2 projects in a convex shape. In addition, the transport sheet 7 and the protective sheet underneath 580714

(6) 片8都沒有粘著層。所以為了將保護薄片8固定在傳送薄片 7上,粘接有固定薄片9。該固定薄片9由固定薄片9 a和固 定粘著層9b形成,其寬度比傳送薄片7窄,而比保護薄片8 寬,因此,保護薄片8被保持在傳送薄片7的下面。根據上 述結構,與上實施例同樣不需擔心接點板4的下面一側外 周部分4c與粘著劑接觸。(6) None of the sheets 8 had an adhesive layer. Therefore, in order to fix the protective sheet 8 to the conveying sheet 7, the fixing sheet 9 is adhered. The fixed sheet 9 is formed of a fixed sheet 9a and a fixed adhesive layer 9b, and its width is narrower than the transport sheet 7 and wider than the protective sheet 8. Therefore, the protective sheet 8 is held under the transport sheet 7. According to the above-mentioned structure, there is no need to worry about the lower peripheral portion 4c of the contact plate 4 coming into contact with the adhesive, as in the previous embodiment.

下面說明確實施例2的製造工序過程。首先,傳送薄片7 以捲繞在滾筒7R上的狀態被放置,然後被拉入加工線。 傳送薄片7通過沖頭5 P沖出定位孔7c和接點板的通孔 5。然後由上薄片2a、上粘著層2b和上隔板2c層積而形成 的上薄片2從滾筒2R中拉出,上隔板2c立刻被剝離成為殘 片捲到滾筒2 S。並且被粘附在傳送薄片7上。The manufacturing process of Example 2 will be described below. First, the conveyance sheet 7 is placed in a state wound on a drum 7R, and then pulled into a processing line. The conveyance sheet 7 is punched out of the positioning hole 7c and the through hole 5 of the contact board through the punch 5P. Then, the upper sheet 2 formed by laminating the upper sheet 2a, the upper adhesive layer 2b, and the upper partition 2c is pulled out from the roller 2R, and the upper partition 2c is immediately peeled into a residual sheet and rolled onto the roller 2S. And it is adhered to the conveyance sheet 7.

由半圓沖頭1 Η形成薄片體1部分外形上的切槽,同時由 沖頭6Ρ沖出通孔6。然後,上薄片2的無用部分被剝離, 作為殘片被捲入滾筒2Τ内。接點板4通過插入機41從相對 於殘留薄片體1下面插入通孔5並與上薄片2a的下面粘接。 由固定薄片9a、固定粘著層9b和固定隔板9c形成、且寬 度小於傳送薄片7兩側的定位孔7c間的距離的固定薄片9 從滾筒9R拉出。由於該固定薄片9並未覆蓋傳送薄片7的 定位孔7 c,所以插入定位孔7 c的加工裝置側定位銷不會被 粘接劑污染。因此,產品精度和成品率得以提高。並且固 定隔板9c立刻作為殘片捲入滾筒9S ;固定粘著層9b—側, 粘接有寬度較窄的保護薄片8;並且,上述3層薄片從進給 途中加工的上述傳送薄片7下側被粘接。最後,製成品被 -10- 580714 ⑺ 捲到滾筒7T上。 在上述實施例中,傳送薄片7是連續的,也可以離散加 工。此外,本實施例中通孔5處只插入接點板4、但並不限 於這種方式,可以將具有電極的電子構件一起裝入,其效 果相同。還有,也可以在上薄片上面層積具有各種功能的 薄片類材料。接點板的形狀也不限於向下的碗狀結構,可 以是其他各種適用的形狀。A semi-circular punch 1 is used to form a cutout in a part of the outer shape of the sheet body 1, and a punch hole 6P is punched out of the through hole 6 at the same time. Then, the useless part of the upper sheet 2 is peeled off, and it is rolled into the drum 2T as a scrap. The contact plate 4 is inserted into the through hole 5 from the lower surface of the residual sheet 1 by an inserter 41 and is bonded to the lower surface of the upper sheet 2a. The fixed sheet 9 formed of the fixed sheet 9a, the fixed adhesive layer 9b, and the fixed partition 9c and having a width smaller than the distance between the positioning holes 7c on both sides of the conveyance sheet 7 is pulled out from the roller 9R. Since the fixing sheet 9 does not cover the positioning holes 7c of the conveying sheet 7, the processing device-side positioning pins inserted into the positioning holes 7c are not contaminated by the adhesive. Therefore, product accuracy and yield are improved. And the fixed partition 9c is immediately rolled into the drum 9S as a residue; the fixed adhesive layer 9b is on one side, and a protective sheet 8 with a narrow width is bonded; and the above-mentioned 3 layers are processed from the above-mentioned conveying sheet 7 on the way of feeding The sides are glued. Finally, the finished product is rolled onto the drum 7T by -10- 580714 ⑺. In the above-mentioned embodiment, the conveying sheet 7 is continuous, and may be processed discretely. In addition, in this embodiment, only the contact board 4 is inserted at the through hole 5, but it is not limited to this method. Electronic components with electrodes can be installed together, and the effect is the same. Alternatively, a sheet-like material having various functions may be laminated on the upper sheet. The shape of the contact plate is not limited to a downward bowl-shaped structure, and may have various other applicable shapes.

【發明的效果】 根據上述說明,本發明的附接點板薄片具有:接點板、 粘著在上述接點板上面的上薄片、設有可從外部穿通上述 接點板的通孔且保持上述上薄片並可使之剝離的傳送薄 片、保持在上述傳送薄片下面並覆蓋上述通孔和上述接點 板的保護薄片;在上述傳送薄片下面設有傳送粘著層、通 過該傳送粘著層粘著並保持上述保護薄片的上面。因此, 不會發生與裝有本附接點板薄片的電子儀器基板上設置 的固定接點相接觸而使接點板下面一側的外圖部分附著 粘接劑的問題。 在另一結構中,由於具有接點板、粘接在該接點板上面 的上薄片、設有能從外部穿通上述接點板的通孔,保持上 述上薄片並使之能剝離的傳送薄片、保持在上述傳送薄片 下面並覆蓋了上述通孔和上述接點板的保護薄片,該保護 薄片被保持在上述傳送薄片的下面、其下面由比其寬的固 定薄片覆蓋,所以接點板下面一側的外周部分不會附著粘 接劑。 -11 - 580714[Effects of the Invention] According to the above description, the attachment point plate sheet of the present invention includes a contact plate, an upper sheet adhered to the contact plate, and a through hole through which the contact plate can be passed from the outside and held. A transport sheet that can be peeled off from the upper sheet, a protective sheet that is held under the transport sheet and covers the through hole and the contact board; a transport adhesive layer is provided under the transport sheet, and the transport adhesive layer is passed through the transport sheet Adhere and hold the above protective sheet. Therefore, there is no problem that an adhesive is adhered to the external portion of the lower side of the contact board by contacting the fixed contact provided on the electronic device substrate on which the contact board sheet is mounted. In another structure, a contact sheet, an upper sheet adhered to the contact sheet, and a through hole capable of penetrating the contact sheet from the outside are provided to hold and peel the transport sheet A protective sheet that is held under the transport sheet and covers the through hole and the contact board. The protective sheet is held under the transport sheet and the lower part is covered by a fixed sheet wider than the protective sheet. Adhesive does not adhere to the outer peripheral part of the side. -11-580714

(8) 【圖式的簡單說明】 圖1是本發明的附接點板薄片實施例1的俯視圖。 圖2是本發明的附接點極薄片實施例1的傳送方向剖面 圖。 圖3是本發明的附接點板薄片實施例1的寬度方向剖面 圖。 圖4是本發明的附接點板薄片實施例1的製造工序示意(8) [Brief description of the drawings] FIG. 1 is a plan view of the first embodiment of the attachment point plate sheet of the present invention. Fig. 2 is a cross-sectional view in the conveying direction of the first embodiment of the attachment point electrode sheet of the present invention. Fig. 3 is a cross-sectional view in the width direction of Embodiment 1 of an attachment point plate sheet of the present invention. FIG. 4 is a schematic view showing a manufacturing process of the attachment point plate sheet according to the first embodiment of the present invention; FIG.

圖。 圖5是本發明的附接點板薄片其他實施例的俯視圖。 圖6是本發明的附接點極薄片其他實施例的傳送方向剖 面圖。 圖7是本發明的附接點板薄片其他實施例的幅寬方向剖 面圖。 圖8是本發明的附接點板薄片其他實施例的製造工序示 意圖。 圖9是習知附接點板薄片的傳送方向剖面圖。Illustration. FIG. 5 is a plan view of another embodiment of an attachment point plate sheet according to the present invention. Fig. 6 is a cross-sectional view in the conveying direction of another embodiment of the attachment point electrode sheet of the present invention. Fig. 7 is a cross-sectional view in the width direction of another embodiment of the attachment point plate sheet of the present invention. Fig. 8 is a schematic view showing a manufacturing process of another embodiment of an attachment point plate sheet according to the present invention. FIG. 9 is a cross-sectional view of a conventional attachment point plate sheet in a conveying direction.

圖1 0是附接點板薄片裝入電子儀器基板上的狀態剖面 示意圖。 〈圖式代表符號說明〉 1 附接點板的薄片體 2 上薄片 3 間隔薄片 4 接點板 5 通孔 -12 - 580714Fig. 10 is a schematic cross-sectional view showing a state in which the attachment point plate sheet is mounted on the electronic device substrate. 〈Explanation of Symbols of Drawings〉 1 Sheet with attached contact plate 2 Upper sheet 3 Spacer sheet 4 Contact sheet 5 Through hole -12-580714

(9) 6 插裝構件用的通孔 7 傳送薄片 7 c 定位孔 8 保護薄片 9 固定薄片 -13 -(9) 6 Through hole for inserting member 7 Conveying sheet 7 c Positioning hole 8 Protective sheet 9 Fixing sheet -13-

Claims (1)

580714 拾、申請專利範面 1. 一種附接點板的薄片,其特徵在於: 包括:接點板、粘著在上述接點板上面的上薄片、設 有可從外部穿通上述接點板的通孔且上述上薄片並使 其能剝離的傳送薄片、及保持在上述傳送薄片下面並覆 蓋上述通孔和上述接點板的保護薄片;且 在上述傳送薄片下面設有傳送粘著層、通過該傳送粘 著層粘著並保持上述保護薄片的上面。 2. 如申請專利範圍第1項所述的附接點板的薄片,其中 上述傳送粘著層係由具有小於上述上薄片與上述傳 送薄片間粘接力的微粘接材料形成。 3 . —種附接點板的薄片,其特徵在於: 包括:接點板、粘接在該接點板上面的上薄片、設有 、能從外部穿通上述接點板的通孔且保持上述上薄片並 使其能剝離的傳送薄片、及被保持在上述傳送薄片下面 並覆蓋上述通孔和上述接點板的保護薄片;且 上述保護薄片粘附保持在上述傳送薄片下面、其下面 由比其寬的固定薄片覆蓋。 4.如申請專利範圍第3項所述的附接點板的薄片,其中 使上述傳送薄片、上述保護薄片、上述固定薄片連續 形成帶狀,並能連續供給多個上述上薄片。 5 .如申請專利範圍第4項記述的附接點板的薄片,其中 將上述固定薄片的寬度形成為去除上述傳送薄片的 進給裝置上的定位孔所得到的寬度。580714 Patent application scope 1. A sheet for attaching a contact board, comprising: a contact board, an upper sheet adhered to the top of the contact board, and a contact board that can pass through the contact board from the outside A through-hole, the upper sheet and the peelable transfer sheet, and a protective sheet held under the transfer sheet and covering the through-hole and the contact board; and a transfer adhesive layer is provided under the transfer sheet, This transfer adhesive layer adheres and holds the above-mentioned protective sheet. 2. The sheet for attaching a point plate according to item 1 of the scope of patent application, wherein the transfer adhesive layer is formed of a micro-adhesive material having a smaller adhesive force between the upper sheet and the transfer sheet. 3. A sheet for attaching a contact board, comprising: a contact board, an upper sheet adhered to the contact board, a through hole provided to pass through the contact board from the outside, and maintaining the above A conveying sheet on which the sheet is peeled off, and a protective sheet held under the conveying sheet and covering the through hole and the contact board; and the protective sheet is adhered and held under the conveying sheet, and the lower part Wide fixed sheet covering. 4. The sheet for attaching a point plate according to item 3 of the scope of patent application, wherein the conveying sheet, the protective sheet, and the fixed sheet are continuously formed into a belt shape, and a plurality of the upper sheets can be continuously supplied. 5. The sheet for attaching a point plate as described in item 4 of the scope of patent application, wherein the width of the fixed sheet is formed to a width obtained by removing a positioning hole on the feeding device of the conveying sheet.
TW91137667A 2002-01-29 2002-12-27 Thin slice with attached contact plate TW580714B (en)

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JP2002019744A JP2003217392A (en) 2002-01-29 2002-01-29 Sheet with contact plate

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TW200302498A TW200302498A (en) 2003-08-01
TW580714B true TW580714B (en) 2004-03-21

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JP2007299588A (en) * 2006-04-28 2007-11-15 Alps Electric Co Ltd Push-button switch and sheet with contact spring used for construction of push-button switch

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