TW200302498A - Thin slice with attached contact plate - Google Patents

Thin slice with attached contact plate Download PDF

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Publication number
TW200302498A
TW200302498A TW91137667A TW91137667A TW200302498A TW 200302498 A TW200302498 A TW 200302498A TW 91137667 A TW91137667 A TW 91137667A TW 91137667 A TW91137667 A TW 91137667A TW 200302498 A TW200302498 A TW 200302498A
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Taiwan
Prior art keywords
sheet
contact board
plate
contact
hole
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TW91137667A
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Chinese (zh)
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TW580714B (en
Inventor
Iwama Hisaya
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Alps Electric Co Ltd
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Publication of TW200302498A publication Critical patent/TW200302498A/en
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Publication of TW580714B publication Critical patent/TW580714B/en

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Abstract

A kind of thin slice with attached contact plate is provided in the present invention, in which the thin slice is capable of increasing contact reliability between contact plate and the fixed contact on the base board facing the user. The upper thin slice 2 is adhered on the transmission thin slice 7 where there is no inserted component in the through hole 5 for the contact plate 4. The thin slice body 1 having the attached contact plate 4 is installed under the thin slice 2. By passing the transmission sticking layer 7b installed under the transmission thin slice 7 to stick the protection thin slice 8 inserted into the through hole 5, it is capable of preventing the external peripheral portion under the contact plate 4, which contacts the fixed contact point on one side of the base board facing the user, from being stuck by the adhesive.

Description

200302498 ⑴ 玖、發明說明 (發明說明應敘明:發明所屬之技術領域、先前技術、内容、實施方式及圖式簡單說明) 【發明所屬技術領域】 本發明是關於作為手機等數位通訊裝置操作用鍵開關 使用的附接點板之薄片(sheet)。 【習知技術】 · 習知附接點板薄片的結構及其製造方法的例子有日本 專利特開平9-282 974號等公開的發明。下面就如圖9所示 的薄片剖面示意圖簡要說明該種薄片結構。要提醒注意的 鲁 是’圖中所有尺寸中,厚度方向的放大倍數遠大於平面方 向的放大倍數。 在數位通訊裝置等各類電子裝置中作為構件而被組裝 起來的附接點板薄片體8 1由上板82、粘附在上板82下面的 間隔板(spacer sheet)83和接點板84組成。上述接點板84 枯附在上板8 2下面,並插入設置在間隔板8 3的通孔8 5中。 上板82由上板82a和上粘著層82b組成,通過該上粘著層 8 2b與間隔板83粘接。間隔板83由間隔薄膜83 a和間隔枯著 · 層8 3b組成。此外,薄片體81上設有裝配LED等構件用的 通孔8 6。 具有上述結構的薄片體8 1通過間隔粘著層8 3 b粘附在帶 狀傳送板8 7上。該傳送板8 7下面粘接帶狀保護板8 8。該保 護板88是為薄片對8丨裝配到電子裝置以前防止接點板84 · 上落上贓物等而設置的。該保護板88由保護板88a和保護 、 枯著層88b形成。 該產品的製造方法簡略敘述如下。首先,裝備好帶狀傳 200302498200302498 发明 发明, description of the invention (the description of the invention should state: the technical field to which the invention belongs, the prior art, the content, the embodiments, and the schematic description of the invention) A sheet of attachment point plates used by key switches. [Known Technology] · Examples of the structure of the attachment point plate sheet and the manufacturing method thereof are disclosed in Japanese Patent Laid-Open No. 9-282,974 and the like. The schematic diagram of the cross section of the sheet shown in Fig. 9 will briefly explain the structure of the sheet. It is important to note that among all the dimensions in the picture, the magnification in the thickness direction is much larger than the magnification in the plane direction. The attachment point plate sheet 8 is assembled as a component in various electronic devices such as digital communication devices, and is composed of an upper plate 82, a spacer sheet 83 adhered to the lower plate 82, and a contact plate 84. composition. The above-mentioned contact plate 84 is attached below the upper plate 82 and is inserted into the through hole 85 provided in the spacer plate 8 3. The upper plate 82 is composed of an upper plate 82a and an upper adhesive layer 82b, and the upper plate 82 is bonded to the spacer plate 83 through the upper adhesive layer 82b. The spacer plate 83 is composed of a spacer film 83a and a spacer spacer layer 8 3b. The sheet 81 is provided with through holes 86 for mounting components such as LEDs. The sheet body 81 having the above-mentioned structure is adhered to the belt-shaped conveying plate 87 through a spacer adhesive layer 8 3b. A band-shaped protective plate 88 is bonded to the lower surface of the transfer plate 88. The protection plate 88 is provided to prevent the contact plate 84 · from falling on the board before the sheet pair 8 is mounted on the electronic device. The protective plate 88 is formed of a protective plate 88a and a protective and dead layer 88b. The manufacturing method of this product is briefly described as follows. First, equip the belt pass 200302498

⑺ 送板87並形成搬運用引導孔(圖中表示)在傳送板87 上钻接帶狀的間隔板(包含有形成間隔板Μ的部分)__〉 形成通孔85— — >钻接帶狀的上板(包含有形成上板82的 部分)一一〉形成通孔86 >為了在形成薄片體81外形的 部分加入裂縫’對於帶狀的上板和帶狀間隔板進行半切割 (傳送板不被切割)一一>將成為薄片體81部分以外的帶狀 上薄片和帶狀間隔板(即殘餘部分)在捲纏的過程中剝 離 >將接點板84從通孔85下面插入並與上板82钻 接一一>使保護板88枯接在傳送板87下面,然後將其捲纏 在滾筒上。 此外,還有其他結構,如無間隔板83型或在上述結構中 在通孔85中插入別的薄片的塞入型等各種形式的結構。 【發明所欲解決之課題】 上述薄片體81裝配在電子裝置基板上時的狀態如圖1〇 所示。在電子裝置的組裝工序中’將薄片體Η從傳送板” 上剝離後枯接到電子裝置產品的基板上。產品的基板9〇 ^設有第一固定接點91和第2固定接點92,當操作者用手 指在接點板84上按壓時,第!固定接點”和第2固定接點” 之間導通。在這種結構中,要求接點板8 4下面的外周部分 84c與第i固定接點91能穩定接觸。 疋在名知結構中,到組裝到電子裝置上為止,接點 :“下面的外周部分…與保護枯著層㈣接近或相接 於傳$ ^安裝或搬運時的溫度等條件變化,保護枯 者^的點接劑有可能枯附到接點板“c所設置部位。 200302498 (3) 【用以解決課題之手段】 為了解決上述課題,本發明的技術手段1所對應的結構 中,具有接點板、貼附在上述接點板上面的上薄片、設有 使上述接點板可從外部插入的通孔且支撐上述上薄片並 使其可剝離的傳送薄片、保持在上述傳送薄片下面並覆蓋 上述通孔和上述接點板的保護薄片;在上述傳送薄片下面 設有傳送粘著層、通過該傳送粘著層粘著並保持上述保護送 Feed the plate 87 and form a guide hole for conveyance (shown in the figure) Drill a belt-shaped spacer plate (including the part forming the spacer plate M) on the conveyor plate 87 __> Form a through hole 85 — —> Drilling belt Shaped upper plate (including the portion forming the upper plate 82) one by one> forming through holes 86 > To add a crack in the portion forming the outer shape of the sheet 81 'Semi-cut the band-shaped upper plate and the band-shaped spacer plate ( The conveying plate is not cut) One by one> The strip-shaped upper sheet and the strip-shaped spacer (that is, the residual part) which will become the sheet body 81 will be peeled off during the winding process> The contact plate 84 will be removed from the through hole 85 Insert below and drill one by one with the upper plate 82 to make the protection plate 88 dry under the conveying plate 87, and then wind it around the drum. In addition, there are other structures, such as a non-spacer plate type 83 or a plug-in type in which another sheet is inserted into the through hole 85 in the above structure. [Problems to be Solved by the Invention] The state when the sheet 81 is mounted on a substrate of an electronic device is shown in FIG. 10. In the assembling process of the electronic device, the sheet is peeled from the conveying plate, and then it is dried and attached to the substrate of the electronic device product. The product substrate 90 is provided with a first fixed contact point 91 and a second fixed contact point 92. When the operator presses on the contact plate 84 with a finger, there is conduction between the "! Fixed contact" and the second fixed contact. In this structure, the outer peripheral portion 84c below the contact plate 84 is required The i-th fixed contact 91 can be contacted stably. 疋 In the well-known structure, until it is assembled on the electronic device, the contact: "The outer peripheral part below ... is close to or connected to the protection layer ㈣. Conditions such as temperature during transportation may change, and the spotting agent that protects the dead may be attached to the portion where the contact board "c is installed. 200302498 (3) [Means to solve the problem] In order to solve the above problem, the present invention The structure corresponding to the technical means 1 includes a contact board, an upper sheet attached to the contact board, a through hole through which the contact board can be inserted from the outside, and supports and peels the upper sheet. Transfer sheet, held under the transfer sheet And the protective sheet covering the through hole and the contact plate; and provided with an adhesive layer on the transfer sheet following transfer, transport through the adhesive layer and the adhesive holding the protective

薄片的上面。 在第二技術手段中,由具有低於上述上薄片與上述傳送 薄片之間粘結力的微粘著材料形成上述傳送粘著層。 在第三技術手段中,具有接點板、粘接在該接點板上面 的上薄片、設有能將上述接點板從外部插入的通孔、保持 上述上薄片使其能剝離的傳送薄片、被保持在上述傳送薄 片下面並覆蓋了上述通孔和上述接點板的保護薄片;上述 保護薄片粘附在上述傳送薄片下面、該保護模片的下面由 比其寬的固定薄片覆蓋。The top of the sheet. In the second technical means, the transfer adhesive layer is formed of a micro-adhesive material having a lower adhesive force between the upper sheet and the transfer sheet. The third technical means includes a contact board, an upper sheet adhered to the contact board, a through hole through which the contact board can be inserted from the outside, and a transport sheet that holds the upper sheet so that it can be peeled off. A protective sheet that is held under the transport sheet and covers the through-holes and the contact board; the protective sheet is adhered to the transport sheet, and the protective sheet is covered with a fixing sheet wider than the protective sheet.

在第四技術手段中,把上述傳送薄片、上述保護薄片、 上述固定薄片連續形成帶狀,並能連續供給多個上述上薄 片。 在第五技術手段中,把上述固定薄片的寬度形成為去除 上述傳送薄片的進給裝置上的定位孔所得到的寬度。 【發明的實施形式】 下面,根據圖1〜圖4說明本發明實施例1。圖1是傳送薄 片的俯視圖,圖2是沿薄片、傳送方向的剖視圖、圖3是沿 (4) 薄片X*度方向的剖插 』現圖,圖4是製造工序過程的示意圖 須提起注惫的导, 面各圖中薄厚方向的尺寸放大倍數 大於平面方向。 如圖1所示,附右 w ’得點板的薄片體1的部分與傳統例 @ ’即由上蒲Η 9 . ^ 厚片、轮附在上薄片2下面的間隔薄片3和 赤占板4構& ^ 0 μ 述接點板4粘附在上薄片2的下面並被插 到設在間隔薄 _ /辱片的通孔5内。上薄片2由上薄片2a和上 考層2b構成,#、名π s广 成 通過上粘著層2b粘接在間隔薄片3上。 ^ 2薄片3由間隔薄膜3a和間隔粘著層3b形成。此外, 片體1具有為裝配L E D等構件而設置的通孔6。 八有上述結構的薄片體1由間隔粘著層3 b粘著在帶狀 心溥片7上,到此為止與現有技術相似。但是,傳送薄 (士圖2所不)由傳送薄片7 a和傳送粘著層7 b形成,其下 枯附有帶狀保護薄片8,但該保護薄片8上未設粘著層, 一點與現有技術不同。所以,在接點板4下面外周部分 處不會附著點接劑,且如圖3所示殘留在定位孔八下面 傳送隔板7 b的X度方向兩側部分、當為了輸送把傳送薄 7 ’捲在滾筒上時,相互沒有粘連。 下面根據圖4說明上述結構的製造工序過程。首先, 傳达薄片7a、傳送粘著層7b和傳送隔板7d層積而成的傳 薄片7以捲纏在滾筒7 R上的狀態被放置,然後被拉入到 工線中。另一方面,由間隔薄膜3 a、間隔粘著層3 b和間 隔板3 c層積而成的間隔薄片3以捲纏在滾筒3 R上的狀 被放置,然後被拉出。當被拉出後,間隔隔板立刻被剝 遠 相 接 入 粘 該 薄 傳 片 面 這 4 c 的 片 由 送 加 隔 態 離 200302498 (5) 成為殘片被捲到滾筒3 S上。 傳送薄片7和間隔薄片3粘著在一起後,由沖頭5 P加工出 定位孔7c和接點板的通孔5。這時,由於傳送粘著層7b由 弱粘著材料形成,所以很難附著在加工裝置上(下面的加 工過程中同此道理)。上薄片2a、上粘著層2b和上隔板2c 層積而成的上薄片2從滾筒2R中拉出後,上隔板2c立刻被 剝離,成為殘片被捲到滾筒2S上。而殘留的上薄片2a和上 粘著層2b被粘著在間隔薄片3上。 由半圓沖頭1 Η在薄片體1部分的外形上形成切槽。同 時,由沖頭6Ρ沖出通孔6。然後,上薄片2和間隔薄片3的 無用部分一起被剝離、並作為殘片被捲到滾筒2Τ上。接 點板4通過插入機41、從相對於殘留薄片體1的下面插入通 孔5、並與上粘著層2b的下面粘接。 然後,通孔空著的傳送隔板7 d被當作殘片捲走,只留有 傳送薄片7的定位孔7c下面一側的部分。並且傳送薄片7 的下面(除定位孔7c下面一側的部分)由從滾筒8R供給的 保護薄片8覆蓋。最後,成品被捲入滾筒7T。 下面根據圖5〜圖8說明本發明實施形式2。圖5是傳送薄 片的俯視圖,圖6是沿薄片片傳送方向的剖視圖,圖7是薄 片片寬度方向的剖視圖、圖8是製造工序過程示意圖。結 構與實施例1相同的部分說明從略。與附接點板薄片體的 實施例1相比較,不同之處就是沒有間隔薄片3這一點。這 種情況下,當用戶在產品基板上連接時,上薄片2的接點 板4的部分伸出呈凸狀。此外,傳送薄片7和下面的保護薄 200302498 (6) 片8都沒有粘著層。所以為了將保護薄片8固定在傳送薄片 7上,粘接有固定薄片9。該固定薄片9由固定薄片9a和固 定粘著層9b形成,其寬度比傳送薄片7窄,而比保護薄片8 寬,因此,保護薄片8被保持在傳送薄片7的下面。根據上 述結構,與上實施例同樣不需擔心接點板4的下面一側外 周部分4c與粘著劑接觸。 下面說明確實施例2的製造工序過程。首先,傳送薄片7 以捲繞在滾筒7R上的狀態被放置,然後被拉入加工線。 傳送薄片7通過沖頭5P沖出定位孔7c和接點板的通孔 5。然後由上薄片2a、上粘著層2b和上隔板2c層積而形成 的上薄片2從滾筒2 R中拉出,上隔板2 c立刻被剝離成為殘 片捲到滾筒2 S。並且被粘附在傳送薄片7上。 由半圓沖頭1 Η形成薄片體1部分外形上的切槽,同時由 沖頭6 Ρ沖出通孔6。然後,上薄片2的無用部分被剝離, 作為殘片被捲入滾筒2Τ内。接點板4通過插入機41從相對 於殘留薄片體1下面插入通孔5並與上薄片2a的下面粘接。 由固定薄片9a、固定粘著層9b和固定隔板9c形成、且寬 度小於傳送薄片7兩側的定位孔7 c間的距離的固定薄片9 從滾筒9R拉出。由於該固定薄片9並未覆蓋傳送薄片7的 定位孔7 c,所以插入定位孔7 c的加工裝置側定位銷不會被 钻接劑污染。因此,產品精度和成品率得以提高。並且固 定隔板9c立刻作為殘片捲入滾筒9S ;固定粘著層9b—側, 粘接有寬度較窄的保護薄片8 ;並且,上述3層薄片從進給 途中加工的上述傳送薄片7下側被粘接。最後,製成品被 -10 - 200302498In the fourth technical means, the conveying sheet, the protective sheet, and the fixed sheet are continuously formed into a belt shape, and a plurality of the upper sheets can be continuously supplied. In a fifth technical means, the width of the fixed sheet is formed to a width obtained by removing a positioning hole in the feeding device of the transport sheet. [Embodiment of the invention] Hereinafter, Embodiment 1 of the present invention will be described with reference to FIGS. 1 to 4. Fig. 1 is a plan view of the conveying sheet, Fig. 2 is a cross-sectional view along the sheet and the conveying direction, and Fig. 3 is a sectional view along the (4) sheet X * degree direction. "Fig. 4 is a schematic diagram of the manufacturing process. The dimension magnification of the thickness direction in each figure of the plane is larger than the plane direction. As shown in FIG. 1, the part 1 of the sheet 1 with the right w 'point plate and the traditional example @' is made by the upper pu 9. ^ The thick sheet, the spacer sheet 3 attached to the bottom sheet 2 and the Akan plate The structure 4 is described as follows: The contact plate 4 is adhered to the lower surface of the upper sheet 2 and is inserted into the through hole 5 provided in the thin film. The upper sheet 2 is composed of an upper sheet 2a and an upper examination layer 2b, and the # and the name π s wide are bonded to the spacer sheet 3 through the upper adhesive layer 2b. ^ 2 sheet 3 is formed of a spacer film 3a and a spacer adhesive layer 3b. In addition, the sheet body 1 has a through hole 6 provided for assembling a member such as LED. The sheet 1 having the above-mentioned structure is adhered to the band-shaped heart diaphragm 7 by the spacer adhesive layer 3b, and so far it is similar to the prior art. However, the transfer sheet (not shown in FIG. 2) is formed of a transfer sheet 7a and a transfer adhesive layer 7b, and a strip-shaped protective sheet 8 is attached under the sheet. However, the protective sheet 8 is not provided with an adhesive layer. The existing technology is different. Therefore, no spotting agent is adhered to the outer peripheral portion below the contact plate 4, and as shown in FIG. 3, the portions on both sides of the X-direction conveying partition plate 7b remaining under the positioning hole 8 are used to convey the thin film 7 'When rolled on the drum, there was no sticking to each other. Hereinafter, the manufacturing process of the above-mentioned structure will be described based on FIG. 4. First, the transfer sheet 7a, the transfer adhesive layer 7b, and the transfer partition 7d are laminated, and the transfer sheet 7 is placed in a state of being wound on a drum 7R, and then pulled into a line. On the other hand, the spacer sheet 3 laminated with the spacer film 3a, the spacer adhesive layer 3b, and the spacer 3c is placed in a state of being wound on a roll 3R, and then pulled out. After being pulled out, the spacers were immediately peeled away and connected to the thin transfer sheet. The 4c sheet was sent and separated by the separation 200302498 (5) into a residual sheet and rolled onto the roller 3S. After the conveyance sheet 7 and the spacer sheet 3 are adhered together, a positioning hole 7c and a through hole 5 of the contact plate are processed by the punch 5P. At this time, since the transfer adhesive layer 7b is formed of a weakly adhesive material, it is difficult to adhere to the processing device (the same applies to the following processing). When the upper sheet 2a laminated with the upper sheet 2a, the upper adhesive layer 2b, and the upper partition 2c is pulled out from the roller 2R, the upper partition 2c is immediately peeled off, and the residual sheet is rolled onto the roller 2S. The remaining upper sheet 2a and the upper adhesive layer 2b are adhered to the spacer sheet 3. A cutout is formed in the outer shape of the sheet 1 by a semi-circular punch 1. At the same time, the through hole 6 is punched out by the punch 6P. Then, the useless parts of the upper sheet 2 and the spacer sheet 3 are peeled off together, and are wound onto the drum 2T as a residual sheet. The contact plate 4 is inserted into the through-hole 5 from the lower surface of the residual sheet 1 by an inserter 41 and adhered to the lower surface of the upper adhesive layer 2b. Then, the conveying partition 7d with the through hole empty is taken up as a scrap, leaving only the portion on the lower side of the positioning hole 7c of the conveying sheet 7. And the lower surface of the conveyance sheet 7 (except the part on the lower side of the positioning hole 7c) is covered by the protective sheet 8 supplied from the roller 8R. Finally, the finished product is wound into the drum 7T. Next, a second embodiment of the present invention will be described with reference to Figs. 5 to 8. Fig. 5 is a plan view of the conveyed sheet, Fig. 6 is a sectional view along the sheet conveying direction, Fig. 7 is a sectional view of the sheet width direction, and Fig. 8 is a schematic view of a manufacturing process. The description of the same parts as those of the first embodiment will be omitted. Compared with Example 1 to which the dot plate sheet is attached, the difference is that there is no spacer sheet 3. In this case, when the user connects on the product substrate, a part of the contact plate 4 of the upper sheet 2 projects in a convex shape. In addition, neither the transfer sheet 7 nor the protective sheet 200302498 (6) sheet 8 has an adhesive layer. Therefore, in order to fix the protective sheet 8 to the conveying sheet 7, the fixing sheet 9 is adhered. This fixed sheet 9 is formed of a fixed sheet 9a and a fixed adhesive layer 9b, and its width is narrower than the transport sheet 7 and wider than the protective sheet 8. Therefore, the protective sheet 8 is held under the transport sheet 7. According to the above structure, there is no need to worry about the contact of the outer peripheral portion 4c on the lower side of the contact plate 4 with the adhesive as in the previous embodiment. The manufacturing process of Example 2 will be described below. First, the conveyance sheet 7 is placed in a state wound on a drum 7R, and then pulled into a processing line. The conveying sheet 7 punches out the positioning hole 7c and the through hole 5 of the contact board through the punch 5P. Then, the upper sheet 2 formed by laminating the upper sheet 2a, the upper adhesive layer 2b, and the upper partition 2c is pulled out from the roller 2R, and the upper partition 2c is immediately peeled into a residual sheet and rolled onto the roller 2S. And adhered to the conveyance sheet 7. A semi-circular punch 1 is used to form a cutout in a part of the outer shape of the sheet body 1, and a punch 6 is punched out of the through hole 6 at the same time. Then, the useless part of the upper sheet 2 is peeled off, and it is rolled into the drum 2T as a scrap. The contact plate 4 is inserted into the through hole 5 from the lower surface of the residual sheet 1 by an inserter 41 and is bonded to the lower surface of the upper sheet 2a. The fixed sheet 9 formed of the fixed sheet 9a, the fixed adhesive layer 9b, and the fixed partition 9c and having a width smaller than the distance between the positioning holes 7c on both sides of the conveyance sheet 7 is pulled out from the roller 9R. Since the fixing sheet 9 does not cover the positioning holes 7c of the conveying sheet 7, the processing device-side positioning pins inserted into the positioning holes 7c are not contaminated by the drilling agent. Therefore, product accuracy and yield are improved. And the fixed partition 9c is immediately rolled into the drum 9S as a residue; the fixed adhesive layer 9b is on one side, and a protective sheet 8 having a narrow width is adhered; The sides are glued. Finally, the finished product was -10-200302498

⑺ 捲到滾筒7T上。 在上述實施例中,傳送薄片7是連續的,也可以離散加 工。此外,本實施例中通孔5處只插入接點板4、但並不限 於這種方式,可以將具有電極的電子構件一起裝入,其效 果相同。還有,也可以在上薄片上面層積具有各種功能的 薄片類材料。接點板的形狀也不限於向下的碗狀結構,可 以是其他各種適用的形狀。⑺ Roll onto the roller 7T. In the above-mentioned embodiment, the conveying sheet 7 is continuous, and it may be processed discretely. In addition, in this embodiment, only the contact board 4 is inserted at the through hole 5, but it is not limited to this method. Electronic components with electrodes can be installed together, and the effect is the same. Alternatively, a sheet-like material having various functions may be laminated on the upper sheet. The shape of the contact plate is not limited to a downwardly-shaped bowl-shaped structure, and may have various other applicable shapes.

【發明的效果】[Effect of the invention]

根據上述說明,本發明的附接點板薄片具有:接點板、 粘著在上述接點板上面的上薄片、設有可從外部穿通上述 接點板的通孔且保持上述上薄片並可使之剝離的傳送薄 片、保持在上述傳送薄片下面並覆蓋上述通孔和上述接點 板的保護薄片;在上述傳送薄片下面設有傳送粘著層、通 過該傳送粘著層粘著並保持上述保護薄片的上面。因此, 不會發生與裝有本附接點板薄片的電子儀器基板上設置 的固定接點相接觸而使接點板下面一側的外圖部分附著 粘接劑的問題。 在另一結構中,由於具有接點板、粘接在該接點板上面 的上薄片、設有能從外部穿通上述接點板的通孔,保持上 4上薄片並使之能剝離的傳送薄片、保持在上述傳送薄片 下面並覆蓋了上述通孔和上述接點板的保護薄片,該保護 薄片被保持在上述傳送薄片的下面、其下面由比其寬的固 定薄片覆蓋,所以接點板下面一側的外周部分不會附著粘 接劑。 -11 - 200302498According to the above description, the attachment point plate sheet of the present invention includes a contact plate, an upper sheet adhered to the contact plate, a through hole through which the contact plate can be passed from outside, and the upper sheet can be held and A peeling transfer sheet, a protective sheet held under the transfer sheet and covering the through-holes and the contact board; a transfer adhesive layer is provided under the transfer sheet, and the transfer adhesive layer is adhered to and holds the above Protect the top of the sheet. Therefore, there is no problem that an adhesive is adhered to the outer portion of the lower side of the contact board by contacting the fixed contact provided on the electronic device substrate on which the contact board sheet is mounted. In another structure, a contact board, an upper sheet adhered to the contact board, and a through-hole capable of penetrating the contact board from the outside are provided, so that the upper 4 sheets are held and peeled and conveyed. Sheet, a protective sheet held under the transport sheet and covering the through hole and the contact board, the protective sheet is held under the transport sheet, and the lower face is covered by a fixed sheet wider than it, so the lower part of the contact board Adhesive does not adhere to the outer peripheral part of one side. -11-200302498

⑻ 【圖式的簡單說明】 圖1是本發明的附接點板薄片實施例1的俯視圖。 圖2是本發明的附接點極薄片實施例1的傳送方向剖面 圖。 圖3是本發明的附接點板薄片實施例1的寬度方向剖面 圖。 圖4是本發明的附接點板薄片實施例1的製造工序示意⑻ [Brief Description of the Drawings] Fig. 1 is a plan view of a first embodiment of an attachment point plate sheet according to the present invention. Fig. 2 is a cross-sectional view in the conveying direction of the first embodiment of the attachment point electrode sheet of the present invention. Fig. 3 is a cross-sectional view in the width direction of Embodiment 1 of an attachment point plate sheet according to the present invention. FIG. 4 is a schematic view showing a manufacturing process of the attachment point plate sheet according to the first embodiment of the present invention; FIG.

圖。 圖5是本發明的附接點板薄片其他實施例的俯視圖。 圖6是本發明的附接點極薄片其他實施例的傳送方向剖 面圖。 圖7是本發明的附接點板薄片其他實施例的幅寬方向剖 面圖。 圖8是本發明的附接點板薄片其他實施例的製造工序示 意圖。Illustration. FIG. 5 is a plan view of another embodiment of an attachment point plate sheet according to the present invention. Fig. 6 is a cross-sectional view in the conveying direction of another embodiment of the attachment point pole sheet of the present invention. Fig. 7 is a cross-sectional view in the width direction of another embodiment of the attachment point plate sheet of the present invention. Fig. 8 is a schematic view showing a manufacturing process of another embodiment of an attachment point plate sheet according to the present invention.

圖9是習知附接點板薄片的傳送方向剖面圖。 圖1 0是附接點板薄片裝入電子儀器基板上的狀態剖面 示意圖。 〈圖式代表符號說明〉 1 附接點板的薄片體 2 上薄片 3 間隔薄片 4 接點板 5 通孔 -12 - 200302498FIG. 9 is a cross-sectional view of a conventional attachment point plate sheet in a conveying direction. Fig. 10 is a schematic cross-sectional view showing a state where the attachment point plate sheet is mounted on the electronic device substrate. 〈Explanation of Symbols of Drawings〉 1 Sheet with attached contact plate 2 Upper sheet 3 Spacer sheet 4 Contact sheet 5 Through hole -12-200302498

(9) 6 插裝構件用的通孔 7 傳送薄片 7 c 定位孔 8 保護薄片 9 固定薄片(9) 6 Through-hole for inserting member 7 Conveying sheet 7 c Positioning hole 8 Protective sheet 9 Fixing sheet

-13 --13-

Claims (1)

200302498 拾、申讀專利範菌 1. 一種附接點板的薄片,其特徵在於: 包括:接點板、粘著在上述接點板上面的上薄片、設 有可從外部穿通上述接點板的通孔且上述上薄片並使 其能剝離的傳送薄片、及保持在上述傳送薄片下面並覆 蓋上述通孔和上述接點板的保護薄片;且 在上述傳送薄片下面設有傳送粘著層、通過該傳送粘 著層粘著並保持上述保護薄片的上面。200302498 Patent application and application 1. A sheet for attaching a contact board, comprising: a contact board, an upper sheet adhered to the contact board, and a contact board that can pass through the contact board from the outside And a protective sheet that is held under the transport sheet and covers the through hole and the contact board; and a transport adhesive layer is provided under the transport sheet, The upper surface of the protective sheet is adhered and held by the transfer adhesive layer. 2. 如申請專利範圍第1項所述的附接點板的薄片,其中 上述傳送粘著層係由具有小於上述上薄片與上述傳 送薄片間粘接力的微粘接材料形成。 3 . —種附接點板的薄片,其特徵在於: 包括:接點板、粘接在該接點板上面的上薄片、設有 能從外部穿通上述接點板的通孔且保持上述上薄片並 使其能剝離的傳送薄片、及被保持在上述傳送薄片下面 並覆蓋上述通孔和上述接點板的保護薄片;且2. The sheet for attaching a point plate according to item 1 of the scope of patent application, wherein the transfer adhesive layer is formed of a micro-adhesive material having a smaller adhesive force than the upper sheet and the transfer sheet. 3. A sheet for attaching a contact board, comprising: a contact board, an upper sheet adhered to the contact board, a through hole through which the contact board can be penetrated from the outside, and the upper board is held. Sheet and a peelable transport sheet, and a protective sheet held under the transport sheet and covering the through hole and the contact board; and 上述保護薄片粘附保持在上述傳送薄片下面、其下面 由比其寬的固定薄片覆蓋。 4.如申請專利範圍第3項所述的附接點板的薄片,其中 使上述傳送薄片、上述保護薄片、上述固定薄片連續 形成帶狀,並能連續供給多個上述上薄片。 5 .如申請專利範圍第4項記述的附接點板的薄片,其中 將上述固定薄片的寬度形成為去除上述傳送薄片的 進給裝置上的定位孔所得到的寬度。The protective sheet is adhered and held under the transport sheet, and the lower surface is covered with a fixing sheet wider than it. 4. The sheet for attaching a point plate according to item 3 of the scope of patent application, wherein the conveying sheet, the protective sheet, and the fixed sheet are continuously formed into a belt shape, and a plurality of the upper sheets can be continuously supplied. 5. The sheet for attaching a point plate as described in item 4 of the scope of patent application, wherein the width of the fixed sheet is formed to a width obtained by removing the positioning holes on the feeding device of the conveying sheet.
TW91137667A 2002-01-29 2002-12-27 Thin slice with attached contact plate TW580714B (en)

Applications Claiming Priority (1)

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JP2002019744A JP2003217392A (en) 2002-01-29 2002-01-29 Sheet with contact plate

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JP2007299588A (en) * 2006-04-28 2007-11-15 Alps Electric Co Ltd Push-button switch and sheet with contact spring used for construction of push-button switch

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