CN1435858A - Sheet with contact plate - Google Patents
Sheet with contact plate Download PDFInfo
- Publication number
- CN1435858A CN1435858A CN 03102280 CN03102280A CN1435858A CN 1435858 A CN1435858 A CN 1435858A CN 03102280 CN03102280 CN 03102280 CN 03102280 A CN03102280 A CN 03102280A CN 1435858 A CN1435858 A CN 1435858A
- Authority
- CN
- China
- Prior art keywords
- mentioned
- plate
- contact
- support plate
- carrying
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Landscapes
- Laminated Bodies (AREA)
- Packaging Frangible Articles (AREA)
- Push-Button Switches (AREA)
- Coating Apparatus (AREA)
Abstract
A kind of thin slice with attached contact plate is provided in the present invention, in which the thin slice is capable of increasing contact reliability between contact plate and the fixed contact on the base board facing the user. The upper thin slice 2 is adhered on the transmission thin slice 7 where there is no inserted component in the through hole 5 for the contact plate 4. The thin slice body 1 having the attached contact plate 4 is installed under the thin slice 2. By passing the transmission sticking layer 7b installed under the transmission thin slice 7 to stick the protection thin slice 8 inserted into the through hole 5, it is capable of preventing the external peripheral portion under the contact plate 4, which contacts the fixed contact point on one side of the base board facing the user, from being stuck by the adhesive.
Description
Technical field that the present invention belongs to
The invention relates to as the thin plate (シ one ト) of digital communication apparatus such as mobile phone operation with the contact-carrying plate of key switch use.
Background technology
Generally, the example of the structure of contact-carrying plate thin plate and manufacture method thereof such as has Japanese patent laid-open 9-282974 number at invention disclosed.Below as shown in Figure 9 this kind of thin plate sectional schematic diagram brief description thin-slab structure just.What point out is that in all sizes, the multiplication factor of thickness direction is much larger than the multiplication factor of in-plane among the figure.
The contact-carrying plate thin plate 81 that is assembled as parts in all kinds of electronic devices such as digital communication apparatus is made up of upper plate 82, space bar (ス ペ one サ シ one ト) 83 and the contact board 84 that stick to below the upper plate 82.Above-mentioned contact board 84 sticks to below the upper plate 82, and insertion is arranged in the through hole 85 of space bar 83.Upper plate 82 is made up of upper plate 82a and last adhesion coating 82b, and is bonding by adhesion coating 82b on this and space bar 83.Space bar 83 is made up of interval film 83a and interval adhesion coating 83b.In addition, thin plate 81 is provided with the through hole 86 that parts such as assembling LED are used.
The manufacture method of this product simply is described below.At first; be equipped with banded support plate 87 and form carrying forms the bonding band shape of through hole 85---〉with the space bar (including the part that forms space bar 83)---〉of bullport (representing among the figure)---〉bonding band shape on support plate 87 upper plate (including the part that forms upper plate 82)---〉formation through hole 86---〉in order to add the crack in the part that forms thin plate 81 profiles; peel off in the process of circumvolution for banded upper thin sheet and banded space bar (being nubbin) that the upper plate of band shape and banded space bar carry out hemisect (support plate is not cut)---〉and will become beyond thin plate 81 parts---〉contact board 84 inserted below through hole 85 and with upper plate 82 bonding-baffle 88 is bonded in below the support plate 87, then with its circumvolution on cylinder.
In addition, also have some other structures, as no space bar 83 types or in said structure in through hole 85 the various forms of structures such as the type of filling in of other thin plate of insertion.
State when above-mentioned thin plate 81 is assemblied on the electronic installation substrate as shown in figure 10.In the packaging technology of electronic installation, thin plate 81 after peeling off, support plate 81 is bonded on the substrate of electronic installation product.The substrate 90 of product is provided with first fixed contact 91 and the 2nd fixed contact 92, when the operator pushes on contact board 84 with finger, and conducting between the 1st fixed contact 91 and the 2nd fixed contact 92.In this structure, require contact board 84 following outer peripheral portion 84c can stablize and contact with the 1st fixed contact 91.
But in traditional structure, till being assembled on the electronic installation, the outer peripheral portion 84c below the contact board 84 is approaching with protection adhesion coating 88b or contact.Because the conditions such as temperature when support plate is installed or carried change, the bonding agent of protection adhesion coating 88b might adhere to the set position of contact board 84c.
Summary of the invention
In order to solve above-mentioned problem, in technical scheme 1 corresponding structure of the present invention, have contact board, be attached to upper plate above the above-mentioned contact board, be provided with and make the through hole that above-mentioned contact board can insert from the outside and support above-mentioned upper plate and make its strippable support plate, remain on below the above-mentioned support plate and cover the baffle of above-mentioned through hole and above-mentioned contact board; Below above-mentioned support plate, be provided with the carrying adhesion coating, adhere and keep above the above-mentioned protection thin plate by this carrying adhesion coating.
In second technical scheme, form above-mentioned carrying adhesion coating by having the little sticky material that is lower than cohesive force between above-mentioned upper plate and the above-mentioned support plate.
In the 3rd technical scheme, have contact board, be bonded in this upper plate above contact board, be provided with the through hole that above-mentioned contact board can be inserted from the outside, keep above-mentioned upper plate to make its support plate that can peel off, be maintained at below the above-mentioned support plate and covered the baffle of above-mentioned through hole and above-mentioned contact board; Above-mentioned baffle sticks to below the above-mentioned support plate, this baffle following by covering than its wide fixed head.
In the 4th technical scheme, above-mentioned support plate, above-mentioned baffle, said fixing plate are formed band shape continuously, and can supply with a plurality of above-mentioned upper plates continuously.
In the 5th technical scheme, the width of said fixing plate formed the resulting width of location hole on the feed arrangement of removing above-mentioned support plate.
The simple declaration of drawing
Fig. 1 is the vertical view of contact-carrying plate thin plate embodiment 1 of the present invention.
Fig. 2 is the contact-carrying of the present invention carrying direction cutaway view of plate embodiment 1 as thin as a wafer.
Fig. 3 is the Width cutaway view of contact-carrying plate thin plate embodiment 1 of the present invention.
Fig. 4 is the process for making schematic diagram of contact-carrying plate thin plate embodiment 1 of the present invention.
Fig. 5 is the vertical view of other embodiment of contact-carrying plate thin plate of the present invention.
Fig. 6 is the contact-carrying of the present invention carrying direction cutaway view of other embodiment of plate as thin as a wafer.
Fig. 7 is the fabric width direction cutaway view of other embodiment of contact-carrying plate thin plate of the present invention.
Fig. 8 is the process for making schematic diagram of other embodiment of contact-carrying plate thin plate of the present invention.
Fig. 9 is traditional contact-carrying plate thin-plate conveyance direction cutaway view
Figure 10 is pack into a state generalized section on the electronic instrument substrate of contact-carrying plate thin plate.
The working of an invention form
Below, according to Fig. 1～Fig. 4 the embodiment of the invention 1 is described.Fig. 1 is the vertical view of support plate, and Fig. 2 is to be cutaway view along the web width direction along the cutaway view of web transport direction, Fig. 3, and Fig. 4 is the schematic diagram of process for making.What must cause concern is, below among each figure the size multiplication factor of thin and thick direction much larger than in-plane.
As shown in Figure 1, the part of thin plate 1 that has contact board is identical with conventional case, promptly is made of upper plate 2, the space bar 3 and the contact board 4 that stick to below the upper plate 2.Above-mentioned contact board 4 sticks to the following of upper plate 2 and is inserted in the through hole 5 that is located at space bar 3.Upper plate 2 is made of upper plate 2a and last adhesion coating 2b, and is bonded on the space bar 3 by last adhesion coating.This space bar 3 is formed by space bar 3 and interval adhesion coating 3b.In addition, thin plate 1 has the through hole 6 that is provided with for parts such as assembling LED.
The process for making of said structure is described according to Fig. 4 below.At first, the support plate 7 that is formed by support plate 7a, carrying adhesion coating 7b and support plate 7d lamination is placed with the state of circumvolution on cylinder 7R, is pulled in the processing line then.On the other hand, the space bar 3 that is formed by space bar 3a, interval adhesion coating 3b and interval dividing plate 3c lamination is placed with the state of circumvolution on cylinder 3R, is drawn out then.After being drawn out, at interval dividing plate is stripped from once and is become relic and be rolled on the cylinder 3s.
After support plate 7 and space bar 3 are adhered together, process the through hole 5 of location hole 7C and contact board by drift 5P.At this moment, because carrying adhesion coating 7b forms by weak sticky material, so very difficult attached to (in the following course of processing herewith reason) on the processing unit (plant).After the upper plate 2 that upper plate 2a, last adhesion coating 2b and upper spacer 2c lamination form was pulled out from cylinder 2R, upper spacer 2c was stripped from once, becomes relic and is rolled on the cylinder 2s.And residual upper plate 2a and last adhesion coating 2b are adhered on the space bar 3.
1H forms grooving on the profile of thin plate 1 part by the semicircle drift.Simultaneously, go out through hole 6 by drift 6P.Then, the nonuseable part of upper plate 2 and space bar 3 is stripped from together and is rolled on the cylinder 2T as relic.Contact board 4 is by insertion machine 4I, from insertion through hole 5 below residual thin plate 1 and bonding below last adhesion coating 2b.
Then, the empty carrying dividing plate 7d of through hole is taken as relic and sweeps away, and only leaves the part of a side below the location hole 7c of support plate 7.And following (the removing the part of a side below the location hole 7c) of support plate 7 covered by the baffle of supplying with from cylinder 8R 8.At last, finished product is involved in cylinder 7T.
According to Fig. 5～Fig. 8 the invention process form 2 is described below.Fig. 5 is the vertical view of support plate, and Fig. 6 is the cutaway view along the thin-plate conveyance direction, and Fig. 7 is that cutaway view, Fig. 8 of web width direction is the process for making schematic diagram.Structure and embodiment 1 identical part explanation is omitted.Compare with the embodiment 1 of contact-carrying plate thin plate, difference does not have space bar 3 this point exactly.In this case, when the user connected on the product substrate, the part of the contact board 4 of upper plate 2 was stretched out and is convex.In addition, support plate 7 and following baffle 8 all do not have adhesion coating.So, be bonded with fixed head 9 for baffle 8 is fixed on the support plate 7.This fixed head 9 by fixed head 9a and fixedly adhesion coating 9b form, its width is narrower than support plate 7, and wideer than baffle 8, therefore, baffle 8 be maintained at support plate 7 below.According to said structure, need not worry equally that with last embodiment a following side outer peripheral portion 4c of contact board 4 contacts with sticker.
The following describes the process for making of true embodiment 2.At first, support plate 7 is placed with the state that is wound on the cylinder 7R, is drawn into processing line then.
Form grooving on the thin plate 1 part profile by semicircle drift 1H, go out through hole 6 by drift 6P simultaneously.Then, the nonuseable part of upper plate 2 is stripped from, and is involved in the cylinder 2T as relic.Contact board 4 is passed through insertion machine 4I from insert through hole 5 and bonding below upper plate 2a below residual thin plate 1.
By fixed head 9a, fixing adhesion coating 9b and stationary barrier 9c forms and width is pulled out from cylinder 9R less than the fixed head 9 of the distance between the location hole 7c of support plate 7 both sides.Because this fixed head 9 does not cover the location hole 7c of support plate 7, can not polluted by bonding agent so insert the processing unit (plant) side alignment pin of location hole 7c.Therefore, product precision and rate of finished products are improved.And after fixed head 9 was pulled out from cylinder 9R, stationary barrier 9c was involved in cylinder 9s as relic at once; Fixedly adhesion coating 9b one side is bonded with the narrower baffle of width 8; And above-mentioned support plate 7 downsides of above-mentioned 3 layers of thin plate processing from the feeding way are by bonding.At last, manufactured goods are rolled on the cylinder 7T.
In the above-described embodiments, support plate 7 is continuous, the processing of also can dispersing.In addition, through hole 5 places only insert contact board 4 but are not limited to this mode in the present embodiment, the electronic unit with electrode can be packed into together, and its effect is identical.Also has thin plate class material that also can lamination has various functions on upper plate.The shape of contact board also is not limited to downward bowl structure, can be other various suitable shapes.
The effect of invention
According to the above description, contact-carrying plate thin plate of the present invention has: contact board, adhere to State upper plate above the contact board, be provided with and from the through hole of the above-mentioned contact board of outside break-through and keep State upper plate and the support plate that can make it to peel off, remain on below the above-mentioned support plate and cover above-mentioned through hole and The baffle of above-mentioned contact board; Below above-mentioned support plate, be provided with the carrying adhesion coating, pass through this carrying Adhesion coating adhesion and keep above-mentioned baffle above. Therefore, can not take place and this band is housed touches The fixed contact that arranges on the electronic instrument substrate of some plate thin plate contacts and makes below the contact board The outer figure of one side partly adheres to the problem of bonding agent.
In another structure, owing to have contact board, be bonded in this upper plate above contact board, Be provided with can be from the through hole of the above-mentioned contact board of outside break-through, keeps above-mentioned upper plate and makes it to peel off Support plate, remain on below the above-mentioned support plate and the protection that has covered above-mentioned through hole and above-mentioned contact board Plate, this baffle be maintained at above-mentioned support plate following, below it by covering than its wide fixed head Lid is not so the outer peripheral portion of a side can adhere to bonding agent below the contact board.
Claims (5)
1, a kind of thin plate of contact-carrying plate comprises:
Contact board, adhere to upper plate above the above-mentioned contact board, be provided with and from the through hole of the above-mentioned contact board of outside break-through and keep above-mentioned upper plate to make its strippable support plate, remain on below the above-mentioned support plate and cover the baffle of above-mentioned through hole and above-mentioned contact board; It is characterized in that:
Below above-mentioned support plate, be provided with the carrying adhesion coating, adhere and keep above the above-mentioned baffle by this carrying adhesion coating.
2, the thin plate of contact-carrying plate according to claim 1 is characterized in that:
Above-mentioned carrying adhesion coating is formed by the little adhesives that has less than bonding force between above-mentioned upper plate and above-mentioned support plate.
3, a kind of thin plate of contact-carrying plate comprises:
Contact board, be bonded in this upper plate above contact board, be provided with and from the through hole of the above-mentioned contact board of outside break-through and keep above-mentioned upper plate and make its support plate that can peel off, be maintained at below the above-mentioned support plate and covered the baffle of above-mentioned through hole and above-mentioned contact board; It is characterized in that:
Above-mentioned baffle adhere to remain on below the above-mentioned support plate, below it by covering than its wide fixed head.
4, the thin plate of contact-carrying plate according to claim 3 is characterized in that:
Make above-mentioned support plate, above-mentioned baffle, said fixing plate form band shape continuously, and can supply with a plurality of above-mentioned upper plates continuously.
5, the thin plate of the contact-carrying plate of recording and narrating according to claim 4 is characterized in that:
The width of said fixing plate formed the resulting width of location hole on the feed arrangement of removing above-mentioned support plate.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002019744A JP2003217392A (en) | 2002-01-29 | 2002-01-29 | Sheet with contact plate |
| JP2002019744 | 2002-01-29 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1435858A true CN1435858A (en) | 2003-08-13 |
| CN1234143C CN1234143C (en) | 2005-12-28 |
Family
ID=27654287
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 03102280 Expired - Fee Related CN1234143C (en) | 2002-01-29 | 2003-01-27 | Sheet with contact plate |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2003217392A (en) |
| CN (1) | CN1234143C (en) |
| TW (1) | TW580714B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007299588A (en) * | 2006-04-28 | 2007-11-15 | Alps Electric Co Ltd | Push-button switch and sheet with contact spring used for construction of push-button switch |
-
2002
- 2002-01-29 JP JP2002019744A patent/JP2003217392A/en not_active Withdrawn
- 2002-12-27 TW TW91137667A patent/TW580714B/en not_active IP Right Cessation
-
2003
- 2003-01-27 CN CN 03102280 patent/CN1234143C/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| TW200302498A (en) | 2003-08-01 |
| CN1234143C (en) | 2005-12-28 |
| TW580714B (en) | 2004-03-21 |
| JP2003217392A (en) | 2003-07-31 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP1112674B1 (en) | Laminates for encapsulating oled devices | |
| CN1322408C (en) | Touch panel and the manufacturing method | |
| US9063605B2 (en) | Thin glass processing using a carrier | |
| KR101330884B1 (en) | Input device and method for manufacturing the same | |
| EP2270865A3 (en) | Method of producing a detection/test tape | |
| KR20150023512A (en) | Glass substrate strip | |
| CN102629015A (en) | Flexible display device and manufacturing method thereof | |
| TWI522866B (en) | Display unit for touch screen and manufacturing method thereof | |
| CN105044940A (en) | Panel and testing method of same | |
| US7081180B2 (en) | Roll-to-roll process for fabricating passive matrix plastic displays | |
| EP1133789B1 (en) | Mechanical patterning of a device layer | |
| WO2003032334A1 (en) | Thick-film sheet member, its applied device, and methods for manufacturing them | |
| US6576149B1 (en) | Method and device for parting laminated substrate for liquid crystal cell | |
| JP2005340182A (en) | Method for thinning substrate of el device and method for parting laminated substrate | |
| CN1234143C (en) | Sheet with contact plate | |
| CN110164824B (en) | Flexible packaging structure, manufacturing method and wearable device with flexible packaging structure | |
| CN202601095U (en) | Flexible display device | |
| Lee et al. | 31‐1: Invited Paper: Novel Technologies for Flexible Displays and Electronics | |
| US20080048347A1 (en) | Display device and manufacturing method thereof | |
| KR100559090B1 (en) | Tablet and method for manufacturing the same | |
| KR20150122454A (en) | Touch Screen Panel and Method for Fabricating the same | |
| US20030198785A1 (en) | Cover tape to be overlaid on a carrier tape for carrying parts therewith | |
| CN117844397A (en) | Film and production process of film | |
| JP2006065610A (en) | Touch panel with protection sheet and manufacturing method thereof | |
| CN1253350C (en) | Coiled packaging and feeding method of flexible printed circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |